TFU 0603 Vishay Beyschlag Thick Film Chip Fuses FEATURES • Proven thick film technology • Very quick acting fuse characteristics • Standard SMD size • Lead (Pb)-free solder contacts • Halogen-free according to IEC 61249-2-21 definition • Compliant to RoHS directive 2002/95/EC TFU 0603 Thick Film Chip Fuse is the best choice for the most fields of modern electronics. The controlled manufacturing process guarantees stable fusing characteristics in standard applications of information technology, telecommunication, and audio/video electronics. APPLICATIONS • Information technology • Telecommunication • Audio/video electronics SIZE INCH 0603 METRIC 1608M TECHNICAL SPECIFICATIONS DESCRIPTION TFU 0603 Metric size 1608M Rated current range IR 2.0 A to 4.0 A Rated voltage, Umax. DC 32 V; 24 V Interrupting rating, Imax. at Umax. DC 35 A Cold resistance at 0.1 x IR 19 mΩ to 61 mΩ Climatic category (LCT/UCT/days) 55/125/56 Permissible continuous current rating at ϑamb = 23 °C UL recognition file Document Number: 28797 Revision: 26-May-10 0.7 x IR E335924 For technical questions, contact: [email protected] www.vishay.com 1 TFU 0603 Vishay Beyschlag Thick Film Chip Fuses PART NUMBER AND PRODUCT DESCRIPTION (1) PART NUMBER: TFU0603FF04000P500 T F MODEL/SIZE TFU0603 U 0 6 0 3 FUSE CHARACTERISTIC F F 0 4 0 RATED CURRENT VALUE FF = Very quick acting 0 0 P 5 0 0 PACKAGING SPECIAL P1 P5 PW Up to 2 digits 00 = Standard Rated current value in mA. Example: 4.0 A = 04000 PRODUCT DESCRIPTION: TFU 0603-FF P5 4A0 TFU 0603 -FF P5 4A0 MODEL SIZE FUSE CHARACTERISTIC PACKAGING RATED CURRENT VALUE TFU 0603 FF = Very quick acting P1 P5 PW Rated current value in mA. Example: 4.0 A = 4A0 Notes (1) Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION PACKAGING REEL MODEL TFU 0603 www.vishay.com 2 DIAMETER PIECES/REEL CODE 180 mm/7" 1000 P1 180 mm/7" 5000 P5 330 mm/13" 20 000 PW For technical questions, contact: [email protected] Document Number: 28797 Revision: 26-May-10 TFU 0603 Vishay Beyschlag Thick Film Chip Fuses DIMENSIONS T1 W WT H T2 L DIMENSIONS - Mass and relevant physical dimensions H (mm) L (mm) W (mm) WT (mm) T1 (mm) T2 (mm) MASS (mg) 0.45 + 0.1/- 0.05 1.55 ± 0.1 0.85 ± 0.1 > 0.55 0.3 + 0.15/- 0.2 0.45 + 0.15/- 0.2 2.3 TYPE TFU 0603 SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING TYPE TFU 0603 REFLOW SOLDERING G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) 0.55 1.10 1.10 2.75 0.65 0.75 0.95 2.15 Note • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. TFU 0603 RATING - Very quick acting (FF) SIZE 0603 FUSE CHAR. FF RATED CURRENT RATED VOLTAGE Umax. DC COLD RESISTANCE (1) at 0.1 x IR INTERRUPTING RATING DC MARKING APPROVAL PART NUMBER (2)(3) 2.0 A 32 V 61 mΩ 35 A at 32 V N UL TFU0603FF02000P500 2.5 A 32 V 44 mΩ 35 A at 32 V O UL TFU0603FF02500P500 3.0 A 24 V 32 mΩ 35 A at 24 V P UL TFU0603FF03000P500 3.5 A 24 V 26 mΩ 35 A at 24 V R UL TFU0603FF03500P500 4.0 A 24 V 19 mΩ 35 A at 24 V S UL TFU0603FF04000P500 Notes (1) Typical values (2) For packages with 1000 pieces, please use for packing P1 instead of P5 (3) For packages with 20 000 pieces, please use for packing PW instead of P5 Document Number: 28797 Revision: 26-May-10 For technical questions, contact: [email protected] www.vishay.com 3 TFU 0603 Vishay Beyschlag Thick Film Chip Fuses DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A mixed film of high conductive particles is deposited on a high grade ceramic body. The fuse elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin layer. The result of the determined production is verified by an extensive testing procedure performed on 100 % of the individual fuses. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3. All products comply with the CEFIC-EECA-EICTA list of legal restrictions on hazardous substances. This includes full compatibility with the following directives. • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2002/95/EC Restriction of the Substances Directive (RoHS) • 2002/96/EC Waste Electrical Equipment Directive (WEEE) use of and Hazardous Electronic APPROVALS The fuses are tested in accordance with UL 248-14, IEC 60127-4 and IEC 60068 series. ASSEMBLY The fuses are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The fuses are lead (Pb)-free (category e3), the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 5 years. www.vishay.com 4 Approval of recognition is indicated by the UL logo on the package label. For technical questions, contact: [email protected] Document Number: 28797 Revision: 26-May-10 TFU 0603 Vishay Beyschlag Thick Film Chip Fuses FUNCTIONAL PERFORMANCE 104 TFU 0603-FF 103 Pre-arc Time tpre-arc (s) 102 4.00 A 3.50 A 3.00 A 2.50 A 2.00 A 101 100 10-1 10-2 10-3 10-4 1 10 Current I (A) 100 Typical tpre-arc vs. I characteristic of TFU 0603 (1) 104 TFU 0603-FF 103 Joule Integral l2t (A2S) 102 101 4.00 A 3.50 A 3.00 A 2.50 A 2.00 A 100 10-1 10-2 10-3 10-4 10-5 10-4 10-3 10-2 10-1 Pre-arc Time tpre-arc (s) 100 101 102 Typical I2t vs. tpre-arc characteristic of TFU 0603 (1) Note (1) Fuses mounted on a test board according to IEC 60127-4 Document Number: 28797 Revision: 26-May-10 For technical questions, contact: [email protected] www.vishay.com 5 TFU 0603 Vishay Beyschlag Thick Film Chip Fuses TESTS AND REQUIREMENTS All tests are carried out in accordance with the following specifications: Unless otherwise specified the following values apply: UL/CSA 248-14, Low voltage fuses - Part 14: Supplemental Fuses Relative humidity: 45 % to 75 % IEC 60127-4, Universal Modular Fuse Links (UMF) The components are mounted for testing on printed-circuit boards in accordance with IEC 60127-4, unless otherwise specified. For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by METI and CCC. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Temperature: 15 °C to 35 °C Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) The requirements stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of UL 248-14 and IEC 60127-4 respectively. However, some additional tests and a number of improvments against those minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS UL/CSA 248-14 - IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE 21 (Ue1) Substrate bending Depth 3 mm; rate 1 mm/s 1 time No visible damage; ΔR/R ≤ 15 % Solder bath method; SnPb40; non-activated flux; (215 ± 3) °C; (3 ± 0.3) s Good tinning (≥ 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (235 ± 3) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered); no visible damage Solder bath method; (260 ± 5) °C; (10 ± 1) s No visible damage; ΔR/R ≤ 15 % Reflow method 2 (IR/forced gas convection); (260 ± 5) °C; (10 ± 1) s No visible damage; ΔR/R ≤ 15 % Solderability - 58 (Td) Resistance to soldering heat - - Time/current characteristics at nominal temperature Destructive testing under overcurrent conditions (DC-current) At 2.0 x IR, tpre-arc < 60 s At 2.5 x IR, tpre-arc < 5 s 5.5 - Interrupting rating (DC) 35 A at rated voltage Optical inspection with naked eye; no visible damage - Endurance test acc. to IEC 60127-4, clause 9.4 a) I = 1.0 x IR (DC) 1.0 h on; 0.25 h off; 23 °C; 100 times b) I = 1.25 x IR (DC) 1.0 h on 23 °C; 1 time No visible damage; ΔR/R ≤ 15 % - Verification of temp.-rise and current-carrying capacity I = 1.0 x IR (DC) Temperature rise of hot spot ≤ 75 K acc. to UL 248-14, clause 8.2.4 - Time/current characteristics at elevated temperature. IEC 60127-1, clause 9.2.2 I = 1.1 x IR (DC) at 70 °C; 1.0 h No visible damage; ΔR/R ≤ 15 % - 8.2.3 - www.vishay.com 6 For technical questions, contact: [email protected] Document Number: 28797 Revision: 26-May-10 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1