LINER LT1123_05

LT1123
Low Dropout
Regulator Driver
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FEATURES
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DESCRIPTIO
The LT®1123 is a 3-pin bipolar device designed to be used
in conjunction with a discrete PNP power transistor to
form an inexpensive low dropout regulator. The LT1123
consists of a trimmed bandgap reference, error amplifier,
and a driver circuit capable of sinking up to 125mA from
the base of the external PNP pass transistor. The LT1123
is designed to provide a fixed output voltage of 5V.
Extremely Low Dropout
Low Cost
Fixed 5V Output, Trimmed to ±1%
700µA Quiescent Current
1mV Line Regulation
5mV Load Regulation
Thermal Limit
4A Output Current Guaranteed
Available in a 3-Pin TO-92 Package
■
■
■
■
■
■
■
■
The drive pin of the device can pull down to 2V at 125mA
(1.4V at 10mA). This allows a resistor to be used to reduce
the base drive available to the PNP and minimize the
power dissipation in the LT1123. The drive current of the
LT1123 is folded back as the feedback pin approaches
ground to further limit the available drive current under
short-circuit conditions.
Total quiescent current for the LT1123 is only 700µA. The
device is available in a low cost TO-92 package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
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TYPICAL APPLICATIO
5V Low Dropout Regulator
Dropout Voltage
0.5
+
MOTOROLA
MJE1123
10µF*
20Ω
DRIVE
*REQUIRED IF DEVICE IS
MORE THAN 6" FROM MAIN
FILTER CAPACITOR
†
REQUIRED FOR STABILITY
(LARGER VALUES INCREASE
STABILITY)
OUTPUT = 5V/4A
LT1123 FB
+
GND
10µF†
0.4
DROPOUT VOLTAGE (V)
SEALED
LEAD ACID
5.4 TO 7.2V
620Ω
0.3
0.2
0.1
LT1123 TA01
0
0
1
3
4
2
OUTPUT CURRENT (A)
5
LT1123 TA02
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LT1123
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ABSOLUTE
RATI GS
(Note 1)
Drive Pin Voltage (VDRIVE to Ground) ..................... 30V
Feedback Pin Voltage (VFB to Ground) .................... 30V
Operating Junction Temperature Range ... 0°C to 125°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
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PACKAGE/ORDER I FOR ATIO
FRONT VIEW
TAB IS
GND
3
FB
2
GND
1
DRIVE
ST PACKAGE
3-LEAD PLASTIC SOT-223
ORDER PART
NUMBER
ORDER PART
NUMBER
BOTTOM VIEW
DRIVE
LT1123CST
FB
GND
LT1123CZ
ST PART MARKING
Z PACKAGE
3-LEAD TO-92 PLASTIC
1123
TJMAX = 125°C, θJA = 220°C/W
θJA AT TAB ≈ 20°C/W
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C.
PARAMETER
Feedback Voltage
CONDITIONS
MIN
TYP
MAX
UNITS
IDRIVE = 10mA, TJ = 25°C
4.90
5.00
5.10
V
4.80
5.00
5.20
V
125
25
5mA ≤ IDRIVE ≤ 100mA
3V ≤ VDRIVE ≤ 20V
●
Feedback Pin Bias Current
VFB = 5.00V, 2V ≤ VDRIVE ≤ 15V
●
300
500
µA
Drive Current
VFB = 5.20V, 2V ≤ VDRIVE ≤ 15V
VFB = 4.80V, VDRIVE = 3V
VFB = 0.5V, VDRIVE = 3V, 0°C ≤ TJ ≤ 100°C
●
●
0.45
170
100
1.0
mA
Drive Pin Saturation Voltage
IDRIVE = 10mA, VFB = 4.5V
IDRIVE = 125mA, VFB = 4.5V
Line Regulation
5V < VDRIVE < 20V
●
Load Regulation
∆IDRIVE = 10 to 100mA
●
Temperature Coefficient of VOUT
150
1.4
2.0
V
1.0
±20
–5
–50
0.2
mV
mV
mV/°C
Note 1: Absolute Maximum Ratings are those values beyond which the life
of the device may be impaired.
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LT1123
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TYPICAL PERFOR A CE CHARACTERISTICS
Feedback Pin Bias Current
vs Temperature
400
200
600
300
200
100
0
25
VDRIVE = 3V
TJ = 125°C
500
400
300
200
150
TJ = 25°C
100
TJ = –50°C
50
100
0
0
125
50
75
100
TEMPERATURE (°C)
VDRIVE = 3V
DRIVE CURRENT (mA)
MINIMUM DRIVE PIN CURRENT (µA)
VFB = 5V
FEEDBACK PIN BIAS CURRENT (µA)
Drive Current
vs Feedback Pin Voltage
Minimum Drive Pin Current
vs Temperature
0
25
50
75
100
TEMPERATURE (°C)
LT1123 G01
0
125
1
5
2
3
4
FEEDBACK PIN VOLTAGE (V)
LT1123 G03
LT1123 G02
Feedback Pin Bias Current
vs Feedback Pin Voltage
Drive Pin Saturation Voltage
vs Drive Current
Output Voltage vs Temperature
2.5
500
6
5.03
5.02
2.0
300
TJ = 125°C
200
TJ = 25°C
TJ = 0°C
OUTPUT VOLTAGE (V)
400
DRIVE PIN VOLTAGE (V)
FEEDBACK PIN BIAS CURRENT (µA)
VFB = 4.5V
1.5
TJ = 125°C
TJ = 25°C
1.0
0.5
100
0
0
1
3
4
2
FEEDBACK PIN VOLTAGE (V)
5
5.00
4.99
4.98
TJ = 0°C
0
5.01
0
20
80
60
40
100
DRIVE CURRENT (mA)
LT1123 G04
120
140
LT1123 G05
4.97
–50 –25
50
25
75
0
TEMPERATURE (°C)
100
125
LT1123 G06
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Drive Pin: The drive pin serves two functions. It provides
current to the LT1123 for its internal circuitry including
start-up, bias, current limit, thermal limit and a portion of
the base drive current for the output Darlington. The sum
total of these currents (450µA typical) is equal to the
minimum drive current. This current is listed in the specifications as Drive Current with VFB = 5.2V. This is the
minimum current required by the drive pin of the LT1123.
The second function of the drive pin is to sink the base
drive current of the external PNP pass transistor. The
available drive current is specified for two conditions.
Drive current with VFB = 4.80V gives the range of current
available under nominal operating conditions, when the
device is regulating. Drive current with VFB = 0.5V gives the
range of drive current available with the feedback pin
pulled low as it would be during start-up or during a shortcircuit fault. The drive current available when the feedback
pin is pulled low is less than the drive current available
when the device is regulating (VFB = 5V). This can be seen
in the curve of Drive Current vs VFB Voltage in the Typical
Performance Characteristics curves. This can provide
some foldback in the current limit of the regulator circuit.
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LT1123
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All internal circuitry connected to the drive pin is designed
to operate at the saturation voltage of the Darlington
output driver (1.4 to 2V). This allows a resistor to be
inserted between the base of the external PNP device and
the drive pin. This resistor is used to limit the base drive to
the external PNP below the value set internally by the
LT1123, and also to help limit power dissipation in the
LT1123. The operating voltage range of this pin is from
0V to 30V. Pulling this pin below ground by more than one
VBE will forward bias the substrate diode of the device.
This condition can only occur if the power supply leads are
reversed and will not damage the device if the current is
limited to less than 200mA.
Feedback Pin (VFB): The feedback pin also serves two
functions. It provides a path for the bias current of the
reference and error amplifier and contributes a portion of
the drive current for the Darlington output driver. The sum
total of these currents is the Feedback Pin Bias Current
(300µA typical). The second function of this pin is to
provide the voltage feedback to the error amplifier.
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SI PLIFIED BLOCK DIAGRA
DRIVE
–
CURRENT
LIMIT
THERMAL
LIMIT
FB
+
5V
LT1123 SBD01
GROUND
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FU CTIO AL DESCRIPTIO
The LT1123 is a 3-pin device designed to be used in
conjunction with a discrete PNP transistor to form an
inexpensive ultralow dropout regulator. The device incorporates a trimmed 5V bandgap reference, error amplifier,
a current-limited Darlington driver and an internal thermal
limit circuit. The internal circuitry connected to the drive
pin is designed to function at the saturation voltage of the
Darlington driver. This allows a resistor to be inserted in
series with the drive pin. This resistor is used to limit the
base drive to the PNP and also to limit the power dissipation in the LT1123. The value of this resistor will be defined
by the operating requirements of the regulator circuit. The
LT1123 is designed to sink a minimum of 125mA of base
current. This is sufficient base drive to form a regulator
circuit which can supply output currents up to 4A at a
dropout voltage of less than 0.75V.
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LT1123
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APPLICATIO S I FOR ATIO
The LT1123 is designed to be used in conjunction with an
external PNP transistor. The overall specifications of a
regulator circuit using the LT1123 and an external PNP will
be heavily dependent on the specifications of the external
PNP. While there are a wide variety of PNP transistors
available that can be used with the LT1123, the specifications given in typical transistor data sheets are of little use
in determining overall circuit performance.
Linear Technology has solved this problem by cooperating
with Motorola to design and specify the MJE1123. This
transistor is specifically designed to work with the LT1123
as the pass element in a low dropout regulator. The
specifications of the MJE1123 reflect the capability of the
LT1123. For example, the dropout voltage of the MJE1123
is specified up to 4A collector current with base drive
currents that the LT1123 is capable of generating (20mA
to 120mA). Output currents up to 4A with dropout voltages
less than 0.75V can be guaranteed.
The following sections describe how specifications can be
determined for the basic regulator. The charts and graphs
are based on the combined characteristics of the LT1123
and the MJE1123. Formulas are included that will enable
the user to substitute other transistors that have been
characterized. A chart is supplied that lists suggested
resistor values for the most popular range of input voltages and output current.
Basic Regulator Circuit
The basic regulator circuit is shown in Figure 1. The
LT1123 senses the voltage at its feedback pin and drives
the base of the PNP (MJE1123) in order to maintain the
output at 5V. The drive pin of the LT1123 can only sink
current; RB is required to provide pull up on the base of the
PNP. RB must be sized so that the voltage drop caused by
the minimum drive pin current is less than the emitter/
base voltage of the external PNP at light loads. The
recommended value for RB is 620Ω. For circuits that are
required to run at junction temperatures in excess of
100°C the recommended value of RB is 300Ω.
VIN
RB
620Ω
MJE1123
RD
DRIVE
VOUT = 5V
FB
LT1123
+
GND
10µF ALUM
LT1123 F01
Figure 1. Basic Regulator Circuit
RD is used to limit the drive current available to the PNP
and to limit the power dissipation in the LT1123. Limiting
the drive current to the PNP will limit the output current of
the regulator which will minimize the stress on the regulator circuit under overload conditions. RD is chosen
based on the operating requirements of the circuit, primarily dropout voltage and output current.
Dropout Voltage
The dropout voltage of an LT1123-based regulator circuit
is determined by the VCE saturation voltage of the discrete
PNP when it is driven with a base current equal to the
available drive current of the LT1123. The LT1123 can sink
up to 150mA of base current (150mA typ, 125mA min)
when output voltage is up near the regulating point (5V).
The available drive current of the LT1123 can be reduced
by adding a resistor (RD) in series with the drive pin (see
the section below on current limit). The MJE1123 is
specified for dropout voltage (VCE sat.) at several values of
output current and up to 120mA of base drive current. The
chart below lists the operating points that can be guaranteed by the combined data sheets of the LT1123 and
MJE1123. Figure 2 illustrates the chart in graphic form.
Although these numbers are only guaranteed by the data
sheet at 25°C, Dropout Voltage vs Temperature (Figure 3)
clearly shows that the dropout voltage is nearly constant
over a wide temperature range.
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APPLICATIO S I FOR ATIO
Dropout Voltage
DROPOUT VOLTAGE
TYP
MAX
DRIVE CURRENT
OUTPUT CURRENT
20mA
1A
0.16V
0.3V
50mA
1A
2A
0.13V
0.25V
0.25V
0.4V
120mA
1A
4A
0.2V
0.45V
0.35V
0.75V
1.0
DROPOUT VOLTAGE (V)
BASED ON
MJE1123 SPECS
Figure 4 can be used to select the value of RD based on the
required drive current and the minimum input voltage.
Curves are shown for 20mA, 50mA and 120mA drive
current corresponding to the specified base drive currents
for the MJE1123. The data for the curves was generated
using the following formula:
0.75
IDRIVE = 120mA
0.50
IDRIVE = 20mA
0.25
IDRIVE = 50mA
0
0
1
RD = (VIN – VBE – VDRIVE)/(IDRIVE + 1mA)
2
3
OUTPUT CURRENT (A)
4
LT1123 F02
Figure 2. Maximum Dropout Voltage
0.75
0.65
DROPOUT VOLTAGE (V)
transistor this can be done using the graph of Dropout
Voltage vs Output Current (Figure 2). For example, 20mA
of drive current will guarantee a dropout voltage of 0.3V
at 1A of output current. For circuits using transistors
other than the MJE1123 the user must characterize the
transistor to determine the drive current requirements. In
general it is recommended that the user choose the
lowest value of drive current that will satisfy the output
current requirements. This will minimize the stress on
circuit components during overload conditions.
0.55
IC = 4A, IB = 0.12A
where:
VIN = the minimum input voltage to the circuit
VBE = the maximum emitter/base voltage of the
PNP pass transistor
VDRIVE = the maximum drive pin voltage of the
LT1123
IDRIVE = the minimum drive current required.
The current through RB is assumed to be 1mA
0.45
0.35
1k
IC = 2A, IB = 0.05A
0.25
IC = 1A, IB = 0.02A
0.15
IDRIVE = 20mA
0.05
60
80
40
100
CASE TEMPERATURE (°C)
120
RD
20
IDRIVE = 50mA
100
LT1123 F03
IDRIVE = 120mA
Figure 3. Dropout Voltage vs Temperature
Selecting RD
In order to select RD the user should first choose the value
of drive current that will give the required value of output
current. For circuits using the MJE1123 as a pass
10
5
6
7
8
9
10 11 12 13 14 15
VIN
LT1123 F04
Figure 4. RD Resistor Value
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For 50mA drive current assume:
VBE = 1.2V at IC = 2A
VDRIVE = 1.9V
For 120mA drive current assume:
VBE = 1.4V at IC = 4A
VDRIVE = 2.1V
The RD Selection Chart lists the recommended values for
RD for the most useful range of input voltage and output
current. The chart includes a number for power dissipation for the LT1123 and RD.
RD Selection Chart
INPUT
VOLTAGE
OUTPUT CURRENT:
DROPOUT VOLTAGE:
5.5V
0A to 1A
0.3V
0A to 2A
0.4V
0A to 4A
0.75V
RD
Power (LT1123)
Power (RD)
120Ω
0.05W
0.12W
43Ω
0.14W
0.32W
––
––
––
6.0V
RD
Power (LT1123)
Power (RD)
150Ω
0.05W
0.13W
51Ω
0.15W
0.35W
20Ω
0.37W
0.76W
7.0V
RD
Power (LT1123)
Power (RD)
180Ω
0.06W
0.16W
75Ω
0.14W
0.36W
27Ω
0.38W
0.89W
RD
Power (LT1123)
Power (RD)
240Ω
0.06W
0.17W
91Ω
0.15W
0.42W
36Ω
0.38W
0.97W
RD
Power (LT1123)
Power (RD)
270Ω
0.20W
0.07W
110Ω
0.16W
0.47W
43Ω
0.41W
1.11W
RD
Power (LT1123)
Power (RD)
330Ω
0.22W
0.07W
130Ω
0.17W
0.52W
51Ω
0.43W
1.25W
8.0V
9.0V
10.0V
For regulator circuits using the LT1123, current limiting is
achieved by limiting the base drive to the external PNP
pass transistor. This means that the actual system current
limit will be a function of both the current limit of the
LT1123 and the Beta of the external PNP. Beta-based
current limit schemes are normally not practical because
of uncertainties in the Beta of the pass transistor. Here the
drive characteristics of the LT1123 combined with the
Beta characteristics of the MJE1123 can provide reliable
Beta-based current limiting. This is shown in Figure 5
where the current limit of 30 randomly selected transistors is plotted. The spread of current limit is reasonably
well controlled.
NUMBER OF UNITS
For 20mA drive current assume:
VBE = 0.95V at IC = 1A
VDRIVE = 1.75V
Current Limit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
4.00 4.25 4.50 4.75 5.00 5.25 5.50 5.75 6.00
OUTPUT CURRENT (A)
LT1123 F05
Figure 5. Short-Circuit Current for 30 Random Devices
9
8
7
6
IC (A)
The following assumptions were made in calculating the
data for the curves. Resistors are 5% tolerance and the
values shown on the curve are nominal.
5
4
3
2
Note that in some conditions RD may be replaced with a
short. This is possible in circuits where an overload is
unlikely and the input voltage and drive requirements are
low. See the section on Thermal Considerations for more
information.
1
0
0
0.05
0.15
0.10
IB (A)
LT1123 F06
Figure 6. MJE1123 IC vs IB
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The curve in Figure 6 can be used to determine the range
of current limit of an LT1123 regulator circuit using an
MJE1123 as a pass transistor. The curve was generated
using the Beta versus IC curve of the MJE1123. The
minimum and maximum value curves are extrapolated
from the minimum and maximum Beta specifications.
PD = (VIN – VBE)(IDRIVE)
Thermal Conditions
The thermal characteristics of three components need to
be considered; the LT1123, the pass transistor and RD.
Power dissipation should be calculated based on the
worst-case conditions seen by each component during
normal operation.
The worst-case power dissipation in the LT1123 is a
function of drive current, supply voltage and the value of
RD. Worst-case dissipation for the LT1123 occurs when
the drive current is equal to approximately one half of its
maximum value. Figure 7 plots the worst-case power
dissipation in the LT1123 versus RD and VIN. The graph
was generated using the following formula:
PD
2
VIN – VBE )
(
=
;R
> 10Ω
D
4RD
where:
VBE = the emitter/base voltage of the PNP pass
transistor (assumed to be 0.6V)
1k
0.1W
RD (Ω)
0.2W
100
0.3W
0.4W
0.5W
0.7W
10
5
6
7
For some operating conditions RD may be replaced with a
short. This is possible in applications where the operating
requirements (input voltage and drive current) are at the
low end and the output will not be shorted. For RD = 0 the
following formula may be used to calculate the maximum
power dissipation in the LT1123.
8
9
10 11 12 13 14 15
VIN (V)
LT1123 F07
Figure 7. Power in LT1123
where:
VIN = maximum input voltage
VBE = emitter/base voltage of PNP
IDRIVE = required maximum drive current
The maximum junction temperature rise above ambient
for the LT1123 will be equal to the worst-case power
dissipation multiplied by the thermal resistance of the
device. The thermal resistance of the device will depend
upon how the device is mounted, and whether a heat sink
is used. Measurements show that one of the most effective
ways of heat sinking the TO-92 package is by utilizing the
PC board traces attached to the leads of the package. The
table below lists several methods of mounting and the
measured value of thermal resistance for each method. All
measurements were done in still air.
THERMAL
RESISTANCE
Package alone ............................................................................. 220°C/W
Package soldered into PC board with plated through
holes only ................................................................................ 175°C/W
Package soldered into PC board with 1/4 sq. in. of copper trace
per lead .................................................................................... 145°C/W
Package soldered into PC board with plated through holes in
board, no extra copper trace, and a clip-on type heat sink:
Thermalloy type 2224B .................................................... 160°C/W
Aavid type 5754 ................................................................ 135°C/W
The maximum operating junction temperature of the
LT1123 is 125°C. The maximum operating ambient temperature will be equal to 125°C minus the maximum
junction temperature rise above ambient.
The worst-case power dissipation in RD needs to be
calculated so that the power rating of the resistor can be
determined. The worst-case power in the resistor will
occur when the drive current is at a maximum. Figure 8
plots the required power rating of RD versus supply
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voltage and resistor value. Power dissipation can be
calculated using the following formula:
PRD
2
VIN – VBE – VDRIVE )
(
=
R
where:
VBE = emitter/base voltage of the PNP pass transistor
VDRIVE = voltage at the drive pin of the LT1123
= VSAT of the drive pin in the worst case
The worst-case power dissipation in the PNP pass transistor is simply equal to:
PMAX = (VIN – VOUT)(IOUT)
where
The maximum junction temperature rise above ambient
for the PNP pass transistor will be equal to the maximum
power dissipation times the thermal resistance, junction
to ambient, of the PNP. The maximum operating junction
temperature of the MJE1123 is 150°C. The maximum
operating ambient temperature for the MJE1123 will be
equal to 150°C minus the maximum junction temperature
rise.
The SOT-223 package is designed to be surface mounted.
Heat sinking is accomplished by using the heat spreading
capabilities of the PC board and its copper traces. The
thermal resistance from junction to ambient can be as low
as 50°C/W. This requires a reasonably sized PC board with
at least one layer of copper to spread the heat across the
board and couple it into the surrounding air.
The table below can be used as a guideline in estimating
thermal resistance. Data for the table was generated using
1/16" FR-4 board with 1oz copper foil.
VIN = Maximum VIN
IOUT = Maximum IOUT
The thermal resistance of the MJE1123 is equal to:
70°C/W Junction to Ambient (no heat sink)
1.67°C/W Junction to Case
The PNP will normally be attached to either a chassis or a
heat sink so the actual thermal resistance from junction to
ambient will be the sum of the PNP’s junction to case
thermal resistance and the thermal resistance of the heat
sink or chassis. For nonstandard heat sinks the user will
need to determine the thermal resistance by experiment.
Table 1.
Copper Area
Topside*
Backside
Board Area
Thermal Resistance
(Junction to Ambient)
2500 sq. mm
2500 sq. mm
2500 sq. mm
50°C/W
1000 sq. mm
2500 sq. mm
2500 sq. mm
50°C/W
225 sq. mm
2500 sq. mm
2500 sq. mm
58°C/W
100 sq. mm
2500 sq. mm
2500 sq. mm
64°C/W
1000 sq. mm
1000 sq. mm
1000 sq. mm
57°C/W
1000 sq. mm
0
1000 sq. mm
60°C/W
* Tab of device attached to topside copper
For the LT1123 the tab is ground so that plated through
holes can be used to couple the tab both electrically and
thermally to the ground plane layer of the board. This will
help to lower the thermal resistance.
1k
0.25W
0.5W
RD (Ω)
1W
100
10
5
2W
6
7
8
9
10 11 12 13 14 15
VIN (V)
LT1123 F08
Figure 8. Power in RD
Thermal Limiting
The thermal limit of the LT1123 can be used to protect both
the LT1123 and the PNP pass transistor. This is accomplished by thermally coupling the LT1123 to the power
transistor. There are clip type heat sinks available for the
TO-92 package that will allow the LT1123 to be mounted
to the same heat sink as the PNP pass transistor. One
example is manufactured by IERC (part #RUR67B1CB).
The LT1123 should be mounted as close as possible to the
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PNP. If the output of the regulator circuit can be shorted,
heat sinking must be adequate to limit the rate of temperature rise of the power device to approximately 50°C/
minute. This can be accomplished with a fairly small heat
sink, on the order of 3 to 4 square inches of surface area.
Design Example
Given the following operating requirements:
5.5V < VIN < 7V
IOUTMAX = 1.5A
Max ambient temperature = 70°C
VOUT = 5V
1. The first step is to determine the required drive current.
This can be found from the Maximum Dropout Voltage
curve. 50mA of drive current will guarantee 0.4V dropout at an output current of 2A. This satisfies our
requirements.
IDRIVE = 50mA
2. The next step is to determine the value of RD. Based on
50mA of drive current and a minimum input voltage of
5.5V, we can select RD from the graph of Figure 4. From
the graph the value of RD is equal to 50Ω, so we should
use the next lowest 5% value which is 47Ω.
RD = 47Ω
3. We can now look at the thermal requirements of the
circuit.
Worst-case power in the LT1123 will be equal to:
(VIN(MAX) – VBE )2
4RD
Given: VIN(MAX) = 7V, VBE = 0.6V, RD = 47Ω
Then: PMAX (LT1123) = 0.22W.
Assuming a thermal resistance of 150°C/W, the maximum
junction temperature rise above ambient will be equal to
(PMAX)(150°C/W) = 33°C. The maximum operating junction temperature will be equal to the maximum ambient
temperature plus the junction temperature rise above
ambient. In this case we have (maximum ambient = 70°C)
plus (junction temperature rise = 33°C) is equal to 103°C.
This is well below the maximum operating junction temperature of 125°C for the LT1123.
The power rating for RD can be found from the plot of
Figure 8 using VIN = 7V and RD = 47Ω. From the plot, RD
should be sized to dissipate a minimum of 1/2W.
The worst-case power dissipation, for normal operation,
in the MJE1123 will be equal to:
(VINMAX – VOUT)(IOUTMAX) = (7V – 5V)(1.5A) = 3W
The maximum operating junction temperature of the
MJE1123 is 150°C. The difference between the maximum
operating junction temperature of 150°C and the maximum ambient temperature of 70°C is 80°C. The device
must be mounted to a heat sink which is sized such that the
thermal resistance from the junction of the MJE1123 to
ambient is less than 80°C/3W = 26.7°C/W.
It is recommended that the LT1123 be thermally coupled
to the MJE1123 so that the thermal limit circuit of the
LT1123 can protect both devices. In this case the ambient
temperature for the LT1123 will be equal to the temperature of the heat sink. The heat sink temperature, under
normal operating conditions, will have to be limited such
that the maximum operating junction temperature of the
LT1123 is not exceeded.
Refer to Linear Technology’s list of Suggested Manufacturers of Specialized Components for information on
where to find the required heat sinks, resistors and capacitors. This listing is available through Linear Technology’s
marketing department.
1123fb
10
LT1123
U
TYPICAL APPLICATIO S
Isolated Feedback for Switching Regulators
5V/2A Regulator with Remote Sensing
VIN
600Ω
MJE1123
75Ω
7V
SWITCHING
REGULATOR
DRIVE
100Ω
REMOTE
LOAD
LT1123 FB
+
100µF
OR LARGER
GND
1k
100Ω
LT1123 TA08
DRIVE
5V
OUTPUT
LT1123 FB
GND
LT1123 TA03
5V Regulator with Antisat Miminizes
Ground Pin Current in Dropout
MJE1123
1N4148
620Ω
VIN
1N4148
2N2907
1k
DRIVE
5V
OUTPUT
LT1123 FB
GND
+
10µF
ALUM
LT1123 TA04
1123fb
11
LT1123
U
TYPICAL APPLICATIO S
5V/1A Regulator with Shutdown
+
6V
GEL CELL
620Ω
50k
10µF
ALUM
MJE1123
HI = ON
LO = OFF
1/6
MPSA12
MM74C906
(OPEN COLLECTOR
OUTPUT)
DRIVE
5V/1A
OUTPUT
LT1123 FB
+
GND
10µF
ALUM
LT1123 TA09
Undervoltage Indicator On for VIN < (VZ +5V)
1k
2.4k
VZ
VIN
DRIVE
LT1123 FB
470k
GND
LT1123 TA12
5V Shunt Regulator or Voltage Clamp
1k
IRL510
DRIVE
LT1123 FB
+
GND
10µF
ALUM
LT1123 TA11
1123fb
12
LT1123
U
TYPICAL APPLICATIO S
Battery Backup Regulator
INTERNAL
BATTERY
6V
GEL CELL
+
EXTERNAL
POWER
10µF
ALUM
+
10µF
ALUM
620Ω
620Ω
MJE1123
1N4148
MJE1123
1N4148
20Ω
DRIVE
5V OUTPUT
LT1123 FB
+
GND
10µF
ALUM
LT1123 TA07
Adjusting VOUT
620Ω
VIN > VOUT
MJE1123
RD
DRIVE
VOUT*
+
IFB
RX
LT1123 FB
GND
10µF
ALUM
LT1123 TA14
*VOUT = (5V + (IFB • RX))
IFB ≈ 300µA
Adjusting VOUT
620Ω
VIN > VOUT
MJE1123
RD
DRIVE
VOUT*
VZ
+
LT1123 FB
GND
10µF
ALUM
LT1123 TA13
*VOUT = (5V + VZ)
1123fb
13
LT1123
U
PACKAGE DESCRIPTIO
ST Package
3-Lead Plastic SOT-223
(Reference LTC DWG # 05-08-1630)
.248 – .264
(6.30 – 6.71)
.129 MAX
.114 – .124
(2.90 – 3.15)
.059 MAX
.264 – .287
(6.70 – 7.30)
.248 BSC
.130 – .146
(3.30 – 3.71)
.039 MAX
.059 MAX
.181 MAX
.033 – .041
(0.84 – 1.04)
.0905
(2.30)
BSC
.090
BSC
RECOMMENDED SOLDER PAD LAYOUT
10° – 16°
.010 – .014
(0.25 – 0.36)
10°
MAX
.071
(1.80)
MAX
10° – 16°
.024 – .033
(0.60 – 0.84)
.181
(4.60)
BSC
.012
(0.31)
MIN
.0008 – .0040
(0.0203 – 0.1016)
ST3 (SOT-233) 0502
1123fb
14
LT1123
U
PACKAGE DESCRIPTIO
Z Package
3-Lead Plastic TO-92 (Similar to TO-226)
(Reference LTC DWG # 05-08-1410)
.180 ± .005
(4.572 ± 0.127)
.060 ± .005
(1.524± 0.127)
DIA
.90
(2.286)
NOM
.180 ± .005
(4.572 ± 0.127)
.500
(12.70)
MIN
.050 UNCONTROLLED
(1.270) LEAD DIMENSION
MAX
.016 ± .003
(0.406 ± 0.076)
.050
(1.27)
BSC
5°
NOM
.015 ± .002
(0.381 ± 0.051)
Z3 (TO-92) 0801
.060 ± .010
(1.524 ± 0.254)
3
2
1
.098 +.016/–.04
(2.5 +0.4/–0.1)
2 PLCS
TO-92 TAPE AND REEL
REFER TO TAPE AND REEL SECTION OF
LTC DATA BOOK FOR ADDITIONAL INFORMATION
.140 ± .010
(3.556 ± 0.127)
10° NOM
1123fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of circuits as described herein will not infringe on existing patent rights.
15
LT1123
U
TYPICAL APPLICATIO S
5V/1A Regulator with Shutdown
6V
GEL CELL
HI = ON
LO = OFF
5V Regulator Powered by Multiple Battery Packs*
5-CELL NiCd
BATTERY PACK
(6V)
620Ω
1M
+
Si9400DY*
1/6
MM74C906
(OPEN COLLECTOR
OUTPUT)
10µF
10V
R1
1.5k
+
R3
1.5k
10µF
10V
+
R5
1.5k
10µF
10V
68Ω
MJE1123
R2
820Ω
DRIVE
R4
820Ω
MJE1123
R6
820Ω
5V/1A OUTPUT
LT1123 FB
GND
MJE1123
+
10µF
ALUM
*P-CHANNEL, LOGIC LEVEL
DRIVE
LT1123 FB
LT1123 TA10
GND
+
LT1123 TA06
10µF
10V
5V/1A
OUTPUT
*PACKS WILL SHARE CURRENT
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1083/4/5
7.5A, 5A, 3A Low Dropout Positive Regulators
1.5V Dropout Voltage, 0.1% Load Regulator, 1.25VREF
LT1117
800mA Low Dropout Regulator
SOT-223 Package, 0.4% Load Regulator
LT1121
150mA, Low Dropout LDO
0.4V Dropout Voltage, IQ = 30µA
LT1761
100mA, Low Noise LDO
300mV Dropout Voltage, IQ = 20µA
LT1763
1.5A, Low Noise, Fast Transient Response LDO
Optimized for Hot Response
1123fb
16
Linear Technology Corporation
LT/LWI/LT 0505 REV B • PRINTED IN USA
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© LINEAR TECHNOLOGY CORPORATION 1992