VISHAY TSHG5210

TSHG5210
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS Compliant, 850 nm,
GaAlAs Double Hetero
FEATURES
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94 8390
DESCRIPTION
TSHG5210 is an infrared, 850 nm emitting diode in GaAlAs
double hetero (DH) technology with high radiant power and
high speed, molded in a clear, untinted plastic package.
Package type: leaded
Package form: T-1¾
Dimensions (in mm): ∅ 5
Leads with stand-off
Peak wavelength: λp = 850 nm
High reliability
High radiant power
High radiant intensity
Angle of half intensity: ϕ = ± 10°
Low forward voltage
Suitable for high pulse current operation
High modulation bandwidth: fc = 18 MHz
Good spectral matching with CMOS cameras
Lead (Pb)-free component in accordance
RoHS 2002/95/EC and WEEE 2002/96/EC
with
APPLICATIONS
• Infrared radiation source for operation with CMOS
cameras
• High speed IR data transmission
• Smoke-automatic fire detectors
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (deg)
λp (nm)
tr (ns)
230
± 10
850
20
TSHG5210
Note
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
Bulk
MOQ: 4000 pcs, 4000 pcs/bulk
T-1¾
TSHG5210
Note
MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Reverse voltage
TEST CONDITION
VR
5
UNIT
V
Forward current
IF
100
mA
200
mA
Peak forward current
tp/T = 0.5, tp = 100 µs
IFM
Surge forward current
tp = 100 µs
IFSM
1
A
PV
180
mW
Power dissipation
Junction temperature
Operating temperature range
Tj
100
°C
Tamb
- 40 to + 85
°C
Tstg
- 40 to + 100
°C
Soldering temperature
t ≤ 5 s, 2 mm from case
Tsd
260
°C
Thermal resistance junction/ambient
J-STD-051, leads 7 mm,
soldered on PCB
RthJA
230
K/W
Storage temperature range
Note
Tamb = 25 °C, unless otherwise specified
Document Number: 81810
Rev. 1.1, 04-Sep-08
For technical questions, contact: [email protected]
www.vishay.com
191
TSHG5210
Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS
Compliant, 850 nm, GaAlAs Double Hetero
200
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
RthJA = 230 K/W
100
80
60
40
100
80
RthJA = 230 K/W
60
40
20
20
0
0
0
10
21142
20
30
40
50
60
70 80
90 100
0
Tamb - Ambient Temperature (°C)
21143
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
10
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS
PARAMETER
TEST CONDITION
SYMBOL
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
Temperature coefficient of VF
Reverse current
Forward voltage
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of φe
MIN.
TYP.
MAX.
VF
1.5
1.8
VF
2.3
IF = 1 mA
TKVF
- 1.8
VR = 5 V
IR
VR = 0 V, f = 1 MHz, E = 0
Cj
IF = 100 mA, tp = 20 ms
Ie
230
V
V
mV/K
10
µA
420
mW/sr
125
140
UNIT
pF
IF = 1 A, tp = 100 µs
Ie
2300
mW/sr
IF = 100 mA, tp = 20 ms
φe
55
mW
IF = 100 mA
TKφe
- 0.35
%/K
ϕ
± 10
Angle of half intensity
deg
Peak wavelength
IF = 100 mA
λp
Spectral bandwidth
IF = 100 mA
Δλ
40
nm
Temperature coefficient of λp
IF = 100 mA
TKλp
0.25
nm/K
Rise time
IF = 100 mA
tr
20
ns
Fall time
IF = 100 mA
tf
13
ns
IDC = 70 mA, IAC = 30 mA pp
fc
18
MHz
d
3.7
mm
Cut-off frequency
Virtual source diameter
820
850
880
nm
Note
Tamb = 25 °C, unless otherwise specified
www.vishay.com
192
For technical questions, contact: [email protected]
Document Number: 81810
Rev. 1.1, 04-Sep-08
TSHG5210
High Speed Infrared Emitting Diode, RoHS Vishay Semiconductors
Compliant, 850 nm, GaAlAs Double Hetero
BASIC CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
1000
Tamb < 50 °C
tP/T = 0.01
1000
Radiant Power (mW)
IF - Forward Current (mA)
0.02
0.05
0.1
10
1
e-
0.2
100
0.5
100
0.01
0.1
0.1
1.0
10
100
tP - Pulse Duration (ms)
16031
1
100
1.25
Φe, rel - Relative Radiant Power
1000
100
tP = 100 µs
tP/T = 0.001
10
1.0
0.75
0.5
0.25
0
1
18873
1
3
2
VF - Forward Voltage (V)
4
800
Fig. 7 - Relative Radiant Power vs. Wavelength
0°
Ie rel - Relative Radiant Intensity
10 000
1000
100
10
tP = 0.1 ms
900
λ- Wavelength (nm)
16972
Fig. 4 - Forward Current vs. Forward Voltage
850
10°
20°
30°
40°
1.0
50°
0.9
60°
0.8
70°
ϕ - Angular Displacement
0
Ie - Radiant Intensity (mW/sr)
1000
Fig. 6 - Radiant Power vs. Forward Current
Fig. 3 - Pulse Forward Current vs. Pulse Duration
IF - Forward Current (mA)
10
IF - Forward Current (mA)
16971
80°
0.7
1
1
21307
10
100
1000
21111
0.6
0.4
0.2
0
IF - Forward Current (mA)
Fig. 5 - Radiant Intensity vs. Forward Current
Document Number: 81810
Rev. 1.1, 04-Sep-08
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
For technical questions, contact: [email protected]
www.vishay.com
193
TSHG5210
Vishay Semiconductors High Speed Infrared Emitting Diode, RoHS
Compliant, 850 nm, GaAlAs Double Hetero
PACKAGE DIMENSIONS in millimeters
C
± 0.15
A
(4.7)
< 0.7
8.7 ± 0.3
7.7 ± 0.15
AREA NOT PLANE
35.5
± 0.55
12.5
± 0.3
5.8
R 2.49 (sphere)
0.2
1.2 +- 0.1
1.5
± 0.25
5 ± 0.15
+ 0.15
0.5 - 0.05
6.544-5258.02-4
Issue: 5; 03.08.98
95 10916
www.vishay.com
194
technical drawings
according to DIN
specification
0.15
0.5 +- 0.05
2.54 nom.
For technical questions, contact: [email protected]
Document Number: 81810
Rev. 1.1, 04-Sep-08
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Document Number: 91000
Revision: 18-Jul-08
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