TI TLC5942RHBR

TLC5942
www.ti.com
SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
16-Channel, 12-Bit PWM LED Driver with
7-Bit Dot Correction
•
FEATURES
1
• 16 Channels, Constant Current Sink Output
• 50-mA Capability (Constant Current Sink)
• 12-Bit (4096 Steps) Grayscale Control with
PWM
• 7-Bit (128 Steps) Dot Correction with Sink
Current
• LED Power-Supply Voltage up to 17 V
• Constant Current Accuracy:
– Channel-to-Channel = ±1.5%
– Device-to-Device = ±3%
• VCC = 3.0 V to 5.5 V
• CMOS Level I/O
• 30-MHz Data Transfer Rate
• 30-MHz Grayscale Control Clock
• Dedicated Ports for Grayscale and Dot
Correction
• Continuous Base LED Open Detection (LOD)
• Thermal Shutdown (TSD):
– Automatic shutdown at high temperature
conditions
– Restart under normal temperature
23
•
•
APPLICATIONS
•
•
•
The TLC5942 is a 16-channel, constant current sink
driver. Each channel is individually adjustable with
4096 pulse-width modulated (PWM) steps and 128
constant current sink steps for dot correction. Dot
correction adjusts the brightness variations between
LEDs. Both grayscale control and dot correction are
accessible via separate, dedicated serial interface
ports. The maximum current value of all 16 channels
can be set by a single external resistor.
VLED
VLED
¼
OUT0
GSSIN
GSSCLK
Controller
for Grayscale XGSLAT
(Outside of
BLANK
LED module)
Monochrome, Multicolor, Full-Color LED
Displays
LED Signboards
Display Backlighting
DESCRIPTION
VLED
GSDATA
Readable Error Information:
– LED Open Detection
– Thermal Error Flag (TEF)
Noise Reduction:
– 4-Channel grouped delay to prevent inrush
current
Operating Temperature: –40°C to +85°C
¼
¼
OUT15
OUT0
GSSOUT
GSSIN
GSSCLK
XGSLAT
DCSIN
TLC5942
IC1
IREF
RIREF
OUT15
GSSOUT
XGSLAT
TLC5942
ICn
BLANK
DCSOUT
DCSIN
VCC
DCSCLK
XDCLAT
¼
GSSCLK
BLANK
ERROR
READ
VLED
¼
GND
VCC
DCSCLK
XDCLAT
VCC
IREF
RIREF
VCC
GND
Controller for DCDATA
Dot Correction DCSCLK
with
XDCLAT
Correction
Data ROM
(Inside of
LED module)
Typical Application Circuit (Multiple Daisy-Chained TLC5942s)
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TLC5942
www.ti.com
SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
DESCRIPTION, CONTINUED
The TLC5942 has two error detection circuits for LED open detection (LOD) and a thermal error flag (TEF). LOD
detects a broken or disconnected LED during the display period. TEF indicates an over-temperature condition;
when a TEF is set, all output drivers are turned off. When the TEF is cleared, all output drivers are restarted.
blank
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
TLC5942
HTSSOP-28 PowerPAD™
5 mm × 5 mm QFN-32
TLC5942
(1)
ORDERING NUMBER
TRANSPORT MEDIA,
QUANTITY
TLC5942PWPR
Tape and Reel, 2000
TLC5942PWP
Tube, 50
TLC5942RHBR
Tape and Reel, 3000
TLC5942RHBT
Tape and Reel, 250
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1) (2)
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
VCC
Supply voltage, VCC
IOUT
Output current (dc): OUT0 to OUT15
VIN
Input voltage range:
GSSIN, GSSCLK, XGSLAT, DCSIN, DCSCLK, XDCLAT, BLANK, IREF
VOUT
Output voltage
range
TJ(max)
Maximum operating junction temperature
TSTG
Storage temperature range
ESD rating
(1)
(2)
2
TLC5942
UNIT
–0.3 to +6.0
V
60
mA
–0.3 to VCC + 0.3
V
GSSOUT, DCSOUT
–0.3 to VCC + 0.3
OUT0 to OUT15
–0.3 to +18
+150
–55 to +150
Human body model (HBM)
Charged device model (CDM)
V
°C
2
kV
500
V
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
All voltage values are with respect to network ground terminal.
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
RECOMMENDED OPERATING CONDITIONS
At TA= –40°C to +85°C, unless otherwise noted.
TLC5942
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
DC Characteristics: VCC = 3 V to 5.5 V
VCC
Supply voltage
VO
Voltage applied to output
3.0
5.5
V
17
VIH
High-level input voltage
V
0.7 × VCC
VCC
V
VIL
Low-level input voltage
IOH
High-level output current
GSSOUT, DCSOUT
GND
0.3 × VCC
–1
mA
IOL
Low-level output current
GSSOUT, DCSOUT
1
mA
IOLC
Constant output sink current
50
mA
TA
Operating free-air temperature
–40
+85
°C
TJ
Operating junction
temperature
–40
+125
°C
OUT0 to OUT15
OUT0 to OUT15
V
AC Characteristics: VCC = 3 V to 5.5 V
fCLK (dcsclk)
Data shift clock frequency
DCSCLK
30
MHz
fCLK (gssclk)
Data shift/grayscale control
clock frequency
GSSCLK
30
MHz
GSSCLK (see Figure 9),
DCSCLK (see Figure 10)
10
ns
TWH1
XGSLAT, BLANK (see Figure 9),
XDCLAT (see Figure 10)
30
ns
TSU0
GSSIN–GSSCLK ↑ (see Figure 9),
DCSIN–DCSCLK ↑ (see Figure 10)
3
ns
TSU1
BLANK ↓– GSSCLK ↑
(see Figure 9)
10
ns
TSU2
XGSLAT ↑ – GSSCLK↑
(see Figure 9),
XDCLAT ↑ – DCSCLK↑
(see Figure 10)
100
ns
TSU3
XGSLAT ↓ – GSSCLK↑
(see Figure 9 and Figure 11)
15
ns
TH0
GSSIN–GSSCLK ↑ (see Figure 9),
DCSIN–DCSCLK ↑ (see Figure 10)
3
ns
XGSLAT ↑ – GSSCLK↑
(see Figure 9),
XDCLAT ↑ – DCSCLK↑
(see Figure 10)
30
ns
TWH0 / TWL0
Pulse duration
Setup time
Hold time
TH1
DISSIPATION RATINGS
PACKAGE
DERATING FACTOR
ABOVE TA = +25°C
TA < +25°C
POWER RATING
TA = +70°C
POWER RATING
TA = +85°C
POWER RATING
HTSSOP-28 with
PowerPAD soldered (1)
31.67 mW/°C
3958 mW
2533 mW
2058 mW
HTSSOP-28 with
PowerPAD not soldered (2)
16.21 mW/°C
2026 mW
1296 mW
1053 mW
27.86 mW/°C
3482 mW
2228 mW
1811 mW
QFN-32
(1)
(2)
(3)
(3)
With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
With PowerPAD not soldered onto copper area on PCB.
The package thermal impedance is calculated in accordance with JESD51-5.
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
ELECTRICAL CHARACTERISTICS
At VCC = 3.0 V to 5.5 V, and TA = –40°C to +85°C. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted.
TLC5942
PARAMETER
TEST CONDITIONS
MIN
VOH
High-level output voltage
IOH = –1 mA at GSSOUT, DCSOUT
VOL
Low-level output voltage
IOL = 1 mA at GSSOUT, DCSOUT
Input current
VIN = VCC or GND at GSSIN, GSSCLK,
XGSLAT, DCSIN, DCSCLK, XDCLAT, BLANK
IIN
MAX
UNIT
VCC – 0.4
TYP
VCC
V
0
0.4
V
–1
1
µA
ICC1
No data transfer, all OUTn = OFF, DCn = 7Fh,
VOUTn = 1 V, RIREF = 10 kΩ
1
3
ICC2
No data transfer, all OUTn = OFF, DCn = 7Fh,
VOUTn = 1 V, RIREF = 2 kΩ
4
8
Supply current
mA
ICC3
Data transfer 30 MHz, all OUTn = ON,
DCn = 7Fh, VOUTn = 1 V, RIREF = 2 kΩ
14
30
ICC4
Data transfer 30 MHz, all OUTn = ON,
DCn = 7Fh, VOUTn = 1 V, RIREF = 1 kΩ
27
50
49
55
mA
0.1
µA
IO(LC)
Constant output current
All OUTn = ON, DCn = 7Fh, VOUTn = 1 V,
VOUTfix = 1 V, RIREF = 1 kΩ
IO(LKG)
Leakage output current
All OUTn = OFF, DCn = 7Fh, VOUTn = 17 V,
RIREF = 1 kΩ
ΔIO(LC)
Constant current error
(channel-to-channel) (1)
All OUTn = ON, DCn = 7Fh, VOUTn = 1 V,
VOUTfix = 1 V, RIREF = 1 kΩ
±1.5
±5
%
ΔIO(LC1)
Constant current error
(device-to-device) (2)
All OUTn = ON, DCn = 7Fh, VOUTn = 1 V,
VOUTfix = 1 V, RIREF = 1 kΩ
±3
±8
%
ΔIO(LC2)
Line regulation (3)
All OUTn = ON, DCn = 7Fh, VOUTn = 1 V,
VOUTfix = 1 V, RIREF = 1 kΩ, VCC = 3 V to 5.5 V
±1
±4
%/V
ΔIO(LC3)
Load regulation (4)
All OUTn = ON, DCn = 7Fh,
VOUTn = 1 V to 3 V, VOUTfix = 1 V, RIREF = 1 kΩ
±1
±3
%/V
43
T(TEF)
Thermal error flag threshold
Junction temperature
+150
+162
+175
°C
T(HYS)
Thermal error hysteresis
Junction temperature (5)
+5
+10
+20
°C
VLOD
LED open detection
threshold
All OUTn = ON
0.2
0.3
0.4
V
VIREF
Reference voltage output
RIREF = 1 kΩ
1.16
1.20
1.24
V
(1)
(5)
The deviation of each output from the average of OUT0–OUT15 constant current. Deviation is calculated by the formula:
D (%) =
IOUTn
-1
´ 100
(IOUT0 + IOUT1 + ... + IOUT15)
(2)
16
.
The deviation of the OUT0–OUT15 constant current average from the ideal constant current value.
(IOUT0 + IOUT1 + ... IOUT14 + IOUT15)
16
D (%) =
- (Ideal Output Current)
´ 100
Ideal Output Current
Deviation is calculated by the following formula:
IOUT(IDEAL) = 41 ´
Ideal current is calculated by the formula:
D (%/V) =
(3)
Line regulation is calculated by this equation:
4
Load regulation is calculated by the equation:
Not tested; specified by design.
(IOUTn at VCC = 5.5 V) - (IOUTn at VCC = 3.0 V)
100
´
(IOUTn at VCC = 3.0 V)
D (%/V) =
(4)
(5)
1.20
RIREF
5.5 V - 3 V
(IOUTn at VOUTn = 3 V) - (IOUTn at VOUTn = 1 V)
100
´
(IOUTn at VOUTn = 1 V)
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
SWITCHING CHARACTERISTICS
At VCC = 3.0 V to 5.5 V, TA = –40°C to +85°C, CL = 15 pF, RL = 82 Ω, RIREF = 1 kΩ, and VLED = 5.0 V. Typical values at
VCC = 3.3 V and TA = +25°C, unless otherwise noted.
TLC5942
PARAMETER
tR0
Rise time
tR1
tF0
TEST CONDITIONS
MIN
10
GSSOUT (see Figure 9)
DCSOUTn (see Figure 10)
tF1
OUTn, DCn = 7Fh (see Figure 9)
tD0
GSSCLK ↑ – GSSOUT (see Figure 9)
DCSCLK ↑ – DCSOUT (see Figure 10)
tD1
BLANK ↑ – OUT0 current sink off
(see Figure 9)
tD2
GSSCLK ↑ – OUT0, 4, 8, 12
(see Figure 9)
tD3
MAX
16
OUTn, DCn = 7Fh (see Figure 9)
Fall time
TYP
GSSOUT (see Figure 9)
DCSOUT (see Figure 10)
ns
30
16
10
UNIT
ns
30
25
ns
20
40
ns
5
18
40
ns
GSSCLK ↑ – OUT1, 5, 9, 13
(see Figure 9)
20
42
73
ns
tD4
GSSCLK ↑ – OUT2, 6, 10, 14
(see Figure 9)
35
66
106
ns
tD5
GSSCLK ↑ – OUT3, 7, 11, 15
(see Figure 9)
50
90
140
ns
10
ns
Propagation delay time
tON_ERR
Output on-time error
tOUTON – TGSSCLK, GSn = 001h,
GSSCLK = 30 MHz (see Figure 9)
–20
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
FUNCTIONAL BLOCK DIAGRAM
VCC
33rd GSSCLK Signal After BLANK Goes Low
LED Open Detection Data Latch
(16 LOD)
VCC
16
LSB
MSB
GSSIN
Grayscale Shift Register
(12 Bits x 16 Channels)
GSSOUT
0
191
192
GSSCLK
LSB
MSB
Grayscale Data Latch
(12 Bits x 16 Channels)
XGSLAT
0
191
LSB
MSB
DCSIN
Dot Correction Shift Register
(7 Bits x 16 Channels)
0
DCSOUT
111
112
DCSCLK
LSB
MSB
192
16
Dot Correction Data Latch
(7 Bits x 16 Channels)
XDCLAT
111
0
112
Grayscale
Counter
12-Bit PWM Timing Control
12
16
Thermal
Detection
Output Switching Delay
(4-Channel Unit)
BLANK
16
Constant Current Driver with Dot Correction
(16 Channels)
Reference
Current
Control
IREF
LED Open Detection
(LOD, 16 Channels)
GND
GND
¼
OUT0
6
OUT1
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OUT14
OUT15
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
DEVICE INFORMATION
PWP PACKAGE
(Top View)
DCSIN
DCSCLK
GND
NC
NC
VCC
IREF
XDCLAT
32
31
30
29
28
27
26
25
RHB PACKAGE
(Top View)
GND
1
28
VCC
DCSCLK
2
27
IREF
DCSIN
3
26
XDCLAT
GSSCLK
4
25
DCSOUT
GSSCLK
1
24
DCSOUT
GSSIN
5
24
GSSOUT
GSSIN
2
23
GSSOUT
XGSLAT
6
23
BLANK
XGSLAT
3
22
BLANK
OUT7
7
22
OUT15
OUT7
4
21
OUT15
OUT6
8
21
OUT14
OUT6
5
20
OUT14
OUT5
9
20
OUT13
OUT5
6
19
OUT13
OUT4
10
19
OUT12
OUT4
7
18
OUT12
OUT3
11
18
OUT11
OUT3
8
17
OUT11
OUT2
12
17
OUT10
OUT1
13
16
OUT9
OUT0
14
15
OUT8
11
12
13
14
15
16
OUT0
NC
NC
OUT8
OUT9
OUT10
OUT2
OUT1 10
Thermal
Pad
9
Thermal
Pad
NC = No connection.
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
TERMINAL FUNCTIONS
TERMINAL
NAME
GSSIN
PWP
RHB
I/O
5
2
I
Serial data input for grayscale.
DESCRIPTION
GSSCLK
4
1
I
Serial data shift clock for grayscale and reference clock for Grayscale PWM control. Data present
on the GSSIN pin are shifted into the Grayscale Shift Register with each rising edge of the
GSSCLK pin. Data are shifted into the LSB of the register with each rising edge. The MSB of the
register is shifted to the GSSOUT pin with each rising edge. If BLANK is low, then each rising
edge of GSSCLK increments the grayscale counter for PWM control.
XGSLAT
6
3
I
Data in the shift register are moved to the grayscale data latch with a low-to-high transition of this
pin.
GSSOUT
24
23
O
Serial data output for Grayscale/Status information data. This signal is connected to MSB of
Grayscale Shift Register.
DCSIN
3
32
I
Serial data input for Dot Correction.
DCSCLK
2
31
I
Serial data shift clock for dot correction. Data present on the DCSIN pin are shifted into the dot
correction shift register with each rising edge of the DCSCLK pin. Data are shifted into the LSB of
the register with each rising edge. The MSB of the register is shifted to the DCSOUT pin with
each rising edge.
XDCLAT
26
25
I
Data in the shift register are moved to the dot correction data latch with a low-to-high transition of
this pin.
DCSOUT
25
24
O
Serial data output for dot correction. This signal is connected to the MSB of the Dot Correction
Shift Register.
BLANK
23
22
I
Blank (all constant current outputs off). When BLANK is high, all constant current outputs (OUT0
through OUT15) are forced off, the Grayscale counter is reset to '0', and the Grayscale PWM
timing controller is initialized. When BLANK is low, all constant current outputs are controlled by
the Grayscale PWM timing controller.
IREF
27
26
I/O
Constant current value setting. OUT0 through OUT15 sink constant current is set to desired
value by connecting an external resistor between IREF and GND.
OUT0
14
11
O
Constant current output
OUT1
13
10
O
Constant current output
OUT2
12
9
O
Constant current output
OUT3
11
8
O
Constant current output
OUT4
10
7
O
Constant current output
OUT5
9
6
O
Constant current output
OUT6
8
5
O
Constant current output
OUT7
7
4
O
Constant current output
OUT8
15
14
O
Constant current output
OUT9
16
15
O
Constant current output
OUT10
17
16
O
Constant current output
OUT11
18
17
O
Constant current output
OUT12
19
18
O
Constant current output
OUT13
20
19
O
Constant current output
OUT14
21
20
O
Constant current output
OUT15
22
21
O
Constant current output
VCC
28
27
—
Power-supply voltage
GND
1
30
—
Power ground
—
12, 13,
28, 29
—
No internal connection
NC
8
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
PARAMETER MEASUREMENT INFORMATION
PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
VCC
INPUT
SOUT
GND
GND
Figure 1. GSSIN, GSSCLK, XGSLAT, DCSIN, DCSCLK,
XDCLAT, BLANK
Figure 2. SOUT
OUTn
GND
Figure 3. OUT0 Through OUT15
TEST CIRCUITS
RL
VCC
VCC
OUTn
IREF
RIREF
VCC
CL
GND
VLED
(1)
GSSOUT/
DCSOUT
VCC
GND
(1)
CL includes measurement probe and jig
capacitance.
Figure 4. Rise Time and Fall Time Test Circuit for OUTn
VCC
(1)
(1)
CL
CL includes measurement probe and jig
capacitance.
Figure 5. Rise Time and Fall Time Test Circuit for
GSSOUT/DCSOUT
OUT0
¼
VCC
IREF
OUTn
¼
RIREF
GND OUT15
VOUTn
VOUTFIX
Figure 6. Test Circuit for OUTn
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SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
TIMING DIAGRAMS
TWH0, TWH1, TWL0
VCC
INPUT
(1)
50%
GND
TWL
TWH
TSU0, TSU1, TSU2, TSU3, TH0, TH1
VCC
CLOCK
INPUT
(1)
50%
GND
TSU
TH
VCC
DATA/CONTROL
INPUT
(1)
50%
GND
(1)
Input pulse rise and fall time is 1 ns to 3 ns.
Figure 7. Input Timing
tR0, tR1, tF0, tF1, tD0, tD1, tD2, tD3, tD4, tD5:
VCC
INPUT
(1)
50%
GND
tD
VOH or VOUTnH
90%
(2)
OUTPUT
50%
10%
VOL or VOUTnL
tR or tF
(1)
Input pulse rise and fall time is 1 ns to 3 ns.
(2)
Input pulse high level is VCC and low level is GND.
Figure 8. Output Timing
10
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GSSIN
SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
GS0
0A
GS15
11B
GS15
10B
GS15
9B
GS15
8B
GS0
3B
GS15
7B
GS0
2B
TH0
TSU0
GS0
0B
GS0
1B
GS15
11C
GS15
10C
GS15
9C
TWH0
GS15
8C
GS15
7C
GS15
6C
GS15
5C
TGSSCLK
TSU2
GSSCLK
1
2
3
4
5
189
190
191
TWL0
192
TH1 TWH1 TSU3
TSU1
XGSLAT
TWH1
BLANK
Shift Register Data are Transferred
to Data Latch
Latched Data
for Grayscale
(Internal)
GSSOUT
TSU1
Previous Data
GS15
11A
tD0
GS15 GS15
10A
9A
Latest Data
tD0
GS15
8A
GS15
7A
GS15
6A
GS0
3A
GS0
2A
GS0
1A
GS0
0A
LOD
15
GS15
11B
tR0/tF0
tD1
LOD
13
LOD
14
LOD
12
LOD
11
LOD
10
LOD
9
SID Load Timing to
GS Data Shift Register
Turning off outputs with the BLANK signal (all GS data are greater than 006h):
(VOUTnH)
OUT
0, 4, 8, 12
OFF
ON
(VOUTnL)
tD2
tF1
OUT OFF
1, 5, 9, 13 ON
tD3
OUT OFF
2, 6, 10, 14 ON
tD4
OUT OFF
3, 7, 11, 15 ON
tD5
tR1
Turning off outputs with GSCLK (all GS data are set to 001h):
OUT
0, 4, 8, 12
OFF
ON
OUT OFF
1, 5, 9, 13 ON
OUT OFF
2, 6, 10, 14 ON
OUT OFF
3, 7, 11, 15 ON
tD2
tD3
tD4
tD5
tOUTON
tOUTON
tOUTON
tOUTON
tON_ERR = tOUTON - TGSSCLK
Figure 9. Grayscale Data Write Timing
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DC0
0A
DCSIN
DC15
6B
DC15
5B
DC15
3B
DC15
4B
DC0
3B
DC15
2B
DC0
2B
DC0
0B
DC0
1B
DC15
6C
DC15
5C
DC15
4C
DC15
3C
DC15
2C
DC15
1C
DC15
0C
TH0
TSU0
TSU2
TWH0
DCSCLK
1
2
3
4
5
109
110
111
TWL0
112
TH1 TWH1
XDCLAT
Latched Data
for Dot Correction
(Internal)
Previous Data
DC15
6A
DCSOUT
tD0
DC15 DC15
5A
4A
DC15
3A
DC15
2A
DC15
1A
DC0
3A
DC0
2A
DC15
6B
DC0
0A
DC0
1A
Latest Data
DC15
5B
DC15
4B
DC15
3B
DC15
2B
DC15
1B
DC15
0B
DC14
6B
tR0/tF0
Figure 10. Dot Correction Data Write Timing
The SCLK falling edge must be prior to the XGSLAT rising edge in case SID is read.
GSSIN
GS0
0
GS0
1
191
192
GS15
11A
GS15
10A
GS15
9A
GS15
8A
GS15
7A
1
2
3
4
5
TSU2
GS14
9A
GS14
8A
14
15
13
GS14
6A
GS14
7A
16
GS14
5A
17
GS14
3A
GS14
4A
18
19
20
GS0
0A
GS0
1A
190
191
192
GSSCLK
TH1 TWH1 TSU3
XGSLAT
tD0
GSSOUT
GS15
11
LOD
15
LOD
14
LOD
13
LOD
12
LOD
3
LOD
2
LOD
1
LOD
0
TEF
SID
16
SID
15
SID
14
SID
13
SID
4
SID
3
SID
2
SID
1
SID
0
GS14
6
GS14
5
GS0
1
GS0
0
GS15
11A
SID are entered in the GS shift register at the first rising edge of GSSCLK after XGSLAT goes low.
The SID readout consists of the saved LOD result at the 33rd GSSCLK rising edge in the previous display period
and the TEF data at the rising edge of the first GSCLK after XGSLAT goes low.
Figure 11. Status Information Data Read Timing
12
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TYPICAL CHARACTERISTICS
At VCC = 3.3 V and TA = +25°C, unless otherwise noted.
REFERENCE RESISTOR vs
OUTPUT CURRENT
10000
POWER DISSIPATION RATE
vs FREE-AIR TEMPERATURE
4000
Power Dissipation Rate (mW)
Reference Resistor (W)
9840
4920
3280
2460
1968
1640
1406
1230
1093
TLC5942PWP
PowerPAD Soldered
TLC5942RHB
3000
2000
TLC5942PWP
PowerPAD Not Soldered
1000
984
0
1000
0
30
20
10
40
50
-40
-20
Output Current (mA)
60
Figure 13.
OUTPUT CURRENT vs
OUTPUT VOLTAGE
OUTPUT CURRENT vs
OUTPUT VOLTAGE
55
53
40
IO = 30 mA
30
IO = 20 mA
20
IO = 10 mA
10
0
2.0
2.5
TA = +85°C
51
50
49
TA = -40°C
TA = +25°C
48
46
45
0
3.0
0.5
1.5
1.0
2.0
Output Voltage (V)
Output Voltage (V)
Figure 14.
Figure 15.
ΔIOLC vs
AMBIENT TEMPERATURE
ΔIOLC vs
OUTPUT CURRENT
5
IO = 50 mA
DCn = 7Fh
3
3
2
2
1
0
3.0
1
0
-1
-1
-2
-2
-3
2.5
TA = +25°C
DCn = 7Fh
4
DIOLC (%)
DIOLC (%)
1.5
1.0
0.5
52
47
IO = 5 mA
0
4
100
IO = 50 mA
DCn = 7Fh
54
IO = 50 mA
Output Current (mA)
Output Current (mA)
Figure 12.
IO = 40 mA
5
80
60
40
Free-Air Temperature (°C)
TA = +25°C
DCn = 7Fh
50
20
0
-3
VCC = 3.3 V
-4
VCC = 3.3 V
-4
VCC = 5 V
-5
VCC = 5 V
-5
-40
-20
0
20
40
60
80
100
0
10
20
30
Ambient Temperature (°C)
Output Current (mA)
Figure 16.
Figure 17.
40
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TYPICAL CHARACTERISTICS (continued)
At VCC = 3.3 V and TA = +25°C, unless otherwise noted.
DOT CORRECTION LINEARITY
DOT CORRECTION LINEARITY
60
60
TA = +25°C
IOLCMax = 50 mA
50
IOLCMax = 50 mA
Output Current (mA)
Output Current (mA)
50
40
30
20
IOLCMax = 30 mA
10
40
30
20
TA = -40°C
TA = +25°C
10
IOLCMax = 5 mA
TA = +85°C
0
0
0
20
40
60
80
100
120
0
140
20
40
60
80
100
Dot Correction Data (dec)
Dot Correction Data (dec)
Figure 18.
Figure 19.
120
140
CONSTANT CURRENT OUTPUT VOLTAGE WAVEFORM
CH1-GSCLK
(30 MHz)
CH1 (2 V/div)
CH2 (2 V/div)
CH3 (2 V/div)
CH2-OUT0
(GSData = 0x001h)
IOLCMax = 50 mA, DCn = 7Fh
TA = +25°C,RL = 82 W
CL = 15 pF, VLED = 5 V
CH3-OUT15
(GSData = 0x001h)
Time (25 ns/div)
Figure 20.
14
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DETAILED DESCRIPTION
Setting for the Maximum Constant Sink Current Value
On the TLC5942, the maximum constant current sink value for each channel, IOLCMax, is determined by an
external resistor, RIREF, placed between the IREF and GND pins. The RIREF resistor value is calculated with
Equation 1:
RIREF (kW) =
VIREF (V)
´ 41
IOLCMax (mA)
(1)
Where:
VIREF = the internal reference voltage on the IREF pin (typically 1.20 V)
IOLCMax is the largest current for all outputs. Each output sinks the IOLCMax current when it is turned on and its dot
correction is set to the maximum value of 7Fh (127d). The sink current for each output can be reduced by
lowering the respective output dot correction value.
RIREF must be between 984 Ω (typ) and 9.84 kΩ (typ) in order to keep IOLCMax between 5 mA and 50 mA. The
output may become unstable when IOLCMax is set lower than 5 mA. However, output currents lower than 5 mA
can be achieved by setting IOLCMax to 5 mA or higher, and then using dot correction to lower the output current.
Figure 12 in the Typical Characteristics and Table 1 show the characteristics of the constant sink current versus
external resistor, RIREF.
Table 1. Maximum Constant Current Output versus
External Resistor Value
IOLCMax (mA, typical)
RIREF (Ω)
50
984
45
1093
40
1230
35
1406
30
1640
25
1968
20
2460
15
3280
10
4920
5
9840
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Dot Correction (DC) Function
The TLC5942 is able to individually adjust the output current of each channel (OUT0 to OUT15). This function is
called dot correction (DC). The DC function allows users to individually adjust the brightness and color deviations
of LEDs connected to the outputs OUT0 to OUT15. Each respective channel output current can be adjusted in
128 steps from 0% to 100% of the maximum output current, IOLCMax. The dot correction data are entered into the
TLC5942 via the serial interface.
Equation 2 determines the sink current for each output (OUTn):
IOUTn (mA) = IOLCMax (mA) ´ ( DCn )
127d
(2)
Where:
IOLCMax = the maximum channel current for each channel determined by RIREF
DCn = the programmed dot correction value for OUTn (DCn = 0 to 127d)
When the IC is powered on, the data in the Dot Correction Shift Register and data latch are not set to any default
values. Therefore, DC data must be written to the DC latch before turning on the constant current output.
Table 2 summarizes the DC data versus current ratio and set current value.
Table 2. DC Data versus Current Ratio and Set Current Value
16
DC DATA
(Binary)
DC DATA
(Decimal)
DC DATA
(Hex)
SET CURRENT
RATIO TO
MAX CURRENT (%)
OUTPUT CURRENT
(mA, typical)
AT IOLCMax = 50 mA
OUTPUT CURRENT
(mA, typical)
AT IOLCMax = 5 mA
000 0000
0
00
0.0
0.0
0.00
000 0001
1
01
0.8
0.4
0.04
000 0010
2
02
1.6
0.8
0.08
... ...
... ...
... ...
... ...
... ...
... ...
111 1101
125
7D
98.4
49.2
4.92
111 1110
126
7E
99.2
49.6
4.96
111 1111
127
7F
100.0
50.0
5.00
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Grayscale (GS) Function (PWM Operation)
The pulse width modulation (PWM) operation is controlled by a 12-bit grayscale counter that is clocked on each
rising edge of the grayscale reference clock, GSSCLK. The counter is reset to zero when the BLANK signal is
set high. The counter value is held at zero while BLANK is high, even if the GSSCLK input toggles high and low.
After the falling edge of BLANK, the counter increments with each rising edge of GSSCLK. Any constant current
sink output (OUT0 through OUT15) with a nonzero value in its corresponding grayscale latch starts to sink
current after the first rising edge of GSSCLK following a high-to-low transition of BLANK. The internal counter
keeps track of the number of GSSCLK pulses. Each output channel stays on as long as the internal counter is
equal to or less than the respective output GSSCLK. Each channel turns off at the rising edge of GSSCLK when
the grayscale counter value is larger than the grayscale latch value.
For example, an output that has a grayscale latch value of '1' turns on at the first rising edge of GSSCLK after
BLANK goes low. It turns off at the second rising edge of GSSCLK. Figure 21 shows the PWM timing diagram.
BLANK
2049
2048 2050
1 2 3 4
GSSCLK
4095
4094 4096
¼
(VOUTnH)
¼
GSSCLK counter starts to count GSSCLK
after BLANK goes low.
OFF
OUTn
Drivers do not turn on when grayscale data are zero.
ON
(GSDATA = 0d)
T = GSSCLK ´ 1
(VOUTnH)
OFF
OUTn
ON
(GSDATA = 1d)
OFF
OUTn
ON
(GSDATA = 2d)
(VOUTnL)
(VOUTnH)
T = GSSCLK ´ 2
(VOUTnL)
(VOUTnH)
T = GSSCLK ´ 3
OFF
(VOUTnL)
¼
(VOUTnH)
ON
(GSDATA = 2047d)
(VOUTnL)
(VOUTnH)
OFF
OUTn
ON
(GSDATA = 2048d)
OFF
OUTn
ON
(GSDATA = 4093d)
(VOUTnL)
(VOUTnH)
(VOUTnH)
OUTn
OFF
ON
(GSDATA = 4095d)
T = GSSCLK ´ 4093
(VOUTnL)
OFF
ON
(GSDATA = 4094d)
¼
¼
OFF
T = GSSCLK ´ 2049
¼
ON
(GSDATA = 2049d)
T = GSSCLK ´ 2048
(VOUTnL)
(VOUTnH)
OUTn
T = GSSCLK ´ 2047
OFF
OUTn
OUTn
¼
¼
OUTn
ON
(GSDATA = 3d)
T = GSSCLK ´ 4094
(VOUTnL)
(VOUTnH)
T = GSSCLK ´ 4095
(VOUTnL)
OUTn turns on at first rising edge of GSSCLK
after BLANK goes low except when grayscale data are zero.
OUTn does not turn on again until
BLANK goes high to reset the grayscale clock
and then goes low to enable all OUTn.
Figure 21. PWM Operation Timing
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When the IC is powered on, the data in the Grayscale Shift Register and latch are not set to any default value.
Therefore, Grayscale data must be written to the Grayscale latch before turning the constant current output on.
Additionally, BLANK should be high when the device turns on, to prevent the outputs from turning on before the
proper grayscale and dot correction values can be written. All constant current outputs are always off when
BLANK is high. Equation 3 determines each output (OUTn) on time (tOUTON):
tOUTON (ns) = TGSSCLK (ns) ´ GSn
(3)
Where:
TGSSCLK = the period of GSSCLK
GSn = the programmed grayscale value for OUTn (GSn = 0 to 4095d)
If there are any unconnected output LED lamps (including connection failures or short-circuits), the grayscale
data corresponding to the unconnected output should be set to '0' before turning on the LEDs. Otherwise, the
supply current (IVCC) increases while the LEDs are on. If GS data changes during a GS period because XLAT
goes high, and latches new GS data, the internal data latch registers are immediately updated. This action can
cause the outputs to turn on or off unexpectedly. For proper operation, GS data should only be latched into the
IC at the end of a GS period when BLANK is high. Table 3 summarizes the GS data versus OUTn on duty and
on time.
Table 3. GS Data versus OUTn On Duty and OUTn On Time
18
GS DATA
(Binary)
GS DATA
(Decimal)
GS DATA
(Hex)
OUTn
ON DUTY (%)
OUTn ON TIME (ns, typical)
AT 30 MHz GSSCLK
0000 0000 0000
0
000
0.00
0
0000 0000 0001
1
001
0.02
33
0000 0000 0010
2
002
0.05
67
0000 0000 0011
3
003
0.07
100
... ...
... ...
... ...
... ...
... ...
0111 1111 1111
2047
7FF
49.99
68263
1000 0000 0000
2048
800
50.01
68267
1000 0000 0001
2049
801
50.04
68300
... ...
... ...
... ...
... ...
... ...
1111 1111 1101
4093
FFD
99.95
136433
1111 1111 1110
4094
FFE
99.98
135467
1111 1111 1111
4095
FFF
100.00
136500
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Grayscale Shift Register and Data Latch
The Grayscale (GS) Shift Registers and data latches are each 192 bits in length, and are used to set the PWM
timing for each constant current driver. See Table 3 for the ON time duty of each GS data bit. Figure 22 shows
the shift register and latch configuration. Refer to Figure 9 for the timing diagram for writing data into the GS shift
register and latch. The driver on time is set by the data in the GS data latch. GS data present on the GSSIN pin
are clocked into the GS Shift Register with each rising edge of the GSSCLK pin. Data are shifted in MSB first.
Data are latched from the shift register into the GS data latch with a rising edge on the XGSLAT pin.
When the IC is powered on, the data in Grayscale Shift Register and data latch are not set to any default value.
Therefore, grayscale data must be written to the GS latch before turning on the constant current output. Also,
BLANK should be high when powered on because the constant current may also turn on. All constant current
outputs are off when BLANK is high.
The Status Information Data (SID) byte is overwritten on the most significant 17 bits of the Grayscale Shift
Register at the rising edge of the first GSSCLK after XGSLAT goes low.
Grayscale Shift Register (12 Bits ´ 16 Channels)
GS Data for OUT15
MSB
191
GSSOUT
OUT15-Bit11
(LOD-OUT15)
¼
GS Data for OUT14
180
179
OUT15-Bit0
(LOD-OUT4)
OUT14-Bit11
(LOD-OUT3)
¼ GS Data for OUT1
175
¼
OUT14-Bit7
(TEF)
¼
GS Data for OUT0
LSB
0
7
6
OUT1-Bit0
OUT0-Bit11
¼
OUT0-Bit0
GSSIN
GSSCLK
SID Data are Overwritten Between Bits 191 and 175
¼
¼
GS Data for OUT15
GS Data for OUT14
MSB
191
OUT15-Bit11
¼
180
179
OUT15-Bit0
OUT14-Bit11
¼
Grayscale Data Latch (12 Bits ´ 16 Channels)
¼
¼
¼ GS Data for OUT1
OUT14-Bit7
¼
GS Data for OUT0
12
11
OUT1-Bit0
OUT0-Bit11
LSB
0
¼
OUT0-Bit0
XGSLAT
192 Bits
To PWM Timing Control Block
Figure 22. Grayscale Shift Register and Data Latch Configuration
Dot Correction Shift Register and Data Latch
The Dot Correction (DC) Shift Registers and latches are each 112 bits in length and are used to individually
adjust the constant current values for each constant current driver. Each channel can be adjusted from 0% to
100% of the maximum LED current with 7-bit resolution. Table 2 describes the percentage of the maximum
current for each dot correction data. See Figure 23 for the Dot Correction Shift Register and data latch
configuration. Figure 10 illustrates the timing chart for writing data into the DC Shift Registers and latches. Each
channel LED current is dot-corrected by the percentage corresponding to the data in its DC data latch. DC data
present on the DCSIN pin are clocked into the DC Shift Register with each rising edge of the DCSCLK pin. Data
are shifted in MSB first. The data are latched from the shift register into the DC data latch with a rising edge on
the XDCLAT pin.
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Dot Correction Shift Register (7 Bits ´ 16 Channels)
DC Data for OUT15
MSB
111
DCSOUT
OUT15-Bit6
¼
DC Data for OUT14
105
104
OUT15-Bit0
OUT14-Bit6
¼ DC Data for OUT1
¼
DC Data for OUT0
LSB
0
7
6
OUT1-Bit0
OUT0-Bit6
¼
OUT0-Bit0
DCSIN
DCSCLK
¼
¼
DC Data for OUT15
MSB
111
OUT15-Bit6
¼
DC Data for OUT14
105
104
OUT15-Bit0
OUT14-Bit6
¼
¼ DC Data for OUT1
¼
Dot Correction Data Latch (7 Bits ´ 16 Channels)
DC Data for OUT0
LSB
0
7
6
OUT1-Bit0
OUT0-Bit6
¼
OUT0-Bit0
XDCLAT
112 Bits
To Constant Current Driver Block
Figure 23. Dot Correction Shift Register and Latch Configuration
When the IC is powered on, the data in the Dot Correction Shift Register and data latch are not set to a specific
default value. Therefore, dot correction data must be written to the DC latch before turning on the constant
current output.
Status Information Data (SID)
Status information data (SID) are 17-bit, read-only data. Both the LED open detection (LOD) error and the
thermal error flag (TEF) are shifted out of the GSSOUT pin with each rising edge of the grayscale clock,
GSSCLK. The 16 LOD bits for each channel and the TEF bit are written into the 17 most significant bits of the
Grayscale Shift Register at the rising edge of the first GSSCLK after XGSLAT goes low. As a result, the previous
data in the 17 most significant bits are lost at the same time. No data are loaded into the other 175 bits.
Figure 24 shows the bit assignments. Figure 11 illustrates the read timing for the status information data.
Status Information Data (SID) Configuration
LOD Data of OUT15 to OUT0 (16 Bits)
MSB
16
OUT15
LOD Data
TEF (1 Bit)
15
¼
2
1
OUT14
LOD Data
¼
OUT1
LOD Data
OUT0
LOD Data
LSB
0
TEF Data
The 16 LOD bits for each channel and the TEF bit overwrite
the most significant 17 bits of the grayscale shift register at the
rising edge of the first GSSCLK after XGSLAT goes low.
¼
GS Data for OUT15
MSB
191
GSSOUT
OUT15-Bit11
(LOD-OUT15)
¼
GS Data for OUT14
180
179
OUT15-Bit0
(LOD-OUT4)
OUT14-Bit11
(LOD-OUT3)
¼ GS Data for OUT1
175
¼
OUT14-Bit7
(TEF)
¼
GS Data for OUT0
12
11
OUT1-Bit0
OUT0-Bit11
LSB
0
¼
OUT0-Bit0
GSSIN
GSSCLK
Grayscale Shift Register (12 Bits ´ 16 Channels)
Figure 24. Status Information Data Configuration
20
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The LOD data are updated at the rising edge of the 33rd GSSCLK pulse after BLANK goes low; the LOD data
are retained until the next 33rd GSSCLK. LOD data are only checked for outputs that are turned on during the
rising edge of the 33rd GSSCLK pulse. A '1' in an LOD bit indicates an open LED condition for the corresponding
channel. A '0' indicates normal operation. It is possible for LOD data to show a '0' even if the LED is open when
the grayscale data are less than 20h (32d). Therefore, the GS data must be set to 21h (33d) or higher to get
updated LOD data beyond 20h (32d).
The TEF bit indicates that the IC temperature is too high. The flag also indicates that the IC has turned off all
drivers to avoid damage by overheating the device. A '1' in the TEF bit means that the IC temperature has
exceeded the detect temperature threshold (TTEF) and the driver is turned off. A '0' in the TEF bit indicates
normal operating temperature conditions. The IC automatically turns the drivers back on when the IC
temperature decreases to less than TTEF-THYS. When the IC is powered on, LOD data do not show correct values.
Therefore, LOD data must be read from the 33rd GSSCLK pulse input after BLANK goes low. Table 4 shows a
truth table for both LOD and TEF.
Table 4. LOD and TEF Truth Table
CONDITION
SID DATA
LED OPEN DETECTION (LODn)
THERMAL ERROR FLAG (TEF)
0
LED is connected (VOUTn > VIOD)
Device temperature is low (temp ≤ TTEF–THYS)
1
LED is open or shorted to GND (VOUTn ≤ VIOD)
Device temperature is high (temp > TTEF)
Continuous Base LED Open Detection
The LED Open Detection (LOD) circuit checks the voltage of each active (that is, on) constant current sink output
(OUT0 through OUT15) at the rising edge of the 33rd GSSCLK after the falling edge of BLANK to detect open
and short LEDs to GND. The channels corresponding to the LOD bit in the Status Information Data register (SID)
are set to a '1' if the voltage of the OUTn pin is less than the LED open detection threshold (VLOD = 0.3 VTYP).
This status information can be read from the GSSOUT pin. No special test sequence is required for LED open
detection.
The LOD function automatically checks for open and short LEDs to GND during each grayscale PWM cycle. The
SID information of the LOD is latched into the LED Open Detection data latch and does not change until the
rising edge of the 33rd GSSCLK pulse following the next falling edge of BLANK. To eliminate false detection of
open LEDs, the LED driver design must ensure that the TLC5942 output voltage is greater than VLOD when the
outputs are on. The GS data must be 21h (33d) or more to get the LOD result.
BLANK
1
2
3
4
¼
28 29 30 31 32 33 34 35 36 37 38 39
¼
4086 4088 4090 4093 4094 4096
4085 4087 4089 4091 4093 4095
GSSCLK
If the OUTn voltage (VOUT) is less than VLOD (0.3 V, typ) at the rising edge of the 33rd
GSSCLK after the falling edge of BLANK, the LOD sets the SID bit corresponding
to the output channel in which LED is open or shorted to GND equal to ‘1’.
OUTn OFF
OUTn
OUTn ON
VOUTn
This LED Open Detection (LOD) data are
kept until the next 33rd rising edge of
GSSCLK after BLANK goes low.
GND
Internal SID
Register Value
Old LED Open Detection Data
New LED Open Detection Data
Figure 25. LED Open Detection (LOD) Timing
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Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5942
21
TLC5942
www.ti.com
SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
Thermal Shutdown and Thermal Error Flag
The Thermal Shutdown (TSD) function turns off all of the constant current outputs on the IC when the junction
temperature (TJ) exceeds the threshold (TTEF = +162°C, typ) and sets the thermal error flag (TEF) to '1'. All
outputs are latched off when TEF is set to '1' and remain off until the next grayscale cycle after the junction
temperature drops below (T(TEF) – T(HYS)). TEF is set to '0' once the junction temperature drops below (T(TEF) –
T(HYS)), but the outputs do not turn on until the first GSSCLK after BLANK goes low while TEF is set to '0'.
BLANK
4094 4096
4093 4095
1 2 3 4
1 2 3
GSSCLK
IC Junction
Temperature (TJ)
TJ < T(TEF) (Normal Temperature)
TJ ³ T(TEF)
TJ ³ T(TEF)
TJ < T(TEF) - T(HYS) (Normal Temperature)
(High Temp)
(High Temp)
'1'
'1'
TEF
(Internal)
'0'
'0'
OFF
OUTn
ON
If TJ ³ T(TEF) at this time,
then OUTn is not turned on.
Figure 26. TEF/TSD Timing
Noise Reduction
Large surge currents may flow through the IC and the board on which the device is mounted if all 16 LED
channels turn on simultaneously at the start of each grayscale cycle. These large current surges could introduce
detrimental noise and electromagnetic interference (EMI) into other circuits. The TLC5942 turns on the LED
channels in a series delay, to provide a current soft-start feature. The output current sinks are grouped into four
groups of four channels each. The first group is OUT0, 4, 8, 12; the second group is OUT1, 5, 9, 13; the third
group is OUT2, 6, 10, 14; and the fourth group is OUT3, 7, 11, 15. Each group turns on sequentially with a small
delay between groups; see Figure 9. Both turn-on and turn-off are delayed.
POWER DISSIPATION CALCULATION
The device power dissipation must be below the power dissipation rate of the device package illustrated in
Figure 13 to ensure correct operation. Equation 4 calculates the power dissipation of the device:
PD = (VCC ´ ICC) + VOUT ´ IMAX ´ N ´
DCn
´ dPWM
127d
(4)
Where:
VCC = device supply voltage
ICC = device supply current
VOUT = OUTn voltage when driving LED current
IMAX = LED current adjusted by R(IREF) resistor
DCn = maximum dot correction value for OUTn (decimal)
N = number of OUTn driving LED at the same time
dPWM = duty ratio defined by BLANK pin or GS PWM value
22
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Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5942
TLC5942
www.ti.com
SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2007) to Revision B ............................................................................................... Page
•
Changed Figure 11. ............................................................................................................................................................. 12
Changes from Original (October 2007) to Revision A .................................................................................................... Page
•
Changed release date for QFN package ............................................................................................................................... 2
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23
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLC5942PWP
ACTIVE
HTSSOP
PWP
28
TLC5942PWPR
ACTIVE
HTSSOP
PWP
TLC5942RHBR
ACTIVE
QFN
TLC5942RHBT
ACTIVE
QFN
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
RHB
32
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
RHB
32
250
CU NIPDAU
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLC5942PWPR
PWP
28
SITE 60
330
16
6.9
10.2
1.8
12
16
Q1
TLC5942RHBR
RHB
32
SITE 41
330
12
5.3
5.3
1.5
8
12
Q2
TLC5942RHBT
RHB
32
SITE 41
180
12
5.3
5.3
1.5
8
12
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TLC5942PWPR
PWP
28
SITE 60
346.0
346.0
33.0
TLC5942RHBR
RHB
32
SITE 41
346.0
346.0
29.0
TLC5942RHBT
RHB
32
SITE 41
190.0
212.7
31.75
Pack Materials-Page 2
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