ETC AU9340

1
Data Book
AU9340
USB Memory Stick Card
Reader Controller Chip
Technical Reference Manual
Product Specification
Official Release
Revision 1.00
Public
Mar 2003
Data sheet status
Objective specification
This data sheet contains target or goal specifications for
product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may
be published later.
Product specification
This data sheet contains final product specifications.
Revision History
Date
Revision/Model
Mar 2003
1.00/
Description
Initial release
Page 2 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
Copyright Notice
Copyright 1997 - 2002
Alcor Micro Corp.
All Rights Reserved.
Trademark Acknowledgements
The company and product names mentioned in this document may be the
trademarks or registered trademarks of their manufacturers.
Disclaimer
Alcor Micro Corp. reserves the right to change this product without prior notice.
Alcor Micro Corp. makes no warranty for the use of its products and bears no
responsibility for any error that appear in this document. Specifications are subject
to change without prior notice
Contact Information:
Web site: http://www.alcormicro.com/
Product URL: http://www.alcormicro.com/product_au9340.htm
Taiwan
Alcor Micro Corp.
4F, No 200 Kang Chien Rd., Nei Hu,
Taipei, Taiwan, R.O.C.
Phone: 886-2-8751-1984
Fax: 886-2-2659-7723
Santa Clara Office
2901 Tasman Drive, Suite 206
Santa Clara, CA 95054
USA
Phone: (408) 845-9300
Fax: (408) 845-9086
Los Angeles Office
9400 Seventh St., Bldg. A2
Rancho Cucamonga, CA 91730
USA
Phone: (909) 483-9900
Fax: (909) 944-0464
Page 3 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
Table of Contents
1 Introduction……………………………………………………………..
6
1.1 Description……………………………………………………………………………..
6
1.2 Features………………………………………………………………………………….
6
2 Application Block Diagram………………………………………….
7
3 Pin Assignment…………………………………………………………
8
4 System Architecture and Reference Design………………….. 10
4.1 AU9340 Block Diagram…………………………………………………………. 10
4.2 Sample Schematics……………………………………………………………….. 11
5 Electrical Characteristics…………………………………………… 12
5.1 Absolute Maximum Ratings……………………………………………………. 12
5.2 Recommended Operating Conditions……………………………………. 12
5.3 General DC Characteristics…………………………………………………… 12
5.4 DC Electrical Characteristics for 5 volts operation……………….. 13
5.5 Crystal Oscillator Circuit Setup for Characterization……………. 13
5.6 USB Transceiver Characteristics…………………………………..……….. 14
5.7 ESD Test Results…………………………………………………………………..… 18
5.8 Latch-Up Test Results…………………………………………………………….. 19
6 Mechanical Information……………………………………………… 21
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AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
List of Figures
2.1 Block Diagram…………………………………………………………………………………..
7
3.1 Pin Assignment Diagram…………………………………………………………………..
8
4.1 AU9340 Block Diagram……………………………………………………………………… 10
5.1 Crystal Oscillator Circuit Setup for Characterization………………………. 13
5.2 Electrical Characteristics Diagram……………………………………………………. 17
5.3 Latch-Up Test Results……………………………………………………………………….. 19
6.1 Mechanical Information Diagram……………………………………………………… 21
List of Tables
3.1
Pin Descriptions…………………………………………………………………………….
5.1
Absolute Maximum Ratings………………………………………………………….. 12
5.2
Recommended Operating Conditions……………………………………………. 12
5.3
General DC Characteristics……………....…………………………………………. 12
5.4
DC Electrical Characteristics for 5 volts operation………………………. 13
5.5
USB Transceiver Characteristics…………………………………………………… 14
5.6
Absolute Maximum Ratings………………………………………………………….. 14
5.7
DC Electrical Characteristics…………………………………………………………. 15
5.8
AC Electrical Characteristics…………………………………………………………. 16
5.9
ESD Data……………………………………………………………………………………….. 18
9
5.10 Latch-Up Data……………………………………………………………………………….. 20
Page 5 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
1.0 Introduction
1.1 Description
The AU9340 is a single chip integrated USB Memory Stick (MS) card reader
controller. The AU9340 enabled Memory Stick card reader to be used as a removable
storage disk in enormous data exchange applications between PC and PC or PC and
various consumer electronic appliances.
The AU9340 reads digital data saved on memory stick while users manipulating
electronic devices such as digital cameras, MP3 players, PDAs and mobile phones…
etc. By the AU9340, users can transfer information such as data, graphics, texts or
digital images from one electronic device to another quickly and easily. With AU9340,
users’ knowledge will be further enhanced by the Plug-and-Play nature built into
latest operation systems such as Windows 2000/XP and Mac OS X.
By integrating of various analog components, the AU9340 is the most powerful and
most effective solution for Memory Stick card .
1.2 Features
Fully compliant with USB v1.1 specification and USB Device Class Definition
for Mass Storage, Bulk-Transport v1.0
Fully compliant with Memory Stick (MS) v1.3 Specification.
Work with default driver from Windows ME, Windows 2000, Windows XP, Mac
OS 9.1, and Mac OS X. Windows 98 is supported by mass storage class driver
from Alcor.
Ping-pong FIFO implementation for concurrent bus operation.
Dedicated hardware engine for MS bus operation, average throughput over
1MB/sec for read, 680KB/sec for write operation.
Support multiple sectors transfer up to 128MB to optimize performance
Support optional external EEPROM for USB VID, PID and string
customization
Capable of handling 8 sets of built-in PID, VID and strings to minimize
inventory control and improve lead production lead time
LED for bus activity indication.
Integrated power switch and power management circuit to meet USB 500uA
power consumption during suspend with MS card in the slot.
Runs at 12MHz, built-in 48 MHz PLL
Built-in 3.3V regulator
28-pin SSOP package
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AU9340 USB Memory Stick Card Reader Controller Chip
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V1.00
2.0 Application Block Diagram
Following is the application diagram of a typical memory stick card reader. By
connecting the reader to a PC through USB bus, the AU9340 is acting as a bridge
between the flash memory card from digital camera, MP3 player, PDA or mobile
phone and PC.
Figure 2.1 Block Diagram
Digital Camera
PC with USB Host Controller
MP3 Player
Memory Stick
PDA
USB Memory
Stick Reader
Moble Phones
PC
Page 7 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
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V1.00
3.0 Pin Assignment
The AU9340 is packed in 28-SSOP form factor. The following figure shows signal
name for each pin and the table in the following page describes each pin in detail
Figure 3.1 Pin Assignment Diagram
GPI0
1
28
GPI1
XTAL2
2
27
RSTN
XTAL1
3
26
GNDK
VCCA
4
25
VCCK
GNDA
5
24
CT3
VCC2Card
6
23
CT1
VCC5V
7
22
GPO7
VCC3V
8
21
GPO6
USB_DM
9
20
EEPDATA
USB_DP
10
19
EEPCLK
GND
11
18
MSBS
GPI2
12
17
MSData
VCCMS
13
16
MSINS
GNDMS
14
15
MSCLK
Alcor Micro
Au9340
28 pin SSOP
Page 8 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
Table 3.1 Pin Descriptions
PIN
Name
Input/Output
1
GPI0
Input
Description
2
XTAL2
Output
3
XTAL1
Input
Crystal Oscillator Input (12 MHz)
4
VCCA
Power
Analog 3.3 Input
Internal ROM selection, Connect to GND or VCC
Crystal Oscillator Output (12 MHz)
5
GNDA
GND
6
VCC2Card
Output
Power to MS Card
Ground
7
VCC5V
Power
5V power supply
8
VCC3V
Power
Regulator 3.3V output for VCCA and VCCK.
9
USB_DM
Input/Output
10
USB_DP
Input/Output
USB D+
11
GND
GND
Ground
USB D-
12
GPI2
Input
Internal ROM selection, Connect to GND or VCC
13
VCCMS
Input
InPut VCC3V
14
GNDMS
Input
InPut Ground
15
MSCLK
Output
to MS Power
to MS Power Ground
Connect to MS Card SCLK. #8
16
MSINS
Input
17
MSData
Input/Output
Connect to MS Card INS
Pin
#6
18
MSBS
Output
19
EEPCLK
Input
EEPROM clock
20
EEPDATA
Input
EEPROM data
21
GPO6
Output
NC
22
GPO7
Output
Connect to LED
23
CT1
Input
Connect to GND
24
CT3
Input
Connect to Ground
25
VCCK
Power
3.3 Core Voltage Input
26
GNDK
GND
27
RSTN
Input
Connect to VCC3
28
GPI1
Input
Internal ROM selection, Connect to GND or VCC
Connect to MS Card
Data Pin #4
Connect to MS Card
BS Pin #2
Ground
Page 9 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
4.0 System Architecture and
Reference Design
4.1 AU9340 Block Diagram
Figure 4.1 AU9340 Block Diagram
Alcor Micro - AU9340 Flash Memory Card Reader Controller Chip Block Diagram
USB
SIE
XCVR
USB
Upstream
Port
Processor
3.3 V
Card
Power
3.3 V
Voltage
Regulator
/Power Switch
MS control
FIFO
RAM
ROM
Arbitrator
Memory Stick
EEPROM
Control
Reset
POR
12MHz
XTAL
EEPROM
Page 10 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
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V1.00
4.2 Sample Schematics
VCC2Card
U1
VCC3.3
VCC
F1
FB
J1
C4
C5
0.1UF
1UF
FB
C6
R5
F2
C7
0.1UF
1UF
VCC5V
1.5K
1
2
3
4
5
VCC
DATADATA+
GND
FGND1
GPI0
XTAL2
XTAL1
VCCA
GNDA
VCC3.3
R6
R7
39
39
GPI2
VCCMS
GNDMS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GPI0
XTAL2
XTAL1
VCCA
GNDA
VCC2Card
VCC5V
VCC3V
USB_DM
USB_DP
GND
GPI2
VCCMS
GNDMS
GPI1
RSTN
GNDK
VCCK
CT3
CT1
GPO7
GPO6
EEPDATA
EEPCLK
MSBS
MSData
MSINS
MSCLK
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GPI1
VCC3.3
GNDK
VCCK
R4
VCC2Card
47K
GPO7
JP1
VSS
BS
VCC
SDIO
RESERVED
INS
RESERVED
SCLK
VCC
VSS
EEPDATA
EEPCLK
F9
FB
AU9340 28PIN
C8
R16
C14
R8
MS SOCKET
0.1UF
47pF
VCC3.3
VCC3.3
F3
FB
47K
C10
0.1UF
FB
VCCMS
C16
0.1UF
F4
F7
FB
VCCK
C9
10K
C15
0.1UF
FB
GNDK
0.1UF
F8
GNDMS
VCC3.3
FB
F5
C1
VCCA
18PF
XTAL1
R1
C11
0.1UF
FB
C12
F6
0.1UF
GNDA
C2
1M
18PF
VCC3.3
R18
0
VCC3.3
R19
0
VCC3.3
R9
0
GPI0
GPI1
GPI2
Y1
R17
R20
R13
0
0
0
12MHZ
XTAL2
See internal ROM selection
Optional
VCC
VCC3.3
VCC3.3
Optional
VCC5V
Internal ROM selection
C3
1UF
R11
R3
330
D1
GPO7
ROM
Select
GPI0
GPI1
GPI2
A
L
L
L
B
H
L
L
VCC3.3
U2
47K
C13
EEPCLK
EEPDATA
8
7
6
5
0.1UF
Disclaimer: This schematic is for reference only.
Alcor Micro Corp. makes no warranty for the use of its
products and bears no responsibility for any error that
appear in this document. Specifications are subject to
change without notice.
C
L
H
L
D
H
H
L
E
L
L
H
F
H
L
H
G
L
H
H
H
H
H
H
VCC
WP
SCL
SDA
A0
A1
A2
GND
1
2
3
4
24C02 or compitable
Size
A4
Document Number
Date:
Tuesday, December 03, 2002
Rev
1.3
Au9340 demostration schematics
Sheet
1
of
1
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5.0
Electrical Characteristics
5.1 Absolute Maximum Ratings
Table 5.1 Absolute Maximum Ratings
SYMBOL
PARAMETER
VCC
VIN
VOUT
TSTG
RATING
UNITS
Power Supply
-0.3 to 6.0
V
Input Voltage
-0.3 to VCC+0.3
V
Output Voltage
-0.3 to VCC+0.3
Storage Temperature
V
˚
-40 to 125
C
5.2 Recommended Operating Conditions
Table 5.2 Recommended Operating Conditions
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS
VCC
Power Supply
4.5
5.0
5.5
V
VIN
Input Voltage
0
VCC
V
TOPR
Operating Temperature
-5
85
O
C
5.3 General DC Characteristics
Table 5.3 General DC Characteristics
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
IIL
Input low current
no pull-up or pull-down
-1
1
µA
IIH
Input high current
no pull-up or pull-down
-1
1
µA
IOZ
Tri-state leakage current
-10
10
µA
CIN
Input capacitance
4
ρF
COUT
Output capacitance
4
ρF
CBID
Bi-directional buffer capacitance
4
ρF
Page 12 of 23
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5.4 DC Electrical Characteristics for 5 volts operation
Table 5.4 DC Electrical Characteristics for 5 volts operation
( Under
SYMBOL
Recommended
Operating
VCC=4.5v ~ 5.5v , Tj= -40OC
TYP
85OC )
MAX
UNITS
TTL
0.8
V
VIL
Input Low Voltage
CMOS
0.3*VCC
V
VIL
Schmitt input Low Voltage
TTL
1.10
V
VIL
Schmitt input Low V oltage
CMOS
1.84
V
VIH
Input High Voltage
TTL
2.2
VIH
Input Hight Voltage
CMOS
0.7*VCC
VIH
Schmitt input High Voltage
TTL
1.87
V
VIH
Schmitt input High Voltage
CMOS
3.22
V
VOL
Output low voltage
IOL=2, 4, 8, 12, 16, 24 mA
VOH
Output high voltage
IOH=2, 4, 8, 12, 16, 24 mA
Vil=0V or
MIN
+
Input Low Voltage
Input Pull-up/down resistance
CONDITIONS
to
VIL
RI
PARAMETER
Conditions and
V
V
0.4
3.5
Vih=VCC
V
V
50
KΩ
5.5 Crystal Oscillator Circuit Setup for
Characterization
The following setup was used to measure the open loop voltage gain for crystal
oscillator circuits. The feedback resistor serves to bias the circuit at its quiescent
operating point and the AC coupling capacitor, Cs, is much larger than C1 and C2.
Figure 5.1 Crystal Oscillator Circuit Setup for Characterization
Page 13 of 23
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5.6 USB Transceiver Characteristics
RECOMMENDED OPERATING CONDITIONS
Table 5.5 USB Transceiver Characteristics
SYMBOL
VCC
PARAMETER
CONDITIONS
LIMITS
DC supply voltage
UNIT
MIN
MAX
3.0
3.6
V
VI
DC input voltage range
0
5.5
V
VI/O
DC input range for I/Os
0
VCC
V
VO
DC output voltage range
0
VCC
V
TAMB
Operating ambient
temperature range in free air
0
70
See DC and AC characteristics
for individual device
˚
C
ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2)
In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v)
Table 5.6 Absolute Maximum Ratings
SYMBOL
PARAMETER
VCC
DC supply voltage
IIK
DC input diode current
VI
DC input voltage
CONDITIONS
LIMITS
MIN
MAX
-0.5
+6.5
V
-50
mA
-0.5
+5.5
V
-0.5
Vcc +0.5
V
+/-50
mA
Vcc +0.5
V
Vi<0
Note 3
UNIT
VI / O
DC input voltage range for I/Os
IOK
DC output diode current
VO
DC output voltage
IO
DC output source sink current
for VP/VM and RCV pins
Vo=0 to Vcc
+/-15
mA
IO
DC output source or sink current
for D+/D- pins
Vo= 0 to Vcc
+/-50
mA
+/-100
mA
ICC, IGND
Vo> Vcc or Vo<0
Note 3
-0.5
DC Vcc or GND current
TSTO
Storage temperature range
PTOT
Power dissipation per package
-60
+150
˚
C
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or
any other conditions beyond those indicated under "Recommended Operating
Conditions" is not implied. Exposure to absolute maximum rated conditions for
extended periods may affect device reliability.
2. The performance capability of a high performance integrated circuit in
conjunction with its thermal environment can create junction temperatures
which are detrimental to reliability. The maximum junction temperature of this
integrated circuit should not exceed 150˚C.
3. The input and output voltage ratings may be exceeded if the input and output
clamp current ratings are observed.
Page 14 of 23
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DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions.
Voltages are referenced to GND (Ground=0V).
Table 5.7 DC Electrical Characteristics
SYMBOL
VHYS
PARAMETER
TEST CONDITIONS
LIMITS
-40˚C to +85˚C
MIN
TYP
MAX
0.3
UNIT
Hysteresis on inputs
Vcc=3.0V to 3.6V (Note 3)
0.4
0.5
V
VIH
HIGH level input
Vcc=3.0V to 3.6V (Note 3)
1.5
2.0
V
VIL
LOW level input
Vcc=3.0V to 3.6V (Note 3)
0.8
1.1
RoH
Output impedance
(HIGH state)
Note 2
28
34
43
ohm
RoL
Output impedance (LOW
state)
Note 2
28
35
43
ohm
VOH
HIGH level output
(Note 3)
2.2
2.4
2.8
2.7
VOL
LOW level output
(Note 3)
Vcc=3.0V Io=6mA
Vcc=3.0V Io=4mA
Vcc=3.0V Io=100µA
Vcc=3.0V Io=6mA
Vcc=3.0V Io=4mA
Vcc=3.0V Io=100µA
0.7
0.4
0.2
V
330
600
µA
70
µA
14
mA
Vcc=3.6V VI=Vcc or GND
Io=0
Isup
Supply current in
suspend
Vcc=3.6V VI=Vcc or GND
Io=0
IFS
Active supply current
(Full Speed)
Vcc=3.3V
9
ILS
Active supply current
(Low Speed)
Vcc=3.3V
2
ILeak
Input leakage current
Vcc=3.6V VI=5.5V or GND,
not for I/O Pins
+/-0.1
IOFF
3-state output OFF-state
current
Vi=Vih or ViL; Vo=Vcc or
GND
NOTES:
1. All typical values are at Vcc=3.3V and Tamb=25˚C.
2. This value includes an external resistor of 24 ohm +/-1%.
D-" diagram for testing details.
3. All signals except D+ and D-.
V
0.3
Quiescent supply current
IQ
V
mA
+/-0.5
µA
+/-10
µA
See "Load D+ and
Page 15 of 23
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AC ELECTRICAL CHARACTERISTICS
GND=0V, tR = tF =3.0 ns; CL =50 pF; RL=500 Ohms
Table 5.8 AC Electrical Characteristics
SYMBOL
PARAMETER
WAVEFORM
LIMITS (TAMB)
0˚C to +25˚C
0˚C to +70˚C
MIN
TYP
MAX
MIN
MAX
tpLH
tpHL
VMO/VPO to D+/DFull Speed
1
0
0
trise
tfall
Rise and Fall Times
Full Speed
2
4
4
tRFM
Rise and Fall Time
Matching
Full Speed
90
tpLH
tpHL
VMO/VPO to D+/DLow Speed
1
trise
tfall
Rise and Fall Times
Low Speed
2
tRFM
9
9
Rise and Fall Time
Matching
Low Speed
120
120
UNIT
12
12
0
0
14
14
ns
20
20
4
4
20
20
ns
110
90
110
%
300
300
ns
300
300
75
75
300
200
75
75
300
200
ns
70
130
70
130
%
tpLH
tpHL
D+/D- to RCV
3
9
9
16
16
16
16
ns
tpLH
tpHL
D+/D- to VP/VM
1
4
4
8
8
8
8
ns
12
12
10
10
12
12
10
10
ns
tpHZ
tpZH
tpLZ
tpZL
OE# to D+/D- RL =
500ohm
4
tsu
Setup for SPEED
5
0
Vcr
Crossover point1
3
1.3
ns
2.0
1.3
2.0
V
NOTES:
1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with
a 50 pF capacitance.
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Figure 5.2 Electrical Characteristics Diagram
Page 17 of 23
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5.7 ESD Test Results
Test Description: ESD Testing was performed on a Zapmaster system using the
Human-Body-Model (HBM) and Machine-Model (MM), according to MIL-STD 883 and
EIAJ IC-121 respectively.
Human-Body-Model stresses devices by sudden application of a high voltage
supplied by a 100pF capacitor through 1.5k-ohm resistance.
Machine-Model stresses devices by sudden application of a high voltage
supplied by a 200pF capacitor through very low (0 ohm) resistance.
Test circuit & condition
Zap Interval: 1 second
Number of Zaps: 3 positive and 3 negative at room temperature
Criteria: I-V Curve Tracing
Table 5.9 ESD Data
Model
Mode
S/S
Target
Results
HBM
Vdd, Vss, I/C
15
6000V
PASS
MM
Vdd, Vss, I/C
15
200V
PASS
Page 18 of 23
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5.8 Latch-Up Test Results
Test Description: Latch-Up testing was performed at room ambient using an
IMCS-4600 system which applies a stepped voltage to one pin per device with all
other pins open except Vdd and Vss which were biased to 5Volts and ground
respectively.
Testing was started at 5.0V (Positive) or 0V (Negative), and the DUT was biased for
0.5 seconds.
If neither the PUT current supply nor the device current supply reached the
predefined limit (DUT=00mA, Icc=100mA), then the voltage was increased by
0.1Volts and the pin was tested again.
This procedure was recommended by the JEDEC JC-40.2 CMOS Logic
standardization committee.
Notes:
1. DUT: Device Under Test.
2. PUT: Pin Under Test.
Figure 5.3 Latch-Up Test Results
Test Circuit: Positive Input/Output Overvoltage/Overcurrent
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Test Circuit: Negative Input/Output Overvoltage/Overcurrent
Supply Overvoltage Test
Table 5.10 Latch–Up Data
Mode
+
Voltage
+
Current
Vdd - Vxx
Voltage (V)/Current (mA)
11.0
11.0
200
200
9.0
S/S
5
5
5
5
5
Results
Pass
Pass
Pass
Pass
Pass
Page 20 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
6.0 Mechanical Information
Following diagrams show the dimensions of the AU9340 28-pin SSOP.
Measurements are in inches. Dimensions do not include mold flash and dambar
protrusion; allowable mold flash is 0.010 inch.
Figure 6.1 Mechanical Information Diagram
Page 21 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
R REV.
DESCRIPTION
1. REGENERATED FROM PO-P402
VERSION"A"
2. ADD GAUGE PLANE
ADD CROSS SECTIONA-A" DRAWING
MODIFY 0.020 TO 0.002
ADD E-PIN
CHANGE PIN "I" DOT DIMENSION
ORIG.
COMMON DIMENSION
MILLIMETERS
MIN.
NOM.
MAX.
2
0.05
1.65
1.75
1.85
0.22
0.38
0.22
0.3
0.33
0.09
0.25
0.09
0.15
0.21
9.90
10.20
10.50
7.4
7.8
8.2
5
5.3
5.6
0.65 BSC
0.55
0.75
0.95
0.25 REF.
0.09
0.09
0
40
80
SYMBOL
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
R1
R2
θ
N
0 ± 0.30
JEDEC NO.
14
6.20
MO-150
AB
UNLESS
DECMAL
OTHERWISE
X
±
xx
±.10
SPECIFIED
xxx ±.05
DRAWN
IRIS 98.06.10
16
6.20
MO-150
AC
18
7.20
MO-150
AD
DATE
JIMMY
97.04.21
STEVEN
IRIS
IRIS
97.07.31
97.08.21
98.06.10
COMMON DIMENSION
INCH
MIN.
NOM.
MAX.
0.079
0.002
0.065
0.069
0.073
0.009
0.015
0.009
0.012
0.013
0.004
0.01
0.004
0.006
0.008
0.390
0.402
0.413
0.291
0.307
0.323
0.197
0.209
0.22
0.0256 BSC
0.021
0.03
0.037
0.050 REF.
0.004
0.004
0
40
80
20
7.20
MO-150
AE
ANGULAR
±3°
BY
24
8.20
MO-150
AG
UNIT
28
10.20
MO-150
AH
MM
SCALE:10:1
ORENT SEMCONOUCTOR ELECTRONICS
SHEET:1 OF1
TITLE
FILE:PD-P503C
CHECKED
SSOP 14/16/20/21/28L(209MIL)
DWG. NO.:
APPROVED
PACKAGE OUTLINE
A3
PD-P503C
Page 22 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00
【MEMO】
About Alcor Micro, Corp
Alcor Micro, Corp. designs, develops and markets highly integrated and advanced
peripheral semiconductor, and software driver solutions for the personal computer
and consumer electronics markets worldwide. We specialize in USB solutions and
focus on emerging technology such as USB and IEEE 1394. The company offers a
range of semiconductors including controllers for USB hub, integrated
keyboard/USB hub and USB Flash memory card reader…etc. Alcor Micro, Corp. is
based in Taipei, Taiwan, with sales offices in Taipei, Japan, Korea and California.
Alcor Micro is distinguished by its ability to provide innovative solutions for
spec-driven products. Innovations like single chip solutions for traditional multiple
chip products and on-board voltage regulators enable the company to provide
cost-efficiency solutions for the computer peripheral device OEM customers
worldwide.
Page 23 of 23
AU9340 USB Memory Stick Card Reader Controller Chip
Official Release_Public
V1.00