SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection HF Pb RoHS SP6001 Lead-Free/Green Series GREEN Description The Littelfuse SP6001 SPA series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Pinout Features 1 • EMI filtering of frequencies from 800MHz to 3GHz 4 UDFN-08 • Greater than -30dB attenuation (TYP) at 1GHz GND 8 5 • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • Small, low-profile UDFN package (TYP 0.5mm height) SP6001-04UTG-1 6 1 GND UDFN-12 SP6001-06UTG-1 Functional Block Diagram Applications SP6001-04UTG-1 1 2 3 4 Cd Cd Cd Cd Cd Cd Cd Cd • Keypad interface for portable electronics • Mobile phone 12 • LCD and camera display interfaces for handsets • Portable navigation device 11 • Connector interfaces for portable electronics SP6001-06UTG-1 8 1 7 2 6 3 5 4 5 Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd Cd 10 9 8 6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. • Smartphone 7 1 SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 7 12 SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Absolute Maximum Ratings Value Units TOP Symbol Operating Temperature Parameter -40 to 85 °C TSTOR Storage Temperature -60 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VRWM=5V Min 7.0 Max Units 6.0 V 7.5 8.0 V 0.1 1.0 µA 100 115 Resistance RA IR=10mA Diode Capacitance1,2 CD VR=2.5V,f=1MHz Line Capacitance1,2 CL VR=2.5V,f=1MHz 19 IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 VESD Cutoff Frequency3 F-3dB 85 Typ 12 Above this frequency, appreciable attenutation occurs 24 115 Ω pF 29 pF MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 3 Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination SP6001 Lead-Free/Green Series 2 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Insertion Loss (S21) 21 CH1 S Analog Crosstalk (S41) log MAG 5 dB/ REF 0 dB 1 _:-5.8807 dB CH1 S Cor Cor Del Smo Smo 1 log MAG 10 dB/ REF 0 dB 1 x2 Start x2 Stop 6 000.000.000MHz 3.000 000MHz START 3.000 000 MHz Stop 6 000.000 000 MHz Line Capacitance vs. DC Bias 50 Capacitance (pF) 40 30 20 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Lead-Free/Green SP6001 0 5.0 DC Bias (V) ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 3 SP6001 Lead-Free/Green Series SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Application Example Dx: SP6001-04 Silicon Protection Array LCD Module Controller Input 4 5 Outside World GND D1 D2 D3 D4 1 8 SP6001-04UTG (µDFN) Signal Ground Soldering Parameters Reflow Condition Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP6001 Lead-Free/Green Series 4 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Package Dimensions - UDFN-08 D UDFN-08 Symbol Max Min Max 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 A1 A3 E A Min 0.450 K L e 0.127 REF 0.005 REF b 0.150 0.250 0.006 0.010 D 1.600 1.800 0.063 0.071 D2 1.100 1.300 0.043 0.051 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e b Inches A A3 E2 D2 Millimeters 0.400 BSC K 0.200 L 0.150 0.016 BSC 0.350 0.008 0.000 0.006 0.014 Package Dimensions - UDFN-12 UDFN-12 A1 A3 E A Symbol E2 K L e ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. Max A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 5 0.127 REF Min Max 0.005 REF b 0.150 0.250 0.006 D 2.400 2.600 0.094 0.102 D2 1.900 2.100 0.075 0.083 0.010 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e b Inches Min A3 D2 Millimeters 0.400 BSC K 0.200 L 0.150 0.350 0.016 BSC 0.008 0.000 0.006 0.014 SP6001 Lead-Free/Green Series Lead-Free/Green SP6001 D SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Product Characteristics Part Numbering System SP 6001 – 0x U T G - 1 Silicon Protection Array G= Green T= Tape & Reel Series Package Number of Channels UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters Part Marking System JH4 JH6 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. J H x 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 4 = UDFN-08 6 = UDFN-12 Product Series J = SP6001 6. Package surface matte finish VDI 11-13. Assembly Site Ordering Information Part Number Package Size Marking Min. Order Qty. SP6001-04UTG-1 uDFN-08 1.7x1.35mm JH4 3000 SP6001-06UTG-1 uDFN-12 2.5x1.35mm JH6 3000 Embossed Carrier Tape & Reel Specification – UDFN-08 t Symbol W E D P2 BO Max 1.65 1.85 0.065 0.073 3.45 3.55 0.136 0.140 D1 1.00 - 0.040 - 10P AO Min F 1.50 min D F P Inches Max E P D1 Millimetres Min 3.90 0.059 min 4.10 40.0 +/- 0.20 0.154 0.161 1.575 +/- 0.008 W 7.70 8.30 0.303 0.327 P2 1.95 2.05 0.077 0.081 A0 1.55 1.75 0.061 0.069 B0 1.90 2.1 0.075 0.083 K0 0.95 1.15 0.037 0.045 0.30 max 0.012 max KO t SP6001 Lead-Free/Green Series 6 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. SPA™ Silicon Protection Array Products 12pF EMI Filter Array with ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-12 o/ D Symbol t oD / Millimetres Min BO Max 1.65 1.85 0.065 0.073 3.45 3.55 0.136 0.140 D1 0.55 0.65 0.021 0.025 P A0 Min F 10P P Inches Max E 1.50 min D F W E P2 3.90 0.059 min 4.10 40.0 +/- 0.20 0.154 0.161 1.575 +/- 0.008 W 7.90 8.30 0.311 0.327 P2 1.95 2.05 0.077 0.081 0.060 A0 1.33 1.53 0.052 B0 2.63 2.83 0.103 0.111 K0 0.58 0.78 0.023 0.031 0.22 max 0.009 max Lead-Free/Green SP6001 K0 t ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 7 SP6001 Lead-Free/Green Series