FAIRCHILD FDD4243

FDD4243
40V P-Channel PowerTrench® MOSFET
-40V, -14A, 44mΩ
Features
General Description
„ Max rDS(on) = 44mΩ at VGS = -10V, ID = -6.7A
This P-Channel MOSFET has been produced using Fairchild
Semiconductor’s proprietary PowerTrench® technology to
deliver low rDS(on) and optimized Bvdss capability to offer
superior performance benefit in the applications.
„ Max rDS(on) = 64mΩ at VGS = -4.5V, ID = -5.5A
„ High performance trench technology for extremely low rDS(on)
„ RoHS Compliant
Application
„ Inverter
„ Power Supplies
S
D
G
S
G
D
-PA
K
TO
-2 52
(TO -252)
D
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VDS
Drain to Source Voltage
Parameter
VGS
Gate to Source Voltage
Drain Current
ID
V
-Continuous (Silicon limited)
TC= 25°C
(Note 1)
-24
-Continuous
TA= 25°C
(Note 1a)
-6.7
-14
A
-60
(Note 3)
Power Dissipation
TC= 25°C
Power Dissipation
TJ, TSTG
±20
TC= 25°C
-Pulsed
PD
Units
V
-Continuous (Package limited)
Single Pulse Avalanche Energy
EAS
Ratings
-40
84
42
(Note 1a)
Operating and Storage Junction Temperature Range
3
-55 to +150
mJ
W
°C
Thermal Characteristics
RθJC
Thermal Resistance, Junction to Case
RθJA
Thermal Resistance, Junction to Ambient
3.0
(Note 1a)
40
°C/W
Package Marking and Ordering Information
Device Marking
FDD4243
©2007 Fairchild Semiconductor Corporation
FDD4243 Rev.C1
Device
FDD4243
Package
D-PAK(TO-252)
1
Reel Size
13’’
Tape Width
12mm
Quantity
2500 units
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FDD4243 40V P-Channel PowerTrench® MOSFET
November 2007
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = -250µA, VGS = 0V
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = -250µA, referenced to 25°C
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Source Leakage Current
V
-40
-32
VDS = -32V,
VGS = 0V
mV/°C
-1
TJ = 125°C
-100
VGS = ±20V, VGS = 0V
µA
±100
nA
-3.0
V
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = -250µA
∆VGS(th)
∆TJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = -250µA, referenced to 25°C
4.7
VGS = -10V, ID = -6.7A
36
44
rDS(on)
Drain to Source On Resistance
VGS = -4.5V, ID = -5.5A
48
64
VGS = -10V, ID = -6.7A, TJ = 125°C
53
69
VDS = -5V, ID = -6.7A
16
gFS
Forward Transconductance
-1.4
-1.6
mV/°C
mΩ
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
VDS = -20V, VGS = 0V,
f = 1MHz
1165
1550
pF
165
220
pF
90
135
pF
Ω
f = 1MHz
4
VDD = -20V, ID = -6.7A
VGS = -10V, RGEN = 6Ω
6
12
ns
15
26
ns
22
35
ns
7
14
ns
21
29
nC
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg(TOT)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDD = -20V, ID = -6.7A
VGS = -10V
3.4
nC
4
nC
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0V, IS = -6.7A
(Note 2)
IF = -6.7A, di/dt = 100A/µs
0.86
1.2
V
29
43
ns
30
44
nC
Notes:
1: RθJA is sum of junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is
guaranteed by design while RθJC is determined by the user’s board design.
a. 40°C/W when mounted on a 1 in2 pad of 2 oz copper
b. 96°C/W when mounted on a minimum pad.
2: Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
3: Starting TJ = 25°C, L = 3mH, IAS = 7.5A, VDD = 40V, VGS = 10V.
FDD4243 Rev.C1
2
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FDD4243 40V P-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25°C unless otherwise noted
50
40
3.5
VGS = -10V
VGS = -4.5V
VGS = - 6V
VGS = -5V
VGS = -4V
30
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
20
VGS = - 3.0V
10
0
0
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
-ID, DRAIN CURRENT (A)
60
1
2
3
4
-VDS, DRAIN TO SOURCE VOLTAGE (V)
5
ID = -6.7A
VGS = -10V
1.4
1.2
1.0
0.8
0.6
-50
-25
0
25
50
75
100 125
TJ, JUNCTION TEMPERATURE (oC)
150
Figure 3. Normalized On Resistance
vs Junction Temperature
-IS, REVERSE DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
40
TJ = 150oC
TJ = 25oC
30
20
TJ = -55oC
10
0
1
2
3
4
5
-VGS, GATE TO SOURCE VOLTAGE (V)
6
VGS = -6V
2.0
1.5
VGS = -10V
1.0
0.5
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
0
10
20
30
40
-ID, DRAIN CURRENT(A)
50
60
ID = -6.7A
100
80
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
TJ = 125oC
60
TJ = 25oC
40
20
2
3
4
5
6
7
8
9
-VGS, GATE TO SOURCE VOLTAGE (V)
10
30
VGS = 0V
10
TJ = 150oC
TJ = 25oC
1
TJ = -55oC
0.1
0.4
0.6
0.8
1.0
1.2
-VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
FDD4243 Rev.C1
VGS = -5V
Figure 4. On-Resistance vs Gate to
Source Voltage
60
50
2.5
120
1.8
1.6
VGS = -4V
VGS = -4.5V
Figure 2. Normalized On-Resistance
vs Drain Current and Gate Voltage
rDS(on), DRAIN TO
SOURCE ON-RESISTANCE (mΩ)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
Figure 1. On Region Characteristics
VGS = -3.0V
3.0
Figure 6. Source to Drain Diode
Forward Voltage vs Source Current
3
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FDD4243 40V P-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
-VGS, GATE TO SOURCE VOLTAGE(V)
10
3000
ID = -6.7A
6
CAPACITANCE (pF)
VDD = -10V
8
VDD = -20V
VDD = -30V
4
2
0
1000
Coss
100
0
4
8
12
16
20
50
0.1
24
Qg, GATE CHARGE(nC)
Figure 7. Gate Charge Characteristics
Crss
30
1
10
-VDS, DRAIN TO SOURCE VOLTAGE (V)
25
8
-ID, DRAIN CURRENT (A)
-IAS, AVALANCHE CURRENT(A)
f = 1MHz
VGS = 0V
Figure 8. Capacitance vs Drain
to Source Voltage
10
6
TJ = 25oC
4
2
TJ = 125oC
20
VGS = -10V
15
10
Limited by Package
VGS = -4.5V
5
o
RθJC = 3.0 C/W
1
0.01
0.1
1
tAV, TIME IN AVALANCHE(ms)
10
0
25
30
100
125
150
Figure 10. Maximum Continuous Drain
Current vs Case Temperature
10000
P(PK), PEAK TRANSIENT POWER (W)
100us
10
1ms
1
10ms
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
1
SINGLE PULSE
TJ = MAX RATED
100ms
TC = 25OC
10
100
-VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe
Operating Area
FDD4243 Rev.C1
75
TC, CASE TEMPERATURE ( C)
100
0.1
0.5
50
o
Figure 9. Unclamped Inductive
Switching Capability
-ID, DRAIN CURRENT (A)
Ciss
FOR TEMPERATURES
VGS = -10V
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
1000
150 – TC
---------------------125
I = I25
TC = 25oC
100
SINGLE PULSE
30
-5
10
-4
10
-3
-2
-1
10
10
10
t, PULSE WIDTH (s)
0
10
1
10
Figure 12. Single Pulse Maximum
Power Dissipation
4
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FDD4243 40V P-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
2
DUTY CYCLE-DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE, ZθJC
1
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.1
PDM
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
0.01
SINGLE PULSE
0.003
-5
10
-4
10
-3
-2
10
10
-1
10
0
10
1
10
t, RECTANGULAR PULSE DURATION (s)
Figure 13. Transient Thermal Response Curve
FDD4243 Rev.C1
5
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FDD4243 40V P-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25°C unless otherwise noted
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PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
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As used herein:
1.
2.
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when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
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A critical component in any component of a life support,
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
tm
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor reserves
the right to make changes at any time without notice to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only.
Rev. I31
FDD4243 Rev.C1
6
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FDD4243 40V P-Channel PowerTrench® MOSFET
TRADEMARKS