VISHAY SI7806BDN

Si7806BDN
Vishay Siliconix
New Product
N-Channel 30-V (D-S) Fast Switching MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (Ω)
ID (A)
0.0145 at VGS = 10 V
12.6
0.0205 at VGS = 4.5 V
10.6
• TrenchFET® Power MOSFETS
• PWM Optimized
• New Low Thermal Resistance PowerPAK®
Package with Low 1.07 mm Profile
RoHS
COMPLIANT
APPLICATIONS
• DC/DC Converters
- Secondary Synchronous Rectifier
- High-Side MOSFET in Synchronous Buck
PowerPAK 1212-8
S
3.30 mm
3.30 mm
1
D
S
2
S
3
G
4
D
8
D
7
G
D
6
D
5
Bottom View
S
Ordering Information: Si7806BDN-T1-E3 (Lead (Pb)-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C unless otherwise noted
Symbol
VDS
VGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
IDM
IS
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Maximum Power
Dissipationa
ID
TA = 25 °C
TA = 70 °C
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
10 secs
12.6
10.1
3.2
3.8
2.0
Steady State
30
± 20
8.0
6.4
40
1.3
1.5
0.8
- 55 to 150
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Symbol
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Case (Drain)
t ≤ 10 sec
Steady State
Steady State
RthJA
RthJC
Typical
24
65
1.9
Maximum
33
81
2.4
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 Board.
Document Number: 73081
S-60790-Rev. B, 08-May-06
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Si7806BDN
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Static
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 µA
1.0
IGSS
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltage
a
Max
Unit
3
V
VDS = 0 V, VGS = ± 20 V
± 100
nA
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
5
VDS ≥ 5 V, VGS = 10 V
Typ
µA
40
A
VGS = 10 V, ID = 12.6 A
0.012
0.0145
VGS = 4.5 V, ID = 10.6 A
0.017
0.0205
gfs
VDS = 15 V, ID = 12.6 A
34
VSD
IS = 3.2 A, VGS = 0 V
0.77
Qg
VDS = 15 V, VGS = 4.5 V, ID = 12.6 A
8.5
11
19
24
rDS(on)
Ω
S
1.2
V
b
Dynamic
Total Gate Charge
Qgt
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
VDS = 15 V, VGS = 10 V, ID = 12.6 A
3.0
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
Ω
2
f = 10 MHz
td(on)
Turn-On Delay Time
nC
3.6
IF = 3.2 A, di/dt = 100 A/µs
8
15
12
20
25
40
10
20
35
70
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C unless noted
40
40
VGS = 10 thru 5 V
35
35
30
4V
I D − Drain Current (A)
I D − Drain Current (A)
30
25
20
15
10
25
20
15
TC = 125 °C
10
25 °C
5
5
3V
- 55 °C
0
0
0
1
2
3
4
VDS − Drain-to-Source Voltage (V)
Output Characteristics
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2
5
0
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
Transfer Characteristics
Document Number: 73081
S-60790-Rev. B, 08-May-06
Si7806BDN
Vishay Siliconix
25 °C unless noted
0.040
1400
0.035
1200
0.030
C − Capacitance (pF)
r DS(on) − On-Resistance (Ω)
TYPICAL CHARACTERISTICS
0.025
VGS = 4.5 V
0.020
0.015
VGS = 10 V
0.010
Ciss
1000
800
600
Coss
400
Crss
200
0.005
0.000
0
0
5
10
15
20
25
30
35
40
0
5
ID − Drain Current (A)
10
25
30
Capacitance
1.8
10
VDS = 15 V
ID = 12.6 A
VGS = 10 V
ID = 12.6 A
1.6
rDS(on) − On-Resistance
(Normalized)
8
6
4
2
1.4
1.2
1.0
0.8
0
0
4
8
12
16
0.6
- 50
20
Qg − Total Gate Charge (nC)
- 25
0
25
75
100
125
150
On-Resistance vs. Junction Temperature
0.030
50
ID = 12.6 A
r DS(on) − On-Resistance (Ω)
0.025
TJ = 150 °C
10
TJ = 25 °C
1
0.0
50
TJ − Junction Temperature (°C)
Gate Charge
I S − Source Current (A)
20
VDS − Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
V GS − Gate-to-Source Voltage (V)
15
ID = 2 A
0.020
0.015
0.010
0.005
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
VSD − Source-to-Drain Voltage (V)
VGS − Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 73081
S-60790-Rev. B, 08-May-06
10
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Si7806BDN
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
0.6
50
0.4
ID = 250 µA
40
Power (W)
V GS(th) Variance (V)
0.2
0.0
- 0.2
30
20
- 0.4
- 0.6
10
- 0.8
- 1.0
- 50
0
- 25
0
25
50
75
100
125
150
0.01
0.1
1
10
100
600
Time (sec)
TJ − Temperature (°C)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
rDS(on) Limited
IDM Limited
P(t) = 0.0001
I D − Drain Current (A)
10
P(t) = 0.001
1
ID(on)
Limited
P(t) = 0.01
P(t) = 0.1
P(t) = 1
0.1
TA = 25 °C
Single Pulse
P(t) = 10
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 65 °C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 73081
S-60790-Rev. B, 08-May-06
Si7806BDN
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10 -4
10 -3
10 -2
Square Wave Pulse Duration (sec)
10 -1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?73081.
Document Number: 73081
S-60790-Rev. B, 08-May-06
www.vishay.com
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Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
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