PYRAMID P4C165

P4C165
ULTRA HIGH SPEED 8K x 8
RESETTABLE STATIC CMOS RAM
FEATURES
Full CMOS, 6T Cell
Output Enable and Dual Chip Enable Control
Functions
High Speed (Equal Access and Cycle Times)
– 15/20/25 ns (Commercial)
– 20/25/35 (Industrial)
Single 5V±10% Power Supply
Low Power Operation
Fully TTL Compatible Inputs and Outputs
Chip Clear Function
Standard Pinout (JEDEC Approved)
– 28-Pin Plastic DIP (300 mil)
Common Data I/O
DESCRIPTION
The P4C165 is a 65,536-bit ultra high-speed static RAM
organized as 8K x 8. The RAM features a reset control to
enable clearing all words to zero within two cycle times.
The CMOS memory requires no clocks or refreshing and
has equal access and cycle times. Inputs are fully TTLcompatible. The RAM operates from a single 5V±10%
tolerance power supply.
Access times as fast as 15 nanoseconds are available,
permitting greatly enhanced system operating speeds.
In full standby mode with CMOS inputs, power consumption is only 5.5 mW for the P4C165.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
The P4C165 is available in a 28-pin 300 mil DIP.
1519B
DIP (P5)
Document # SRAM117 Rev OR
1
Revised October 2005
P4C165
MAXIMUM RATINGS(1)
Symbol
Parameter
Value
Unit
VCC
Power Supply Pin with
Respect to GND
–0.5 to +7
V
VTERM
Terminal Voltage with
Respect to GND
(up to 7.0V)
–0.5 to
VCC +0.5
V
TA
Operating Temperature
–55 to +125
°C
Symbol
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Parameter
Value
Unit
TBIAS
Temperature Under
Bias
–55 to +125
°C
TSTG
Storage Temperature
–65 to +150
°C
PT
Power Dissipation
1.0
W
IOUT
DC Output Current
50
mA
CAPACITANCES(4)
VCC = 5.0V, TA = 25°C, f = 1.0MHz
Grade(2)
Ambient
Temperature
GND
VCC
Symbol
Commercial
Industrial
0°C to +70°C
–40°C to +85°C
0V
0V
5.0V ± 10%
5.0V ± 10%
CIN
COUT
Parameter
Input Capacitance
Output Capacitance
Conditions Typ. Unit
VIN = 0V
5
pF
VOUT = 0V
7
pF
DC ELECTRICAL CHARACTERISTICS
Over recommended operating temperature and supply voltage(2)
Symbol
Parameter
P4C165
Min
Max
Test Conditions
Unit
VIH
Input High Voltage
2.2
VCC +0.5
V
VIL
Input Low Voltage
–0.5(3)
0.8
V
V HC
CMOS Input High Voltage
VLC
CMOS Input Low Voltage
V CD
Input Clamp Diode Voltage
VOL
Output Low Voltage
(TTL Load)
Output High Voltage
(TTL Load)
VOH
ILI
Input Leakage Current
ILO
Output Leakage Current
ISB
Standby Power Supply Current
(TTL Input Levels)
ISB1
Standby Power Supply Current
(CMOS Input Levels)
VCC –0.2 VCC +0.5
V
0.2
V
VCC = Min., IIN = –18 mA
–1.2
V
IOL = +8 mA, VCC = Min.
0.4
V
–0.5
(3)
IOH = –4 mA, VCC = Min.
2.4
V
VCC = Max.
VIN = GND to VCC
Ind./Com’l.
–5
+5
µA
Ind./Com’l.
–5
+5
µA
Ind./Com’l.
___
30
mA
Ind./Com’l.
___
15
mA
VCC = Max., CE = VIH,
VOUT = GND to VCC
CE ≥ VIH or
CE2 ≤VIL, VCC= Max
f = Max., Outputs Open
CE ≥ VHC or
CE2 ≤VLC, VCC= Max
f = 0, Outputs Open
VIN ≤ VLC or VIN ≥ VHC
n/a = Not Applicable
Notes:
1. Stresses greater than those listed under MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification
is not implied. Exposure to MAXIMUM rating conditions for extended
periods may affect reliability.
Document # SRAM117 Rev OR
2. Extended temperature operation guaranteed with 400 linear feet per
minute of air flow.
3. Transient inputs with VIL and IIL not more negative than –3.0V and
–100mA, respectively, are permissible for pulse widths up to 20 ns.
4. This parameter is sampled and not 100% tested.
2
Page 2 of 9
P4C165
POWER DISSIPATION CHARACTERISTICS VS. SPEED
Symbol
Parameter
ICC
Dynamic Operating Current*
–15
–20
–25
–35
Unit
Commercial
160
155
150
N/A
mA
Industrial
N/A
160
155
150
mA
Temperature Range
*VCC = 5.5V. Tested with outputs open. f = Max. Switching inputs are 0V and 3V. CE1 = VIL, CE2 = VIH, OE = VIH
AC ELECTRICAL CHARACTERISTICS—READ CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
-15
-20
-25
-35
Sym.
Parameter
t RC
Read Cycle Time
tAA
Address Access Time
15
20
25
35
ns
tAC
Chip Enable Access Time
15
20
25
35
ns
t OH
Output Hold from Address Change
3
3
3
3
ns
tLZ
Chip Enable to Output in Low Z
2
2
2
2
ns
t HZ
Chip Disable to Output in High Z
8
8
10
15
ns
tOE
Output Enable Low to Data Valid
9
10
13
18
ns
Min Max Min Max Min Max Min Max
15
tOLZ Output Enable Low to Low Z
2
Chip Enable to Power Up Time
t PD
Chip Disable to Power Down Time
Document # SRAM117 Rev OR
0
3
2
9
0
15
35
25
2
9
tOHZ Output Enable High to High Z
t PU
20
0
20
ns
2
12
ns
15
ns
ns
0
20
Unit
20
ns
Page 3 of 9
P4C165
OE CONTROLLED)(5)
READ CYCLE NO. 1 (OE
READ CYCLE NO. 2 (ADDRESS CONTROLLED)(5,6)
CE1, CE2 CONTROLLED)(5,7,10)
READ CYCLE NO. 3 (CE
Notes:
5. WE is HIGH for READ cycle.
6. CE1 is LOW, CE2 is HIGH and OE is LOW for READ cycle.
7. ADDRESS must be valid prior to, or coincident with CE1 transition
LOW and CE2 transition HIGH.
8. Transition is measured ± 200 mV from steady state voltage prior to
change, with loading as specified in Figure 1. This parameter is
sampled and not 100% tested.
Document # SRAM117 Rev OR
9. READ Cycle Time is measured from the last valid address to the first
transitioning address.
10. Transitions caused by a chip enable control have similar delays
irrespective of whether CE1 or CE2 causes them.
4
Page 4 of 9
P4C165
AC CHARACTERISTICS—WRITE CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Sym.
-15
Parameter
-25
-20
-35
Min Max Min Max Min Max Min Max
Unit
tWC
Write Cycle Time
15
20
25
35
ns
tCW
Chip Enable Time to End of Write
12
15
18
25
ns
tAW
Address Valid to End of Write
12
15
18
25
ns
tAS
Address Set-up Time
0
0
0
0
ns
tWP
Write Pulse Width
12
15
18
20
ns
tAH
Address Hold Time
0
0
0
0
ns
tDW
Data Valid to End of Write
9
11
13
15
ns
tDH
Date Hold Time
0
0
0
0
ns
tWZ
Write Enable to Output in High Z
tOW
Output Active from End of Write
7
3
8
3
10
3
14
3
ns
ns
WE CONTROLLED)(11)
WRITE CYCLE NO. 1 (WE
Notes:
11. CE1 and WE must be LOW, and CE2 HIGH for WRITE cycle.
12. OE is LOW for this WRITE cycle to show tWZ and tOW.
13. If CE1 goes HIGH, or CE2 goes LOW, simultaneously with WE HIGH,
the output remains in a high impedance state.
Document # SRAM117 Rev OR
14. Write Cycle Time is measured from the last valid address to the first
transitioning address.
5
Page 5 of 9
P4C165
CE CONTROLLED)(11)
TIMING WAVEFORM OF WRITE CYCLE NO. 2 (CE
AC CHARACTERISTICS—CLEAR CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Sym.
tCLCL
-15
Parameter
-20
-25
-35
Min Max Min Max Min Max Min Max
Unit
CLEAR Cycle Time
30
40
50
70
ns
tCLPW CLEAR Pulse Width
12
15
15
20
ns
tCLIX
CLEAR Low to Inputs Don't Care
0
0
0
0
ns
tCLIR
CLEAR Low to Inputs Recognized
30
40
50
70
ns
TIMING WAVEFORM OF CLEAR CYCLE
Document # SRAM117 Rev OR
6
Page 6 of 9
P4C165
AC TEST CONDITIONS
Input Pulse Levels
TRUTH TABLE
GND to 3.0V
Input Rise and
Fall Times
3ns
Input Timing
Reference Level
1.5V
Output Timing
Reference Level
Output Load
1.5V
See Figures 1 and 2
CLEAR CE1
Mode
CE2
OE
WE
I/O
Power
Reset
L
X
X
X
X
---
Active
Standby
H
H
X
X
X
High Z
Standby
Standby
H
X
L
X
X
High Z
Standby
Output
Disabled
H
L
H
H
H
High Z
Active
Read
H
L
H
L
H
DOUT
Active
Write
H
L
H
X
L
High Z
Active
Figure 1. Output Load
Figure 2. Thevenin Equivalent
* including scope and test fixture.
Note:
Because of the ultra-high speed of the P4C165, care must be taken
when testing this device; an inadequate setup can cause a normal
functioning part to be rejected as faulty. Long high-inductance leads that
cause supply bounce must be avoided by bringing the VCC and ground
planes directly up to the contactor fingers. A 0.01 µF high frequency
capacitor is also required between VCC and ground. To avoid signal
Document # SRAM117 Rev OR
reflections, proper termination must be used; for example, a 50Ω test
environment should be terminated into a 50Ω load with 1.73V (Thevenin
Voltage) at the comparator input, and a 116Ω resistor must be used in
series with DOUT to match 166Ω (Thevenin Resistance).
7
Page 7 of 9
P4C165
ORDERING INFORMATION
SELECTION GUIDE
The P4C165 is available in the following temperature, speed and package options.
Temperature
Range
Package
Speed
15
20
25
35
Commercial
Plastic DIP
-15PC
-20PC
-25PC
-35PC
Industrial
Plastic DIP
-15PI
-20PI
-25PI
-35PI
Pkg #
# Pins
Symbol
A
A1
b
b2
C
D
E1
E
e
eB
L
α
P5
PLASTIC DUAL IN-LINE PACKAGE
28 (300 mil)
Min
Max
0.210
0.014
0.023
0.045
0.070
0.008
0.014
1.345
1.400
0.270
0.300
0.300
0.380
0.100 BSC
0.430
0.115
0.150
0°
15°
Document # SRAM117 Rev OR
8
Page 8 of 9
P4C165
REVISIONS
DOCUMENT NUMBER:
DOCUMENT TITLE:
SRAM117
P4C165 ULTRA HIGH SPEED 8K x 8 RESETTABLE STATIC CMOS RAM
REV.
ISSUE
DATE
ORIG. OF
CHANGE
OR
Oct-05
JDB
Document # SRAM117 Rev OR
DESCRIPTION OF CHANGE
New Data Sheet
9
Page 9 of 9