CYPRESS CY2DM1502ZXCT

CY2DM1502
1:2 CML / LVPECL Input to CML Output
Fanout Buffer
Features
Functional Description
■
One current mode logic (CML) or low-voltage positive
emitter-coupled logic (LVPECL) input pair distributed to two
CML output pairs
■
20-ps maximum output-to-output skew
■
480-ps maximum propagation delay
The CY2DM1502 is an ultra-low noise, low-skew,
low-propagation delay 1:2 CML or LVPECL to CML fanout buffer
targeted to meet the requirements of high-speed clock
distribution applications. The device has a fully differential
internal architecture that is optimized to achieve low additive jitter
and low skew at operating frequencies of up to 1.5 GHz.
■
0.15-ps maximum additive RMS phase jitter at 156.25 MHz
(12-kHz to 20-MHz offset)
■
Up to 1.5 GHz operation
■
8-Pin thin shrunk small outline package (TSSOP) package
■
2.5-V or 3.3-V operating voltage[1]
■
Commercial and industrial operating temperature range
Logic Block Diagram
VDD
VDD
VSS
Q0
Q0#
IN
IN#
Q1
Q1#
Note
1. Input AC-coupling capacitors are required for voltage-translation applications.
Cypress Semiconductor Corporation
Document Number: 001-56315 Rev. *F
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 25, 2011
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CY2DM1502
Contents
Pinouts ..............................................................................
Absolute Maximum Ratings ............................................
Operating Conditions.......................................................
DC Electrical Specifications ............................................
AC Electrical Specifications ............................................
Ordering Information........................................................
Ordering Code Definition.............................................
Package Dimension..........................................................
Document Number: 001-56315 Rev. *F
3
3
3
4
5
8
8
9
Acronyms ........................................................................
Document Conventions .................................................
Document History Page .................................................
Sales, Solutions, and Legal Information ......................
Worldwide Sales and Design Support.......................
Products ....................................................................
PSoC Solutions .........................................................
10
10
11
12
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Page 2 of 12
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CY2DM1502
Pinouts
Q0
1
Q0#
2
Q1
3
Q1#
4
CY2DM1502
Figure 1. Pin Diagram – 8-Pin TSSOP Package
8
VDD
7
IN
6
IN#
5
VSS
Table 1. Pin Definitions
Pin No.
Pin Name
Pin Type
Description
1,3
Q(0:1)
Output
CML output clocks
2,4
Q(0:1)#
Output
CML complementary output clocks
5
VSS
Power
Ground
6
IN#
Input
CML/LVPECL complementary input clock
7
IN
Input
CML/LVPECL input clock
8
VDD
Power
Power supply
Absolute Maximum Ratings
Parameter
Description
Condition
Min
Max
Unit
VDD
Supply voltage
Nonfunctional
–0.5
4.6
V
VIN[2]
Input voltage, relative to VSS
Nonfunctional
–0.5
lesser of 4.0
or VDD + 0.4
V
VOUT[2]
DC output or I/O voltage, relative to VSS
Nonfunctional
–0.5
lesser of 4.0
or VDD + 0.4
V
TS
Storage temperature
Nonfunctional
–55
150
°C
ESDHBM
Electrostatic discharge (ESD) protection
(Human body model)
JEDEC STD 22-A114-B
2000
–
V
LU
Latch up
UL–94
Flammability rating
MSL
Moisture sensitivity level
Meets or exceeds JEDEC Spec
JESD78B IC Latchup Test
At 1/8 in
V-0
3
Operating Conditions
Parameter
Description
VDD
Supply voltage
TA
Ambient operating temperature
tPU
Power ramp time
Min
Max
Unit
2.5-V supply
Condition
2.375
2.625
V
3.3-V supply
3.135
3.465
V
Commercial
0
70
°C
Industrial
–40
85
°C
Power-up time for VDD to reach
minimum specified voltage (power
ramp must be monotonic).
0.05
500
ms
Note
2. The voltage on any I/O pin cannot exceed the power pin during power up. Power supply sequencing is NOT required.
Document Number: 001-56315 Rev. *F
Page 3 of 12
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CY2DM1502
DC Electrical Specifications
(VDD = 3.3 V ± 5% or 2.5 V ± 5%; TA = 0 °C to 70 °C (Commercial) or –40 °C to 85 °C (Industrial))
Parameter
Description
Min
Max
Unit
–
50
mA
Input high voltage, CML / LVPECL inputs
IN and IN#
–
VDD + 0.3
V
VIL
Input low voltage, CML / LVPECL inputs
IN and IN#
–0.3
–
V
VID[3]
Input differential amplitude
See Figure 2 on page 6
0.4
1.0
V
VICM
Input common mode voltage
See Figure 2 on page 6
0.5
VDD – 0.2
V
IIH
Input high current, CML / LVPECL inputs Input = VDD[4]
IN and IN#
–
150
μA
IIL
Input low current, CML / LVPECL inputs Input = VSS[4]
IN and IN#
–150
–
μA
VOH
CML output high voltage
Terminated with 50 Ω to VDD[5]
VDD – 0.1
–
VOL
CML output low voltage
Terminated with 50 Ω to VDD[5]
VDD – 0.7 VDD – 0.3
CIN
Input capacitance
Measured at 10 MHz; per pin
IDD
Operating supply current
VIH
Condition
All CML outputs floating (internal IDD)
–
3
V
V
pF
Notes
3. VID minimum of 400 mV is required to meet all output AC Electrical Specifications. The device is functional with VID minimum of greater than 200 mV.
4. Positive current flows into the input pin, negative current flows out of the input pin.
5. Refer to Figure 3 on page 6.
Document Number: 001-56315 Rev. *F
Page 4 of 12
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CY2DM1502
AC Electrical Specifications
(VDD = 3.3 V ± 5% or 2.5 V ± 5%; TA = 0 °C to 70 °C (Commercial) or –40 °C to 85 °C (Industrial))
Parameter
Description
Condition
Min
Typ
Max
Unit
DC
–
1.5
GHz
FOUT = FIN
DC
–
1.5
GHz
Fout = DC to 150 MHz
250
–
700
mV
250
–
600
mV
Input rise/fall time < 1.5 ns
(20% to 80%)
–
–
480
ps
Output duty cycle
50% duty cycle at input
Frequency range up to 1 GHz
48
–
52
%
tSK1[8]
Output-to-output skew
Any output to any output, with
same load conditions at DUT
–
–
20
ps
tSK1 D[8]
Device-to-device output skew
Any output to any output
between two or more devices.
Devices must have the same
input and have the same output
load.
–
–
150
ps
PNADD
Additive RMS phase noise
156.25-MHz Input
Rise/fall time < 150 ps (20% to 80%)
VID > 400 mV
Offset = 1 kHz
–
–
–120
dBc/Hz
Offset = 10 kHz
–
–
–130
dBc/Hz
Offset = 100 kHz
–
–
–135
dBc/Hz
FIN
Input frequency
FOUT
Output frequency
VPP
CML differential output voltage
peak-to-peak, single-ended.
Terminated with 50 Ω to VDD[5]
Fout = >150 MHz to 1.5 GHz
tPD[6]
Propagation delay input pair to output
pair
tODC[7]
Offset = 1 MHz
–
–
–145
dBc/Hz
Offset = 10 MHz
–
–
–153
dBc/Hz
Offset = 20 MHz
–
–
–155
dBc/Hz
tJIT[9]
Additive RMS phase jitter (Random)
156.25 MHz, 12 kHz to 20 MHz
offset; input rise/fall time <
150 ps (20% to 80%), VID >
400 mV
–
–
0.15
ps
tR, tF[10]
Output rise/fall time
50% duty cycle at input,
20% to 80% of full swing
(VOL to VOH)
Input rise/fall time < 1.5 ns
(20% to 80%)
Measured at 1 GHz
–
–
250
ps
Notes
6. Refer to Figure 4 on page 6.
7. Refer to Figure 5 on page 6.
8. Refer to Figure 6 on page 7.
9. Refer to Figure 7 on page 7.
10. Refer to Figure 8 on page 7.
Document Number: 001-56315 Rev. *F
Page 5 of 12
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CY2DM1502
Figure 2. Input Differential and Common Mode Voltages
VA
IN
VICM = (VA + VB)/2
VID
IN#
VB
Figure 3. Output Differential Voltage
VOH
Q
VPP
Q#
VOL
Figure 4. Input to Any Output Pair Propagation Delay
IN
IN #
QX
Q X#
tP D
Figure 5. Output Duty Cycle
QX
Q X#
tPW
tPERIOD
tODC =
Document Number: 001-56315 Rev. *F
tPW
tPERIOD
Page 6 of 12
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CY2DM1502
Figure 6. Output-to-Output and Device-to-Device Skew
QX
Q X#
Device 1
QY
Q Y#
tSK1
QZ
Device 2
Q Z#
tSK1 D
Figure 7. RMS Phase Jitter
Phase noise
Noise Power
Phase noise mark
Offset Frequency
f2
f1
RMS Jitter ∝
Area Under the Masked Phase Noise Plot
Figure 8. Output Rise/Fall Time
QX
80% 80%
VPP
20%
QX#
20%
tR
Document Number: 001-56315 Rev. *F
tF
Page 7 of 12
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CY2DM1502
Ordering Information
Part Number
Type
Production Flow
Pb-free
CY2DM1502ZXC
8-Pin TSSOP
Commercial, 0 °C to 70 °C
CY2DM1502ZXCT
8-Pin TSSOP tape and reel
Commercial, 0 °C to 70 °C
CY2DM1502ZXI
8-Pin TSSOP
Industrial, –40 °C to 85 °C
CY2DM1502ZXIT
8-Pin TSSOP tape and reel
Industrial, –40 °C to 85 °C
Ordering Code Definition
CY 2DM15 02 ZX C/I T
Tape and reel
Temperature range
C = Commercial
I = Industrial
Pb-free TSSOP package
Number of differential output pairs
Base part number
Company ID: CY = Cypress
Document Number: 001-56315 Rev. *F
Page 8 of 12
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CY2DM1502
Package Dimension
Figure 9. 8-Pin Thin Shrunk Small Outline Package (4.40 MM Body) Z8
51-85093 *C
Document Number: 001-56315 Rev. *F
Page 9 of 12
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CY2DM1502
Acronyms
Document Conventions
Table 2. Acronyms Used in this Document
Table 3. Units of Measure
Acronym
Description
Symbol
Unit of Measure
CML
current mode logic
°C
degree Celsius
ESD
electrostatic discharge
dBc
decibels relative to the carrier
HBM
human body model
GHz
giga hertz
JEDEC
Joint electron devices engineering council
Hz
hertz
LVDS
low-voltage differential signal
kΩ
kilo ohm
LVCMOS
low-voltage complementary metal oxide
semiconductor
µA
microamperes
µF
micro Farad
LVPECL
low-voltage positive emitter-coupled logic
LVTTL
low-voltage transistor-transistor logic
OE
Output enable
RMS
root mean square
TSSOP
thin shrunk small outline package
Document Number: 001-56315 Rev. *F
µs
microsecond
mA
milliamperes
ms
millisecond
mV
millivolt
MHz
megahertz
ns
nanosecond
Ω
ohm
pF
pico Farad
ps
pico second
V
volts
W
watts
Page 10 of 12
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CY2DM1502
Document History Page
Document Title: CY2DM1502 1:2 CML / LVPECL Input to CML Output Fanout Buffer
Document Number: 001-56315
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
**
2782891
CXQ
10/09/09
*A
2838916
CXQ
01/05/2010
Changed status from “ADVANCE” to “PRELIMINARY”.
Changed from 0.34 ps to 0.25 ps maximum additive jitter in “Features” on page
1 and in tJIT in the AC Electrical Specs table on page 4.
Added tPU spec to the Operating Conditions table on page 2.
Removed VOH spec maximum of VDD in the DC Electrical Specs table on page
3.
Changed VOL spec min from VDD - 0.6V to VDD - 0.7V; changed max from VDD
- 0.4V to VDD - 0.3V in the DC Electrical Specs table on page 3.
Removed VOD spec of minimum 300 mV, maximum 450 mV in the DC
Electrical Specs table on page 3.
Added RP spec in the DC Electrical Specs table on page 3. Min = 60 kΩ, Max
= 140 kΩ.
Added a measurement definition for CIN in the DC Electrical Specs table on
page 3.
Added VPP spec to the AC Electrical Specs table on page 4. VPP max = 700
mV for DC - 150 MHz and max = 600 mV for 150 MHz to 1.5 GHz. VPP min =
250 mV over the entire range.
Changed letter case and some names of all the timing parameters in the AC
Electrical Specs table on page 4 to be consistent with EROS.
Lowered all additive phase noise mask specs by 3 dB in in the AC Electrical
Specs table on page 4.
Added condition to tR and tF specs in the AC Electrical specs table on page 4
that input rise/fall time must be less than 1.5 ns (20% to 80%).
Changed letter case and some names of all the timing parameters in Figures
3, 4, 5, 6 and 8, to be consistent with EROS.
*B
3011766
CXQ
08/20/2010
Changed from 0.25 ps to 0.11 ps maximum additive jitter in “Features” on page
1 and in tJIT in the AC Electrical Specs table.
Added note 3 to describe IIH and IIL specs.
Removed reference to data distribution from “Functional Description”.
Changed RP for diff inputs from 100 kΩ to 150 kΩ in the Logic Block Diagram
and from 60 kΩ min / 140 kΩ max to 90 kΩ min / 210 kΩ max in the DC
Electrical Specs table.
Added max VID of 1.0V in DC Electrical Specs table.
Updated phase noise specs for 1 k/10 k/100 k/1 M/10 M/20 MHz offset to
-120/-130/-135/-150/-150/-150dBc/Hz, respectively, in the AC Electrical
Specs table.
Added “Frequency range up to 1 GHz” condition to tODC spec.
Updated package diagram.
Added Acronyms and Ordering Code Definition.
*C
3017258
CXQ
08/27/2010
Corrected Output Rise/Fall time diagram.
*D
3100234
CXQ
11/18/2010
Updated Phase jitter to 0.15ps max from 0.11ps max.
Changed VIN and VOUT specs from 4.0V to “lesser of 4.0 or VDD + 0.4”
Removed 200mA min LU spec, replaced with “Meets or exceeds JEDEC Spec
JESD78B IC Latchup Test”
Removed RP spec for differential input clock pins INX and INX#.
Changed CIN condition to “Measured at 10 MHz”.
Changed PNADD specs for 1MHz, 10MHz, and 20MHz offsets.
Added condition “Measured at 1 GHz” to tR, tF specs.
*E
3137726
CXQ
01/13/2011
Removed “Preliminary” status heading.
Removed resistors from IN/IN# in Logic Block Diagram.
*F
3090938
CXQ
02/25/2011
Post to external web.
Document Number: 001-56315 Rev. *F
New Datasheet.
Page 11 of 12
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© Cypress Semiconductor Corporation, 2009-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-56315 Rev. *F
Revised February 25, 2011
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