Data Sheet June 29, 2009 KNW013-020 (Sixteenth-Brick) Power Modules: 36 –75Vdc Input; 3.3Vdc to 5.0Vdc Output; 13A to 20A Output Current RoHS Compliant Applications Features Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to RoHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) Delivers up to 20A output current 5V(13A), 3.3V(20A) High efficiency – 91% at 3.3V full load Small size and low profile: 33.0 mm x 22.9 mm x 10.2 mm (1.30 in x 0.9 in x 0.40 in) Industry standard DOSA footprint Distributed power architectures -20% to +10% output voltage adjustment trim Wireless networks Remote on/off Access and optical networking equipment including Power over Ethernet (PoE) Remote sense Enterprise networks No reverse current during output shutdown Over temperature protection (latching) Output overcurrent/overvoltage protection (latching) Latest generation IC’s (DSP, FPGA, ASIC) and Microprocessor powered applications Options Negative Remote On/Off logic Surface Mount (Tape and Reel, -SR Suffix) Over current/Over temperature/Over voltage protections (auto-restart) Shorter lead trim Wide operating temperature range (-40°C to 85°C) 2250 Vdc Isolation tested in compliance with IEEE ¤ 802.3 PoE standards Meets the voltage isolation requirements for ETSI 300-132-2 and complies with and is licensed for Basic Insulation rating per EN60950-1 UL*Recognized to UL60950-1, CAN/CSA† C22.2 No.60950-1, and EN60950-1(VDE ‡ 0805-1) Licensed CE mark meets 2006/95/EC directive§ ISO** 9001 and ISO 14001 certified manufacturing facilities Description The KNW (Sixteenth-brick) series power modules are isolated dc-dc converters that operate over a wide input voltage range of 36 to 75Vdc and provide a single precisely regulated output. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, typical efficiency of 91% for 3.3V/20A. These open frame modules are available either in surface-mount (-SR) or in through-hole (TH) form. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. Document No: DS08-009 ver. 1.01 * UL is a registered trademark of Underwriters Laboratories, Inc. PDF name: knw013-020_ds.pdf † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-use equipment. All of the required procedures of end-use equipment should be followed. ** ISO is a registered trademark of the International Organization of Standards Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Operating Input Voltage Continuous All VIN -0.3 80 Vdc Transient (100 ms) All VIN,trans -0.3 100 Vdc All TA -40 85 °C All Tstg -55 125 °C All ⎯ ⎯ 2250 Vdc Operating Ambient Temperature (see Thermal Considerations section) Storage Temperature I/O Isolation voltage (100% Factory Hi-Pot tested) Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 36 48 75 Vdc Maximum Input Current (VIN= VIN, min to VIN, max, IO=IO, max) All IIN,max 1.7 2.4 All IIN,No load 45 All IIN,stand-by 6 Inrush Transient All It Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) All 30 mAp-p Input Ripple Rejection (120Hz) All 60 dB Input No Load Current (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current (VIN = VIN, nom, module disabled) EMC, EN55022 2 Adc mA 8 0.1 mA 2 As See EMC Considerations section CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. LINEAGE POWER 2 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Electrical Specifications (continued) Parameter Output Voltage Set-point (VIN=VIN, min, IO=IO, max, TA=25°C) Device Symbol Min Typ Max Unit 5.0V VO, set 4.93 5.0 5.07 Vdc 3.3V VO, set 3.25 3.3 3.35 Vdc All VO -3.0 +3.0 % VO, set All VO, adj -20.0 +10.0 % VO, set 0.1 % VO, set Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Selected by an external resistor Output Regulation ⎯ ⎯ Line (VIN=VIN, min to VIN, max) All Load (IO=IO, min to IO, max) All ⎯ ⎯ 0.1 % VO, set Temperature (Tref=TA, min to TA, max) All ⎯ ⎯ 1.0 % VO, set All ⎯ ⎯ 25 75 30 100 mVrms mVpk-pk 0 ⎯ 10,000 μF 20,000 μF Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance Rated Output Current Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO≤250mV) ( Hiccup Mode ) Efficiency VIN= VIN, nom; TA=25°C; IO=IO, max ; VO= VO,set 5.0V CO, max 3.3V CO, max 5.0V IO, Rated 0 ⎯ 13 Adc 3.3V IO, Rated 0 ⎯ 20 Adc All IO, lim 115 120 130 %IO, Rated All IO, s/c ⎯ 20 ⎯ %IOmax Arms 5.0V η 91.0 3.3V η All fsw ⎯ Peak Deviation All Vpk ⎯ Settling Time (VO<10% peak deviation) All ts ⎯ Load Change from IO= 50% to 75% or 25% to 50% of IO,max; Peak Deviation All Vpk ⎯ Settling Time (VO<10% peak deviation) All ts ⎯ Switching Frequency % 91.0 % ⎯ kHz 4 ⎯ % VO, set 200 ⎯ μs 5 ⎯ % VO, set 200 ⎯ μs 400 Dynamic Load Response (dIO/dt=0.1A/μs; VIN = VIN, nom; TA=25°C) Load Change from IO= 50% to 75% or 25% to 50% of IO,max; (dIO/dt=1.0A/μs; VIN = VIN, nom; TA=25°C) Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All Ciso ⎯ 1000 ⎯ pF Isolation Resistance All Riso 10 ⎯ ⎯ MΩ I/O Isolation Voltage All All ⎯ ⎯ 2250 Vdc LINEAGE POWER 3 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current General Specifications Parameter Calculated Reliability Based upon Telcordia SR332 Issue 2: Method I, Case 3, (IO=80%IO, max, TA=40°C, Airflow = 200 lfm), 90% confidence Powered Random Vibration (VIN=VIN, min, IO=IO, max, TA=25°C, 0 to 5000Hz, 10Grms) Weight Device Symbol 5.0V MTBF Min 4,114,000 Hours 5.0V FIT 243.1 10 /Hours 3.3V MTBF 4,589,027 Hours 3.3V FIT 217.9 10 /Hours All 90 Minutes All 15.6 (0.55) ⎯ Typ Max Unit 9 9 ⎯ g (oz.) Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit mA Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off ⎯ ⎯ 1.0 Logic Low - On/Off Voltage All Von/off -0.7 ⎯ 1.2 V Logic High Voltage – (Typ = Open Collector) All Von/off ⎯ 5 V Logic High maximum allowable leakage current All Ion/off ⎯ ⎯ 10 μA All Tdelay ― 13 20 msec All Tdelay ― 30 35 msec 5.0 Trise ― 20 25 msec 3.3 Trise ― 6 10 msec ― 3 % VO, set Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25 C) Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (delay from instant at which VIN = VIN, min until VO=10% of VO,set) Case 2: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = from instant at which VIN=VIN, min until VO = 10% of VO, set) Output voltage Rise time (time for Vo to rise from 10% of VO,set to 90% of VO, set) Output voltage overshoot – Startup o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range Output Overvoltage Protection +10 % VO, set 5.0V All VO, limit 6.1 ⎯ 7.0 Vdc 3.3V VO, limit 4.0 ⎯ 4.6 Vdc Input Undervoltage Lockout Turn-on Threshold All Vuv/on 32.5 34.0 35.8 Vdc Turn-off Threshold All Vuv/off 30.0 31.0 33.0 Vdc Hysterisis All Vhyst 2 ⎯ ⎯ Vdc LINEAGE POWER 4 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Characteristic Curves The following figures provide typical characteristics for the KNW013A0A (5V, 13A) at 25oC. The figures are identical for either positive or negative remote On/Off logic. 95 14 12 85 OUTPUT CURRENT, Io (A) EFFICIENCY, η (%) 90 Vin=75V Vin=48V 80 Vin=36V 75 70 0 3 6 9 12 15 Figure 3. Transient Response to Dynamic Load Change, 0.1A/µS, from 75% to 50% to 75% of full load. LINEAGE POWER 4 2.0 m/s 400 LFM 2 0 20 30 40 50 60 70 80 90 VOn/off (V) (2V/div) VO (V) (2V/div) OUTPUT VOLTAGE On/Off VOLTAGE TIME, t (10ms/div) VIN (V) (20V/div) Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max). INPUT VOLTAGE TIME, t (200 μs /div) 1.0 m/s 200 LFM 6 Figure 4. Derating Output Current versus Local Ambient Temperature and Airflow. VO (V) (2V/div) VO (V) (200mV/div) Io (A) (10A/div) OUTPUT CURRENT OUTPUT VOLTAGE Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Io,max). 0.5 m/s 100 LFM 8 AMBIENT TEMPERATURE, TA C OUTPUT VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE TIME, t (1μs/div) NC O OUTPUT CURRENT, IO (A) Figure 1. Converter Efficiency versus Output Current. 10 TIME, t (5ms/div) Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Io = Io,max). 5 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Characteristic Curves The following figures provide typical characteristics for the KNW020A0F (3.3V, 20A) at 25 OC. The figures are identical for either positive or negative remote On/Off logic. 95 20 85 Vin=36V 80 OUTPUT CURRENT, Io (A) EFFICIENCY, η (%) 90 Vin=75V Vin=48 75 70 0 5 10 15 20 0.5 m/s 100 LFM 1.0 m/s 200 LFM 5 2.0 m/s 400 LFM 0 30 40 50 60 70 80 90 O AMBIENT TEMPERATURE, TA C Figure 11. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max). INPUT VOLTAGE VIN (V) (20V/div) Io (A) (5A/div) VO (V) (100mV/div) Figure 8. Typical output ripple and noise (VIN = VIN,NOM, Io = Io,max). VO (V) (1V/div) TIME, t (5ms/div) OUTPUT VOLTAGE VO (V) (1V/div) VOn/off (V) (2V/div) Figure 10. Derating Output Current versus Local Ambient Temperature and Airflow. OUTPUT VOLTAGE On/Off VOLTAGE VO (V) (20mV/div) OUTPUT VOLTAGE 10 OUTPUT CURRENT OUTPUT VOLTAGE TIME, t (1μs/div) NC 20 OUTPUT CURRENT, IO (A) Figure 7. Converter Efficiency versus Output Current. 15 TIME, t (200 μs /div) Figure 9. Transient Response to Dynamic Load Change, 0.1A/µS, from 75% to 50% to 75% of full load. LINEAGE POWER TIME, t (5ms/div) Figure 12. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Io = Io,max). 6 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE LTEST Vin+ BATTERY 12μH CS 220μF 33μF E.S.R.<0.1Ω @ 20°C 100kHz The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 13, a 33μF electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. Vin- Safety Considerations NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12μH. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 13. Input Reflected Ripple Current Test Setup. COPPER STRIP VO (+) RESISTIVE LOAD SCOPE V O (–) 0.1uF 10uF GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 14. Output Ripple and Noise Test Setup. Rdistribution Rcontact Rcontact Vin+ RLOAD VO VIN Rdistribution Rcontact Rcontact Vin- Rdistribution Vout+ Rdistribution Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 15. Output Voltage and Efficiency Test Setup. VO. IO Efficiency η = LINEAGE POWER VIN. IIN x 100 % For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e UL60950-1, CSA C22.2 No.60950-1, and VDE0805-1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 5 A time-delay fuse in the ungrounded lead. 7 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. SENSE(+) SENSE(–) SUPPLY II VI(+) VO(+) VI(-) VO(–) CONTACT RESISTANCE Vin+ IO LOAD CONTACT AND DISTRIBUTION LOSSE Vout+ Figure 17. Circuit Configuration for remote sense. Ion/off ON/OFF TRIM Von/off Vin- Vout- Figure 16. Remote On/Off Implementation. Input Undervoltage Lockout At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Overtemperature Protection To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 16). Logic low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a logic low is 1mA; the switch should be maintaining a logic low level while sinking this current. During a logic high, the typical maximum Von/off generated by the module is 15V, and the maximum allowable leakage current at Von/off = 5V is 1μA. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 17). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 10% VO,set Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should LINEAGE POWER To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point o Tref (Figure 19), exceeds 128-133 C (typical) depending on TA and airflow, but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature. Output Overvoltage Protection The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second, or by toggling the remote on/off signal for at least one second. If the unit is configured with the 8 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Feature Descriptions (continued) auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max. Output Voltage Programming Trimming allows the output voltage set point to be increased or decreased. This is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. VIN(+) ⎡ 5.11 × Vo , set × (100 + Δ %) 511 ⎤ Rtrim − up = ⎢ − − 10 .22 ⎥ ΚΩ 1.225 × Δ % Δ% ⎣ ⎦ Where ⎛V − V o , set Δ % = ⎜⎜ desired V o , set ⎝ ⎞ ⎟ × 100 ⎟ ⎠ For example, to trim-up the output voltage of 5.0V module (KNW013A0A/A1) by 5% to 5.25V, Rtrim-up is calculated is as follows: Δ% = 5 ⎡ 5 . 11 × 5 . 0 × (100 + 5 ) 511 ⎤ − − 10 . 22 ⎥ ΚΩ R trim − up = ⎢ 1 . 225 × 5 5 ⎣ ⎦ VO(+) Rtrim −up = 325 .6 ΚΩ Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VIN(-) VO(-) Figure 18. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the Vo(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of Δ% ⎡ 511 ⎤ R trim − down = ⎢ − 10 . 22 ⎥ ΚΩ ⎣ Δ% ⎦ Where Δ % = ⎛⎜ V o , set − V desired ⎜ V o , set ⎝ ⎞ ⎟ × 100 ⎟ ⎠ For example, to trim-down the output voltage of 3.3V module (KNW020A0F/F1) by 8% to 3.036V, Rtrim-down is calculated as follows: Δ% = 8 ⎡ 511 ⎤ Rtrim − down = ⎢ − 10.22 ⎥ ΚΩ ⎣ 8 ⎦ R trim − down = 53 . 6 ΚΩ The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference points, Trefx, used in the specifications are shown in Figure 19. For reliable operation, the temperature of both Tref points should o not exceed 125 C. Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equations determine the required external resistor value to obtain a percentage output voltage change of Δ%: LINEAGE POWER 9 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Thermal Considerations (continued) Figure 21. KNW020A0F Quasi Peak Conducted Emissions with EN 55022 Class A limits, Figure 20 filter (VIN = VIN,NOM, Io = 0.80 Io,max). Layout Considerations Avoid placing copper areas on the outer layer of the application PCB directly underneath the power module in the keep out areas shown in the Recommended Pad Layout figures. Also avoid placing via interconnects underneath the power module in these keep out areas. Figure 19. Trefx Temperature Measurement Location. Please refer to the Application Note “Thermal Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. EMC Considerations The KNW series module shall also meet limits of EN55022 Class B with a recommended single stage filter, shown in Figure 20. Please contact your Lineage Power Sales Representative for further information. Figure 20. Single stage filter used for test results. LINEAGE POWER 10 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Surface Mount Information Pick and Place The KNW013-020 modules use an open frame construction and are designed for a fully automated assembly process. The pick and place locations on the module are the larger magnetic core or the transistor package as shown in Figure 22. The modules are fitted with a label which meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow o temperatures of up to 300 C. The label also carries product information such as product code, serial number and the location of manufacture. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than o o 235 C. Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. 300 P eak Temp 235oC REFLOW TEMP (°C) 250 Co o ling zo ne 1-4oCs -1 Heat zo ne max 4oCs -1 200 150 So ak zo ne 30-240s 100 Tlim above 205oC P reheat zo ne max 4oCs -1 50 0 REFLOW TIME (S) Figure 22. Pick and Place Locations. Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process Nozzle Recommendations 240 235 MAX TEMP SOLDER (°C) The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The recommended nozzle diameter for reliable operation is 5mm. Oblong or oval nozzles up to 11 x 5 mm may also be used within the space available. 230 225 220 215 210 Tin Lead Soldering 205 The KNW013-020 power modules (both non-Z and –Z codes) can be soldered either in a conventional Tin/Lead (Sn/Pb) process. The non-Z version of the KNW013-020 modules are RoHS compliant with the lead exception. Lead based solder paste is used in the soldering process during the manufacturing of these modules. These modules can only be soldered in conventional Tin/lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. 200 LINEAGE POWER 0 10 20 30 40 50 60 Figure 24. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process 11 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Surface Mount Information (continued) 300 Lead Free Soldering Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 25. MSL Rating The KNW013-020 modules have a MSL rating of 1. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Peak Temp 260°C 250 Reflow Temp (°C) The –Z version of the KNW013-020 modules are lead-free (Pb-free) and RoHS compliant, and are both forward and backward compatible in a Pb-free and a SnPb soldering process. The non-Z version of the KNW006/010 modules are RoHS compliant with the lead exception. Lead based solder paste is used in the soldering process during the manufacturing of these modules. These modules can only be soldered in conventional Tin/lead (Sn/Pb) process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Per J-STD-020 Rev. C 200 * Min. Time Above 235°C 15 Seconds 150 Heating Zone 1°C/Second Cooling Zone *Time Above 217°C 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 25. Recommended linear reflow profile using Sn/Ag/Cu solder. Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3°C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210°C. For Pb solder, the recommended pot temperature is 260°C, and, for Pb-free solder, the recommended pot temperature is 270°C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). LINEAGE POWER 12 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Mechanical Outline for Surface Mount Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] Top View Side View Bottom View PIN FUNCTION 1 VIN(+) 2 On/Off 3 VIN(-) 4 Vo(-) 5 Sense(-) 6 Trim 7 Sense(+) 8 Vo(+) LINEAGE POWER 13 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] Top View Side View Bottom View PIN 1 2 3 4 5 6 7 8 FUNCTION VIN(+) On/Off VIN(-) Vo(-) Sense(-) Trim Sense(+) Vo(+) LINEAGE POWER 14 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Recommended Pad Layout Dimensions are in and millimeters [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] SMT Recommended Pad Layout (Component Side View) TH Recommended Pad Layout (Component Side View) LINEAGE POWER 15 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Packaging Details The Sixteenth-brick SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown below. Modules are shipped in quantities of 140 modules per reel. Tape Dimensions Dimensions are in millimeters. LINEAGE POWER 16 Data Sheet June 29, 2009 KNW013-020 Series Power Modules: 36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current Ordering Information Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Code Product Codes Input Voltage KNW013A0A41-SRZ KNW013A0A41Z KNW020A0F41-SRZ KNW020A0F41Z 48V (36-75Vdc) 48V (36-75Vdc) 48V (36-75Vdc) 48V (36-75Vdc) Output Voltage 5.0V 5.0V 3.3V 3.3V Output Current 13A 13A 20A 20A On/Off Logic Negative Negative Negative Negative Connector Type Surface mount Through hole Surface mount Through hole Comcode CC109141438 CC109141446 CC109139267 CC109139275 Ratings Table 2. Device Coding Scheme and Options Characteristic Form Factor Family Designator Input Voltage Output Current Output Voltage Character and Position Definition K = Sixteenth Brick W W = Wide Input Voltage Range, 36V -75V 020A0 = 020.0 Amps Rated Output Current F = 3.3 Vout Nominal Omit = No Pin Trim 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Omit = Latching Mode 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic 1 = Negative Logic K N 020A0 F Pin Length Options Action following Protective Shutdown On/Off logic Customer Specific Mechanical Features RoHS 6 8 4 1 XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module S R SR = Surface mount connections (Tape and Reel) Omit = RoHS 5/6, Lead Based Solder Used Z Z = RoHS 6/6 Compliant, Lead free Asia-Pacific Headquarters Tel: +65 6416 4283 World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: [email protected] Europe, Middle-East and Africa Headquarters Tel: +49 898 780 672 80 India Headquarters Tel: +91 80 28411633 Lineage Power reserves the right to m ake changes to t he product(s) or inf ormation contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. © 2008 Lineage Pow er C orporation, (Mesquite, Texas) All I nternational Rights Res erved. Document No: DS08-009 ver. 1.01 PDF name: knw013-020_ds.pdf