CYPRESS CY7C1049CV33

CY7C1049CV33
4-Mbit (512 K × 8) Static RAM
4-Mbit (512 K × 8) Static RAM
Features
Functional Description
■
Temperature ranges
❐ Commercial: 0 °C to 70 °C
❐ Industrial: –40 °C to 85 °C
■
High speed
❐ tAA = 8 ns
■
Low active power
❐ 360 mW (max)
The CY7C1049CV33 is a high performance Complementary
metal oxide semiconductor (CMOS) Static RAM organized as
524,288 words by eight bits. Easy memory expansion is provided
by an active LOW Chip Enable (CE), an active LOW Output
Enable (OE), and three-state drivers. Writing to the device is
accomplished by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. Data on the eight I/O pins (I/O0 through I/O7)
is then written into the location specified on the address pins (A0
through A18).
■
2.0 V data retention
■
Automatic power down when deselected
■
Transistor- transistor logic (TTL) compatible inputs and outputs
■
Easy memory expansion with CE and OE features
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins appear on the I/O pins.
The eight input and output pins (I/O0 through I/O7) are placed in
a high impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a write
operation (CE LOW, and WE LOW).
The CY7C1049CV33 is available in standard 44-pin TSOP II
package with center power and ground (revolutionary) pinout.
Logic Block Diagram
SENSE AMPS
IO1
512K x 8
ARRAY
IO2
IO3
IO4
IO5
IO6
CE
•
IO7
POWER
DOWN
A18
A17
A15
A13
A14
OE
A16
COLUMN DECODER
WE
Cypress Semiconductor Corporation
Document #: 38-05006 Rev. *M
IO0
INPUT BUFFER
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 14, 2011
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CY7C1049CV33
Contents
Selection Guide ................................................................ 3
Pin Configuration ............................................................. 3
Pin Definitions .................................................................. 3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
Electrical Characteristics ................................................. 4
Capacitance ...................................................................... 4
Thermal Resistance .......................................................... 4
AC Test Loads and Waveforms ....................................... 5
AC Switching Characteristics ......................................... 6
Switching Waveforms ...................................................... 7
Truth Table ........................................................................ 9
Document #: 38-05006 Rev. *M
Ordering Information ........................................................ 9
Ordering Code Definitions ........................................... 9
Package Diagram ............................................................ 10
Acronyms ........................................................................ 11
Document Conventions ................................................. 11
Units of Measure ....................................................... 11
Document History Page ................................................. 12
Sales, Solutions, and Legal Information ...................... 13
Worldwide Sales and Design Support ....................... 13
Products .................................................................... 13
PSoC Solutions ......................................................... 13
Page 2 of 13
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CY7C1049CV33
Selection Guide
Description
-8
-10
Unit
8
10
ns
Maximum operating current
100
100
mA
Maximum CMOS standby current
10
10
mA
Maximum access time
Pin Configuration
Figure 1. 44-pin TSOP II (Top View)
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
VCC
VSS
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
1
44
2
3
43
42
4
41
40
39
38
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A18
A17
A16
A15
OE
I/O7
I/O6
VSS
VCC
I/O5
I/O4
A14
A13
A12
A11
A10
NC
NC
NC
Pin Definitions
Pin Name
44-pin TSOP II
Pin Number
A0–A18
3–7, 16–20, 26–30,
38–41
Input
I/O0–I/O7
9, 10, 13, 14, 31,
32, 35, 36
Input/Output
Bidirectional data I/O lines. Used as input or output lines depending on
operation.
NC[1]
1, 2, 21, 22, 23, 24,
25, 42, 43, 44
No connect
No connects. This pin is not connected to the die.
WE
15
Input/Control
Write Enable input, active LOW. When selected LOW, a WRITE is
conducted. When selected HIGH, a READ is conducted.
CE
8
Input/Control
Chip Enable input, active LOW. When LOW, selects the chip. When HIGH,
deselects the chip.
OE
37
Input/Control
Output Enable, active LOW. Controls the direction of the I/O pins. When
LOW, the I/O pins are allowed to behave as outputs. When deasserted
HIGH, I/O pins are three-stated, and act as input data pins.
VSS, GND
12, 34
Ground
VCC
11, 33
Power supply
I/O Type
Description
Address inputs used to select one of the address locations.
Ground for the device. Should be connected to ground of the system.
Power supply inputs to the device.
Note
1. NC pins are not connected on the die.
Document #: 38-05006 Rev. *M
Page 3 of 13
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CY7C1049CV33
Maximum Ratings
DC voltage applied to outputs
in High Z State[2] ................................. –0.5 V to VCC + 0.5 V
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Input Voltage[2] ................................... –0.5 V to VCC + 0.5 V
Current into Outputs (LOW) ........................................ 20 mA
Storage temperature ................................ –65 C to +150 C
Operating Range
Ambient temperature with
power applied .......................................... –55 C to +125 C
Range
Supply voltage on
VCC to Relative GND[2] ................................–0.5 V to +4.6 V
Ambient Temperature
VCC
0 C to +70 C
3.3 V  0.3 V
-40 C to +85 C
3.3 V  0.3 V
Commercial
Industrial
Electrical Characteristics
Over the Operating Range
Parameter
Description
-8
Test Conditions
Min
-10
Max
Unit
Max
Min
2.4
–
2.4
–
V
–
0.4
–
0.4
V
VOH
Output HIGH voltage
VCC = Min; IOH = –4.0 mA
VOL
Output LOW voltage
VCC = Min; IOL = 8.0 mA
VIH
Input HIGH voltage
2.0
VCC + 0.3
2.0
VCC + 0.3
V
VIL
Input LOW voltage[2]
–0.3
0.8
–0.3
0.8
V
IIX
Input load current
GND < VI < VC
–1
+1
–1
+1
A
ICC
VCC operating supply
current
VCC = Max, f = fMAX = 1/tRC
–
100
–
100
mA
ISB1
Automatic CE
power down current
—TTL inputs
Max. VCC, CE > VIH, VIN > VIH or
VIN < VIL, f = fMAX
–
40
–
40
mA
ISB2
Automatic CE
power down current
—CMOS Inputs
Max. VCC, CE > VCC – 0.3 V,
VIN > VCC – 0.3 V, or VIN < 0.3 V,
f=0
–
10
–
10
mA
Capacitance
Parameter[3]
Description
CIN
Input capacitance
COUT
I/O capacitance
Test Conditions
TA = 25 C, f = 1 MHz, VCC = 3.3 V
Max
Unit
8
pF
8
pF
Thermal Resistance
Parameter[3]
JA
JC
Description
Thermal resistance
(Junction to ambient)
Thermal resistance
(Junction to case)
Test Conditions
Test conditions follow standard test methods and procedures for
measuring thermal impedance, per EIA / JESD51.
44-pin TSOP-II Unit
41.66
°C/W
10.56
°C/W
Notes
2. AC characteristics (except High Z) are tested using the load conditions shown in Figure 2 on page 5 (a). High Z characteristics are tested for all speeds using the test
load shown in Figure 2 on page 5 (c).
3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05006 Rev. *M
Page 4 of 13
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CY7C1049CV33
AC Test Loads and Waveforms
Figure 2. AC Test Loads and Waveforms [4]
8, 10-ns devices:
Z = 50 
OUTPUT
50 
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
30 pF*
1.5 V
(a)
High Z characteristics:
ALL INPUT PULSES
3.0 V
90%
GND
Rise Time: 1 V/ns
90%
10%
10%
(b)
R 317
3.3 V
Fall Time: 1 V/ns
OUTPUT
R2
351
5 pF
(c)
Note
4. AC characteristics (except High Z) are tested using the load conditions shown in Figure 2 (a). High Z characteristics are tested for all speeds using the test load shown
in Figure 2 (c).
Document #: 38-05006 Rev. *M
Page 5 of 13
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CY7C1049CV33
AC Switching Characteristics
Over the Operating Range
Parameter [5]
Description
-8
-10
Min
Max
Min
Max
Unit
100
–
100
–
s
Read Cycle
tpower[6]
VCC(typical) to the first access
tRC
Read cycle time
8
–
10
–
ns
tAA
Address to data valid
–
8
–
10
ns
tOHA
Data Hold from Address Change
3
–
3
–
ns
tACE
CE LOW to data valid
–
8
–
10
ns
tDOE
OE LOW to data valid
–
5
–
5
ns
0
–
0
–
ns
–
4
–
5
ns
3
–
3
–
ns
–
4
–
5
ns
tLZOE
OE LOW to Low
Z[7]
Z[7, 8]
tHZOE
OE HIGH to High
tLZCE
CE LOW to Low Z[7]
Z[7, 8]
tHZCE
CE HIGH to High
tPU
CE LOW to power up
0
–
0
–
ns
tPD
CE HIGH to power down
–
8
–
10
ns
Write Cycle [9, 10]
tWC
Write cycle time
8
–
10
–
ns
tSCE
CE LOW to write end
6
–
7
–
ns
tAW
Address setup to write end
6
–
7
–
ns
tHA
Address hold from write end
0
–
0
–
ns
tSA
Address setup to write start
0
–
0
–
ns
tPWE
WE pulse width
6
–
7
–
ns
tSD
Data setup to write end
4
–
5
–
ns
tHD
Data hold from write end
0
–
0
–
ns
WE HIGH to Low
Z[7]
3
–
3
–
ns
WE LOW to High
Z[7, 8]
–
4
–
5
ns
tLZWE
tHZWE
Notes
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V.
6. tPOWER gives the minimum amount of time that the power supply should be at stable, typical VCC values until the first memory access can be performed.
7. At any temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any device.
8. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (c) of Figure 2 on page 5. Transition is measured ±500 mV from steady-state voltage.
9. The internal Write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a Write, and the transition of either of
these signals can terminate the Write. The input data setup and hold timing should be referenced to the leading edge of the signal that terminates the Write.
10. The minimum Write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05006 Rev. *M
Page 6 of 13
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CY7C1049CV33
Switching Waveforms
Figure 3. Read Cycle No. 1 (Address Transition Controlled) [11, 12]
tRC
RC
ADDRESS
tAA
tOHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Figure 4. Read Cycle No. 2 (OE Controlled) [12, 13]
2
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
tLZOE
HIGH IMPEDANCE
DATA OUT
tLZCE
VCC
SUPPLY
CURRENT
tHZCE
HIGH
IMPEDANCE
DATA VALID
tPD
tPU
50%
ICC
50%
ISB
Notes
11. Device is continuously selected. OE, CE = VIL.
12. WE is HIGH for read cycles.
13. Address valid before or similar to CE transition LOW.
Document #: 38-05006 Rev. *M
Page 7 of 13
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CY7C1049CV33
Switching Waveforms (continued)
Figure 5. Write Cycle No. 1 (WE Controlled, OE HIGH During Write) [14, 15]
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
tPWE
WE
OE
tSD
DATA I/O
NOTE 16
tHD
DATA VALID
tHZOE
Figure 6. Write Cycle No. 2 (WE Controlled, OE LOW) [15]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
tSD
DATA I/O
NOTE 16
tHD
DATA VALID
tHZWE
tLZWE
Notes
14. Data I/O is high impedance if OE = VIH.
15. If CE goes HIGH simultaneously with WE HIGH, the output remains in high impedance state.
16. During this period, the I/Os are in output state. Do not apply input signals.
Document #: 38-05006 Rev. *M
Page 8 of 13
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CY7C1049CV33
Truth Table
CE
OE
WE
I/O0–I/O7
Mode
Power
H
X
X
High Z
Power Down
Standby (ISB)
L
L
H
Data Out
Read
Active (ICC)
L
X
L
Data In
Write
Active (ICC)
L
H
H
High Z
Selected, Outputs Disabled
Active (ICC)
Ordering Information
Speed
(ns)
Ordering Code
Package
Diagram
Package Type
Operating
Range
8
CY7C1049CV33-8ZSXC
51-85087 44-pin TSOP II (Pb-free)
Commercial
10
CY7C1049CV33-10ZXI
51-85087 44-pin TSOP II (Pb-free)
Industrial
Ordering Code Definitions
CY 7C
1
04
9
C V33 - XX ZS X
X
Temperature Range: X = C or I
C = Commercial; I = Industrial
X = Pb-free; X Absent = Leaded
Package Type:
ZS = 44-pin TSOP II
Speed Grade: XX = 8 ns or 10 ns
V33 = 3.0 V to 3.6 V
Process Technology: C  150 nm
Data width: × 8-bits
4-Mbit density
Fast Asynchronous SRAM
Marketing Code: 7C = SRAMs
Company ID: CY = Cypress
Document #: 38-05006 Rev. *M
Page 9 of 13
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CY7C1049CV33
Package Diagram
Figure 7. 44-pin TSOP Z44-II, 51-85087
51-85087 *C
Document #: 38-05006 Rev. *M
Page 10 of 13
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CY7C1049CV33
Acronyms
Acronym
Document Conventions
Description
Units of Measure
CE
chip enable
CMOS
complementary metal oxide semiconductor
°C
degree Celsius
I/O
input/output
MHz
Mega Hertz
OE
output enable
µA
micro Amperes
RAM
random access memory
µs
micro seconds
SRAM
static random access memory
mA
milli Amperes
TSOP
thin small outline package
mm
milli meter
TTL
transistor-transistor logic
ms
milli seconds
WE
write enable
mW
milli Watts
ns
nano seconds

ohms
%
percent
Document #: 38-05006 Rev. *M
Symbol
Unit of Measure
pF
pico Farad
V
Volts
W
Watts
Page 11 of 13
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CY7C1049CV33
Document History Page
Document Title: CY7C1049CV33, 4-Mbit (512 K × 8) Static RAM
Document Number: 38-05006
Rev.
ECN
Orig. of
Change
Submission
Date
Description of Change
**
112569
HGK
03/06/02
New data sheet
*A
114091
DFP
04/25/02
Changed Tpower unit from ns to s
*B
116479
CEA
09/16/02
Add applications foot note to data sheet, page 1.
*C
262949
RKF
See ECN
Added Automotive-E Specs
Added JA and JC values on Page #3.
*D
300091
RKF
See ECN
Added -20-ns Speed bin
*E
344595
SYT
See ECN
Added Pb-free package on page #8
Removed shading for CY7C1049CV33-15ZSXE in the ordering Information on
page 9
*F
2615344
VKN/PYRS
12/03/08
Added Automotive-A information
Removed 8 ns and 20 ns speed bins,
Changed tPOWER spec from 1 s to 100 s,
Updated Ordering Information table.
*G
2841563
NXR/
*H
2898958
AJU
01/07/2010 Added CY7C1049CV33-10VXA to Ordering Info table.
03/25/10
Removed inactive parts from the ordering information table. Updated package
diagrams.
*I
2954734
AJU
*J
3072834
PRAS
11/12/2010 Removed obsolete parts and updated package diagram.
*K
3185812
PRAS
03/02/2011 Updated Features.
Updated Functional Description.
Updated Selection Guide (Added 8 ns speed grade devices and removed 10 ns,
12 ns, and 15 ns speed grade devices).
Removed Figure 36-pin SOJ (Top View) in Pin Configuration.
Updated Electrical Characteristics (Added 8 ns speed grade devices and
removed 10 ns, 12 ns, and 15 ns speed grade devices).
Deleted 36-pin SOJ column in Thermal Resistance.
Updated AC Switching Characteristics (Added 8 ns speed grade devices and
removed 10 ns, 12 ns, and 15 ns speed grade devices).
Added Units of Measure.
Dislodged Automotive information to 001-67511.
Removed SOJ package related information in all instances in the document.
*L
3250938
PRAS
*M
3282230
AJU
Document #: 38-05006 Rev. *M
06/30/2010 New Part Number added CY7C1049CV33-10ZXC to Ordering Info table.
05/25/11
Updated Functional Description (Removed “For best practice recommendations,
refer to the Cypress application note AN1064, SRAM System Guidelines.”).
Updated Selection Guide (Added 10 ns speed grade devices).
Updated Electrical Characteristics (Added 10 ns speed grade devices).
Updated Note 2 in page 4 as “AC characteristics (except High Z) are tested using
the load conditions shown in Figure 2 on page 5 (a). High Z characteristics are
tested for all speeds using the test load shown in Figure 2 on page 5 (c)”.
Updated Figure 2.
Updated Note 4 in page 5 as “AC characteristics (except High Z) are tested using
the load conditions shown in Figure 2 (a). High Z characteristics are tested for
all speeds using the test load shown in Figure 2 (c)”.
Updated AC Switching Characteristics (Added 10 ns speed grade devices).
Updated Ordering Information (Included CY7C1049CV33-10ZXI).
06/14/2011 Updated in new template.
Page 12 of 13
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CY7C1049CV33
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
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PSoC Solutions
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PSoC 1 | PSoC 3 | PSoC 5
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© Cypress Semiconductor Corporation, 2002-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-05006 Rev. *M
Revised June 14, 2011
Page 13 of 13
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