1/4 STRUCTURE Silicon monolithic integrated circuits PRODUCT SERIES 1chip motor driver for printer (H bridge driver 2ch, switching regulator, series regulator, reset output) TYPE BD64550EFV FUNCTION ・Built-in thermal shut down circuit ・Built-in UVLO circuit ○Absolute maximum ratings (Ta=25℃) Parameter Symbol Limit Unit Supply voltage VM 40 Power dissipation Pd 1600※ Logic input voltage VL -0.4～5.5 V RIN applied voltage VRIN 5.5 V RNF voltage VRNF 0.5 V Motor driver maximum output current (peak500nsec) Motor driver maximum output current (DC) Switching Reg maximum output current (DC) IOUT(peak) 8.0 IOUT(DC) 2.5※ IOUT 0.5 V 1 mW A 2 A A Series Reg maximum output current (DC) IOUT 0.25 A Operating temperature range TOPR -25～+85 ℃ Storage temperature range TSTG -55～+150 ℃ Junction temperature Tjmax 150 ℃ ※1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/℃ for operating above Ta=25℃. ※2 Do not exceed Pd, ASO and Tjmax=150℃. ○Recommended operating conditions (Ta= -25～+85℃) Parameter Supply voltage Symbol Min Typ Max Unit VM 7 24 36 V SCLK input frequency FSCLK - - 20 MHz Switching Reg output voltage Vswreg 3 - 5 V This product isn’t designed for protection against radioactive rays. Status of this document The Japanese version of this document is the formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document, formal version takes priority. REV. A 2/4 ○Electrical characteristics (Unless otherwise specified, Ta=25℃, VＭ=24V) Parameter Symbol Limit Min. Typ. Max. Unit Conditions Overall VM current 1 IVM1 - - 8 mA VM=7V VM current 2 IVM2 - - 12 mA VM=24V H bridge 1 Output on resistance (source side) RONH1 - 0.6 0.78 Ω IOUT=1A Output on resistance (sinking side) RONL1 - 0.4 0.52 Ω IOUT=1A Output leak current ILEAK1 0 - 10 μA VM=36V VFH1 0.6 0.9 1.2 V IOUT=1A VFL1 0.6 0.9 1.2 V IOUT=1A Built-in diode forward direction voltage (source side) Built-in diode forward direction voltage (sinking side) H bridge 2 Output on resistance（source side） RONH2 - 0.7 0.91 Ω IOUT=1A Output on resistance（sinking side） RONL2 - 0.5 0.65 Ω IOUT=1A Output leak current ILEAK2 0 - 10 μA VM=36V VFH2 0.6 0.9 1.2 V IOUT=1A VFL2 0.6 0.9 1.2 V IOUT=1A VREF 0.8 - 3.5 V μA Built-in diode forward direction voltage (source side) Built-in diode forward direction voltage (sinking side) Current control VREF voltage range VREF pin outflow current IREF - 0 1 RNF pin outflow current IRNF 5 15 30 μA RNFS pin outflow current IRNFS - 0 1 μA VOFFSET -15 0 15 mV High input voltage VINH 2.0 - 5.5 V Low input voltage VINL 0 - 0.8 V IIN 21 33 45 μA VSWBIAS 0.873 0.9 0.927 V VREF-RNFS offset voltage VREF=2V Control logic Input current Input voltage=3.3V Switching power source DSEN threshold voltage Output on resistance RSWON - 0.8 1.04 Ω Leak current ISWLEAK 0 - 10 μA DMAX - 92 - % Clock frequency FSW 130 200 270 kHz DSEN pin outflow current IDSEN - 0 1 μA Output voltage VSOUT 1.425 1.5 1.575 V Leak current ISLEAK 0 - 10 μA DUTY_MAX value IOUT=250mA VM=36V Series power source IOUT=70mA RESET pin Output voltage VRSTL 0 - 0.2 V Leak current IRSTLEAK 0 - 10 μA High VM threshold voltage VMPORH 6.3 6.5 6.7 V Low VM threshold voltage L VMPORL 5.9 6.1 6.3 V VM at power off High motor UVLO voltage VMMTH 13.5 15 16.5 V Off motor only Low motor UVLO voltage VMMTL 12.5 14 15.5 V Reset delay time TPOR 50 80 110 msec REV. A IDRAIN=1mA VM at power on 3/4 ○Package outline Product No. BD64550EFV Lot No. HTSSOP-B40 (Unit: mm) ○Block diagram ○Pin No. / Pin name VM2 32 8 VM1 VM2 33 9 VM1 OUT2P 39 7 OUT1P 2 OUT1M Predriver Predriver OUT2M 34 RNF2 37 Pin No. Pin name Pin No. Pin name 1 NC 21 DGND 2 OUT1M 22 SELECT 3 RNF1 23 DC2E 4 RNF1 24 DC2P 3 RNF1 RNF2 38 4 RNF1 5 RNF1S 25 STROBE RNF2S 36 5 RNF1S 6 NC 26 SDATA 20 VREF1 7 OUT1P 27 SCLK 31 VM3 28 RESET VREF2 19 CONTROL LOGIC 1/10 1/10 SELECT 22 DC2P 24 SCLK(DC1P) 27 Serial Selector POWER MONITOR Control DC2E 23 8 VM1 28 RESET 9 VM1 29 AGND 10 VM4 30 NC VM3 11 NC 31 12 SWOUT 32 VM2 13 NC 33 VM2 14 ROUT 34 OUT2M 15 NC 35 NC 16 RIN 36 RNF2S RESET STROBE 25 SDATA 26 AGND 29 OSC UVLO TSD ROUT 14 BG BG PGND 21 DGND 10 VM4 BG RIN 16 REG 40 DRIVER 12 18 SWOUT DSEN 17 NC 37 RNF2 18 DSEN 38 RNF2 19 VREF2 39 OUT2P 20 VREF1 40 PGND NC: Non Connection REV. A 4/4 ○Operation Notes (1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range (TOPR) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. (2) Power supply lines Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and GND pins. (3) Ground potential Ensure a minimum GND pin potential in all operating conditions. (4) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. (6) ASO When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO. (7) Thermal shutdown circuit The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher, coil output to the motor and regulator output will be OFF, and reset output will be L. The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect peripheral equipment. (8) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. REV. A Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. 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More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2009 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster @ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix-Rev4.0