CYU01M16SFE MoBL3™ 16-Mbit (1M x 16) Pseudo Static RAM Features • Wide voltage range: 1.7V–1.95V • Access Time: 70 ns • Ultra-low active power — Typical active current: 3 mA @ f = 1 MHz — Typical active current: 18 mA @ f = fmax • Ultra low standby power • Automatic power-down when deselected • CMOS for optimum speed/power • Available in 48-ball BGA package • Operating Temperature: –40°C to +85°C Functional Description[1] The CYU01M16SFE is a high-performance CMOS Pseudo Static RAM organized as 1M words by 16 bits that supports an asynchronous memory interface. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery Life™ (MoBL®) in To read from the device, take Chip Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O8 to I/O15. Refer to the truth table for a complete description of read and write modes. 1M x 16 RAM Array SENSE AMPS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 To write to the device, take Chip Enable (CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A19). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A19). DATA IN DRIVERS ROW DECODER Logic Block Diagram portable applications such as cellular telephones. The device can be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input/output pins (I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE1 HIGH or CE2 LOW), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or during a write operation (CE1 LOW and CE2 HIGH and WE LOW). I/O0–I/O7 I/O8–I/O15 COLUMN DECODER A7 A6 A5 A4 A3 A2 A1 A0 BHE WE CE2 CE1 OE BLE Power -Down Circuit BHE BLE CE2 CE1 Note: 1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05603 Rev. *E • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised September 20, 2006 [+] Feedback CYU01M16SFE MoBL3™ Pin Configuration[2, 3] 48-Ball VFBGA Top View 4 3 1 2 BLE OE A0 I/O8 BHE I/O9 5 6 A1 A2 CE2 A A3 A4 CE1 I/O0 B I/O10 A5 A6 I/O1 I/O2 C VSS I/O11 A17 A7 I/O3 VCC D VCC I/O12 NC A16 I/O4 VSS E I/O14 I/O13 A14 A15 I/O5 I/O6 F I/O15 A19 A12 A13 WE I/O7 G A18 A8 A9 A10 A11 NC H Product Portfolio[4] Power Dissipation Product CYU01M16SFE Operating ICC (mA) Speed (ns) VCC Range (V) Min. Typ.[4] Max. 1.7 1.8 1.95 70 f = 1MHz f = fmax Standby ISB2 (µA) Typ.[4] Max. Typ.[4] Max. Typ.[4] Max. 3 5 18 20 55 70 Power-up Characteristics The initialization sequence is shown in the figure below. Chip Select should be CE1 HIGH or CE2 LOW for at least 200 µs after VCC has reached a stable value. No access must be attempted during this period of 200 µs. Stable Power VCC First Access Tpu CE1 Parameter Description Min. Tpu Chip Enable Low After Stable VCC 200 Typ. Max. Unit µs Notes: 2. Ball H6 and E3 can be used to upgrade to a 32-Mbit and a 64-Mbit density, respectively. 3. NC “no connect”-not connected internally to the die. 4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC (typ) and TA = 25°C. Tested initially and after design changes that may affect the parameters. Document #: 38-05603 Rev. *E Page 2 of 11 [+] Feedback CYU01M16SFE MoBL3™ DC Input Voltage[5, 6, 7] .................... –0.2V to VCCMAX + 0.3V Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Output Current into Outputs (LOW)............................. 20 mA Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Latch-Up Current .................................................... > 200 mA Supply Voltage to Ground Potential .–0.2V to VCCMAX + 0.3V Device Range Operating Temperature (TA) DC Voltage Applied to Outputs in High Z State[5, 6, 7] ........................–0.2V to VCCMAX + 0.3V CYU01M16SFE Industrial –40°C to +85°C VCC 1.7V to 1.95V DC Electrical Characteristics (Over the Operating Range) [5, 6, 7] CYU01M16SFE-70 ns Parameter Description Test Conditions VCC Supply Voltage VOH Output HIGH Voltage IOH = –0.1 mA VCC= 1.7V to 1.95V VOL Output LOW Voltage IOL = 0.1 mA VCC= 1.7V to 1.95V VIH Input HIGH Voltage VCC= 1.7V to 1.95V VIL Input LOW Voltage VCC= 1.7V to 1.95V IIX Input Leakage Current IOZ ICC Min. Typ.[4] Max. Unit 1.7 1.8 1.95 V VCC – 0.2 V 0.2 V 0.8 * VCC VCC + 0.3V V –0.2 0.2 * VCC V GND < VIN < VCC –1 +1 µA Output Leakage Current GND < VOUT < VCC –1 +1 µA VCC Operating Supply Current f = fMAX = 1/tRC 18 20 mA f = 1 MHz 3 5 mA VCC= VCCmax IOUT = 0 mA CMOS levels ISB1 Automatic CE Power-Down Current — CMOS Inputs CE1 > VCC – 0.2V, CE2 < 0.2V, VIN > VCC – 0.2V, VIN < 0.2V f = fMAX (Address and Data Only), f = 0 (OE, WE, BHE and BLE), VCC = 3.60V 55 70 µA ISB2 Automatic CE Power-Down Current — CMOS Inputs CE1 > VCC – 0.2V, CE2 < 0.2V VIN > VCC – 0.2V or VIN < 0.2V, f = 0, VCC = VCCMAX 55 70 µA Capacitance[8] Parameter Description CIN Input Capacitance COUT Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VCC = VCC(typ) Max. Unit 8 pF 8 pF Thermal Resistance[8] Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions VFBGA Unit Test conditions follow standard test methods and procedures for measuring thermal impedence, per EIA/JESD51. 56 °C/W 11 °C/W Notes: 5. VIL(MIN) = –0.5V for pulse durations less than 20 ns. 6. VIH(Max) = VCC + 0.5V for pulse durations less than 20 ns. 7. Overshoot and undershoot specifications are characterized and are not 100% tested. 8. Tested initially and after any design or process changes that may affect these parameters. Document #: 38-05603 Rev. *E Page 3 of 11 [+] Feedback CYU01M16SFE MoBL3™ AC Test Loads and Waveforms R1 VCC VCC OUTPUT GND R2 30 pF 10% ALL INPUT PULSES 90% 90% 10% Fall Time = 1 V/ns Rise Time = 1 V/ns INCLUDING JIG AND SCOPE Equivalent to: THEVENIN EQUIVALENT RTH OUTPUT VTH Parameters 1.8V (VCC) Unit R1 14000 Ω R2 14000 Ω RTH 7000 Ω VTH 0.90 V Switching Characteristics Over the Operating Range[9, 10, 11, 15, 14] 70 ns Parameter Description Min. Max. Unit 40000 ns Read Cycle tRC [13] Read Cycle Time 70 tCD Chip Deselect Time CE1 = HIGH or CE2 = LOW, BLE/BHE High Pulse Time 15 tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE1 LOW and CE2 HIGH to Data Valid tDOE OE LOW to Data Valid tLZOE OE LOW to Low Z[10, 11, 12] tHZOE OE HIGH to High Z[10, 11, 12] 70 10 tHZCE CE1 HIGH and CE2 LOW to High tDBE BLE/BHE LOW to Data Valid tHZBE BLE/BHE LOW to Low Z[10, 11, 12] BLE/BHE HIGH to High Z[10, 11, 12] ns ns ns 25 Z[10, 11, 12] tLZBE 70 35 CE1 LOW and CE2 HIGH to Low ns ns 5 Z[10, 11, 12] tLZCE ns 10 ns ns 25 ns 70 ns 5 ns 25 ns Notes: 9. Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 ns/V, timing reference levels of VCC(typ.)/2, input pulse levels of 0V to VCC, and output loading of the specified IOL/IOH as shown in the “AC Test Loads and Waveforms” section. 10. At any given temperature and voltage conditions tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. All low-Z parameters will be measured with a load capacitance of 30 pF (3V). 11. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high-impedance state. 12. High-Z and Low-Z parameters are characterized and are not 100% tested. 13. If invalid address signals shorter than min.tRC are continuously repeated for 40 µs, the device needs a normal read timing (tRC) or needs to enter standby state at least once in every 40 µs. 14. In order to achieve 70-ns performance, the read access must be Chip Enable (CE1 or CE2) controlled. That is, the addresses must be stable prior to Chip Enable going active. Document #: 38-05603 Rev. *E Page 4 of 11 [+] Feedback CYU01M16SFE MoBL3™ Switching Characteristics Over the Operating Range[9, 10, 11, 15, 14] (continued) 70 ns Parameter Description Min. Max. Unit 40000 ns [15] Write Cycle tWC Write Cycle Time 70 tSCE CE1 LOW and CE2 HIGH to Write End 60 ns tAW Address Set-Up to Write End 60 ns tCD Chip Deselect Time CE1 = HIGH or CE2 = LOW, BLE/BHE High Pulse Time 15 ns tHA Address Hold from Write End 0 ns tSA Address Set-Up to Write Start 0 ns tPWE WE Pulse Width 50 ns tBW BLE/BHE LOW to Write End 60 ns tSD Data Set-Up to Write End 25 ns tHD Data Hold from Write End 0 tHZWE WE LOW to High-Z[10, 11, 12] tLZWE WE HIGH to Low-Z[10, 11, 12] ns 25 10 ns ns Note: 15. The internal Write time of the memory is defined by the overlap of WE,CE1 = VIL or CE2 = VIH, BHE and/or BLE = VIL. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates the write. Document #: 38-05603 Rev. *E Page 5 of 11 [+] Feedback CYU01M16SFE MoBL3™ Switching Waveforms Read Cycle 1 (Address Transition Controlled)[17, 18] tRC ADDRESS tOHA DATA OUT tAA DATA VALID PREVIOUS DATA VALID Read Cycle 2 (OE Controlled)[16, 18,19] ADDRESS tRC CE1 tCD tHZCE CE2 tACE BHE/BLE tLZBE tDBE IMPEDANCE tHZBE OE tHZOE tDOE DATA OUT tLZOE HIGH IMPEDANCE HIGH DATA VALID tLZCE VCC SUPPLY CURRENT 50% 50% ICC ISB Notes: 16. Whenever CE 1 = HIGH or CE2 = LOW, BHE/BLE are taken inactive, they must remain inactive for a minimum of 5 ns. 17. Device is continuously selected. OE = CE1 = VIL and CE2 = VIH. 18. WE is HIGH for Read Cycle. 19. CE is the Logical AND of CE1 and CE2. Document #: 38-05603 Rev. *E Page 6 of 11 [+] Feedback CYU01M16SFE MoBL3™ Switching Waveforms (continued) t WC ADDRESS tSCE CE1 tCD CE2 tAW tHA tSA tPWE WE tBW BHE/BLE OE tSD DATA I/O tHD VALID DATA DON’T CARE tHZOE Notes: 20. Data I/O is high-impedance if OE > VIH. 21. During the DON’T CARE period in the DATA I/O waveform, the I/Os are in output state and input signals should not be applied. Document #: 38-05603 Rev. *E Page 7 of 11 [+] Feedback CYU01M16SFE MoBL3™ Switching Waveforms (continued) Write Cycle 2 (CE1 or CE2 Controlled)[15, 12, 16, 20, 21] tWC ADDRESS tSCE CE1 CE2 tSA tAW tHA tPWE WE tBW BHE/BLE OE tSD DATA I/O tHD VALID DATA DON’T CARE tHZOE Write Cycle 3 (WE Controlled, OE LOW)[16, 21] tWC ADDRESS tSCE CE1 CE2 tBW BHE/BLE tAW tSA tHA tPWE WE tSD DATAI/O DON’T CARE VALID DATA tHZWE Document #: 38-05603 Rev. *E t HD tLZWE Page 8 of 11 [+] Feedback CYU01M16SFE MoBL3™ Switching Waveforms (continued) Write Cycle 4 (BHE/BLE Controlled, OE LOW)[15, 16, 20, 21] tWC ADDRESS CE1 CE2 tSCE tAW tHA tBW BHE/BLE tSA tPWE WE tHD tSD DON’T CARE DATA I/O VALID DATA Truth Table[22] CE1 CE2 WE OE BHE BLE Inputs/Outputs H X X X X X X L X X X X High Z Deselect/Power-down Standby (ISB) X X X X H H High Z Deselect/Power-down Standby (ISB) L H H L L L Data Out (I/O0–I/O15) Read Active (ICC) L H H L H L Data Out (I/O0–I/O7); I/O8–I/O15 in High Z Read Active (ICC) L H H L L H Data Out (I/O8–I/O15); I/O0–I/O7 in High Z Read Active (ICC) L H H H L L High Z Output Disabled Active (ICC) L H H H H L High Z Output Disabled Active (ICC) L H H H L H High Z Output Disabled Active (ICC) L H L X L L Data In (I/O0–I/O15) Write (Upper Byte and Lower Byte) Active (ICC) L H L X H L Data In (I/O0–I/O7); I/O8–I/O15 in High Z Write (Lower Byte Only) Active (ICC) L H L X L H Data In (I/O8–I/O15); I/O0 –I/O7 in High Z Write (Upper Byte Only) Active (ICC) High Z Mode Deselect/Power-down Power Standby (ISB) Note: 22. H = Logic HIGH, L = Logic LOW, X = Don’t Care. Document #: 38-05603 Rev. *E Page 9 of 11 [+] Feedback CYU01M16SFE MoBL3™ Ordering Information Speed (ns) Ordering Code Package Diagram Package Type Operating Range 70 CYU01M16SFEU-70BVXI 51-85150 48-ball Fine Pitch VBGA (6 mm × 8 mm × 1 mm) (Pb-Free) Industrial Package Diagram 48-ball VFBGA (6 x 8 x 1 mm) (51-85150) BOTTOM VIEW TOP VIEW A1 CORNER Ø0.05 M C Ø0.25 M C A B A1 CORNER Ø0.30±0.05(48X) 2 3 4 5 6 6 4 5 3 2 1 C C E F G D E 2.625 D 0.75 A B 5.25 A B 8.00±0.10 8.00±0.10 1 F G H H A 1.875 A B 0.75 6.00±0.10 3.75 6.00±0.10 0.15(4X) 0.10 C 0.21±0.05 0.25 C 0.55 MAX. B 51-85150-*D C 1.00 MAX 0.26 MAX. SEATING PLANE MoBL is a registered trademark and MoBL3 and More Battery Life are trademarks of Cypress Semiconductor Corporation. All product and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-05603 Rev. *E Page 10 of 11 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. [+] Feedback CYU01M16SFE MoBL3™ Document History Page Document Title: CYU01M16SFE MoBL3TM 16-Mbit (1M x 16) Pseudo Static RAM Document Number: 38-05603 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 342199 See ECN PCI New Data sheet *A 386551 See ECN PCI *B 422623 See ECN HRT Changed from Advance to Preliminary Replaced TBDs with appropriate values Changed tPC and tPA from 20 to 25 ns Corrected footnote # 16 as OE = CE1 = VIL and CE2 = VIH Added separate waveforms for CE1 and CE2 in Read #2, Page Read and Write#1 Timing diagram Removed the 55-ns Speed Bin Changed Isb2 Max value from 60 µA to 70 µA Added Isb1 to the DC parameters Added Chip Enable Access Foot Note to AC Parameters Changed the tCD Min value from 5 ns to 15 ns Changed the Page Mode Values (tPC and tPAA) from 25 ns to 35 ns *C 462289 See ECN NXR Revised MPN from CYU01M16SFCU to CYU01M16SFE Renamed Package Name column with Package Diagram *D 492939 See ECN NXR Removed Page Mode feature *E 504021 See ECN NXR Converted from Preliminary to Final Changede ICC(Max) from 25 mA to 20 mA Changed tOHA(Min) from 5 ns to 10 ns Document #: 38-05603 Rev. *E Page 11 of 11 [+] Feedback