VISHAY TSTS7503

TSTS750.
Vishay Telefunken
GaAs IR Emitting Diodes in Hermetically Sealed TO18
Case
Description
The TSTS750. series are infrared emitting diodes in
standard GaAs technology in a hermetically sealed
TO–18 package. Their flat glass windows make them
ideal for use with external optics.
Features
D
D
D
D
D
Suitable for pulse operation
Wide angle of half intensity ϕ = ± 30°
Peak wavelength lp = 950 nm
High reliability
94 8400
Good spectral matching to Si photodetectors
Applications
Radiation source in near infrared range
Absolute Maximum Ratings
Tamb = 25_C
Parameter
Reverse Voltage
Forward Current
Peak Forward Current
Surge Forward Current
Power Dissipation
Test Conditions
x
Tcase
Junction Temperature
Storage Temperature Range
Thermal Resistance Junction/Ambient
Thermal Resistance Junction/Case
Document Number 81049
Rev. 2, 20-May-99
x
x
Tcase
25 °C
tp/T = 0.5, tp
100 ms,
Tcase
25 °C
tp
100 ms
x
x 25 °C
Symbol
VR
IF
IFM
Value
5
250
500
Unit
V
mA
mA
IFSM
PV
PV
Tj
Tstg
RthJA
RthJC
2.5
170
500
100
–55...+100
450
150
A
mW
mW
°C
°C
K/W
K/W
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TSTS750.
Vishay Telefunken
Basic Characteristics
Tamb = 25_C
Parameter
Forward Voltage
Breakdown Voltage
Junction Capacitance
Radiant Power
Temp. Coefficient of fe
Angle of Half Intensity
Peak Wavelength
Spectral Bandwidth
Rise Time
Test Conditions
IF = 100 mA, tp
20 ms
IR = 100 mA
VR = 0 V, f = 1 MHz, E = 0
IF = 100 mA, tp
20 ms
IF = 100 mA
x
x
Symbol
VF
V(BR)
Cj
Typ
1.3
tr
30
7
–0.8
±30
950
50
400
Unit
V
V
pF
mW
%/K
deg
nm
nm
ns
tf
400
ns
TKfe
ϕ
lp
Dl
x
x
Max
1.7
5
fe
IF = 100 mA
IF = 100 mA
IF = 1.5 A, tp/T = 0.01,
tp
10 ms
IF = 1.5 A, tp/T = 0.01,
tp
10 ms
Fall Time
Min
Type Dedicated Characteristics
Tamb = 25_C
Parameter
Radiant Intensity
y
Test Conditions
IF=100mA, tp=20ms
Type
TSTS7500
TSTS7501
TSTS7502
TSTS7503
Symbol
Ie
Ie
Ie
Ie
Min
1.25
1.6
2.5
4
Typ
1.6
2.5
4
6.3
Max
3.2
5
8
Unit
mW/sr
mW/sr
mW/sr
mW/sr
Typical Characteristics (Tamb = 25_C unless otherwise specified)
300
RthJC
500
IF – Forward Current ( mA )
PV – Power Dissipation ( mW )
600
400
300
200
RthJA
250
200
RthJC
150
50
100
0
0
0
94 8017 e
RthJA
100
25
50
75
100
125
Tamb – Ambient Temperature ( °C )
Figure 1. Power Dissipation vs. Ambient Temperature
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0
94 8018 e
20
40
60
80
100
Tamb – Ambient Temperature ( °C )
Figure 2. Forward Current vs. Ambient Temperature
Document Number 81049
Rev. 2, 20-May-99
TSTS750.
Vishay Telefunken
100
I e – Radiant Intensity ( mW/sr )
I F – Forward Current ( A )
101
IFSM = 2.5 A ( Single Pulse )
tp / T = 0.01
100
0.05
0.1
0.2
TSTS 7502
TSTS 7503
10
TSTS 7501
1
0.5
10–1
0.1
10–2
94 8003 e
10–1
100
101
tp – Pulse Duration ( ms )
102
100
Figure 3. Pulse Forward Current vs. Pulse Duration
1000
103
Fe – Radiant Power ( mW )
IF – Forward Current ( mA )
104
Figure 6. Radiant Intensity vs. Forward Current
104
102
101
100
10–1
100
10
1
0.1
0
1
2
4
3
VF – Forward Voltage ( V )
94 7996 e
100
101
102
103
IF – Forward Current ( mA )
94 7977 e
Figure 4. Forward Current vs. Forward Voltage
104
Figure 7. Radiant Power vs. Forward Current
1.2
1.6
1.1
1.2
IF = 10 mA
I e rel ; Fe rel
V Frel – Relative Forward Voltage
101
102
103
IF – Forward Current ( mA )
94 7926 e
1.0
IF = 20 mA
0.8
0.9
0.4
0.8
0.7
0
94 7990 e
20
40
60
80
Tamb – Ambient Temperature ( °C )
Figure 5. Relative Forward Voltage vs.
Ambient Temperature
Document Number 81049
Rev. 2, 20-May-99
0
–10 0 10
100
94 7993 e
50
100
140
Tamb – Ambient Temperature ( °C )
Figure 8. Rel. Radiant Intensity\Power vs.
Ambient Temperature
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TSTS750.
Vishay Telefunken
0°
I e rel – Relative Radiant Intensity
Fe rel – Relative Radiant Power
1.25
1.0
0.75
0.5
0.25
10
°
20
°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
IF = 100 mA
0
900
94 7994 e
950
1000
l – Wavelength ( nm )
Figure 9. Relative Radiant Power vs. Wavelength
0.6
0.4
0.2
0
0.2
0.4
0.6
94 7978 e
Figure 10. Relative Radiant Intensity vs.
Angular Displacement
Dimensions in mm
14485
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Document Number 81049
Rev. 2, 20-May-99
TSTS750.
Vishay Telefunken
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs ).
The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA ) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
Document Number 81049
Rev. 2, 20-May-99
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