VISHAY SS23S

New Product
SS22S, SS23S & SS24S
Vishay General Semiconductor
Surface Mount Schottky Barrier Rectifier
FEATURES
• Low profile package
• Ideal for automated placement
• Low forward voltage drop, low power
losses
• High efficiency
• High surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
DO-214AC (SMA)
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in low voltage, high frequency inverters,
freewheeling, dc-to-dc converters, and polarity
protection applications.
(Note: These devices are not Q101 qualified.)
PRIMARY CHARACTERISTICS
IF(AV)
2A
VRRM
20 V, 30 V, 40 V
IFSM
40 A
VF at IF = 2.0 A
0.517 V
TJ max.
150 °C
MECHANICAL DATA
Case: DO-214AC (SMA)
Epoxy meets UL 94V-0 flammability rating
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test
Polarity: Color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
SS22S
SS23S
SS24S
UNIT
22S
23S
24S
V
20
30
40
V
Maximum repetitive peak reverse voltage
VRRM
Maximum average forward rectified current (Fig. 1)
IF(AV)
2.0
A
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load
IFSM
40
A
dV/dt
10 000
V/µs
TJ, TSTG
- 55 to + 150
°C
Voltage rate of change (rated VR)
Operating junction and storage temperature range
Document Number: 89008
Revision: 19-May-08
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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New Product
SS22S, SS23S & SS24S
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
Instantaneous forward voltage (1)
IF = 1 A,
IF = 2 A,
Reverse current (2)
rated VR
Typical junction capacitance
4.0 V, 1 MHz
SYMBOL
TYP
MAX.
UNIT
TJ = 25 °C
VF
0.436
0.517
0.55
V
TJ = 25 °C
TJ = 100 °C
IR
13
1.65
200
8
µA
mA
CJ
130
-
pF
Notes:
(1) Pulse test: 300 µs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
SS22S
SS23S
RθJA
RθJL
Typical thermal resistance (1)
SS24S
UNIT
75
25
°C/W
Note:
(1) P.C.B. mounted with 0.4 x 0.4" (10 x 10 mm) copper pad areas
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
SS24S-E3/61T
0.064
61T
1800
7" diameter plastic tape and reel
SS24S-E3/5AT
0.064
5AT
7500
13" diameter plastic tape and reel
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
1.2
D = 0.3
Resistive or Inductive Load
1.6
1.2
0.8
P.C.B. Mounted on
0.4 x 0.4" (10 x 10 mm)
Copper Pad Areas
0.4
D = 0.5
D = 0.8
D = 0.2
1.0
2.0
Average Power Loss (W)
Average Forward Rectified Current (A)
2.4
D = 0.1
0.8
D = 1.0
0.6
T
0.4
0.2
D = tp/T
tp
0
0
0
25
50
75
100
125
150
175
0
0.5
1.0
1.5
2.0
2.5
Lead Temperature (°C)
Average Forward Current (A)
Figure 1. Forward Current Derating Curve
Figure 2. Forward Power Loss Characteristics
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 89008
Revision: 19-May-08
New Product
SS22S, SS23S & SS24S
Vishay General Semiconductor
100 000
At rated TL
8.3 ms Single Half Sine-Wave
Instantaneous Reverse Current (µA)
Peak Forward Surge Current (A)
50
40
30
20
10
TJ = 150 °C
10 000
TJ = 125 °C
1000
100
TJ = 25 °C
10
1
0
0
10
10
100
20
30
40
50
60
70
80
90
100
Number of Cycles at 60 Hz
Percent of Rated Peak Reverse Voltage (%)
Figure 3. Maximum Non-Repetitive Peak Forward Surge Current
Figure 5. Typical Reverse Leakage Characteristics
1000
TJ = 150 °C
10
TJ = 125 °C
1
0.1
0.1
Junction Capacitance (pF)
Instantaneous Forward Current (A)
100
TJ = 25 °C
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
100
10
0.3
0.5
0.7
0.9
1.1
1.3
0.1
1
10
100
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Figure 4. Typical Instantaneous Forward Characteristics
Figure 6. Typical Junction Capacitance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-214AC (SMA)
Cathode Band
Mounting Pad Layout
0.110 (2.79)
0.100 (2.54)
0.065 (1.65)
0.049 (1.25)
0.177 (4.50)
0.157 (3.99)
0.012 (0.305)
0.006 (0.152)
0.060 (1.52)
MIN.
0.208 (5.28)
REF.
0.090 (2.29)
0.078 (1.98)
0.060 (1.52)
0.030 (0.76)
0.074 (1.88)
MAX.
0.066 (1.68)
MIN.
0.008 (0.203)
0 (0)
0.208 (5.28)
0.194 (4.93)
Document Number: 89008
Revision: 19-May-08
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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