VISHAY SI3850ADV

Si3850ADV
Vishay Siliconix
Complementary MOSFET Half-Bridge (N- and P-Channel)
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
20
P-Channel
- 20
rDS(on) (Ω)
ID (A)
0.300 at VGS = 4.5 V
1.4
0.410 at VGS = 3.0 V
1.2
0.640 at VGS = - 4.5 V
- 0.96
0.980 at VGS = - 3.0 V
- 0.78
• 100 % Rg Tested
RoHS
COMPLIANT
S2
TSOP-6
Top View
G1
1
6
S1
D
2
5
D
G2
3
4
S2
G2
D
G1
Ordering Information: Si3850ADV-T1-E3 (Lead (Pb)-free)
S1
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TA = 25 °C
TA = 70 °C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipation
(Surface Mounted on FR4 Board)
ID
IDM
IS
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
N-Channel
20
P-Channel
- 20
± 12
1.4
1.1
3.5
0.9
- 0.96
- 0.77
- 2.0
- 0.9
Unit
V
A
TJ, Tstg
1.08
0.70
- 55 to 150
°C
Symbol
N- or P-Channel
Unit
RthJA
115
°C/W
PD
W
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient (Sourface Mounted on FR4 Board,
± ≤ 10 sec)
Notes:
Maximum under Steady State condition is 150 °C/W.
Document Number: 73789
S-60470-Rev. A, 27-Mar-06
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Si3850ADV
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
Diode Forward Voltageb
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VDS = VGS, ID = 250 µA
N-Ch
0.6
1.5
VDS = VGS, ID = - 250 µA
P-Ch
- 0.6
- 1.5
VDS = 0 V, VGS = ± 12 V
± 100
VDS = 20 V, VGS = 0 V
N-Ch
1
VDS = - 20 V, VGS = 0 V
P-Ch
-1
VDS = 20 V, VGS = 0 V, TJ = 70 °C
N-Ch
10
VDS = - 20 V, VGS = 0 V, TJ = 70 °C
P-Ch
VDS = 5 V, VGS = 4.5 V
N-Ch
3.0
VDS = - 5 V, VGS = - 4.5 V
P-Ch
- 1.5
VGS = 4.5 V, ID = 0.5 A
N-Ch
nA
µA
- 10
A
0.240
0.300
VGS = - 4.5 V, ID = - 0.5 A
P-Ch
0.510
0.640
VGS = 3.0 V, ID = 0.5 A
N-Ch
0.325
0.410
VGS = - 3.0 V, ID = - 0.5 A
P-Ch
0.780
0.980
VDS = 10 V, ID = 1 A
N-Ch
1.8
VDS = - 10 V, ID = - 1 A
P-Ch
1.1
IS = 0.9 A, VGS = 0 V
N-Ch
0.87
1.2
IS = - 0.8 A, VGS = 0 V
P-Ch
- 1.0
- 1.3
N-Ch
0.95
1.4
P-Ch
1.10
1.7
N-Ch
0.22
P-Ch
0.28
N-Ch
0.24
P-Ch
0.26
VSD
V
Ω
S
V
Dynamicb
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Body Diode Reverse Recovery Tme
Body Diode Reverse Recovery
Charge
Qg
N-Channel
VDS = 10 V, VGS = 4.5 V, ID = 1 A
Qgs
Qgd
P-Channel
VDS = - 10 V, VGS = - 4.5 V, ID = - 1 A
Rg
td(on)
tr
td(off)
tf
trr
Qrr
N-Channel
VDD = 10 V, RL = 10 Ω
ID ≅ 0.9 A, VGEN = 4.5 V, RG = 1 Ω
nC
N-Ch
3.5
5.3
P-Ch
10.5
16
N-Ch
8
14
P-Ch
13
20
N-Ch
16
25
P-Ch
34
50
N-Ch
20
30
P-Ch
18
30
N-Ch
9
15
P-Ch
18
30
N-Ch
20
30
IF = - 0.9 A, di/dt = 100 A/µs
P-Ch
25
40
IF = 0.9 A, di/dt = 100 A/µs
N-Ch
9
15
IF = - 0.9 A, di/dt = 100 A/µs
P-Ch
9
15
P-Channel
VDD = - 10 V, RL = 10 Ω
ID ≅ - 0.9 A, VGEN = - 4.5 V, RG = 1 Ω
IF = 0.9 A, di/dt = 100 A/µs
Ω
ns
nC
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73789
S-60470-Rev. A, 27-Mar-06
Si3850ADV
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless noted
3.0
3.5
VGS = 5.0 thru 4 V
- 55 °C
3.0
2.4
2.5
I D – Drain Current (A)
I D – Drain Current (A)
3V
2.0
2.5 V
1.5
1.0
25 °C
1.8
TC = 125 °C
1.2
0.6
0.5
2V
0.0
0.0
0.0
0.7
1.4
2.1
2.8
0
3.5
1
VDS – Drain-to-Source Voltage (V)
3
4
VGS – Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
110
0.7
0.6
VGS = 2.5 V
0.5
C – Capacitance (pF)
r DS(on)– On-Resistance (Ω)
2
VGS = 3 V
0.4
VGS = 4.5 V
0.3
88
Ciss
66
44
Coss
0.2
22
Crss
0.1
0.0
0.0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
3.5
4
ID – Drain Current (A)
8
20
Capacitance
1.8
10
ID = 1.2 A
ID = 1 A
8
1.6
VDS = 5 V
rDS(on) – On-Resistance
(Normalized)
V GS – Gate-to-Source Voltage (V)
16
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
VDS = 10 V
6
VGS = 15 V
4
2
0
0.0
12
VGS = 3 V
1.4
VGS = 4.5 V
1.2
1.0
0.8
0.5
1.0
1.5
Qg – Total Gate Charge (nC)
Gate Charge
Document Number: 73789
S-60470-Rev. A, 27-Mar-06
2.0
2.5
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ – Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si3850ADV
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
1.5
10
r DS(on)– On-Resistance (Ω)
I S – Source Current (A)
150 °C
1
25 °C
0.1
0.01
0.001
1.2
0.9
0.6
125 °C
25 °C
0.3
0.0
0.0
0.3
0.6
0.9
1.2
0
1.5
1
2
3
4
5
VGS – Gate-to-Source Voltage (V)
VSD – Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.2
30
0.1
- 0.0
Power (W)
V GS(th) Variance (V)
24
- 0.1
ID = 5 mA
18
12
- 0.2
- 0.3
- 0.4
- 50
6
ID = 250 µA
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
TJ – Temperature (°C)
Time (sec)
Threshold Voltage
Single Pulse Power
1
10
10
I D – Drain Current (A)
*Limited by rDS(on)
1 ms
1
10 ms
100 ms
1s
10 s
0.1
TA = 25 °C
Single Pulse
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
* VGS minimum VGS at which rDS(on) is specified
Safe Operating Area
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Document Number: 73789
S-60470-Rev. A, 27-Mar-06
Si3850ADV
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 100 °C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (sec)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
Document Number: 73789
S-60470-Rev. A, 27-Mar-06
www.vishay.com
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Si3850ADV
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
2.5
2.0
VGS = 5 thru 4 V
- 55 °C
1.6
3.5 V
I D – Drain Current (A)
I D – Drain Current (A)
2.0
1.5
3V
1.0
2.5 V
0.5
25 °C
1.2
TC = 125 °C
0.8
0.4
2V
0.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
1
VDS – Drain-to-Source Voltage (V)
C – Capacitance (pF)
r DS(on)– On-Resistance (Ω)
VGS = 2.5 V
VGS = 3 V
1.0
VGS = 4.5 V
Ciss
88
66
Coss
44
Crss
22
0.5
0
0.5
1.0
1.5
2.0
0
2.5
4
ID – Drain Current (A)
8
16
20
Capacitance
1.8
10
ID = 0.5 A
ID = 1 A
VDS = 5 V
1.6
8
rDS(on) – On-Resi stance
(Normalized)
V GS – Gate-to-Source Voltage (V)
12
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
VDS = 10 V
6
VGS = 15 V
4
2
VGS = 3 V
1.4
VGS = 4.5 V
1.2
1.0
0.8
0.5
1.0
1.5
Qg – Total Gate Charge (nC)
Gate Charge
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5
110
1.5
0
0.0
4
Transfer Characteristics
2.5
0.0
0.0
3
VGS – Gate-to-Source Voltage (V)
Output Characteristics
2.0
2
2.0
2.5
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ – Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 73789
S-60470-Rev. A, 27-Mar-06
Si3850ADV
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
3.0
10
r DS(on)– On-Resistance (Ω)
I S – Source Current (A)
TJ = 150 °C
1
25 °C
0.1
0.01
0.001
2.4
1.8
125 °C
1.2
25 °C
0.6
0.0
0.0
0.4
0.8
1.2
1.6
0
2.0
1
2
3
4
5
VGS – Gate-to-Source Voltage (V)
VSD – Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
30
24
ID = 250 µA
0.2
Power (W)
V GS(th) Variance (V)
0.3
ID = 5 mA
0.1
18
12
0.0
6
- 0.1
- 0.2
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
TJ – Temperature (°C)
Time (sec)
Threshold Voltage
Single Pulse Power vs. Junction-to-Ambient
10
10
I D – Drain Current (A)
*Limited by rDS(on)
1 ms
1
10 ms
100 ms
1s
10 s
0.1
TA = 25 °C
Single Pulse
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
* VGS minimum VGS at which rDS(on) is specified
Safe Operating Area
Document Number: 73789
S-60470-Rev. A, 27-Mar-06
www.vishay.com
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Si3850ADV
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
0.02
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 100 °C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (sec)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
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data, see http://www.vishay.com/ppg?73789.
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Document Number: 73789
S-60470-Rev. A, 27-Mar-06
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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Document Number: 91000
Revision: 18-Jul-08
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