VISHAY TSOP6236

TSOP62..
Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
Description
The TSOP62.. - series are miniaturized SMD-IR
Receiver Modules for infrared remote control systems. PIN diode and preamplifier are assembled on
lead frame, the epoxy package is designed as IR filter.
The demodulated output signal can directly be
decoded by a microprocessor. TSOP62.. is the standard IR remote control SMD-Receiver series, supporting all major transmission codes.
1
2
3
4
16797
Features
Special Features
• Photo detector and preamplifier in one
package
• Internal filter for PCM frequency
e3
• Continuous data transmission possible
• TTL and CMOS compatibility
• Output active low
• Low power consumption
• High immunity against ambient light
• Low power consumption
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
• Improved immunity against ambient light
• Suitable burst length ≥ 10 cycles/burst
• Taping available for Topview and Sideview
assembly
30 kΩ
VS
4
AGC
Band
Pass
Demodulator
OUT
Control Circuit
16839
Document Number 82177
Rev. 1.5, 23-Oct-06
Part
Carrier Frequency
TSOP6230
30 kHz
TSOP6233
33 kHz
TSOP6236
36 kHz
TSOP6237
36.7 kHz
TSOP6238
38 kHz
TSOP6240
40 kHz
TSOP6256
56 kHz
16842
Transmitter TSOPxxxx
with
TSALxxxx
R1 = 100 Ω
VS
OUT
GND
1; 2
PIN
Parts Table
Application Circuit
3
Input
Pinning:
1 = GND, 2 = GND, 3 = VS, 4 = OUT
Circuit
Block Diagram
Mechanical Data
GND
+ VS
C1 =
4.7 µF
µC
VO
GND
R1 and C1 recommended to suppress power supply
disturbances.
The output voltage should not be hold continuously a
a voltage below VO = 3.3 V by the external circuit.
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TSOP62..
Vishay Semiconductors
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Symbol
Value
Supply Voltage
Parameter
Pin 3
Test condition
VS
- 0.3 to 6.0
V
Supply Current
Pin 3
IS
5
mA
Output Voltage
Pin 4
VO
- 0.3 to 6.0
V
Output Current
Pin 4
IO
15
mA
Tj
100
°C
Tstg
- 40 to + 100
°C
Tamb
- 25 to + 85
°C
Ptot
50
mW
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Power Consumption
Tamb ≤ 85 °C
Unit
Electrical and Optical Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Supply Current
Symbol
Min
Typ.
Max
Unit
VS = 5 V, Ev = 0
Test condition
ISD
0.8
1.1
1.5
mA
VS = 5 V,
Ev = 40 klx, sunlight
ISH
Supply Voltage
VS
Transmission Distance
Ev = 0, test signal see fig. 1,
IR diode TSAL6200,
IF = 400 mA
Output Voltage Low (Pin 4)
IOSL = 0.5 mA,
1.4
4.5
d
mA
5.5
35
VOSL
V
m
250
mV
mW/m2,
Ee = 0.7
test signal see fig. 1
Minimum Irradiance
(30 - 40 kHz)
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee min
0.35
0.5
mW/m2
Minimum Irradiance
(56 kHz)
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee min
0.4
0.6
mW/m2
Maximum Irradiance
tpi - 5/fo < tpo < tpi + 6/fo,
test signal see fig. 1
Ee max
Directivity
Angle of half transmission
distance
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2
ϕ1/2
30
W/m2
± 50
deg
Document Number 82177
Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors
Typical Characteristics
Tamb = 25 °C, unless otherwise specified
Optical Test Signal
Ee
1.0
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms)
tpi *
T
10/fo is recommended for optimal function
* tpi
Output Signal
VO
1)
2)
VOH
16110
7/f0 < td < 15/f0
tpi - 5/f 0 < tpo < tpi + 6/f 0
VOL
tpo2 )
td1 )
Ton ,Toff - Output Pulse Width (ms)
t
0.9
0.8
Ton
0.7
0.6
0.5
Toff
0.4
0.3
0.2
= 950 nm,
optical test signal, fig. 3
0.1
0.0
0.1
t
1.0
16909
Figure 1. Output Function
Figure 4. Output Pulse Diagram
1.2
1.0
t po - Output Pulse Width (ms)
E e min /E e - Rel. Responsivity
Output Pulse
0.9
0.8
Input Burst Duration
0.7
0.6
0.5
0.4
0.3
0.2
= 950 nm,
optical test signal, fig. 1
0.1
0.0
0.1
1.0
10.0
1.0
0.8
0.6
0.4
f = f0 ± 5 %
f (3 dB) = f0/10
0.2
0.0
0.7
100.0 1000.0 10000.0
Ee - Irradiance (mW/m²)
16908
0.9
1.1
f/f0 - Relative Frequency
16925
Figure 2. Pulse Length and Sensitivity in Dark Ambient
Ee
10.0 100.0 1000.0 10000.0
Ee - Irradiance (mW/m²)
1.3
Figure 5. Frequency Dependence of Responsivity
Optical Test Signal
600 µs
t
600 µs
T = 60 ms
VO
94 8134
Output Signal, (see fig. 4)
VOH
VOL
Ton
Toff
t
Ee min - Threshold Irradiance (mW/m2 )
4.0
3.5
3.0
2.5
2.0
1.5
Document Number 82177
Rev. 1.5, 23-Oct-06
Ambient, = 950 nm
1.0
0.5
0.0
0.01
16911
Figure 3. Output Function
Correlation with ambient light sources:
10 W/m2 1.4 klx (Std.illum.A, T= 2855 K)
10 W/m2 8.2 klx (Daylight, T = 5900 K)
0.10
1.00
10.00
100.00
E - Ambient DC Irradiance (W/m 2)
Figure 6. Sensitivity in Bright Ambient
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3
TSOP62..
16912
2.0
f = fo
1.5
f = 10 kHz
1.0
f = 1 kHz
0.5
f = 100 Hz
0.0
0.1
1.0
10.0
100.0
1000.0
VsRMS - AC Voltage on DC Supply Voltage (mV)
0.6
Ee min - Threshold Irradiance (mW/m²)
Ee min- Threshold Irradiance (mW/m²)
Vishay Semiconductors
Sensitivity in dark ambient
0.5
0.4
0.3
0.2
0.1
0.0
- 30 - 15 0
15 30 45 60 75
16918
Tamb - Ambient Temperature (°C)
Figure 7. Sensitivity vs. Supply Voltage Disturbances
90
Figure 10. Sensitivity vs. Ambient Temperature
S ( λ) rel - Relative Spectral Sensitivity
E e min - Threshold Irradiance (mW/m²)
1.2
2.0
f(E) = f0
1.6
1.2
0.8
0.4
0.0
0.0
0.4
0.8
1.2
1.6
2.0
E - Field Strength of Disturbance (kV/m)
94 8147
Figure 8. Sensitivity vs. Electric Field Disturbances
1.0
0.8
0.6
0.4
0.2
0.0
750
850
950
1050
1150
λ - Wavelength (nm)
16919
Figure 11. Relative Spectral Sensitivity vs. Wavelength
0°
0.8
10°
20°
30°
Max. Envelope Duty Cycle
0.7
0.6
40°
0.5
1.0
0.4
0.9
50°
0.8
60°
0.3
0.2
f = 38 kHz, Ee = 2 mW/m2
70°
0.7
0.1
80°
0.0
0
16913
20
40
60
80
100 120
Burst Length (number of cycles/burst)
Figure 9. Max. Envelope Duty Cycle vs. Burstlength
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4
16801
0.6 0.4 0.2
0
0.2
0.4 0.6
d rel - Relative Transmission Distance
Figure 12. Directivity
Document Number 82177
Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors
Document Number 82177
Rev. 1.5, 23-Oct-06
IR Signal from fluorescent
lamp with low modulation
0
5
10
15
20
Time (ms)
16920
Figure 13. IR Signal from Fluorescent Lamp with low Modulation
IR Signal from fluorescent
lamp with high modulation
IR Signal
The circuit of the TSOP62.. is designed in that way
that unexpected output pulses due to noise or disturbance signals are avoided. A bandpass filter, an integrator stage and an automatic gain control are used
to suppress such disturbances.
The distinguishing mark between data signal and disturbance signal are carrier frequency, burst length
and duty cycle.
The data signal should fulfill the following conditions:
• Carrier frequency should be close to center frequency of the bandpass (e.g. 38 kHz).
• Burst length should be 10 cycles/burst or longer.
• After each burst which is between 10 cycles and
70 cycles a gap time of at least 14 cycles is necessary.
• For each burst which is longer than 1.8 ms a corresponding gap time is necessary at some time in the
data stream. This gap time should be at least 4 times
longer than the burst.
• Up to 800 short bursts per second can be received
continuously.
Some examples for suitable data format are: NEC
Code (repetitive pulse), NEC Code (repetitive data),
Toshiba Micom Format, Sharp Code, RC5 Code,
RC6 Code, R-2000 Code, Sony Code.
When a disturbance signal is applied to the TSOP62..
it can still receive the data signal. However the sensitivity is reduced to that level that no unexpected
pulses will occur.
Some examples for such disturbance signals which
are suppressed by the TSOP62.. are:
• DC light (e.g. from tungsten bulb or sunlight)
• Continuous signal at 38 kHz or at any other frequency
• Signals from fluorescent lamps with electronic ballast with high or low modulation
(see Figure 13 or Figure 14).
IR Signal
Suitable Data Format
0
16921
10
10
15
20
Time (ms)
Figure 14. IR Signal from Fluorescent Lamp with high Modulation
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TSOP62..
Vishay Semiconductors
Package Dimensions in mm
16629
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Document Number 82177
Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors
Reflow Soldering
• Reflow soldering must be done within 72 hours
while stored under a max. temperature of 30 °C, 60 %
RH after opening the dry pack envelope.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown in the diagram. Excercise extreme
care to keep the maximum temperature below
260 °C. The temperature shown in the profile means
the temperature at the device surface. Since there is
a temperature difference between the component and
the circuit board, it should be verified that the temperature of the device is accurately being measured.
• Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature has
cooled off.
Document Number 82177
Rev. 1.5, 23-Oct-06
Vishay Leadfree Reflow Solder Profile
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
T [°C]
Assembly Instructions
max. 20 s
150
max. 100 sec
max. 120 sec
100
max. Ramp Up 3 °C/sec
50
max. Ramp Down 6 °C/sec
0
0
19800
50
100
150
t [sec]
200
250
300
max. 2 cycles allowed
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TSOP62..
Vishay Semiconductors
Taping Version TSOP..TT
16584
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8
Document Number 82177
Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors
Taping Version TSOP..TR
16585
Document Number 82177
Rev. 1.5, 23-Oct-06
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9
TSOP62..
Vishay Semiconductors
Reel Dimensions
16734
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10
Document Number 82177
Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors
Leader and Trailer
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 ± 10 mm/min
165° - 180° peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard packing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
Document Number 82177
Rev. 1.5, 23-Oct-06
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11
TSOP62..
Vishay Semiconductors
Vishay Semiconductor GmbH standard bar code product label (finished goods)
Abbreviation
INO
SEL
BATCH
COD
PTC
QTY
ACC
PCK
MIXED CODE
xxxxxxx+
Length
18
8
3
10
3 (YWW)
2
8
Company Logo
Long Bar Code Top
Item-Number
Plant-Code
Sequence-Number
Quantity
Total Length
Type
N
N
X
N
-
Length
8
2
3
8
21
Short Bar Code Bottom
Selection-Code
Data-Code
Batch-Number
Filter
Total Length
Type
X
N
X
-
Length
3
3
10
1
17
Plain Writing
Item-Description
Item-Number
Selection-Code
LOT-/Serial-Number
Data-Code
Plant-Code
Quantity
Accepted by:
Packed by:
Mixed Code Indicator
Origin
16942
Dry Packing
Final Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transportation and storage.
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping purposes.
Aluminium bag
Label
Reel
15973
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Document Number 82177
Rev. 1.5, 23-Oct-06
TSOP62..
Vishay Semiconductors
Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 °C + 5 °C/ - 0 °C and < 5 % RH
(dry air/nitrogen) or
96 hours at 60 °C + 5 °C and < 5 % RH for all device
containers or
24 hours at 125 °C + 5 °C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
16962
16943
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices especially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Telefunken
specific data.
Document Number 82177
Rev. 1.5, 23-Oct-06
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13
TSOP62..
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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14
Document Number 82177
Rev. 1.5, 23-Oct-06
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
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