TFBS4652 Vishay Semiconductors Infrared Transceiver 9.6 kbit/s to 115.2 kbit/s (SIR) Description The TFBS4652 is one of the smallest IrDA compliant transceivers available. It supports data rates up to 115 kbit/s. The transceiver consists of a PIN photodiode, infrared emitter, and control IC in a single package. Features 20206 • Compliant with the IrDA® physical layer IrPHY 1.4 (low power specification, 9.6 kbit/s to 115.2 kbit/s) e4 • Link distance: 30 cm/20 cm full 15° cone with standard or low power IrDA, respectively. Emission intensity can be set by an external resistor to increase the range to > 50 cm • Typical transmission distance to standard device: 50 cm • Small package L 6.8 mm x W 2.8 mm x H 1.6 mm • Low current consumption 75 µA idle at 3.6 V • Operates from 2.4 V to 3.6 V within specification over full temperature range from - 25 °C to + 85 °C • Split power supply, emitter can be driven by a separate power supply not loading the regulated. U.S. Pat. No. 6,157,476 • Adjustable to logic I/O voltage swing from 1.5 V to 5.5 V • Lead (Pb)-free device • Qualified for lead (Pb)-free and Sn/Pb processing (MSL4) • Device in accordance with RoHS 2002/95/EC and WEEE 2002/96/EC Applications • Mobile phone • PDAs Parts Table Part Description Qty / Reel TFBS4652-TR1 Oriented in carrier tape for side view surface mounting 1000 pcs TFBS4652-TR3 Oriented in carrier tape for side view surface mounting 2500 pcs Document Number 84671 Rev. 1.1, 03-Jul-06 www.vishay.com 131 TFBS4652 Vishay Semiconductors Functional Block Diagram VCC Vlog Tri-State Driver PD Amplifier RXD Comparator IREDA SD Mode Control IRED Driver IRED TXD ASIC GND 19288 Pin Description Pin Number Function Description I/O Active 1 IREDA IRED Anode, connected via a current limiting resistor to Vcc2. A separate unregulated power supply can be used. 2 RXD Receiver Output. Normally high, goes low for a defined pulse duration with the rising edge of the optical input signal. Output is a CMOS tri-state driver, which swings between ground and Vlogic. Receiver echoes transmitter output. O LOW 3 TXD Transmitter Data Input. Setting this input above the threshold turns on the transmitter. This input switches the IRED with the maximum transmit pulse width of about 50 µs. I HIGH 4 SD Shut Down. Logic Low at this input enables the receiver, enables the transmitter, and un-tri-states the receiver output. It must be driven high for shutting down the transceiver. I HIGH 5 Vlogic Reference for the logic swing of the output and the input logic levels. I 6 VCC Power Supply, 2.4 V to 3.6 V. This pin provides power for the receiver and transmitter drive section. Connect Vcc1 via an optional filter. 7 GND Ground Pinout Definitions: TFBS4652, bottom view weight 0.05 g In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhY 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhY 1.1, followed by IrPhY 1.2, adding the SIR Low Power Standard. IrPhY 1.3 extended the Low Power Option to MIR and FIR and VFIR was added with IrPhY 19284 1.4. A new version of the standard in any case obsoletes the former version. www.vishay.com 132 Document Number 84671 Rev. 1.1, 03-Jul-06 TFBS4652 Vishay Semiconductors Absolute Maximum Ratings Reference point Pin, GND unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Symbol Min Max Unit Supply voltage range, transceiver Parameter 0 V < VCC2 < 6 V Test Conditions VCC1 - 0.5 Typ. 6.0 V Supply voltage range, transmitter 0 V < VCC1 < 3.6 V VCC2 - 0.5 6.0 V Supply voltage range, digital supply 0 V < VCC1 < 3.6 V Vlogic - 0.5 6.0 V Voltage at RXD All states Vin - 0.5 Vlogic + 0.5 V Input voltage range, transmitter TXD Independent of Vdd or Vlogic Vin - 0.5 6.0 V Input currents For all pins, except IRED anode pin - 40 40 mA Output sinking current 20 mA Power dissipation PD 250 mW Junction temperature TJ 125 °C Ambient temperature range (operating) Tamb - 25 + 85 °C Storage temperature Tstg - 40 + 100 °C Soldering temperature ***) see section Recommended Solder Profile Repetitive pulse output current < 90 µs, ton < 20 % Average output current (transmitter) °C IIRED (RP) 500 mA IIRED (DC) 100 mA Virtual source size Method: (1-1/e) encircled energy d Maximum Intensity for Class 1 IEC60825-1 or EN60825-1, edition Jan. 2001 Ie *) 0.8 mm mW/sr *) (500)**) Due to the internal limitation measures the device is a "class1" device. **) IrDA ***) specifies the max. intensity with 500 mW/s.r Sn/Pb-free soldering. The product passed VISHAY’s standard convection reflow profile soldering test. Document Number 84671 Rev. 1.1, 03-Jul-06 www.vishay.com 133 TFBS4652 Vishay Semiconductors Electrical Characteristics Transceiver Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Test Conditions Supply voltage range Symbol Min VCC 2.4 Typ. Max Unit 3.6 V 130 µA Dynamic Supply current Idle, dark ambient SD = Low (< 0.8 V), Eeamb = 0 klx, ICC 90 ICC 75 Iccpk 2 Ee < 4 mW/m2 - 25 °C ≤ T ≤ + 85 °C Idle, dark ambient SD = Low (< 0.8 V), Eeamb = 0 klx, µA Ee < 4 mW/m2 T = + 25 °C Peak supply current during transmission SD = Low, TXD = High Idle, dark ambient at Vlogic - pin SD = Low (< 0.8 V), Eeamb = 0 klx, 3 mA Ilogic 1 µA Ee < 4 mW/m2 Shutdown supply current Dark ambient SD = High (> Vlogic - 0.5 V), T = 25 °C, Ee = 0 klx ISD 0.1 µA Shutdown supply current, dark ambient SD = High (> Vlogic - 0.5 V), T = 70 °C, Ee = 0 klx ISD 2.0 µA Shutdown supply current, dark ambient SD = High (> Vlogic - 0.5 V), T = 85 °C, Ee = 0 klx ISD 3.0 µA + 85 °C Output voltage low IOL = 0.2 mA, VCC = 2.4 V Cload = 15 pF VOL Output voltage high IOL = 0.2 mA, VCC = 2.4 V Cload = 15 pF VOH RXD to Vcc pull-up impedance SD = VCC, VCC = 2.4 V to 5 V RRXD Operating temperature range TA Input voltage low (TXD, SD) Input voltage high (TXD, SD) VCC = 2.4 V to 3.6 V Input voltage threshold SD VCC = 2.4 V to 3.6 V Input capacitance (TXD, SD) www.vishay.com 134 - 25 0.3 Vlogic - 0.5 V Vlogic 500 V kΩ VIL - 0.5 0.5 V VIH Vlogic - 0.5 Vlogic + 0.5 V 0.9 CI 0.5 x Vlogic 0.66 x Vlogic 6 V pF Document Number 84671 Rev. 1.1, 03-Jul-06 TFBS4652 Vishay Semiconductors Optoelectronic Characteristics Receiver Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Test Conditions Symbol Sensitivity: Minimum irradiance Ee in angular range *)**) 9.6 kbit/s to 115.2 kbit/s λ = 850 nm to 900 nm Ee Maximum irradiance Ee in angular range ***) λ = 850 nm to 900 nm Ee No output receiver input irradiance According to IrDA IrPHY 1.4, Appendix A1, fluorescent light specification Ee Min Typ. Max Unit 40 (4.0) 81 (8.1) mW/m2 5 (500) (µW/cm2) kW/m2 (mW/cm2) 4 (0.4) mW/m2 (µW/cm2) Rise time of output signal 10 % to 90 %, CL = 15 pF tr (RXD) 20 100 Fall time of output signal 90 % to 10 %, CL = 15 pF tf (RXD) 20 100 ns RXD pulse width of output signal, 50 %****) Input pulse width 1.63 µs tPW 1.7 2.9 µs Receiver start up time Power on delay tL 30 Latency ns 100 150 µs 50 100 µs *) This parameter reflects the backlight test of the IrDA physical layer specification to guarantee immunity against light from fluorescent lamps. **) IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length. ***) Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. ****) RXD output is edge triggered by the rising edge of the optical input signal. The output pulse duration is independent of the input pulse duration. For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf). Document Number 84671 Rev. 1.1, 03-Jul-06 www.vishay.com 135 TFBS4652 Vishay Semiconductors Transmitter Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. Parameter Test Conditions Symbol Min Max Unit IRED operating current, current controlled The IRED current is internally controlled but also can be reduced by an external resistor R1 ID 200 400 mA Output leakage IRED current Tamb = 85°C 1 µA 4 150 mW/sr IIRED ) α = 0°, 15°, TXD = High, SD = Low, VCC1 = 3.0 V, VCC2 = 3.0 V, R1 = 30 Ω (resulting in about 50 mA drive current) Ie Output radiant intensity*) α = 0°, 15°, TXD = High, SD = Low, VCC1 = 3.0 V, VCC2 = 3.0 V, R1 = 0 Ω, If = 300 mA Ie Output radiant intensity*) VCC1 = 5.0 V, α = 0°, 15° TXD = Low or SD = High (Receiver is inactive as long as SD = High) Ie Saturation voltage of IRED driver VCC = 3.0 V, If = 50 mA Output radiant intensity* Peak - emission wavelength Optical output pulse duration 25 mW/sr 0.04 VCEsat Optical rise time, Optical fall time Optical output pulse duration Typ. mW/sr 0.4 λp 880 tropt, tfopt 20 V 886 900 nm 100 ns Input pulse width t < 30 µs Input pulse width t ≥ 30 µs topt topt 30 t 50 300 µs µs Input pulse width t = 1.63 µs topt 1.45 1.61 2.2 µs 20 % Optical overshoot *) The radiant intensity can be adjusted by the external current limiting resistor to adapt the intensity to the desired value. The given value is for minimum current consumption. This transceiver can be adapted to > 50 cm operation by increasing the current to > 200 mA, e.g. operating the transceiver without current control resistor (i.e. R1 = 0 Ω) and using the internal current control. Table 1. Truth table Inputs TXD RXD Optical input Irradiance mW/m Transmitter high x x Tri-state floating with a weak pull-up to the supply voltage 0 low high x low (echo on) Ie low low high > 100 µs x high 0 low <2 high 0 low low > Min. irradianceEe < Max. irradiance Ee low (active) 0 low low > Max. irradiance Ee x 0 www.vishay.com 136 Outputs SD 2 Document Number 84671 Rev. 1.1, 03-Jul-06 TFBS4652 Vishay Semiconductors Recommended Circuit Diagram Operated at a clean low impedance power supply the TFBS4652 needs only one additional external component when the IRED drive current should be minimized for minimum current consumption according the low power IrDA standard. When combined operation in IrDA and Remote Control is intended no current limiting resistor is recommended. When long wires are used for bench tests, the capacitors are mandatory for testing rise/fall time correctly. VCC2 IRED Anode R1 Vlogic VCC1 Vlogic VCC R2 C1 GND C2 Ground SD SD TXD TXD RXD RXD 19289 Figure 1. Recommended Application Circuit The capacitor C1 is buffering the supply voltage VCC2 and eliminates the inductance of the power supply line. This one should be a small ceramic version or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is necessary for controlling the IRED drive current when the internally controlled current is too high for the application. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. As already stated above R2, C1 and C2 are optional and depend on the quality of the supply voltages VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as close as possible to Document Number 84671 Rev. 1.1, 03-Jul-06 the transceiver power supply pins. When connecting the described circuit to the power supply, low impedance wiring should be used. In case of extended wiring the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not apply to follow the fast current is rise time. In that case another 10 µF cap at VCC2 will be helpful. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Wienfield Hill, 1989, Cambridge University Press, ISBN: 0521370957. Table 2. Recommended Application Circuit Components Component Recommended Value C1, C2 0.1 µF, Ceramic, Vishay part# VJ 1206 Y 104 J XXMT R1 See table 3 R2 47 Ω, 0.125 W (VCC1 = 3 V) Table 3. Recommended resistor R1 [Ω] VCC2 [V] Minimized current consumption, IrDA Low power compliant 2.7 24 3.0 30 3.3 36 www.vishay.com 137 TFBS4652 Vishay Semiconductors Recommended Solder Profiles Manual Soldering Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Solder Profile for Sn/Pb soldering 260 10 s max. at 230 °C 240 °C max. 240 220 2...4 °C/s 200 180 140 120 s...180 s 120 90 s max. 100 80 2...4 °C/s 60 40 20 0 0 50 100 150 200 250 300 350 Time/s 19431 Figure 2. Recommended Solder Profile for Sn/Pb soldering Lead (Pb)-Free, Recommended Solder Profile The TFBS4652 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-SoakSpike (RSS) and Ramp-To-Spike (RTS). The RampSoak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in figure 3 is VISHAY's recommended profiles for use with the TFBS4652 transceivers. For more details please refer to Application note: SMD Assembly Instruction. Storage The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note "Taping, Labeling, Storage and Packing" (http://www.vishay.com/docs/82601/82601.pdf). 280 T ≥ 255 °C for 20 s max 260 T peak = 260 °C max. 240 T ≥ 217 °C for 50 s max 220 200 180 Temperature/°C Temperature/°C 160 °C max. 160 160 20 s 140 120 90 s...120 s 100 50 s max. 2 °C...4 °C/s 80 60 2 °C...4 °C/s 40 20 0 0 50 100 150 200 250 300 350 19261 Time/s Figure 3. Solder Profile, RSS Recommendation Wave Soldering For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. www.vishay.com 138 Document Number 84671 Rev. 1.1, 03-Jul-06 TFBS4652 Vishay Semiconductors Package Dimensions in mm 19322 Figure 4. TFBS4652 mechanical dimensions, tolerance ± 0.2 mm, if not otherwise mentioned 19729 Figure 5. TFBS4652 soldering footprint, tolerance ± 0.2 mm, if not otherwise mentioned Document Number 84671 Rev. 1.1, 03-Jul-06 www.vishay.com 139 TFBS4652 Vishay Semiconductors Reel Dimensions Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05 14017 Tape Width A max. N W1 min. W2 max. W3 min. mm mm mm mm mm mm mm 16 180 60 16.4 22.4 15.9 19.4 16 330 50 16.4 22.4 15.9 19.4 www.vishay.com 140 W3 max. Document Number 84671 Rev. 1.1, 03-Jul-06 TFBS4652 Vishay Semiconductors Tape Dimensions in mm 19286 Document Number 84671 Rev. 1.1, 03-Jul-06 www.vishay.com 141 TFBS4652 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany www.vishay.com 142 Document Number 84671 Rev. 1.1, 03-Jul-06 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1