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SEMICONDUCTOR TECHNICAL DATA
The RF Line
Designed for Class B and C common base amplifier applications in short
pulse TACAN, IFF, and DME transmitters.
• Guaranteed Performance @ 1090 MHz, 50 Vdc
Output Power = 150 Watts Peak
Minimum Gain = 7.8 dB
150 W PEAK, 960–1215 MHz
MICROWAVE POWER
TRANSISTOR
NPN SILICON
• 100% Tested for Load Mismatch at All Phase Angles with 10:1 VSWR
• Industry Standard Package
• Nitride Passivated
• Gold Metallized, Emitter Ballasted for Long Life and Resistance to Metal
Migration
• Internal Input Matching for Broadband Operation
CASE 332A–03, STYLE 1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector–Base Voltage
VCBO
70
Vdc
Emitter–Base Voltage
VEBO
4.0
Vdc
Collector Current — Peak (1)
IC
12
Adc
Total Device Dissipation @ TC = 25°C (1) (2)
Derate above 25°C
PD
583
3.33
Watts
W/°C
Storage Temperature Range
Tstg
–65 to +150
°C
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case (3)
Symbol
Max
Unit
RθJC
0.3
°C/W
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector–Emitter Breakdown Voltage
(IC = 50 mAdc, VBE = 0)
V(BR)CES
70
—
—
Vdc
Collector–Base Breakdown Voltage
(IC = 50 mAdc, IE = 0)
V(BR)CBO
70
—
—
Vdc
Emitter–Base Breakdown Voltage
(IE = 5.0 mAdc, IC = 0)
V(BR)EBO
4.0
—
—
Vdc
ICBO
—
—
10
mAdc
hFE
10
30
—
—
OFF CHARACTERISTICS
Collector Cutoff Current
(VCB = 50 Vdc, IE = 0)
ON CHARACTERISTICS
DC Current Gain (4)
(IC = 5.0 Adc, VCE = 5.0 Vdc)
NOTES:
(continued)
1. Pulse Width = 10 µs, Duty Cycle = 1%.
2. This device is designed for RF operation. The total device dissipation rating applies only when the device is operated as an RF amplifier.
3. Thermal Resistance is determined under specified RF operating conditions by infrared measurement techniques.
4. 80 µs Pulse on Tektronix 576 or equivalent.
REV 0
1
ELECTRICAL CHARACTERISTICS — continued (TC = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
Cob
—
25
32
pF
Common–Base Amplifier Power Gain
(VCC = 50 Vdc, Pout = 150 W pk, f = 1090 MHz)
GPB
7.8
9.8
—
dB
Collector Efficiency
(VCC = 50 Vdc, Pout = 150 W pk, f = 1090 MHz)
η
35
40
—
%
Load Mismatch
(VCC = 50 Vdc, Pout = 150 W pk, f = 1090 MHz,
VSWR = 10:1 All Phase Angles)
ψ
Characteristic
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 50 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS (Pulse Width = 10 µs, Duty Cycle = 1.0%)
No Degradation in Power Output
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C1, C2 — 220 pF Chip Capacitor, 100–mil ATC
C3 — 0.1 µF/100 V
C4 — 47 µF/75 V Electrolytic
L1, L2 — 3 Turns #18 AWG, 1/8″ ID
Z1–Z10 — Distributed Microstrip Elements — See Photomaster
Board Material — 0.031″ Thick Teflon–Fiberglass, εr = 2.5
Figure 1. 1090 MHz Test Circuit
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Figure 2. Output Power versus Input Power
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Figure 3. Output Power versus Frequency
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Pout = 150 W pk VCC = 50 V
tp = 10 µs D = 1%
-13
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f
MHz
Zin
Ohms
ZOL*
Ohms
960
1090
1215
1.5 + j9.6
5.0 + j7.5
2.4 + j5.6
2.6 + j4.1
2.7 + j4.6
2.8 + j5.3
ZOL* = Conjugate of the optimum load
ZOL* = impedance into which the device
ZOL* = output operates at a given output
ZOL* = power, voltage, and frequency.
Figure 6. Series Equivalent Input/Output Impedance
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Figure 7. Typical Pulse Performance
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Figure 5. Power Gain versus Frequency
-# Figure 4. Output Power versus Supply Voltage
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PACKAGE DIMENSIONS
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F
K
D
H
A
J
C
CASE 332A–03
ISSUE D
Specifications subject to change without notice.
n North America: Tel. (800) 366-2266, Fax (800) 618-8883
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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