VISHAY SI4966DY

Si4966DY
Vishay Siliconix
Dual N-Channel 2.5-V (G-S) MOSFET
VDS (V)
20
rDS(on) ()
ID (A)
0.025 @ VGS = 4.5 V
7.1
0.035 @ VGS = 2.5 V
6.0
D1
D1
D2
D2
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G1
G2
Top View
S1
S2
N-Channel MOSFET
N-Channel MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
12
Continuous Drain Current (TJ = 150C)
150 C)a
TA = 25C
ID
TA = 70C
Pulsed Drain Current (10 s Pulse Width)
Continuous Source Current (Diode Conduction)a
TA = 25C
Maximum Power Dissipationa
V
7.1
5.7
IDM
40
IS
1.7
A
2
PD
TA = 70C
Operating Junction and Storage Temperature Range
Unit
W
1.3
TJ, Tstg
–55 to 150
C
Symbol
Limit
Unit
RthJA
62.5
C/W
Parameter
Maximum Junction-to-Ambienta
Notes
a. Surface Mounted on FR4 Board, t 10 sec.
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Document Number: 70718
S-54939—Rev. A, 29-Sep-97
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Si4966DY
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
Typ
Max
VGS(th)
VDS = VGS, ID = 250 A
0.6
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "12 V
"100
IDSS
VDS = 20 V, VGS = 0 V
1
Zero Gate Voltage Drain Current
VDS = 20 V, VGS = 0 V, TJ = 55C
5
Unit
Static
Gate Threshold Voltage
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
VDS w 5 V, VGS = 4.5 V
V
20
0.019
0.025
VGS = 2.5 V, ID = 6.0 A
0.025
0.035
27
gfs
VDS = 10 V, ID = 7.1 A
Diode Forward Voltagea
VSD
IS = 1.7 A, VGS = 0 V
A
A
VGS = 4.5 V, ID = 7.1 A
Forward Transconductancea
nA
S
1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
25
VDS = 10 V,
V VGS = 4
4.5
5V
V, ID = 7.1
71 A
Gate-Drain Charge
Qgd
4
Turn-On Delay Time
td(on)
40
Rise Time
Turn-Off Delay Time
tr
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
VDD = 10 V
V,, RL = 10 ID ^ 1 A,
A VGEN = 4
4.5
5V
V, RG = 6 IF = 1.7 A, di/dt = 100 A/s
50
nC
C
6.5
60
40
60
90
150
40
60
40
80
ns
Notes
a. Pulse test; pulse width v 300 s, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 70718
S-54939—Rev. A, 29-Sep-97
Si4966DY
Vishay Siliconix
Output Characteristics
Transfer Characteristics
40
40
VGS = 5 thru 3 V
2.5 V
30
I D – Drain Current (A)
I D – Drain Current (A)
30
20
2V
10
20
TC = 125C
10
25C
1, 1.5 V
–55C
0
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
0.5
VDS – Drain-to-Source Voltage (V)
1.0
2.0
2.5
3.0
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.10
4000
0.08
3200
C – Capacitance (pF)
r DS(on)– On-Resistance ( )
1.5
0.06
0.04
VGS = 2.5 V
0.02
Ciss
2400
1600
Coss
800
VGS = 4.5 V
Crss
0
0
0
10
20
30
40
0
4
ID – Drain Current (A)
1.6
4
3
2
1
0
5
10
15
Qg – Total Gate Charge (nC)
Document Number: 70718
S-54939—Rev. A, 29-Sep-97
16
20
On-Resistance vs. Junction Temperature
VGS = 4.5 V
ID = 7.1 A
r DS(on)– On-Resistance ( )
(Normalized)
V GS – Gate-to-Source Voltage (V)
VDS = 10 V
ID = 7.1 A
0
12
VDS – Drain-to-Source Voltage (V)
Gate Charge
5
8
20
25
1.4
1.2
1.0
0.8
0.6
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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Si4966DY
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.10
40
r DS(on)– On-Resistance ( )
I S – Source Current (A)
ID = 7.1 A
0.08
TJ = 150C
10
TJ = 25C
0.06
0.04
0.02
0
1
0
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
VSD – Source-to-Drain Voltage (V)
Threshold Voltage
30
0.2
24
ID = 250 A
3
4
5
–0.2
Single Pulse Power
18
Power (W)
V GS(th) Variance (V)
2
VGS – Gate-to-Source Voltage (V)
0.4
–0.0
1
12
–0.4
6
–0.6
–50
–25
0
25
50
75
100
125
0
0.01
150
0.10
TJ – Temperature (C)
1.00
10.00
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 62.5C/W
3. TJM – TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10–4
10–3
10–2
S
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2-4
10–1
W
P l
D
ti
1
(
10
30
)
Document Number: 70718
S-54939—Rev. A, 29-Sep-97