ESD Protection Devices ESD Protection Devices Tyco Electronics’ ESD line of devices help protect I/O ports on HDMI 1.3, portable video players, LCD & plasma TVs, USB 2.0, digital visual interface (DVI), and antenna switches. ESD devices shunt electrostatic discharge away from sensitive circuitry in HDTV equipment, printers, laptops, cellular phones, and other portable devices. ESD devices offer many advantages over traditional protection devices, such as multi layer varistors (MLVs), which may degrade or distort the signal in high data rate circuits. Compared to transient voltage suppression (TVS) diodes and miniature gas discharge tubes (GDTs), ESD devices provide a more compact form factor and an economical solution for the shrinking profiles of today’s compact information appliances. Available in a range of form factors, our ESD protection devices provide low capacitance, and meet transmission line pulse (TLP) testing, as well as IEC61000-4-2 testing. Benefits • ESD protection for high frequency applications (HDMI 1.3) • Smaller form factor for board space savings • Helps protect sensitive electronic circuits against damage caused by electrostatic discharge (ESD) events • Assists equipment to pass IEC 61000-4-2, level 4 testing 7 Features • RoHS compliant • Halogen free (refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm) • 0.25 pF (typical) capacitance • Low-leakage current • Low-clamping voltage • Fast response time (< 1ns) • Capable of withstanding numerous ESD strikes • Compatible with standard reflow installation procedures • Thick film technology • Bi-directional protection Applications • HDMI 1.3 interfaces • Printer ports • LCD & plasma TV • Satellite radios • Cellular phones • USB 2.0 and IEEE 1394 interfaces • Antennas • DVI • Portable video players • GPS systems • Portable devices (PDA, DSC, BlueTooth) 45 Table E1 Electrical Characteristics for ESD Devices Symbol Continuous Max Operating Voltage Typical Trigger Voltage* Typical Clamping Voltage† Typical Capacitance @1 MHz, 1VRMS Typical Leakage Current Max Leakage Current @ Max VDC IL(MAX) VDC VT(TLP) VC(TLP) CP IL(TYP) Unit V V V pF µA µA PESD0402-140 14 250 40 0.25 < 0.01 10.0 PESD0603-240 24 215 45 0.25 < 0.01 10.0 PESD1206Q-240 24 250 45 0.25 < 0.01 10.0 Notes : * TLP test method at 1kV. † Measured 30ns after pulse initiation. Typical capacitance value is at 0V and Max Operating Voltage bias. Capacitance (pF) Figure E1 Capacitance vs. Frequency for ESD Devices 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 0 500 1000 1500 2000 2500 3000 Frequency (MHz) 7 Figure E2 Eye Diagram Performance at 3.4 GHz for ESD Devices Figure E3 Insertion Loss Diagram for ESD Devices 0.1 0 Insertion Loss (dB) -0.1 -0.1dB at 3.4GHz -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 0.3 1 10 100 Frequency (MHz) 46 RoHS Compliant, ELV Compliant HF Halogen Free 1000 6000 ESD Protection Devices Figure E4-E5 ESD Protection for HDMI Figure E4 Figure E5 ESD Protection for HDMI (0402 and 0603) ESD Protection for HDMI (1206Q) HDMI Transmitter or Receiver HDMI Port TX0+ TX0TX01+ TX01TX02+ TX02TC+ TC- Outside World TX0+ TX0TX01+ TX01TX02+ TX02TC+ TC- Outside World HDMI Transmitter or Receiver HDMI Port PESD Devices PESD Devices 2 PESD1206Q Arrays GND GND Chassia Chassia Table E2 Dimensions for ESD Devices in Millimeters (Inches)* A B C D E F Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Figure PESD0402-140 0.90 1.10 0.23 0.43 0.10 0.30 0.40 0.60 — — — — E6 (0.035) (0.043) (0.009) (0.017) (0.004) (0.012) (0.016) (0.024) — — — — E6 E7 PESD0603-240 1.50 1.70 0.45 0.55 0.10 0.50 0.70 1.00 (0.059) (0.067) (0.018) (0.022) (0.004) (0.020) (0.028) (0.039) PESD1206Q-240 3.10 3.30 0.40 0.60 0.10 0.30 1.50 1.70 0.20 0.60 0.20 0.60 (0.122) (0.130) (0.016) (0.024) (0.004) (0.012) (0.059) (0.067) (0.008) (0.024) (0.008) (0.024) 7 *The dimensions in inches are rounded approximations. Figure E6-E7 Dimension Figures for ESD Devices Figure E6 Figure E7 D D A A A A B B F B B C F E C E C (side view) (side view) C (drawing not to scale) (drawing not to scale) Table E3 Environmental Specifications for ESD Devices Test Conditions Pass / Fail Criteria Bias humidity test 85°C, 85% RH, VDC (max), 1000 hrs IL ⬉ 10 µA Thermal shock -55°C to 125°C, 30 min dwell, 1000 cycles IL ⬉ 10 µA Bias heat test 125°C, VDC (max), 1000 hrs IL ⬉ 10 µA Bias low temp test -55°C, VDC (max), 1000 hrs IL ⬉ 10 µA Solderability 250°C ± 5°C, 3 ±1s 95% coverage Solder heat 260°C, 10s 90% coverage Vibration 10 to 50Hz, 60s cycle, 2 hrs each in X-Y-Z-direction No physical damage Solvent resistance IPA ultrasonic 300s No physical damage Shock 1500G, 0.5ms each, X-Y-Z axis 3 times each axis No physical damage RoHS Compliant, ELV Compliant HF Halogen Free 47 Table E4 General Characteristics for ESD Devices Storage temperature -40°C to +85°C Operating temperature -55°C to +125°C ESD voltage capability (tested per IEC 61000-4-2) Contact discharge mode : 8kV (typical), 15kV (max) Air discharge mode : 15kV (typical), 25kV (max) [1 pulse: per customer request] ESD pulse withstand 100 pulses (tested per IEC 61000-4-2, level 4,contact method) Table E5 Materials Information for ESD Devices RoHS compliant Directive 2002/95/EC compliant ELV compliant Directive 2000/53/EC compliant Halogen free Halogen free refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm Table E6 Recommended Pad Layout for ESD Devices in Millimeters (Inches)* V Part Number PESD0402-140 PESD0603-240 7 W X Y Z Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Figure — — 0.60 0.70 0.30 0.40 0.80 0.90 2.10 2.20 E8 (0.024) (0.028) (0.012) (0.016) (0.031) (0.035) (0.083) (0.087) — — 0.90 1.00 0.50 0.60 1.00 1.10 2.70 2.80 (0.035) (0.039) (0.020) (0.024) (0.039) (0.043) (0.106) (0.110) Part Number V Typ. W Typ. X Typ. Y Typ. Z Typ. PESD1206Q-240 3.20 2.20 0.50 0.80 1.00 (0.126) (0.087) (0.020) (0.031) (0.039) E8 Figure E9 *The dimensions in inches are rounded approximations. Figure E8 Figure E9 X V W Z W Y X Z Y Note: Solder thickness 0.15 to 0.2 mm Table E7 Solder Reflow Recommendations for ESD Devices A Temperature ramp up 1 From ambient to preheating temperature 30s to 60s B Preheating 140°C - 160°C 60s to 120s C Temperature ramp up 2 From preheating to main heating temperature 20s to 40s D Main heating at 200°C at 220°C at 240°C at 260°C 60s to 70s 50s to 60s 30s to 40s 5s to 10s From main heating temperature to 100°C 4°C/s max Figure E10 Preheating E 48 Cooling RoHS Compliant, ELV Compliant HF Halogen Free Temperature (˚C) 300 Soldering Cooling D E 250 200 150 100 50 0 A B C Times (s) ESD Protection Devices Table E8 Tape and Reel Specifications for ESD Devices Tape Dimension EIA Mark 0402 Dimension (mm) 0603 Tolerance Dimension (mm) 1206Q Tolerance Dimension (mm) Tolerance W 8.00 ±0.30 8.00 ±0.30 8.00 ±0.30 P0 4.00 ±0.10 4.00 ±0.10 4.00 ±0.10 P1 4.00 ±0.05 4.00 ±0.05 4.00 ±0.05 P2 2.00 ±0.05 2.00 ±0.05 2.00 ±0.05 A0 0.69 ±0.05 1.27 ±0.15 2.02 ±0.20 B0 1.19 ±0.05 2.02 ±0.20 3.62 ±0.20 D0 1.50 ±0.10 1.50 ±0.10 1.50 ±0.10 F 3.50 ±0.05 3.50 ±0.05 3.50 ±0.05 E1 1.75 ±0.10 1.75 ±0.10 1.75 ±0.10 T 0.48 ±0.03 0.60 ±0.03 0.75 ±0.03 Reel Dimensions (0402, 0603 & 1206Q) EIA Mark Dimension (mm) A max. 180.0 N min. 60.5 W1 max. 9.5 W2 max. 14.0 Figure E11 EIA Referenced Taped Component Dimensions for ESD Devices 7 P0 P2 T E1 A0 D0 F W B0 P1 Figure E12 EIA Referenced Reel Dimensions for ESD Devices W2 W1 A RoHS Compliant, ELV Compliant HF Halogen Free N 49 Parameter Definitions for ESD Devices Operation Voltage (VDC) Defined as DC voltage, under which device is in OFF state and leakage current below certain threshold. Leakage Current (IL) Current through device under Operation Voltage VDC. Trigger Voltage (VT) Voltage at which the device switches from the OFF to the ON state, during the IEC waveform or the TLP system. Clamping Voltage (VC) Voltage cross device under 8 kV per IEC or measured by TLP system. Typically measured 30 ns after initiation of the ESD pulse (for TLP, both 30ns and 60ns are sometimes used). Capacitance (CP) Capacitance of the device measured at 1 MHz with 0V and max operating voltage bias. Part Numbering System for ESD Devices PESD xxxx Q - 240 Operating Voltage Designator 24 x 10˚ = 24VDC 7 Array of 4 Elements EIA Size Series Warning : Application Limitations for PESD0402-140, PESD0603-240 and PESD1206Q-240: These parts are not intended to be used under power bus applications. Users should independently evaluate the suitability of and test each product selected for their own application. All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics only obligations are those in the Tyco Electronics Standard Terms and Conditions of Sale and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of its products. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. Without expressed or written consent by an officer of Tyco Electronics, Tyco Electronics does not authorize the use of any of its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. 50 RoHS Compliant, ELV Compliant HF Halogen Free