BYV26DGP & BYV26EGP Vishay General Semiconductor Glass Passivated Ultrafast Rectifier FEATURES • Cavity-free glass-passivated junction ® • Ultrafast reverse recovery time • Low forward voltage drop • Low switching losses, high efficiency d* e t n e Pat • High forward surge capability • Meets environmental standard MIL-S-19500 DO-204AC (DO-15) * Glass Encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306 • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication. PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 800 V, 1000 V IFSM 30 A trr 75 ns VF 1.3 V TJ max. 175 °C MECHANICAL DATA Case: DO-204AC, molded epoxy over glass body Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC Q101 qualified), meets JESD 201 class 2 whisker test Polarity: Color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL BYV26DGP BYV26EGP UNIT Maximum repetitive peak reverse voltage VRRM 800 1000 V Maximum RMS voltage VRMS 560 700 V Maximum DC blocking voltage VDC 800 1000 V Maximum average forward rectified current 0.375" (9.5 mm) lead length (Fig. 1) IF(AV) 1.0 A Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 30 A Non repetitive peak reverse energy (1) Operating junction and storage temperature range ERSM 10 mj TJ, TSTG - 65 to + 175 °C Note: (1) Peak reverse energy measured at IR = 400 mA, TJ = TJ max. on inductive load, t = 20 µs Document Number: 88554 Revision: 20-Aug-07 For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 1 BYV26DGP & BYV26EGP Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS Minimum avalanche breakdown voltage 100 µA Maximum instantaneous forward voltage 1.0 A Maximum DC reverse current at rated DC blocking voltage SYMBOL BYV26DGP BYV26EGP UNIT VBR 900 1100 V TJ = 25 °C TJ = 175 °C VF 2.5 1.3 V TA = 25 °C TA = 165 °C IR 5.0 150 µA Max. reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 75 ns Typical junction capacitance 4.0 V, 1 MHz CJ 15 pF THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL BYV26DGP RθJA RθJL Typical thermal resistance (1)(2) BYV26EGP UNIT 70 16 °C/W Notes: (1) Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on P.C.B. with 0.5 x 0.5" (12 x 12 mm) copper pads (2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to heatsink ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE BYV26EGP-E3/54 0.428 54 4000 13" diameter paper tape and reel BYV26EGP-E3/73 0.428 73 2000 Ammo pack packaging BYV26EGPHE3/54 (1) 0.428 54 4000 13" diameter paper tape and reel (1) 0.428 73 2000 Ammo pack packaging BYV26EGPHE3/73 Note: (1) Automotive grade AEC Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) 1.8 Resistive or Inductive Load TL = Lead Temperature Lead Mounted on Heatsinks 1.0 0.8 0.6 Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.5 x 0.5" (12 x 12 mm) Copper Pads 0.4 1.6 Average Power Loss (W) Average Forward Rectified Current (A) 1.2 D = 0.3 1.4 D = 0.2 1.2 D = 1.0 D = 0.1 1.0 0.8 T 0.6 0.4 0.2 D = tp/T 0.2 TA = Ambient Temperature D = 0.8 D = 0.5 tp 0 0 0 25 50 75 100 125 150 175 Temperature (°C) Figure 1. Maximum Forward Current Derating Curve www.vishay.com 2 0 0.2 0.4 0.6 0.8 1.0 1.2 Average Forward Current (A) Figure 2. Forward Power Loss Characteristics For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] Document Number: 88554 Revision: 20-Aug-07 BYV26DGP & BYV26EGP Vishay General Semiconductor 100 100 Junction Capacitance (pF) Peak Forward Surge Current (A) TJ = TJ Max. 10 ms Single Half Sine-Wave 10 1 1 10 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 10 1 0.1 100 1 10 100 Number of Cycles at 60 Hz Reverse Voltage (V) Figure 3. Maximum Non-Repetitive Peak Forward Surge Current Figure 6. Typical Junction Capacitance 100 Transient Thermal Impedance (°C/W) Instantaneous Forward Current (A) 100 TJ = 175 °C 10 TJ = 150 °C 1 TJ = 125 °C 0.1 TJ = 25 °C 0.01 0.2 0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 10 Mounted on P.C.B. 0.375" (9.5 mm) Lead Length on 0.47 x 0.47" (12 x 12 mm) Copper Pads 1 0.01 0.1 1 10 100 Instantaneous Forward Voltage (V) t - Pulse Duration (s) Figure 4. Typical Instantaneous Forward Voltage Characteristics Figure 7. Typical Transient Thermal Impedance Instantaneous Reverse Leakage Current (µA) 100 TJ = 175 °C TJ = 165 °C 10 TJ = 125 °C 1 0.1 TJ = 25 °C 0.01 0.001 0 20 40 60 80 100 Percent of Peak Reverse Voltage (%) Figure 5. Typical Reverse Leakage Characteristics Document Number: 88554 Revision: 20-Aug-07 For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 3 BYV26DGP & BYV26EGP Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-204AC (DO-15) 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 0.300 (7.6) 0.230 (5.8) 0.140 (3.6) 0.104 (2.6) DIA. 1.0 (25.4) MIN. www.vishay.com 4 For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] Document Number: 88554 Revision: 20-Aug-07 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1