CTS RT1210B7

VME64, VME64x Terminator
Technical Data Sheet
RoHS Compliant Parts Available
Description
This Thevenin termination network provides high performance
resistor termination for VME64 and VME64x back planes.
Features
•
•
•
•
•
•
Designed with a ceramic substrate, this device minimizes
parasitic capacitance and inductance, a primary cause of
reduced system performance. In addition, the BGA package
eases touting design, saving the designer many hours of
printed circuit layout.
8-Bit Termination Network
VME64, VME64x Compliant
Low Channel Capacitance
Laser Trimmed Resistance to ± 1%
Slim BGA Package
RoHS Compliant Designs Available
•
Compatible with both lead and lead
free processes
The BGA packaging has been proven to reduce rework and
improve reliability
Electrical Specifications
Style G
3
R1
2
R2
1
A
B
C
D
E
F
G
H
Resistor Tolerance:
± 1.0%
TCR
Operating Temperature Range
± 200ppm/°C
-55°C to +125°C
Maximum Resistor Power:
0.05 Watts at 70°C
Maximum Package Power:
Process Requirements:
1.0 Watts at 70°C
Maximum Re-flow Temperature
Per IPC/JEDEC J-STD-020C
Typical Applications
VME64x Backplane
3.3V
Card
RT2211
Card
Card
Card
3.3V
RT2211
Standard
Termination
VME64
Low Voltage
Termination
VME64x
+5V
+3.3V
330
220
470
1.8K
RT2211
RT2210
Ordering Information
Standard
Part No.
RT1210B7
RT1211B7
R1 Ω
330
220
R2 Ω
470
1800
Packaging Information
Array Size
3x8
3x8
Pitch (mm)
1.00
1.00
RoHS
Part No.
RT2210B7
RT2211B7
TR7
TR13
Tape Width
Suffix
24 mm
24mm
Carrier Pitch
8 mm
8 mm
Reel Diameter
7 inch
13 inch
Parts/Reel
1,000
4,000
Part Number Coding
7 inch reel, Add TR7 to part
number, example RT2210B7TR7
13 inch reel, Add TR13 to part
number, example RT2210B7TR13
(Bulk packaging is not available)
Direction of Feed
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change
Page 1
VME64 & VME64x Terminators
March 06
Recommended Land Pattern
BGA Routing Schemes
Blind vias to ground
reference pla ne layer
recomme nded o n
every oth er row as
shown.
Outline of Substrate
Blind vias to VCC
reference pla ne layer
recomme nded o n
every oth er row as
shown.
Blind vias to ground
reference plane layer
recommended on
every other row as
shown.
Termination Island
Vias to Vcc
Solder mask is
used to define
the ball pads.
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
PCB Pad Diameter
1.00 mm Pitch (B7) = 0.51mm/.020 inch
For .006" Thick Solder Paste Stencil, Aperture Opening
Should be Equal to the PCB Pad Diameter.
Refer to www.ctscorp.com/components/clearone.asp for
additional PCB design information
Option A
Option B
Mechanical Diagram
L
W
H
RT_2__B7
CTS YRWK
P (Pitch)
A1 Identifier
K
P (Pitch)
1.0mm Pitch
RT1210B7
RT1211B7
RT2210B7
RT2211B7
D
L
W
H
P
D
K
mm
8.00±0.15
3.00±0.15
1.19±0.15
1.00±0.25
0.64±0.05
0.50±0.25
inch
.315±.006
.157±.006
.047±.006
.039±.010
.025±.002
.020±.010
Complete ClearONE Product, Processing, and Application Information can be found at the following link:
http://www.ctscorp.com/components/clearone.asp
CTS Electronic Components
www.ctscorp.com
© 2006 CTS Corporation. All rights reserved. Information subject to change
Page 2
VME64 & VME64x Terminators
March 06