IBIS5-B-1300 CYII5FM1300AB 1.3 MP CMOS Image Sensor Description Table 1. The IBIS5-B-1300 is a solid state CMOS image sensor that integrates the functionality of complete analog image acquisition, digitizer, and digital signal processing system on a single chip. This 1.3-mega pixel (1280 x 1024) CMOS active pixel sensor dedicated to industrial vision applications features both rolling and snapshot (or global) shutter. Full frame readout time is 36 ms (max. 27.5 fps), and readout speed are boosted by windowed region of interest (ROI) readout. Another feature includes the double and multiples slope functionality to capture high dynamic range scenes. The sensor is available in a Monochrome version or Bayer (RGB) patterned color filter array. User programmable row and column start/stop positions allow windowing down to a 2x1 pixel window for digital zoom. Sub sampling or viewfinder mode reduces resolution while maintaining the constant field of view and an increased frame rate. An on-chip analog signal pipeline processes the analog video output of the pixel array. Double sampling (DS) eliminates the fixed pattern noise. The programmable gain and offset amplifier maps the signal swing to the ADC input range. A 10-bit ADC converts the analog data to a 10-bit digital word stream. The sensor uses a 2-wire, I2C™-compatible interface, a 3-wire serial parallel (SPI) interface, or a 16-bit parallel interface. It operates with a 3.3V power supply and requires only one master clock for operation up to 40 MHz. It is housed in an 84-pin ceramic LCC package. Key Performance Parameters Parameter Active pixels 1280 (H) x 1024 (V) Pixel size 6.7 µm x 6.7 µm Optical format 2/3 inch Shutter type Snapshot (global) shutter rolling shutter Maximum data rate / master clock 40 MPS / 40 MHz Frame rate 27 fps (1280 x 1024) 106 fps (640 x 480) ADC resolution 10-bit, on-chip Sensitivity (@ 650 nm) 715 V.m2/W.s 8.40 V/lux.s S/N ratio 64 dB Full well charge 62.500 e– Temporal noise 40 e– Dark current 7.22 mV/s High dynamic range Multiple slope Supply voltage Analog: 3.0V–4.5V Digital: 3.3V I/O: 3.3V Power consumption 175 mW Operating temperature –30°C to +65°C Color filter array Mono RGB Bayer pattern Packaging 84-pins LCC Applications n Machine vision n Inspection n Robotics n Traffic monitoring Typical Value IBIS5-B-1300 Cypress Semiconductor Corporation Document #: 38-05710 Rev. *C • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised August 27, 2007 IBIS5-B-1300 CYII5FM1300AB Architecture and Operation This section presents detailed information about the most important sensor blocks. Floor Plan Figure 1. Block Diagram of the IBIS5-B-1300 Image Sensor Sensor Imager core Reset C Pixel Y-left addressing Select Sample Y-right addressing Column output Pixel core Sequencer Column amplifiers Analog multiplexer System clock 40 MHz Output amplifier External connection X-addressing Figure 1 shows the architecture of the IBIS5-B-1300 image sensor. It consists basically of a pixel array, one X- and two Y-addressing registers for the readout in X- and Y-direction, column amplifiers that correct for the fixed pattern noise, an analog multiplexer, and an analog output amplifier. Use the left Y-addressing register for readout operation. Use the right Y-addressing register for reset of pixel rows. In multiple slope synchronous shutter mode, the right Y-addressing register resets the whole pixel core with a lowered reset voltage. In rolling curtain shutter mode, use the right Y-addressing register for the reset pointer in single and double slope operation to reset one pixel row. ADC Architecture The pixel architecture used in the IBIS5-B-1300 is a 4-transistor pixel as shown in Figure 2. Implement the pixel using the high fill factor technique as patented by Cypress (US patent No. 6,225,670 and others). The 4T-pixel features a snapshot shutter but can also emulate the 3T-pixel by continuously closing sampling switch M2. Using M4 as a global sample transistor for all pixels enables the snapshot shutter mode. Due to this pixel architecture, integration during read out is not possible in synchronous shutter mode. Figure 2. Architecture of the 4T-pixel The on-chip sequencer generates most of the signals for the image core. Some basic signals (like start/stop integration, line and frame sync signals, and others.) are generated externally. A 10-bit ADC is implemented on chip but electrically isolated from the image core. You must route the analog pixel output to the analog ADC input on the outside. Pixel A description of the pixel architecture and the color filter array follows. Document #: 38-05710 Rev. *C M1 reset C M2 sample M3 mux M4 column output Page 2 of 40 IBIS5-B-1300 CYII5FM1300AB Color Filter Array The IBIS5-B-1300 is also processed with a Bayer RGB color pattern. Pixel (0,0) has a green filter and is situated on a green-blue row. Green1 and green2 have a slightly different spectral response due to cross talk from neighboring pixels. Green1 pixels are located on a blue-green row, green2 pixels are located on a green-red row. Figure 4 shows the response of the color filter array as function of the wavelength. Note that this response curve includes the optical cross talk of the pixels. Green2 Green1 Blue The frame period of the IBIS5-B-1300 sensor depends on the shutter type. Rolling Shutter => Frame period = (Nr. Lines * (RBT + pixel period * Nr. Pixels)) Figure 3. Color Filter Arrangement on the Pixels Red 7).” on page 13), this requires a minimum pixel rate of nearly 40 MHz. The final bandwidth of the column amplifiers, output stage, and others is determined by external bias resistors. With a nominal pixel rate of 40 MHz, a full frame rate of a little more than 27 frames per second is obtained. with: Nr. Lines Nr. Pixels RBT Pixel period Number of lines read out each frame (Y) Number of pixels read out each line (X) Row blanking time = 3.5 µs (typical) 1/40 MHz = 25 ns Example Read out time of the full resolution at nominal speed (40-MHz pixel rate): Red Green2 Red Green2 Green1 Blue Green1 Blue => Frame period = (1024 * (3.5 µs + 25 ns * 1280)) = 36.4 ms => 27.5 fps Snapshot shutter => Frame period = Tint + Tread out = Tint + (Nr. Lines * (RBT + pixel period * Nr. Pixels)) Pixel 0,0 Frame Rate The pixel rate for this sensor is high enough to support a frame rate of >100 Hz for a window size of 640 x 480 pixels (VGA format). Taking into account a row blanking time of 3.5 µs (as baseline, see also “Internal clock granularities (bits 4, 5, 6 and with: Tint Nr. Lines Nr. Pixels RBT Pixel period Integration (exposure) time Number of lines read out each frame (Y) Number of pixels read out each line (X) Row blanking time = 3.5 µs (typical) 1/40 MHz = 25 ns Figure 4. Color Filter Response Wavelength (nm) Document #: 38-05710 Rev. *C Page 3 of 40 IBIS5-B-1300 CYII5FM1300AB Example Read out time of the full resolution at nominal speed (40 MHz pixel rate) with an integration time of 1 ms: => Frame period = 1 ms + (1024 * (3.5 µs + 25 ns * 1280)) = 37.4 ms => 26.8 fps Region-Of-Interest (ROI) Read Out Windowing is easily achieved by uploading the starting point of the X- and Y-shift registers in the sensor registers using the various interfaces. This downloaded starting point initiates the shift register in the X- and Y-direction triggered by the Y_START (initiates the Y-shift register) and the Y_CLK (initiates the X-shift register) pulse. The minimum step size for the x-address is two (only even start addresses are chosen) and one for the Y-address (every line is addressable). The frame rate increases almost linearly when fewer pixels are read out. Table 2 gives an overview of the achievable frame rates (in rolling shutter mode) with various ROI dimensions. Table 2. Frame Rate vs. Resolution Image Resolution (X*Y) Frame Frame Rate Readout Time [frames/s] [ms] Comment 1280 x 1024 27 36 Full resolution. 640 x 480 100 10 ROI read out. 100 x 100 1657 0.6 ROI read out. Image Core Operation Image Core Operation and Signalling Figure 5 is a functional representation of the image core without sub-sampling and column/row swapping circuits. Most of the signals involved are not available from the outside because they are generated by the X-sequencer and SS-sequencer blocks. The integration of the pixels is controlled by internal signals such as reset, sample, and hold which are generated by the on-chip SS-sequencer that is controlled with the external signals SS_START and SS_STOP. Reading out the pixel array starts by applying a Y_START together with a Y_CLOCK signal; internally this is followed by a calibration sequence to calibrate the output amplifiers (during the row blanking time). Signals necessary to do this calibration are generated by the on-chip X-sequencer. This calibration sequence takes typically 3.5 µs and is necessary to remove ‘Fixed Pattern Noise’ of the pixels and of the column amplifiers themselves by means of a double sampling technique. After the row blanking time, the pixels are fed to the output amplifier. The pixel rate is equal to the SYS_CLOCK frequency. Image Core Supply Considerations The image sensor has several supply voltages: VDDH is the voltage that controls the sample switches. Do not apply a higher voltage than this to the chip. The VDDR_LEFT voltage is the highest (nominal) reset voltage of the pixel core. Figure 5. Image Core Vddreset VDDR_LEFT SAMPLE RESET HOLD VDDH VDDR_RIGHT Pixel row Pixel A Y-left addressing Pixel B Y-right addressing Pixel column Y_START Y_CLOCK Y_START Y_CLOCK VDDC Column amplifiers Read-pointer Output amplifier BUS_A BUS_B SYS_CLOCK Document #: 38-05710 Rev. *C PXL_OUT X addressing Page 4 of 40 IBIS5-B-1300 CYII5FM1300AB The VDDR_RIGHT voltage is generated from the VDDR_LEFT voltage using a circuit that is programmed with the KNEEPOINT_LSB/MSB bits in the sequencer register (see also “Pixel reset knee-point for multiple slope operation (bits 8, 9, and 10).” on page 14). You can disconnect the VDDR_RIGHT pin from the circuit and apply an external voltage to supply the multiple slope reset voltage by setting the VDDR_RIGHT_EXT bit in the SEQUENCER register. When no external voltage is applied (recommended), connect the VDDR_RIGHT pin to a capacitor (recommended value = 1µF). VDDC is the pixel core supply. VDDA is the image core and periphery analog supply. VDDD is the image core and periphery digital supply. Note that the IBIS5-B-1300 image sensor has no on-chip power rejection circuitry. As a consequence all variations on the analog supply voltages can contribute to random variations (noise) on the analog pixel signal, which is seen as random noise in the image. During the camera design, take precautions to supply the sensor with very stable supply voltages to avoid this additional noise. The pixel array (VDDR_LEFT, VDDH and VDDC) analog supplies are especially vulnerable to this. Snapshot Shutter Supply Considerations The recommended supply voltage settings listed in Table 3 are used when the IBIS5-B-1300 sensor is in snapshot shutter mode only. Table 3. Snapshot Shutter Recommended Supply Settings Parameter Description Typ Unit VDDH Voltage on HOLD switches. +4.5 V VDDR_LEFT Highest reset voltage. +4.5 V VDDC Pixel core voltage. +3.3 V VDDA Analog supply voltage of the image core. +3.3 V VDDD Digital supply voltage of the image core. +3.3 V GNDA Analog ground. 0 V GNDD Digital ground. 0 V GND_AB Anti-blooming ground. 0 V Table 5. Dual Shutter Supply Considerations If you analyze the supply settings listed in Table 3, you can see some fixed column non-uniformities (FPN) when operating in rolling shutter mode. If a dual shutter mode (both rolling and snapshot shutter) is required during operation, you must apply the supply settings listed in Table 4 to achieve the best possible image quality. Table 4. Dual Shutter Recommended Supply Settings Parameter Typ Unit Voltage on HOLD switches. +4.5 V VDDR_LEFT Highest reset voltage. +4.5 V VDDC Pixel core voltage. +3.0 V VDDA Analog supply voltage of the image core. +3.3 V VDDD Digital supply voltage of the image core. +3.3 V GNDA Analog ground. 0 V VDDH Description GNDD Digital ground. 0 V GND_AB Anti-blooming ground. 0 V Image Core Biasing Signals Table 5 summarizes the biasing signals required to drive the IBIS5-A-1300. For optimizations reasons, with respect to speed and power dissipation of all internal blocks, several biasing resistors are needed. Each biasing signal determines the operation of a corresponding module in the sense that it controls the speed and power dissipation. The tolerance on the DC-level of the bias levels can vary ±150 mV due to process variations. Overview of Bias Signals Signal Comment Related module DC-Level DEC_CMD Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Decoder stage. 1.0V DAC_VHIGH Connect to VDDA with R = 0Ω. High level of DAC. 3.3V DAC_VLOW Connect to GNDA with R = 0Ω. Low level of DAC. 0.0V AMP_CMD Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Output amplifier stage. 1.2V COL_CMD Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Columns amplifiers stage. 1.0V PC_CMD Connect to VDDA with R = 25 kΩ and decouple to GNDA with C = 100 nF. Pre-charge of column busses. 1.1V ADC_CMD Connect to VDDA with R = 50 kΩ and decouple to GNDA with C = 100 nF. Analog stage of ADC. 1.0V ADC_VHIGH Connect to VDDA with R = 360Ω and decouple to GNDA with C = 100 nF. High level of ADC. 2.7V ADC_VLOW Connect to GNDA with R = 1200Ω and decouple to GNDA with C = 100 nF. Low level of ADC. 1.8V Document #: 38-05710 Rev. *C Page 5 of 40 IBIS5-B-1300 CYII5FM1300AB X-Addressing Because of the high pixel rate, the X-shift register selects two columns at a time for readout, so it runs at half the system clock speed. All even columns are connected to bus A; all odd columns to bus B. In the output amplifier, bus A and bus B are combined into one stream of pixel data at system clock speed. Because every register addresses two columns at a time, the addressable pixels range in sub-sample mode is from zero to half the maximum number of pixels in a row (only even values). For instance: 0, 2, 4, 6, 8… 638. Table 6. X_SUB At the end of the row blanking time, the X_SYNC switch is closed while all other switches are open and the decoder output is fed to the register. The decoder loads a logical one in one of the registers and a logical zero in the rest. This defines the starting point of the window in the X direction. As soon as the X_SYNC signal is released, the register starts shifting from the start position. When no sub-sampling is required, X_SUB is inactive. The pointer in the shift-register moves one bit at a time. When sub-sampling is enabled, X_SUB is activated. The shift register moves two bits at a time. Taking into account that every register selects two columns, hence two pixels sub-sampling results in the pattern ’XXOOXXOO’ when eight pixels are considered. Suppose the columns are numbered from left to right starting with 0 (zero) and sub-sampling is enabled: X–Sub-sample Patterns X_SWAP12 X_SWAP30 Sub-Sample Pattern 0 0 0 XXXXXXXX 1 0 0 XXOOXXOO 1 1 0 XOXOXOXO 1 0 1 OXOXOXOX 1 1 1 OOXXOOXX Y-addressing For symmetry reasons, the sub-sampling modes in the Y-direction are the same as in X-direction. Table 7. Y–Sub-Sample Patterns Y_SUB 0 1 1 1 1 If columns 1 and 2, 5 and 6, 9 and 10 … are swapped using the SWAP_12 switches, a normal sub-sampling pattern of ’XOXOXOXO’ is obtained. If columns 3 and 4, 7 and 8, 11 and 12 … are swapped using the SWAP_30 switches, the pattern is ’OXOXOXOX’. If both the SWAP_12 and SWAP_30 switches are closed, pattern ’OOXXOOXX’ is obtained. Y_SWAP12 Y_SWAP30 Sub-Sample Pattern 0 0 XXXXXXXX 0 0 XXOOXXOO 1 0 XOXOXOXO 0 1 OXOXOXOX 1 1 OOXXOOXX Figure 6. Column Structure COL(i) COL(i+2) COL(i+1) COL(i+3) X_SWAP30 X_SWAP12 A B A B A B Column amplifiers BUS_A BUS_B Reg(n) SYS_CLOCK Reg(n+1) Reg(n+2) Output amplifier 1/2 X_SUB X_SYNC DEC(n+1) Document #: 38-05710 Rev. *C DEC(n+2) Page 6 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 7. Row Structure Y_SYNC Y_SUB Y_SWAP12 Y_SWAP30 Reg(n) DEC(n+1) DEC(n+2) DEC(n+3) DEC(n+4) Reg(n+1) SRH Reg(n+2) SRH Reg(n+3) SRH Reg(n+4) SRH In normal mode, the pointer for the pixel row is shifted one at a time. When sub-sampling is enabled, Y_SYNC is activated. The Y-shift register shifts 2 succeeding bits and skips the 2 next bits. This results in pattern ’XXOOXXOO’. Activating Y_SWAP12 results in pattern ’XOXOXOXO’. Activating Y_SWAP30 results in pattern ’OXOXOXOX’. Activating both Y_SWAP12 and Y_SWAP30 results in pattern ’OOXXOOXX’. The addressable pixel range when Y-sub sampling is enabled is: 0–1, 4–5, 8–9, 12–13, … 1020–1021 Output Amplifier Architecture and Settings The output amplifier stage is user programmable for gain and offset level. Gain is controlled by 4-bit wide word; offset by a 7-bit wide word. Gain settings are on an exponential scale. Offset is controlled by a 7-bit wide DAC, which selects the offset voltage between two reference voltages (DAC_VHIGH and DAC_VLOW) on a linear scale. The amplifier is designed to match the specifications of the imager array output. This signal has a data rate of 40 MHz and is located between 1.17V and 2.95V. The output impedance of the amplifier is 260Ω. The output signal has a range between 1.17V and 2.95V, depending on the gain and offset settings of the amplifier. At unity gain and with a mid-range offset value, the amplifier outputs a signal in between 1.59V (light) and 2.70V (dark). This analog range must fit to the input range of the ADC, external or internal. The output swing in unity gain is approximately 1.11V and maximum 1.78V at the highest gain settings. Figure 8 on page 8 shows the architecture of the output amplifier. The odd and even column amplifiers sample both pixel and reset value to perform a double sampling FPN correction. You can adjust two different offsets using the on-chip DAC (7 bit): DAC_FINE and DAC_RAW. DAC_FINE is used to tune the difference between odd and even columns; DAC_RAW is used to add a general (both even and odd columns) to the FPN Document #: 38-05710 Rev. *C ROW(n+1) ROW(n+2) ROW(n+3) ROW(n+4) corrected pixel value. This pixel value is fed to the first amplifier stage which has an adjustable gain, controlled by a 4-bit word (’GAIN [0…3]’). After this, a unity feedback amplifier buffers the signal and the signal leaves the chip. This second amplifier stage determines the maximal readout speed, that is, the bandwidth and the slew rate of the output signal. The whole amplifier chain is designed for a data rate of 40 Mpix/s (@20 pF). Output Amplifier Gain Control The output amplifier gain is controlled by a 4-bit word set in the AMPLIFIER register (see section “Amplifier Register (6:0)” on page 15). An overview of the gain settings is given in Table 8. Table 8. Overview Gain Settings Bits 0000 0001 0010 0011 0100 0101 0110 0111 DC Gain 1.37 1.62 1.96 2.33 2.76 3.50 4.25 5.20 Bits 1000 1001 1010 1011 1100 1101 1110 1111 DC Gain 6.25 7.89 9.21 11.00 11.37 11.84 12.32 12.42 Setting of the DAC Reference Voltage In the output amplifier, the offset is trimmed by loading registers DACRAW_REG and DACFINE_REG. DAC_RAW is used to adjust the offset of the output amplifier and DAC_FINE is used to tune the offset between the even and odd columns. These registers are inputs for two DACs (see Figure 9 on page 8) that operate on the same resistor that is connected between pins DAC_VHIGH and DAC_VLOW. The range of the DAC is defined using a resistive division with RVHIGH, RDAC and RVLOW. The internal resistor RDAC has a value of approximately 7.88 kΩ. The recommend resistor values for both DAC_VLOW and DAC_VHIGH are 0Ω. Page 7 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 8. Output Structure S odd R even + S A 1 + R PXL_OUT DAC_FINE GAIN [0…3] unity gain DAC_VHIGH DAC_FINE [6:0] DAC_RAW [6:0] DAC_RAW DAC_VLOW Figure 9. In- and External DAC Connections RDAC_VHIGH DAC_VHIGH = 3.3V Analog to Digital Converter The IBIS5-B-1300 has a 10-bit flash analog digital converter running nominally at 40 Msamples/s. The ADC is electrically separated from the image sensor. Tie the input of the ADC (ADC_IN; pin 69) externally to the output (PXL_OUT1; pin 28) of the output amplifier. Table 9. RDAC external internal 7.88 kΩ DAC_VLOW = 0V internal external RDAC_VLOW ADC Specifications Input range 1–3V Quantization 10 Bits Nominal data rate 40 Msamples/s DNL (linear conversion mode) Typ. < 0.5 LSB INL (linear conversion mode) Typ. < 3 LSB Input capacitance < 20 pF Power dissipation @ 40 MHz Typ. 45 mA * 3.3V = 150 mW Conversion law Linear / Gamma-corrected ADC Timing At the rising edge of SYS_CLOCK, the next pixel is fed to the input of the output amplifier. Due to internal delays of the SYS_CLOCK signal, it takes approximately 20 ns before the output amplifier outputs the analog value of the pixel as shown in Figure 10 on page 9. The ADC converts the pixel data on the rising edge of the ADC_CLOCK, but it takes two clock cycles before this pixel data is at the output of the ADC. Figure 10 shows this pipeline delay. Note 1. The internal ADC range is typically 100 mV lower then the external applied ADC_VHIGH and ADC_VLOW voltages due to voltage drops over parasitic internal resistors Document #: 38-05710 Rev. *C Page 8 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 10. ADC Timing Due to these delays, it is advisable that a variable phase difference is foreseen between the ADC_CLOCK and the SYS_CLOCK to tune the optimal sample moment of the ADC. Setting of the ADC Reference Voltages Figure 11. In- and External ADC Connections Non-linear and Linear Conversion Mode—’gamma’ Correction Figure 12 on page 10 shows the ADC transfer characteristic. The non-linear (exponential) ADC conversion is intended for gamma-correction of the images. It increases contrast in dark areas and reduces contrast in bright areas. The non-linear transfer function is given by: 2 a*x + b*x Vin = ADC_VHIGH + ( ADC_VHIGH – ADC_VLOW ) * ----------------------------------------------a*1023 + b*1023 2 With: RADC_VHIGH ADC_VHIGH ~ 2.7V b = 0.027 external internal RADC ADC_VLOW ~ 1.8V external The internal resistor RADC has a value of approximately 585Ω. This results in the following values for the external resistors: Resistor Value (O) 360 RADC 585 RADC_VLOW 1200 Note that the recommended ADC resistor values yield in a conversion of the full analog output swing at unity gain (VDARK_ANALOG < ADC_VHIGH and VLIGHT_ANALOG > ADC_VLOW). The values of the resistors depend on the value of RADC. To assure proper working of the ADC, make certain the voltage difference between ADC_VLOW and ADC_VHIGH is at least 1.0V. Document #: 38-05710 Rev. *C x = digital output code Electronic Shutter Types The IBIS5-B-1300 has two different shutter types: a rolling (curtain) shutter and a snapshot (synchronous) shutter. RADC_VLOW RADC_VHIGH a=5 Rolling (Curtain) Shutter The name is due to the fact that the effect is similar to a curtain shutter of a SLR film camera. Although it is a pure electronic operation, the shutter seems to slide over the image. A rolling shutter is easy and elegant to implement in a CMOS sensor. Notice that in Figure 13 on page 10, there are two Y-shift registers. One of them points to the row that is currently being read out. The other shift register points to the row that is currently being reset. Both pointers are shifted by the same Y-clock and move over the focal plane. The integration time is set by the delay between both pointers. Figure 13 on page 10 graphically displays the relative shift of the integration times for different lines during the rolling shutter operation. Each line is read and reset in a sequential way. The integration time is the same for all lines, but is shifted in time. You can vary the integration time through the INT_TIME register (in number of lines). This indicates that all pixels are light sensitive at another period of time, and can cause some blurring if a fast moving object is captured. When the sensor is set to rolling shutter mode, make certain to hold the input SS_START and SS_STOP low. Page 9 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 12. Linear and Non-linear ADC Conversion Characteristic Figure 13. Rolling Shutter Operation x Reset line Read line y x y Line number Reset sequence Time axis Frame time Document #: 38-05710 Rev. *C Integration time Page 10 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 14. Synchronous Shutter Operation COMMON SAMPLE&HOLD Flash could occur here COMMON RESET Line number Time axis Integration time Snapshot (Synchronous) Shutter A synchronous (global, snapshot) shutter solves the inconvenience found in the rolling shutter. Light integration takes place on all pixels in parallel, although subsequent readout is sequential. Figure 14 shows the integration and read out sequence for the synchronous shutter. All pixels are light sensitive at the same period of time. The whole pixel core is reset simultaneously and after the integration time all pixel values are sampled together on the storage node inside each pixel. The pixel core is read out line by line after integration. Note that the integration and read out cycle is carry-out in serial; that causes that no integration is possible during read out. During synchronous shutter mode, the input pins SS_START and SS_STOP are used to start and stop the synchronous shutter. Sequencer Figure 5 on page 4 shows a number of control signals that are needed to operate the sensor in a particular sub-sampling mode with a certain integration time, output amplifier gain, and so on. Document #: 38-05710 Rev. *C Burst Readout time Most of these signals are generated on-chip by the sequencer that uses only a few control signals. Make certain that these control signals are generated by the external system: n SYS_CLOCK (X-clock) defines the pixel rate n Y_START pulse indicates the start of a new frame read out n Y_CLOCK selects a new row and starts the row blanking sequence, including the synchronization and loading of the X-register n SS_START and SS_STOP control the integration period in snapshot shutter mode. The relative position of the pulses is determined by a number of data bits that are uploaded in internal registers through the serial or parallel interface. Internal Registers Table 10 on page 12 shows a list of the internal registers with a short description. In the next section, the registers are explained in more detail. Page 11 of 40 IBIS5-B-1300 CYII5FM1300AB Table 10. Internal Registers Register Bit 0 (0000) 11:0 Name Description SEQUENCER register Default value <11:0>: ’000011000100’ 0 SHUTTER_TYPE 1 = rolling shutter 0 = synchronous shutter 1 FRAME_CAL_MODE 0 = fast 1 = slow 2 LINE_CAL_MODE 0 = fast 1 = slow 3 CONT_CHARGE 1 = ’Continuous’ precharge enabled 4 GRAN_X_SEQ_LSB Granularity of the X sequencer clock 5 GRAN_X_SEQ_MSB 6 GRAN_SS_SEQ_LSB 7 GRAN_SS_SEQ_MSB 8 KNEEPOINT_LSB Granularity of the SS sequencer clock Sets reset voltage for multiple slope operation 9 KNEEPOINT_MSB 10 KNEEPOINT_ENABLE 1 = Enables multiple slope operation in synchronous shutter mode 11 VDDR_RIGHT_EXT 1 = Disables circuit that generates VDDR_RIGHT voltage; this allows the application of an external voltage 1 (0001) 11:0 NROF_PIXELS Number of pixels to count (maximum 1280/2) Default value <11:0>: ’001001111111’ 2 (0010) 11:0 NROF_LINES Number of lines to count Default value <11:0>: ’001111111111’ 3 (0011) 11:0 INT_TIME Integration time Default value <11:0>: ’111111111111’ 4 (0100) 10:0 X_REG X start position (maximum 1280/2) Default value <10:0>: ’00000000000’ 5 (0101) 10:0 YL_REG Y-left start position Default value <10:0>: ’00000000000’ 6 (0110) 10:0 YR_REG Y-right start position Default value <10:0>: ’00000000000’ 7 (0111) 7:0 8 (1000) IMAGE CORE register Default value <7:0>: ’00000000’ 0 TEST_EVEN Test even columns 1 TEST_ODD Test odd columns 2 X_SUBSAMPLE Enable sub-sampling in X-direction 3 X_SWAP12 Swap columns 1-2, 5-6, … 4 X_SWAP30 Swap columns 3-4, 7-8, … 5 Y_SUBSAMPLE Enable sub-sampling in Y-direction 6 Y_SWAP12 Swap rows 1-2, 5-6, … 7 Y_SWAP30 Swap rows 3-4, 7-8, … 6:0 AMPLIFIER register Default value <6:0>: ’1010000’ 0 GAIN<0> Output amplifier gain setting 1 GAIN<1> 2 GAIN<2> 3 GAIN<3> 4 UNITY 1 = Amplifier in unity gain mode 5 DUAL_OUT 1 = Activates second output 6 STANDBY 0 = Amplifier in standby mode Document #: 38-05710 Rev. *C Page 12 of 40 IBIS5-B-1300 CYII5FM1300AB Table 10. Internal Registers (continued) Register Bit Name 9 (1001) 6:0 DACRAW_REG Amplifier DAC raw offset Default value <6:0>: ’1000000’ 10 (1010) 6:0 DACFINE_REG Amplifier DAC fine offset Default value <6:0>: ’1000000’ 11 (1011) 2:0 ADC register Default value <2:0>: ’011’ 0 TRISTATE_OUT 0 = Output bus in tri-state 1 GAMMA 0 = Gamma-correction on 2 BIT_INV 1 = Bit inversion on output bus 12 (1100) Reserved 13 (1101) Reserved 14 (1110) Reserved 15 (1111) Reserved Description Detailed Description of the Internal Registers Sequencer register (7:0) 1. Shutter type (bit 0). The IBIS5-B-1300 image sensor has two shutter types: 0 = synchronous shutter. 1 = rolling shutter. 2. Output amplifier calibration (bits 1 and 2). Bits FRAME_CAL_MODE and LINE_CAL_MODE define the calibration mode of the output amplifier. pixel signals on the two buses are combined into one pixel stream at the same frequency as SYS_CLOCK. Use the bits GRAN_SS_SEQ_MSB (bit 7) and GRAN_SS_SEQ_LSB (bit 6) to program the clock that drives the ’snapshot’ or synchronous shutter sequencer. This way the integration time in synchronous shutter mode is a multiple of 32, 64, 128, or 256 times the system clock period. To overcome global reset issues, use the longest SS granularity (bits 6 and 7 set to '1'). Table 11. SS Sequencer Clock Granularities During every row-blanking period, a calibration is done of the output amplifier. There are two calibration modes. The FAST mode (= 0) forces a calibration in one cycle but is not so accurate and suffers from KTC noise. The SLOW mode (= 1) only makes incremental adjustments and is noise free. GRAN_SS_SEQ_MSB/ LSB SS-Sequencer Clock Integration Time Step 00 32 x SYS_CLOCK 800 ns 01 64 x SYS_CLOCK 1.6 µs Approximately 200 or more ’slow’ calibrations have the same effect as one ’fast’ calibration. 10 128 x SYS_CLOCK 3.2 µs 11 256 x SYS_CLOCK 6.4 µs Different calibration modes are set at the beginning of the frame (FRAME_CAL_MODE bit) and for every subsequent line that is read (LINE_CAL_MODE bit). The Y_START input defines the beginning of a frame, Y_CLOCK defines the beginning of a new row. 3. Continuous charge (bit 3). Some applications may require the use continuous charging of the pixel columns instead of a pre-charge on every line sample operation. Setting bit CONT_CHARGE to ’1’ activates this function. The resistor connected to pin PC_CMD controls the current level on every pixel column. 4. Internal clock granularities (bits 4, 5, 6 and 7). The clock that drives the X-sequencer is a multiple of 4, 8, 16, or 32 times the system clock. Clocking the X-sequencer at a slower rate (longer row blanking time; pixel read out speed is always equal to the SYSTEM_CLOCK) results in more signal swing for the same light conditions. Table 12. X Sequencer Clock Granularities GRAN_X_SEQ_MSB/ LSB X-Sequencer Clock Row Blanking Time 00 4 x SYS_CLOCK 3.5 µs 01 8 x SYS_CLOCK 7 µs The system clock is divided several times on-chip. 10 16 x SYS_CLOCK 14 µs Half the system clock rate clocks the X-shift-register that controls the column/pixel readout. Odd and even pixel columns are switched to two separate buses. In the output amplifier the 11 32 x SYS_CLOCK 28 µs Note 2. Using a SYS_CLOCK of 40 MHz (25 ns period). Document #: 38-05710 Rev. *C Page 13 of 40 IBIS5-B-1300 CYII5FM1300AB 5. Pixel reset knee-point for multiple slope operation (bits 8, 9, and 10). In normal (single slope) mode the pixel reset is controlled from the left side of the image core using the voltage applied on pin VDDR_LEFT as pixel reset voltage. In multiple slope operation, apply one or more variable pixel reset voltages. Bits KNEE_POINT_MSB and KNEE_POINT_LSB select the on chip-generated pixel reset voltage. Bit KNEE_POINT_ENABLE set to ’1’ switches control to the right side of the image core so the pixel reset voltage (VDDR_RIGHT), selected by bits KNEE_POINT_MSB/LSB, is used. Use bit KNEE_POINT_ENABLE only for multiple slope operation in synchronous shutter mode. In rolling shutter mode, use only the bits KNEE_POINT_MSB/LSB to select the second knee-point in dual slope operation. The actual knee-point depends on VDDH, VDDR_LEFT and VDDC applied to the sensor. Table 13. Multiple Slope Register Settings KNEE_POINT Pixel Reset Voltage Knee-point (V)VDDR_RIGHT (V) MSB/LSB ENABLE 00 0 or 1 VDDR_LEFT 0 01 1 VDDR_LEFT – 0.76 + 0.76 10 1 VDDR_LEFT – 1.52 + 1.52 11 1 VDDR_LEFT – 2.28 + 2.28 6. External Pixel Reset Voltage for Multiple Slope (bit 11) Setting bit VDDR_RIGHT_EXT to ’1’ disables the circuit that generates the variable pixel reset voltage and uses the voltage externally applied to pin VDDR_RIGHT as the double/multiple slope reset voltage. Setting bit VDDR_RIGHT_EXT to ’0’ allows you to monitor the variable pixel reset voltage (used for multiple slope operation) on pin VDDR_RIGHT. NROF_PIXELS Register (11:0) After the internal x_sync is generated (start of the pixel readout of a particular row), the PIXEL_VALID signal goes high. The PIXEL_VALID signal goes low when the pixel counter reaches the value loaded in the NROF_PIXEL register. Due to the fact that two pixels are read at the same clock cycle, you must divide this number by 2 (NROF_PIXELS = (width of ROI / 2) – 1). ROF_LINES Register (11:0) After the internal yl_sync is generated (start of the frame readout with Y_START), the line counter increases with each Y_CLOCK pulse until it reaches the value loaded in the NROF_LINES register and generates a LAST_LINE pulse. INT_TIME Register (11:0) Use the INT_TIME register to set the integration time of the electronic shutter. The interpretation of the INT_TIME depends on the chosen shutter type (rolling or synchronous). 1. Synchronous shutter. After the SS_START pulse is applied an internal counter counts the number of SS granulated clock cycles until it reaches the value loaded in the INT_TIME register and generates a TIME_OUT pulse. Use this TIME_OUT pulse to generate the SS_STOP pulse to stop the integration. When the INT_TIME register is used, the maximum integration time is: TINT_MAX = 212 * 256 (maximum granularity) * (40 MHZ) – 1 = 26.2 ms. You can increase this maximum time if you use an external counter to trigger SS_STOP. Ten is the minimal value that you can load into the INT_TIME register (see also “Internal clock granularities (bits 4, 5, 6 and 7).” on page 13). 2. Rolling shutter. When the Y_START pulse is applied (start of the frame readout), the sequencer generates the yl_sync pulse for the left Y-shift register (read out Y-shift register). This loads the left Y-shift register with the pointer loaded in YL_REG register. At each Y_CLOCK pulse, the pointer shifts to the next row and the integration time counter increases until it reaches the value loaded in the INT_TIME register. At that moment, the sequencer generates the yr_sync pulse for the right Y-shift register; it loads the right Y-shift register (reset Y-shift register) with the pointer loaded in YR_REG register (see Figure 15). The integration time counter is reset when the sync for the left Y-shift register is asserted. Both shift registers keep moving until the next sync is asserted (it generates the Y_START for the left Y-shift register and the sync for the right Y-shift register when the integration time counter reaches the INT_TIME value). Treg_int Difference between the left and right pointer = value set in the INT_TIME register (number of lines). The actual integration time is given by: Tint Integration time [# lines] = NROF_LINES register – INT_TIME register. Figure 15. Synchronization of the Shift Registers in Rolling Shutter Mode Sync of left shift-register Last line, followed by sync of left shift-register Sync of right shift-register Sync Line n Document #: 38-05710 Rev. *C Tint Treg_int Page 14 of 40 IBIS5-B-1300 CYII5FM1300AB 4. STANDBY X_REG Register (10:0) The X_REG register determines the start position of the window in the X-direction. In this direction, there are 640 possible starting positions (two pixels are addressed at the same time in one clock cycle). If sub sampling is enabled, only the even pixels are set as starting position (for instance: 0, 2, 4, 6, 8… 638). YL_REG (10:0) and YR_REG (10:0) The YL_REG and YR_REG registers determine the start position of the window in the Y-direction. In this direction, there are 1024 possible starting positions. In rolling shutter mode the YL_REG register sets the start position of the read (left) pointer and the YR_REG sets the start position of the reset (right) pointer. For both shutter types YL_REG is always equal to YR_REG. If STANDBY = 0, the complete output amplifier is put in standby. For normal use, set STANDBY to ‘1’. DAC_RAW Register (6:0) and DAC_FINE (6:0) Register These registers determine the black reference level at the output of the output amplifier. Bit setting 1111111 for the DAC_RAW register gives the highest offset voltage. Bit setting 0000000 for the DAC_RAW register gives the lowest offset voltage. Ideally, if the two output paths have no offset mismatch, the DAC_FINE register is set to 1000000. Deviation from this value is used to compensate the internal mismatch (see “Output Amplifier” on page 7). ADC Register (2:0) Image Core Register (7:0) 1. TRISTATE_OUT (bit 0) Bits 1:0 of the IMAGE_CORE register define the test mode of the image core. Setting 00 is the default and normal operation mode. In case the bit is set to ‘1’, the odd (bit 1) or even (bit 0) columns are tight to the reset level. If the internal ADC is used, bits 0 and 1 are used to create test pattern to test the sample moment of the ADC. If the ADC sample moment is not chosen correctly, the created test pattern is not black-white-black-etc. (IMAGE_CORE register set at 1 or 2) or black-black-white-white-black-black (IMAGE_CORE register set at 9) but grey shadings if the sensor is saturated. In case TRISTATE = 0, the ADC_D<9:0> outputs are in tri-state mode. TRISTATE = 1 for normal operation mode. 2. GAMMA (bit 1) Bits 7:2 of the IMAGE_CORE register define the sub-sampling mode in the X-direction (bits 4:2) and in the Y-direction (bits 7:5). The sub-sampling modes and corresponding bit setting are given in Table 6 on page 6 and Table 7 on page 6. Amplifier Register (6:0) 1. GAIN (bits 3:0) If GAMMA is set to ‘1’, the ADC input to output conversion is linear; otherwise the conversion follows a 'gamma' law (more contrast in dark parts of the window, lower contrast in the bright parts). 3. BIT_INV (bit 2) If BIT_INV = 1, 0000000000 is the conversion of the lowest possible input voltage, otherwise the bits are inverted. Data Interfaces Two different data interfaces are implemented. They are selected using pins IF_MODE (pin 12) and SER_MODE (pin 6). Table 14. Serial and Parallel Interface Selection The gain bits determine the gain setting of the output amplifier. They are only effective if UNITY = 0. The gains and corresponding bit setting are given in Table 8 on page 7. 2. UNITY (bit 4) IF_MODE SER_MODE 1 X Parallel 0 1 Serial 3 Wire In case UNITY = 1, the gain setting of GAIN is bypassed and the gain amplifier is put in unity feedback. 3. DUAL_OUT (bit 5) 0 0 Serial 2 Wire. If DUAL_OUT = 1, the two output amplifiers are active. If DUAL_OUT = 0, the signals from the two buses are multiplexed to output PXL_OUT1 which connects to ADC_IN. The gain amplifier and output driver of the second path are put in standby. Selected interface Parallel Interface The parallel interface uses a 16-bit parallel input (P_DATA (15:0)) to upload new register values. Asserting P_WRITE loads the parallel data into the internal register of the IBIS5-B-1300 where it is decoded. (See Figure 16. P_DATA (15:12) address bits REG_ADDR (3:0); P_DATA (11:0) data bits REG_DATA (11:0)). Figure 16. Parallel Interface Timing Document #: 38-05710 Rev. *C Page 15 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 17. Serial 3-Wire Interface Timing Serial 3-Wire Interface Serial 2-Wire Interface The serial 3-wire interface (or serial-to-parallel Interface) uses a serial input to shift the data in the register buffer. When the complete data word is shifted into the register buffer the data word is loaded into the internal register where it is decoded. (See Figure 17. S_DATA (15:12) address bits REG_ADDR (3:0); S_DATA (11:0) data bits REG_DATA (11:0). When S_EN is asserted the parallel data is loaded into the internal registers of the IBIS5-A-1300. The maximum tested frequency of S_DATA is 2.5 MHz.) The serial 2-wire interface is a unidirectional interface (you can only write register values to the sensor; you cannot read anything out). Therefore, the R/W_N bit (bit 8) is ignored internally. An acknowledge pulse is asserted each time a data word is received successfully. The maximum tested frequency of S_DATA is 2.5 MHz. (See Figure 18. S_DATA (15:12) address bits REG_ADDR (3:0); S_DATA (11:0) data bits REG_DATA (11:0)). Figure 18. Serial 2-Wire Interface Timing 1-7 S_CLK 8 9 1-7 8 9 1-7 8 9 S_DATA Start SI2 R/ Ack address W_N Data(15:8) Ack Data(7:0) Ack Stop REG_LOAD (internal) Document #: 38-05710 Rev. *C Page 16 of 40 IBIS5-B-1300 CYII5FM1300AB Timing Diagrams Synchronous Shutter: Single Slope Integration Timing Requirements SS_START and SS_STOP must change on the falling edge of the SYS_CLOCK (Tsetup and Thold > 7.5 ns). Make certain that the pulse width of both signals is a minimum of 1 SYS_CLOCK cycle. As long as SS_START or SS_STOP are asserted, the sequencer stays in a suspended state. (See Figure 21.) There are six control signals that operate the image sensor: • SS_START • SS_STOP • Y_CLOCK • Y_START • X_LOAD • SYS_CLOCK T1—Time counted by the integration timer until the value of INT_TIME register is reached. The integration timer is clocked by the granulated SS-sequencer clock. The external system generates these control signals with following time constraints to SYS_CLOCK (rising edge = active edge): T3—There are no constraints for this time. Use the TIME_OUT signal to trigger the SS_STOP pin (or use an external counter to trigger SS_STOP); you cannot tie both signals together. TSETUP >7.5 ns T4—During this time, the SS-sequencer applies the control signals to reset the image core and start integration. This takes four granulated SS-sequencer clock periods. The integration time counter starts counting at the first rising edge after the falling edge of SS_START. THOLD > 7.5 ns It is important that these signals are free of any glitches. Figure 19 shows a recommended schematic for generating the basic signals and to avoid any timing problems. Figure 19. Recommended Schematic for Generating Basic Signals FF T2—TIME_OUT signal stays SS-sequencer clock period. high for one granulated T5—The SS-sequencer puts the image core in a readable state. It takes two granulated SS-sequencer clock periods. Tint—The ’real’ integration or exposure time. SS_START SS_STOP Y_CLOCK Y_START X_LOAD SYS_CLOCK_N SYS_CLOCK Figure 20. Relative Timing of the 5 Sequencer Control Signal Figure 21. Synchronous Shutter: Single Slope Integration Document #: 38-05710 Rev. *C Page 17 of 40 IBIS5-B-1300 CYII5FM1300AB Figure 22. Synchronous Shutter: Pixel Read Out Synchronous Shutter: Pixel Readout Basic Operation Y_START and Y_CLOCK must change on the falling edge of the SYS_CLOCK (Tsetup and Thold > 7.5 ns). Make certain that the pulse width is a minimum of one clock cycle for Y_CLOCK and three clock cycles for Y_START. As long as Y_CLOCK is applied, the sequencer stays in a suspended state. (See Figure 22.) T1—Row blanking time: During this period, the X-sequencer generates the control signals to sample the pixel signal and pixel reset levels (double sampling fpn-correction), and starts the readout of one line. The row blanking time depends on the granularity of the X-sequencer clock (see Table 15). Table 15. Row Blanking Time as Function of X-Sequencer Granularity Granularity NGRAN x4 T1(µs) GRAN_X_SEQ = 35 x NGRAN x TSYS_CLOCK MSB/LSB 140 x TSYS_CLOCK = 3.5 00 x8 280 x TSYS_CLOCK = 7.0 01 x 16 560 x TSYS_CLOCK = 14.0 10 x 32 1120 x TSYS_CLOCK = 28.0 11 T2—Pixels counted by pixel counter until the value of NROF_PIXELS register is reached. PIXEL_VALID goes high when the internal X_SYNC signal is generated, in other words when the readout of the pixels is started. PIXEL_VALID goes low when the pixel counter reaches the value loaded in the NROF_PIXELS register (after a complete row read out). T3—LAST_LINE goes high when the line counter reaches the value loaded in the NROF_LINES register and stays high for one line period (until the next falling edge of Y-CLOCK). On Y_START the left Y-shift-register of the image core is loaded with the YL-pointer that is loaded in to register YL_REG. Pixel Output The pixel signal at the PXL_OUT1 output becomes valid after five SYS_CLOCK cycles when the internal X_SYNC (= start of PIXEL_VALID output or external X_LOAD pulse) pulse is asserted. (See Figure 23.) T1—Row blanking time (see Table 15). T2—5 SYS_CLOCK cycles. T3—Time for new X-pointer position upload in X_REG register (see “Windowing in X-direction” on page 20 for more details). Figure 23. Pixel Output Document #: 38-05710 Rev. *C Page 18 of 40 IBIS5-B-1300 CYII5FM1300AB Synchronous Shutter: Multiple Slope Integration Figure 24. Multiple Slope Integration Use up to four different pixel reset voltages during multiple slope operation in synchronous shutter mode. This is done by uploading new values to register bits KNEEPOINT_MSB/LSB/ENABLE before a new SS_START pulse is applied. Set bit KNEEPOINT_ENABLE high to do a pixel reset with a lower voltage. Set bits KNEEPOINT_MSB/LSB/ENABLE back to ‘0’ before the SS_STOP pulse is applied. Every time an SS_START pulse is applied, the integration time counter is reset. Table 16. Multiple Slope Register Settings Kneepoint MSB/LSB Enable Initial Setup 00 0 1st Register Upload 01 1 2nd Register Upload 10 1 3th Register Upload 11 1 4th Register Upload 00 0 Document #: 38-05710 Rev. *C Upload the register after time Tstable, otherwise, the change affects the SS-sequencer resulting in a bad pixel reset. Tstable depends on the granularity of the SS-sequencer clock (see Table 17). Table 17. Tstable for Different Granularity Settings Granularity Tstable (µs) NGRAN = 5 x NGRAN x TSYS_CLOCK x 32 GRAN_SS_SEQ MSB/LSB 160 x TSYS_CLOCK = 4 00 x 64 320 x TSYS_CLOCK = 8 01 x 128 640 x TSYS_CLOCK = 16 10 x 256 1280 x TSYS_CLOCK = 32 11 Tupload depends on the interface mode used to upload the registers. Table 18. Tupload for Different Interface Modes Interface Mode Tupload (µs) Parallel 1 Serial 3-wire 8 Page 19 of 40 IBIS5-B-1300 CYII5FM1300AB Rolling Shutter Operation Figure 25. Rolling Shutter Operation The integration of the light in the image sensor is done during readout of the other lines. The only difference with synchronous shutter is that the TIME_OUT pin is used to indicate when the Y_SYNC pulse for the right Y-shift-register (reset Y-shift register) is generated. This loads the right Y-shift-register with the pointer loaded in register YR_REG. The Y_SYNC pulse for the left Y-shift register (read Y-shift register) is generated with Y_START. The INT_TIME register defines how many lines to count before the Y_SYNC of the right Y-shift-register is generated, hence defining the integration time. See also “INT_TIME Register (11:0)” on page 14 for a detailed description of the rolling shutter operation. Tint Integration time [# lines] = register(NROF_LINES) – register(INT_TIME) Note For normal operation the values of the YL_REG and YR_REG registers are equal. Windowing in X-direction An X_LOAD pulse overrides the internal X_SYNC signal, loading a new X-pointer (stored in the X_REG register) into the X-shift-register. The X_LOAD pulse has to appear on the falling edge of SYS_CLOCK and has to remain high for two SYS_CLOCK cycles overlapping two rising edges of SYS_CLOCK. The new X-pointer is loaded on one of the two rising edges of SYS_CLOCK. The available time to upload the register is Tload; it is defined from the previous register load to the rising edge of X_LOAD. It depends on the settling time of the register and the X-decoder. The actual time to load the register itself depends on the interface mode that is used. The parallel interface is the fastest. Table 19. Tload for Different Interfaces Interface Mode Tload (µs) Parallel interface 1 (about 40 SYS_CLOCK cycles) Serial 3 Wire 16 (at 2.5 MHz data rate) Figure 26. Windowing in the X-Direction Document #: 38-05710 Rev. *C Page 20 of 40 IBIS5-B-1300 CYII5FM1300AB Windowing in Y-direction Figure 27. Windowing in the Y-Direction Reapply the Y_START pulse after loading a new Y-pointer value into the YL_REG and YR_REG registers to load a new Y-pointer into the Y-shift-register. Every time a Y_START pulse appears, a frame calibration of the output amplifier occurs. Initialization (Start-Up Behavior) After power on of the image sensor, apply SYS_RESET for a minimum of five SYS_CLOCK periods to ensure a proper reset of the on-chip sequencer and timing circuitry. All internal registers are set to ‘0’ after SYS_RESET is applied. Since all the IBIS5-B-1300 control signals are active high, apply a low level (before SYS_RESET occurs) to these pins at start up to avoid latch up. To avoid any high current consumption at start-up, apply the SYS_CLOCK signal as soon as possible after or even before power on of the image sensor. Document #: 38-05710 Rev. *C Page 21 of 40 IBIS5-B-1300 CYII5FM1300AB Pin List The IBIS5-B-1300 image sensor is packaged in a leadless ceramic carrier (LCC package). Table 20 lists all the pins and their functions. There are 84 pins total. Table 20. Pin List[3, 4, 5] Pin Pin Name Pin Type Pin Description 1 P_DATA<8> Input Digital input. Data parallel interface. 2 P_WR Input Digital input (active high). Parallel write. 3 S_CLK Input Digital input. Clock signal of serial interface. 4 S_DATA Input Digital input/output. Data of serial interface. 5 S_EN Input Digital input (active low). Enable of serial 3-wire interface. 6 SER_MODE Input Digital input. Serial mode enable (1 = Enable serial 3-wire, 0 = Enable serial 2-wire). 7 VDDC Supply Analog supply voltage. Supply voltage of the pixel core [3.3V]. 8 VDDA Supply Analog supply voltage. Analog supply voltage of the image sensor [3.3V]. 9 GNDA Ground Analog ground. Analog ground of the image sensor. 10 GNDD Ground Digital ground. Digital ground of the image sensor. 11 VDDD Supply Digital supply voltage. Digital supply voltage of the image sensor [3.3V]. 12 IF_MODE Input Digital input. Interface mode (1 = parallel; 0 = serial). 13 DEC_CMD Input Analog input. Biasing of decoder stage. Connect to VDDA with R = 50 kΩ and decouple with C = 100 nF to GNDA. 14 Y_START Input Digital input (active high). Start frame read out. 15 Y_CLOCK Input Digital input (active high). Line clock. 16 LAST_LINE Output Digital output. Generates a high level when the last line is read out. 17 X_LOAD Input Digital input (active high). Loads new X-position during read out. 18 SYS_CLOCK Input Digital input. System (pixel) clock (40 MHz). 19 PXL_VALID Output Digital output. Generates high level during pixel read out. 20 SS_START Input Digital input (active high). Start synchronous shutter operation. 21 SS_STOP Input Digital input (active high). Stop synchronous shutter operation. 22 TIME_OUT Output Digital output. Synchronous shutter: pulse when timeout reached. It is used to trigger SS_STOP; do not tie both signals together. Rolling shutter: pulse when second Y-sync appears. 23 SYS_RESET Input Digital input (active high). Global system reset. 24 EL_BLACK Input Digital input (active high). Enables electrical black in output amplifier. 25 EOSX Output Digital output. Diagnostic end-of-scan of X-register. 26 DAC_VHIGH Input Analog reference input. Biasing of DAC for output dark level. Use this to set the output range of DAC. Default: Connect to VDDA with R = 0Ω. 27 DAC_VLOW Input Analog reference input. Biasing of DAC for output dark level. Use this to set the output range of DAC. Default: Connect to GND A with R = 0Ω. 28 PXL_OUT1 Output Analog output. Analog pixel output 1. Notes 3. You can connect all pins with the same name together. 4. All digital input are active high (unless mentioned otherwise). 5. Tie all digital inputs that are not used to GND (inactive level). Document #: 38-05710 Rev. *C Page 22 of 40 IBIS5-B-1300 CYII5FM1300AB Table 20. Pin List[3, 4, 5] (continued) Pin Pin Name Pin Type Pin Description 29 PXL_OUT2 Output Analog output. Analog pixel output 2. Leave not connected if not used. 30 AMP_CMD Input Analog input. Biasing of the output amplifier. Connect to VDDA with R = 50 kΩ and decouple with C = 100 nF to GNDA. 31 COL_CMD Input Analog input. Biasing of the column amplifiers. Connect to VDDA with R = 50 kΩ and decouple with C = 100 nF to GNDA. 32 PC_CMD Input Analog input. Pre-charge bias. Connect to VDDA with R = 25 kΩ and decouple with C = 100 nF to GNDA. 33 VDDD Supply Digital supply. Digital supply voltage of the image sensor [3.3V]. 34 GNDD Ground Digital ground. Digital ground of the image sensor. 35 GNDA Ground Analog ground. Analog ground of the image sensor. 36 VDDA Supply Analog supply voltage. Analog supply voltage of the image sensor [3.3V]. 37 VDDC Supply Analog supply voltage. Supply voltage of the pixel core [3.3V]. 38 P_DATA<0> Input Digital input. Data parallel interface (LSB). 39 P_DATA<1> Input Digital input. Data parallel interface. 40 P_DATA<2> Input Digital input. Data parallel interface. 41 P_DATA<3> Input Digital input. Data parallel interface. 42 P_DATA<4> Input Digital input. Data parallel interface. 43 P_DATA<5> Input Digital input. Data parallel interface. 44 P_DATA<6> Input Digital input. Data parallel interface. 45 P_DATA<7> Input Digital input. Data parallel interface. 46 SI2_ADDR<0> Input Digital input. Sets I2C address. 47 SI2_ADDR<1> Input Digital input. Sets I2C address. 48 SI2_ADDR<2> Input Digital input. Sets I2C address. 49 SI2_ADDR<3> Input Digital input. Sets I2C address. 50 SI2_ADDR<4> Input Digital input. Sets I2C address. 51 GNDAB Supply Analog supply voltage. Anti-blooming ground. 52 VDDR_RIGHT Supply Analog supply voltage. Variable reset voltage (multiple slope operation). Decouple with 1 µF to GNDA. 53 ADC_VLOW Input Analog reference input. ADC low reference voltage.Default: Connect to GNDA with R = 1200Ω and decouple with C = 100 nF to GNDA. 54 ADC_GNDA Ground Analog ground. ADC analog ground. 55 ADC_VDDA Supply Analog supply voltage. ADC analog supply voltage [3.3V]. 56 ADC_GNDD Ground Digital ground. ADC digital ground. 57 ADC_VDDD Supply Digital supply voltage. ADC digital supply voltage [3.3V]. 58 ADC_CLOCK Input Digital input. ADC clock (40 MHz). 59 ADC_OUT<9> Output Digital output. ADC data output (MSB). 60 ADC_OUT<8> Output Digital output. ADC data output. 61 ADC_OUT<7> Output Digital output. ADC data output. 62 ADC_OUT<6> Output Digital output. ADC data output. 63 ADC_OUT<5> Output Digital output. ADC data output. 64 ADC_OUT<4> Output Digital output. ADC data output. Document #: 38-05710 Rev. *C Page 23 of 40 IBIS5-B-1300 CYII5FM1300AB Table 20. Pin List[3, 4, 5] (continued) Pin Pin Name Pin Type Pin Description 65 ADC_OUT<3> Output Digital output. ADC data output. 66 ADC_OUT<2> Output Digital output. ADC data output. 67 ADC_OUT<1> Output Digital output. ADC data output. 68 ADC_OUT<0> Output Digital output. ADC data output (LSB). 69 ADC_IN Input Analog input. ADC analog input. 70 ADC_CMD Input Analog input. Biasing of the input stage of the ADC. Connect to ADC_VDDA with R = 50 kΩ and decouple with C = 100 nF to ADC_GNDA. 71 ADC_VDDD Supply Digital supply voltage. ADC digital supply voltage [3.3V]. 72 ADC_GNDA Ground Analog ground. ADC analog ground. 73 ADC_GNDD Ground Digital ground. ADC digital ground. 74 ADC_VDDA Supply Analog supply voltage. ADC analog supply voltage [3.3V]. 75 ADC_VHIGH Input Analog reference input. ADC high reference volt age.Default: Connect to VDDA with R = 360Ω and decouple with C = 100 nF to GNDA. 76 VDDR_LEFT Supply Analog supply voltage. High reset level [4.5V]. 77 VDDH Supply Analog supply voltage. High supply voltage for HOLD switches in the image core [4.5V] 78 P_DATA<15> Input Digital input. Data parallel interface (MSB). 79 P_DATA<14> Input Digital input. Data parallel interface. 80 P_DATA<13> Input Digital input. Data parallel interface. 81 P_DATA<12> Input Digital input. Data parallel interface. 82 P_DATA<11> Input Digital input. Data parallel interface. 83 P_DATA<10> Input Digital input. Data parallel interface. 84 P_DATA<9> Input Digital input. Data parallel interface. Document #: 38-05710 Rev. *C Page 24 of 40 IBIS5-B-1300 CYII5FM1300AB Specifications Electro-Optical Specifications General Specifications. Overview Table 21. General Specifications Table 22. Electro-Optical Specifications Parameter Specification Pixel architecture 4T-pixel Pixel size 6.7 µm x 6.7 µm Resolution 1280 x 1024 Pixel rate 40 MHz Shutter type Full frame rate • Electronic rolling shutter • Snapshot shutter Remarks High fill factor square pixels (based on the high fill factor active pixel sensor technology of Cypress). Patents pending. The resolution and pixel size results in a 2/3" optical format. Using a 40 MHz system clock. • Continuous imaging. • Triggered global shutter with integration and readout separate in time. 27 frames/second Increases with ROI read out and/or sub sampling. Parameter Specification Remarks FPN (local) <0.20% RMS % of saturation signal. PRNU (local) <10% Peak-to-peak of signal level. Conversion gain 17.6 µV/electron @ output (measured). Output signal amplitude 1V Saturation charge 62.500 e- Sensitivity (peak) 715V.m2/W.s 8.40 V/lux.s At nominal conditions. @ 650 nm (85 lux = 1 W/m2). Sensitivity (visible) 572 V.m2/W.s 3.51 V/lux.s 400-700 nm (163 lux = 1 W/m2). Peak QE * FF Peak 30%0.16 A/W Spectral Resp. Average QE*FF = 22% (visible range). Average SR*FF = 0.1 A/W (visible range). See spectral response curve. Fill factor 40% Light sensitive part of pixel (measured). Dark current 7.22 mV/s 410e-/s Typical value of average dark current of the whole pixel array (@ 21 °C). Dark Signal Non Uniformity 7 mV/s 400 e-/s Dark current RMS value (@ 21 °C). Temporal noise 40 RMS e- Measured at digital output (in the dark). S/N Ratio 1563:1 (64 dB) Measured at digital output (in the dark). Spectral sensitivity 400 - 1000 nm range Optical cross talk Document #: 38-05710 Rev. *C 16% To the first neighboring pixel. Parasitic Sensitivity 3% Averaged over spectrum Power dissipation Typical (including ADCs). 175 mWatt Page 25 of 40 IBIS5-B-1300 CYII5FM1300AB Spectral Response Curve Figure 28. Spectral response curve CYII5SM1300AB CYII5FM1300AB 0.225 QE 40% QE 30% 0.2 0.175 QE 20% Spec res [A/W] 0.15 0.125 0.1 QE 10% 0.075 0.05 0.025 0 400 500 600 700 800 900 1000 Wavelenght [nm] Figure 28 shows the spectral response characteristic for the IBIS5-B-1300 (CYII5SM1300AB) and the IBIS-5-BE-1300 (CYII5FM1300AB). The curve is measured directly on the pixels. It includes effects of non-sensitive areas in the pixel, for example, interconnection lines. The sensor is light sensitive between 400 and 1000 nm. The peak QE * FF is 30%, approximately around 650 nm. In view of a fill factor of 40%, the QE is thus close to 75% between 500 and 700 nm. The IBIS5-BE-1300 has superior response in the NIR region (700-900 nm). For more information about the IBIS5-B-1300, refer to “IBIS5-BE-1300 (CYII5FM1300AB)” on page 27. Document #: 38-05710 Rev. *C Page 26 of 40 IBIS5-B-1300 CYII5FM1300AB Electro-voltaic Response Curve Figure 29. Electro-Voltaic Response Curve 1,2 Output swing [V] 1 0,8 0,6 0,4 0,2 0 0 10000 20000 30000 40000 50000 60000 70000 80000 # electrons Figure 29 shows the pixel response curve in linear response mode. This curve is the relation between the electrons detected in the pixel and the output signal. The resulting voltage-electron curve is independent of any parameters (integration time, and others). The voltage to electrons conversion gain is 17.6 µV/electron. IBIS5-BE-1300 (CYII5FM1300AB) The IBIS5-BE-1300 is processed on a thicker epitaxial Si layer featuring a superb sensitivity in the NIR (Near Infra Red) wavelengths (700–900 nm). The spectral response curves of the two IBIS5-B-1300 image sensors are shown in Figure 28 on page 26. As many machine vision applications use light sources in the NIR, the IBIS5-BE-1300 sensor has a significant sensitivity advantage in the NIR. A drawback of the thicker epitaxial layer is a slight performance decrease in MTF (Modular Transfer Function or electrical pixel to pixel cross-talk) as indicated in the Table 23. Table 23. MTF comparison Direction Wavelength IBIS5-B-1300 0.58 IBIS5-BE-1300 0.37 Horizontal 600 Horizontal 700 0.18 Horizontal 800 0.16 Horizontal 900 0.07 Vertical 600 Vertical 700 0.16 Vertical 800 0.13 Vertical 900 0.11 0.53 0.26 The resulting image sharpness is hardly affected by this decreased MTF value. Both IBIS5-B-1300 versions are fully pin compatible and have identical timing and biasing Document #: 38-05710 Rev. *C Page 27 of 40 IBIS5-B-1300 CYII5FM1300AB Features and General Specifications Table 24. Features and General Specifications Feature Electronic shutter types Specification/Description 1. Rolling curtain shutter. 2. Synchronous (snapshot) shutter. Windowing (ROI) Implemented as scanning of lines/columns from an uploaded position. Sub-sampling modes: 1:2 sub-sampling. Sub-sampling patterns: XXOOXXOO (for Bayer pattern color filter) OOXXOOXX (for Bayer pattern color filter) XOXOXOXOOXOXOXOX Identical sub-sample patterns in X- and Y-direction. Extended dynamic range In rolling shutter: Normal (1) or double (2) slope. In Synchronous shutter: 1, 2, 3 or 4 slopes. Digital output 10 bit ADC @ 40 MSamples/s. Programmable gain range x1 to x12, in 16 steps of approx. 1.5 dB using 4-bit programming. Programmable offset 128 steps (7 bit). Supply voltage VDD Image core supply: Range from 3.0V to 4.5V Analog supply: Nominal 3.3V Digital: Nominal 3.3V Logic levels 3.3 V (Digital supply). Operational temperature range –30°C to 65°C, with degradation of dark current. Die size (with scribe lines) 10.1 mm by 9.3 mm (x by y). Package 84 pins LCC. Electrical Specifications Absolute Maximum Ratings Table 25. Absolute Maximum Ratings Parameter Description Value Unit VDD DC supply voltage –0.5 to 4.5 V VIN DC input voltage –0.5 to 3.8 V VOUT DC output voltage –0.5 to 3.8 V IIO DC current drain per pin; any single input or output. ± 50 mA TL Lead temperature (5 seconds soldering). 350 °C TST Storage temperature –30 to +85 °C H Humidity (relative) 85% at 85°C ESD ESD susceptibility 2000 V VDD = VDDD = VDDA (VDDD is supply to digital circuit, VDDA to analog circuit). Stresses beyond those listed under the section Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections are not implied. Exposure to absolute maximum rating conditions for extended periods can affect device reliability. Document #: 38-05710 Rev. *C Page 28 of 40 IBIS5-B-1300 CYII5FM1300AB Recommended Operating Conditions Table 26. Recommended Operating Conditions Parameter Description Min Typ Max Unit VDDH Voltage on HOLD switches. +3.3 +4.5 +4.5 V VDDR_LEFT Highest reset voltage. +3.3 +4.5 +4.5 V VDDC Pixel core voltage. +2.5 +3.0 +3.3 V VDDA Analog supply voltage of the image core. +3.0 +3.3 +3.6 V VDDD Digital supply voltage of the image core. +3.0 +3.3 +3.6 V GNDA Analog ground –0.5 0 +0.5 V GNDD Digital ground –0.5 0 +0.5 V GND_AB Anti-blooming ground. –0.5 0 +0.5 V TA Commercial operating temperature. 0 30 60 °C All parameters are characterized for DC conditions after thermal equilibrium is established. Always tie unused inputs to an appropriate logic level, for example, either VDD or GND. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields. However, take normal precautions to avoid application of any voltages higher than the maximum rated voltages to this high impedance circuit. DC Electrical Characteristics Table 27. DC Electrical Characteristics Parameter Characteristic VIH Input high voltage VIL Input low voltage Condition Min 2.1 IIN Input leakage current VIN = VDD or GND –10 VOH Output high voltage VDD = min; IOH = –100 mA 2.2 VOL Output low voltage VDD = min; IOH = 100 mA IDD Maximum operating current System clock <= 40 MHz Document #: 38-05710 Rev. *C Max 40 Unit V 0.6 V +10 µA V 0.5 V 60 mA Page 29 of 40 IBIS5-B-1300 CYII5FM1300AB Pad position and Packaging Bare Die The IBIS5-B-1300 image sensor has 84 pins, 21 pins on every edge. The die size from pad-edge to pad-edge (without scribe-line) is: 10156.5 µm (x) by 9297.25 µm (y). Scribe lines take about 100 to 150 µm extra on each side. Pin 1 is located in the middle of the left side, indicated by a ‘1’ on the layout. A logo and some identification tags are on the top right of the die. Figure 30. IBIS5-B-1300 Bare Die Dimensions (All dimensions in µm) Test structure Document #: 38-05710 Rev. *C Identification Page 30 of 40 IBIS5-B-1300 CYII5FM1300AB IBIS5-B-1300 in 84-pin LCC Package Technical Drawing of 84-pin LCC Package (spec 001-05461-**) Figure 31. Top View of the 84-Pin LCC Package (all dimensions in mm) Figure 32. Side View of the 84-pin LCC Package (all dimensions in mm Document #: 38-05710 Rev. *C Page 31 of 40 IBIS5-B-1300 CYII5FM1300AB Table 28. Side View Dimensions Dimension A Description (Inch) (mm) Min Typ Max Min Typ Max Glass (thickness) - mono 0.020 0.022 0.024 0.500 0.550 0.600 0.060 0.069 0.078 1.520 1.750 1.980 B Cavity (depth) C Die - Si (thickness) - mono D Bottom layer (thickness) E Die attach-bondline (thickness) 0.001 0.002 0.004 0.030 0.060 0.090 0.001 0.003 0.004 0.030 0.070 0.110 0.029 0.740 0.020 F Glass attach-bondline (thickness) G Imager to lid-outer surface H Imager to lid-inner surface J Imager to seating plane of package 0.500 0.062 1.570 0.037 0.050 0.051 0.950 0.052 1.270 1.300 1.330 Figure 33. Side View Dimensions Figure 34. Bottom View of the 84-pin LCC Package (all dimensions in mm) Pin 1 Document #: 38-05710 Rev. *C Page 32 of 40 IBIS5-B-1300 CYII5FM1300AB Bonding of the IBIS5-B-1300 Sensor in the 84-Pin LCC Package Figure 35. Bonding of the IBIS5-B-1300 in the 84-Pin LCC Package Document #: 38-05710 Rev. *C Page 33 of 40 IBIS5-B-1300 CYII5FM1300AB Die Placement of the IBIS5-B-1300 in the 84-Pin LCC Package Figure 36. Die Placement of the IBIS5-B-1300 in the 84-Pin LCC Package Tolerance on the die placement in X- and Y-directions is maximal ±50 µm. Document #: 38-05710 Rev. *C Page 34 of 40 IBIS5-B-1300 CYII5FM1300AB Cover Glass A D263 glass lid (which has a refraction index of 1.52) is used as a protection glass lid on top of all IBIS5-B-1300 sensors. Figure 37 shows the transmission characteristics of the D263 glass. Figure 37. Transmission Characteristics of the D263 Glass 100 Transmission [%] 90 80 70 60 50 40 30 20 10 0 400 500 600 700 800 900 Wavelength [nm] Document #: 38-05710 Rev. *C Page 35 of 40 IBIS5-B-1300 CYII5FM1300AB Storage and Handling Precautions and Cleaning Storage Conditions Table 29. Storage Conditions Description Temperature Minimum Maximum Units –30 +85 °C Avoid spilling solder flux on the cover glass; bare glass and particularly glass with antireflection filters are adversely affected by the flux. Avoid mechanical or particulate damage to the cover glass. Use isopropyl alcohol (IPA) as a solvent for cleaning the image sensor glass lid. When using other solvents, make certain to confirmed beforehand whether or not the solvent can dissolve the package and/or the glass lid. Handling and Soldering Conditions X-ray inspection Take special care when soldering image sensors with color filter arrays (RGB color filters) onto a circuit board since color filters are sensitive to high temperatures. Prolonged heating at elevated temperatures can result in deterioration of the performance of the sensor. The following recommendations are made to ensure that sensor performance is not compromised during end-users' assembly processes. X-ray inspection to check the solder leads of the image sensor is not recommended because the high energetic radiation can permanently damage the devices or cause image artefacts. Board Assembly Place the device onto boards in accordance with strict ESD controls for Class 0, JESD22 Human Body Model, and Class A, JESD22 Machine Model devices. Assembly operators must always wear all designated and approved grounding equipment; use grounded wrist straps at ESD protected workstations including the ionized blowers. Use only ESD protected tools. Manual Soldering Observe the following conditions when using a soldering iron: Use a soldering iron with temperature control at the tip. The soldering iron tip temperature must not exceed 350°C. Make certain that the soldering period for each pin is less than five seconds. Reflow Soldering Figure 38 shows the maximum recommended thermal profile for a reflow soldering system. If the temperature/time profile exceeds these recommendations, damage to the image sensor can occur. See Figure 38 for more details. RoHS (Pb-free) Compliance This paragraph reports the use of hazardous chemical substances as required by the RoHS Directive (excluding packing material). Table 30. The Chemical Substances and Information About Any Intentional Content Chemical Substance Intentional content? Where is the intentional content contained? Lead NO - Cadmium NO - Mercury NO - Hexavalent Chromium NO - PBB (Polybrominated biphenyls) NO - PBDE (Polybrominated diphenyl ethers) NO - Figure 38. Reflow Soldering Temperature Profile Document #: 38-05710 Rev. *C Page 36 of 40 IBIS5-B-1300 CYII5FM1300AB Information on Pb-Free Soldering: IBIS5-B-1300-M2 (serial numbers beyond 3694): the product was tested successfully for Pb-free soldering processes, using a reflow temperature profile with maximum 260°C, minimum 40s at 255°C and minimum 90s at 217°C. Note ‘Intentional content’ is defined as any material demanding special attention that is allowed into the product as follows: 1. A chemical composition is added into the inquired product intentionally in order to produce and maintain the required performance and function of the product. 2. A chemical composition which is used intentionally in the manufacturing process, that is allowed into the product. The following case is not treated as ‘intentional content’: 1. The above material is contained as an impurity into raw materials or parts of the intended product. The impurity is defined as a substance that cannot be removed industrially, or it is produced using a process such as chemical composing or reaction, and it cannot be removed technically. Ordering Information Cypress Part number CYII5SC1300AA-HSC CYII5SC1300AB-HDC Glass Lid Mono/Color 84-pin JLCC Mono Mono 84-pin JLCC Package Mono RGB Bayer CYII5SM1300AB-HDC 84-pin JLCC Mono Mono CYII5SM1300AB-QDC 84-pin LCC Mono Mono CYII5SC1300AB-QDC 84-pin LCC Mono RGB Bayer CYIIFM1300AB-QDC 84-pin LCC Mono Mono Notes 6. JLCC package for use in evaluation kits only. 7. D263 is used as protective cover glass lid (see Figure 37 for spectral transmittance). 8. The CYII5FM1300AB has a thicker epitaxial Si layer for enhanced sensitivity in the NIR region. Other packaging combinations are available upon special request. Contact your local Cypress sales office for more information about part names, prices and availability. Document #: 38-05710 Rev. *C Page 37 of 40 IBIS5-B-1300 CYII5FM1300AB Appendix A: IBIS5 Evaluation System For evaluating purposes an IBIS5 evaluation kit is available. The IBIS5 evaluation kit consists of a multifunctional digital board (memory, sequencer and IEEE 1394 Fire Wire interface) and an analog image sensor board. Visual Basic software (under Win 2000™ or XP™) allows the grabbing and display of images and movies from the sensor. Store all acquired images and movies in different file formats (8 or 16-bit). You can adjust all setting on the fly to evaluate the sensors specifications. You can load default register values to start the software in a wanted state. Figure 39. Content of the IBIS5 Evaluation Kit Document #: 38-05710 Rev. *C Page 38 of 40 IBIS5-B-1300 CYII5FM1300AB Appendix B: IBIS5-1300 Revision Overview Table 31. IBIS5-1300 Revision Differences Parameter IBIS5-1300 IBIS5-A-1300 IBIS5-AE-1300 IBIS5-B-1300 Status Obsolete Production Production Sampling QE * FF (peak) 0.13 A/W (@ 650 nm) 0.16 A/W (@ 650 nm) 0.21 A/W (@ 760 nm) 0.16 A/W (@ 650 nm) Full well charge 120.000 e- 62.500 e- 62.500 e- 62.500 e- Output signal swing 1V (unity gain) 1.8V (max.) 1.1V (unity gain) 1.8V (max) 1.1V (unity gain) 1.8V (max) 1.1V (unity gain) 1.8V (max) Conversion gain 12 µV/e– 17.6 µV/e– 17.6 µV/e– 17.6 µV/e– Temporal noise 85 e– 40 e– 40 e– 40 e– S/N ratio 1412:1 / 63 dB 1563:1 / 64 dB 1563:1 / 64 dB 1563:1 / 64 dB FPN 0.34 (% of fw) 0.15 (% of fw) 0.15 (% of fw) 0.15 (% of fw) PRNU (at Qsat/2) < 10% (p-p) < 10% (p-p) < 10% (p-p) < 10% (p-p) Dark current (average) 66 mV/s 7.22 mV/s 7.22 mV/s 7.22 mV/s Pixel output rate 40 MHz 40 MHz 40 MHz 40 MHz Frame rate 27.5 fps 27.5 27.5 fps 27.5 fps Interface Serial Serial 3-wire Parallel Serial 3-wire Parallel Serial 3-wire Parallel Serial 2-wire Serial 3-wire Parallel Extended dynamic range Double/multiple slope Double/multiple slope Double/multiple slope Double/multiple slope Timing See “Timing Diagrams” Identical on page 17 Identical Identical 50 kΩ 5 kΩ 10 kΩ 50 kΩ 50 kΩ 25 kΩ 50 kΩ 130Ω 240Ω 50 kΩ 0Ω 0Ω 50 kΩ 50 kΩ 25 kΩ 50 kΩ 90Ω 360Ω 50 kΩ 0Ω 0Ω 50 kΩ 50 kΩ 25 kΩ 50 kΩ 360Ω 1200Ω Biasing: 2-wire fps DEC_CMD DAC_VHIGH DAC_VLOW AMP_CMD COL_CMD PC_CMD ADC_CMD ADC_VHIGH ADC_VLOW 50 kΩ 0Ω 0Ω 50 kΩ 50 kΩ 25 kΩ 50 kΩ 90Ω 360Ω Notes 9. Rolling shutter mode (see also paragraph ). 10. The serial 2-wire interface is a write-only I2C-compatible interface. Document #: 38-05710 Rev. *C Page 39 of 40 IBIS5-B-1300 CYII5FM1300AB Document History Page Document Title: IBIS5-B-1300 CYII5FM1300AB 1.3 MP CMOS Image Sensor Document Number: 38-05710 REV. ECN NO. Orig. of Change ** 310213 FVK New Data Sheet Description of Change *A 649064 FPW Ordering information update and new layout. Implemented the new template. Moved figure captions to the top of the figures and moved notes to the bottom of the page per new template. Verified all cross-referencing. Moved the specifications towards the back. Corrected one variable on the Master pages. Spelled checked. *B 1162847 FPW/ARI BGA package information removed. Implemented new template. Edited for template compliance. *C 1417584 FPW Die placement drawing update © Cypress Semiconductor Corporation, 2005-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document #: 38-05710 Rev. *C Revised August 27, 2007 Page 40 of 40 PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names mentioned in this document may be the trademarks of their respective holders.