CYPRESS CY8C20224

CY8C20224, CY8C20324
CY8C20424, CY8C20524
®
®
CapSense PSoC
Programmable System-on-Chip™
CapSense® PSoC® Programmable System-on-Chip
Features
■
Low power, configurable CapSense®
❐ Configurable capacitive sensing elements
❐ operating voltage
❐ Operating voltage: 2.4 V to 5.25 V
❐ Low operating current
• Active 1.5 mA (at 3.0 V, 12 MHz)
• Sleep 2.8 µA (at 3.3 V)
❐ Supports up to 25 capacitive buttons
❐ Supports one slider
❐ Up to 10 cm proximity sensing
❐ Supports up to 28 general-purpose I/O (GPIO) pins
• Drive LEDs and other outputs
❐ Configurable LED behavior (fading, strobing)
❐ LED color mixing (RBG LEDs)
❐ Pull-up, high Z, open-drain, and CMOS drive modes on all
GPIOs
❐ Internal ±5.0% 6 or12 MHz main oscillator
❐ Internal low-speed oscillator at 32 kHz
❐ Low external component count
• No external crystal or oscillator components
• No external voltage regulator required
■
High-performance CapSense
❐ Ultra fast scan speed —1 kHz (nominal)
❐ Reliable finger detection through 5 mm thick acrylic
❐ Excellent EMI and AC noise immunity
■
Industry best flexibility
❐ 8 KB flash program storage 50,000 erase and write cycles
❐ 512-bytes SRAM data storage
❐ Bootloader for ease of field reprogramming
❐ Partial flash updates
❐ Flexible flash protection modes
❐ Interrupt controller
❐ In-system serial programming (ISSP)
❐ Free complete development tool (PSoC Designer™)
❐ Full-featured, in-circuit emulator and programmer
• Full-speed emulation
• Complex breakpoint structure
• 128 KB trace memory
■
Additional system resources
❐ Configurable communication speeds
2
❐ I C slave
❐ SPI master and SPI slave
❐ Watchdog and sleep timers
❐ Internal voltage reference
❐ Integrated supervisory circuit
Logic Block Diagram
Port 3
Port 2
Port 1
Port 0
3V LDO
PSoC
CORE
System Bus
Global Analog Interconnect
SRAM
512 Bytes
SROM
Flash 8K
CPU Core
(M8C)
Interrupt
Controller
Sleep and
Watchdog
6/12 MHz Internal Main Oscillator
ANALOG
SYSTEM
I2C Slave/SPI
Master-Slave
CapSense
Basic
Block
Analog
Ref.
POR and LVD
Analog
Mux
System Resets
SYSTEM RESOURCES
Cypress Semiconductor Corporation
Document Number: 001-41947 Rev. *L
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 15, 2012
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Contents
PSoC® Functional Overview ............................................ 3
PSoC Core .................................................................. 3
CapSense Analog System .......................................... 3
Additional System Resources ..................................... 4
Getting Started .................................................................. 4
Application Notes ........................................................ 4
Development Kits ........................................................ 4
Training ....................................................................... 4
CYPros Consultants .................................................... 4
Solutions Library .......................................................... 4
Technical Support ....................................................... 4
Development Tools .......................................................... 5
PSoC Designer Software Subsystems ........................ 5
Designing with PSoC Designer ....................................... 6
Select User Modules ................................................... 6
Configure User Modules .............................................. 6
Organize and Connect ................................................ 6
Generate, Verify, and Debug ....................................... 6
Pinouts .............................................................................. 7
16-pin Part Pinout ........................................................ 7
24-pin Part Pinout ........................................................ 8
28-pin Part Pinout ........................................................ 9
32-pin Part Pinout ...................................................... 10
48-pin OCD Part Pinout ............................................. 12
Electrical Specifications ................................................ 14
Absolute Maximum Ratings .......................................... 14
Operating Temperature .................................................. 14
Document Number: 001-41947 Rev. *L
DC Electrical Characteristics ........................................ 15
AC Electrical Characteristics ........................................ 19
Ordering Information ...................................................... 26
Ordering Code Definitions ......................................... 26
Packaging Dimensions .................................................. 27
Thermal Impedances ................................................ 30
Solder Reflow Specifications ..................................... 30
Development Tool Selection ......................................... 31
Software .................................................................... 31
Development Kits ...................................................... 31
Evaluation Tools ........................................................ 31
Device Programmers ................................................. 32
Accessories (Emulation and Programming) .............. 32
Acronyms ........................................................................ 33
Acronyms Used ......................................................... 33
Reference Documents .................................................... 33
Document Conventions ................................................. 34
Units of Measure ....................................................... 34
Numeric Conventions ................................................ 34
Glossary .......................................................................... 34
Document History Page ................................................. 39
Sales, Solutions, and Legal Information ...................... 41
Worldwide Sales and Design Support ....................... 41
Products .................................................................... 41
PSoC Solutions ......................................................... 41
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CY8C20224, CY8C20324
CY8C20424, CY8C20524
PSoC® Functional Overview
IDAC
Analog Global Bus
The PSoC family consists of many programmable
system-on-chips with on-chip controller devices. These devices
are designed to replace multiple traditional MCU based system
components with one, low cost single chip programmable
component. A PSoC device includes configurable analog and
digital blocks, and programmable interconnect. This architecture
enables the user to create customized peripheral configurations,
to match the requirements of each individual application.
Additionally, a fast CPU, flash program memory, SRAM data
memory, and configurable I/O are included in a range of
convenient pinouts.
Figure 1. Analog System Block Diagram
Vr
The PSoC architecture for this device family is comprised of
three main areas: core, system resources, and CapSense
analog system. A common, versatile bus enables connection
between I/O and the analog system. Each CY8C20x24 PSoC
device includes a dedicated CapSense block that provides
sensing and scanning control circuitry for capacitive sensing
applications. Depending on the PSoC package, up to 28 GPIOs
are also included. The GPIOs provide access to the MCU and
analog mux.
Reference
Buffer
Cinternal
Comparator
Mux
Mux
Refs
PSoC Core
The PSoC core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and internal main
oscillator (IMO) and internal low-speed oscillator (ILO). The CPU
core, called the M8C, is a powerful processor with speeds up to
12 MHz. The M8C is a 2-MIPS, 8-bit Harvard-architecture
microprocessor.
Cap Sense Counters
CSCLK
IMO
System resources provide additional capability, such as a
configurable I2C slave or SPI master-slave communication
interface and various system resets supported by the M8C.
The analog system is composed of the CapSense PSoC block
and an internal 1.8-V analog reference. Together, they support
capacitive sensing of up to 28 inputs.
CapSense Analog System
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. Capacitive sensing is configurable on
each GPIO pin. Scanning of enabled CapSense pins are
completed quickly and easily across multiple ports.
CapSense
Clock Select
Relaxation
Oscillator
(RO)
Analog Multiplexer System
The analog mux bus connects to every GPIO pin. Pins are
connected to the bus individually or in any combination. The bus
also connects to the analog system for analysis with the
CapSense block comparator.
Switch control logic enables selected pins to precharge
continuously under hardware control. This enables capacitive
measurement for applications such as touch sensing. The
analog multiplexer system in the CY8C20x24 device family is
optimized for basic CapSense functionality. It supports sensing
of CapSense buttons, proximity sensors, and a single slider.
Other multiplexer applications include:
■
Capacitive slider interface.
■
Chip-wide mux that enables analog input from any I/O pin.
■
Crosspoint connection between any I/O pin combinations.
When designing capacitive sensing applications, refer to the
latest signal to noise signal level requirements application notes,
which are found in http://www.cypress.com > Design Resources
> Application Notes. In general, and unless otherwise noted in
the relevant application notes, the minimum signal-to-noise ratio
(SNR) requirement for CapSense applications is 5:1.
Document Number: 001-41947 Rev. *L
Page 3 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Typical Application
Getting Started
Figure 2 illustrates a typical application: CapSense multimedia
keys for a notebook computer with a slider, four buttons, and four
LEDs.
This datasheet is an overview of the PSoC integrated circuit and
presents specific pin, register, and electrical specifications.
Figure 2. CapSense Multimedia Button-Board Application
For in depth information, along with detailed programming
details, see the PSoC® Technical Reference Manual.
For up-to-date ordering, packaging, and electrical specification
information, see the latest PSoC device datasheets on the web.
Application Notes
Cypress application notes are an excellent introduction to the
wide variety of possible PSoC designs.
Development Kits
Additional System Resources
System resources, some of which are previously listed, provide
additional capability useful to complete systems. Additional
resources include low voltage detection (LVD) and power on
reset (POR). Brief statements describing the merits of each
system resource follow.
■
The I2C slave and SPI master-slave module provides 50, 100,
or 400 kHz communication over two wires. SPI communication
over three or four wires runs at speeds of 46.9 kHz to 3 MHz
(lower for a slower system clock).
■
LVD interrupts signal the application of falling voltage levels,
while the advanced POR circuit eliminates the need for a
system supervisor.
■
An internal 1.8-V reference provides an absolute reference for
capacitive sensing.
■
The 5 V maximum input, 3 V fixed output, low dropout regulator
(LDO) provides regulation for I/Os. A register controlled bypass
mode enables the user to disable the LDO.
PSoC Development Kits are available online from and through a
growing number of regional and global distributors, which
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and
Newark.
Training
Free PSoC technical training (on demand, webinars, and
workshops), which is available online via www.cypress.com,
covers a wide variety of topics and skill levels to assist you in
your designs.
CYPros Consultants
Certified PSoC consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC
consultant go to the CYPros Consultants web site.
Solutions Library
Visit our growing library of solution focused designs. Here you
can find various application designs that include firmware and
hardware design files that enable you to complete your designs
quickly.
Technical Support
Technical support – including a searchable Knowledge Base
articles and technical forums – is also available online. If you
cannot find an answer to your question, call our Technical
Support hotline at 1-800-541-4736.
Document Number: 001-41947 Rev. *L
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CY8C20224, CY8C20324
CY8C20424, CY8C20524
Development Tools
PSoC Designer™ is the revolutionary Integrated Design
Environment (IDE) that you can use to customize PSoC to meet
your specific application requirements. PSoC Designer software
accelerates system design and time to market. Develop your
applications using a library of precharacterized analog and digital
peripherals (called user modules) in a drag-and-drop design
environment. Then, customize your design by leveraging the
dynamically generated application programming interface (API)
libraries of code. Finally, debug and test your designs with the
integrated debug environment, including in-circuit emulation and
standard software debug features. PSoC Designer includes:
Code Generation Tools
The code generation tools work seamlessly within the
PSoC Designer interface and have been tested with a full range
of debugging tools. You can develop your design in C, assembly,
or a combination of the two.
Assemblers. The assemblers allow you to merge assembly
code seamlessly with C code. Link libraries automatically use
absolute addressing or are compiled in relative mode, and linked
with other software modules to get absolute addressing.
■
Application editor graphical user interface (GUI) for device and
user module configuration and dynamic reconfiguration
■
Extensive user module catalog
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices. The
optimizing C compilers provide all of the features of C, tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
■
Integrated source-code editor (C and assembly)
Debugger
■
Free C compiler with no size restrictions or time limits
■
Built-in debugger
■
In-circuit emulation
PSoC Designer has a debug environment that provides
hardware in-circuit emulation, allowing you to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow you to read and program and
read and write data memory, and read and write I/O registers.
You can read and write CPU registers, set and clear breakpoints,
and provide program run, halt, and step control. The debugger
also allows you to create a trace buffer of registers and memory
locations of interest.
■
Built-in support for communication interfaces:
2
❐ Hardware and software I C slaves and masters
❐ Full-speed USB 2.0
❐ Up to four full-duplex universal asynchronous receiver/transmitters (UARTs), SPI master and slave, and wireless
PSoC Designer supports the entire library of PSoC 1 devices and
runs on Windows XP, Windows Vista, and Windows 7.
PSoC Designer Software Subsystems
Design Entry
In the chip-level view, choose a base device to work with. Then
select different onboard analog and digital components that use
the PSoC blocks, which are called user modules. Examples of
user modules are analog-to-digital converters (ADCs),
digital-to-analog converters (DACs), amplifiers, and filters.
Configure the user modules for your chosen application and
connect them to each other and to the proper pins. Then
generate your project. This prepopulates your project with APIs
and libraries that you can use to program your application.
The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration
makes it possible to change configurations at run time. In
essence, this allows you to use more than 100 percent of PSoC's
resources for a given application.
Document Number: 001-41947 Rev. *L
Online Help System
The online help system displays online, context-sensitive help.
Designed for procedural and quick reference, each functional
subsystem has its own context-sensitive help. This system also
provides tutorials and links to FAQs and an Online Support
Forum to aid the designer.
In-Circuit Emulator
A low-cost, high-functionality In-Circuit Emulator (ICE) is
available for development support. This hardware can program
single devices.
The emulator consists of a base unit that connects to the PC
using a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full-speed
(24-MHz) operation.
Page 5 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Designing with PSoC Designer
The development process for the PSoC device differs from that
of a traditional fixed-function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and lowering inventory costs. These
configurable resources, called PSoC blocks, have the ability to
implement a wide variety of user-selectable functions. The PSoC
development process is:
1. Select user modules.
2. Configure user modules.
3. Organize and connect.
4. Generate, verify, and debug.
Select User Modules
PSoC Designer provides a library of prebuilt, pretested hardware
peripheral components called “user modules.” User modules
make selecting and implementing peripheral devices, both
analog and digital, simple.
Configure User Modules
Each user module that you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a Pulse
Width Modulator (PWM) User Module configures one or more
digital PSoC blocks, one for each eight bits of resolution. Using
these parameters, you can establish the pulse width and duty
cycle. Configure the parameters and properties to correspond to
your chosen application. Enter values directly or by selecting
values from drop-down menus. All of the user modules are
documented in datasheets that may be viewed directly in
PSoC Designer or on the Cypress website. These user module
data sheets explain the internal operation of the user module and
provide performance specifications. Each datasheet describes
the use of each user module parameter, and other information
that you may need to successfully implement your design.
Document Number: 001-41947 Rev. *L
Organize and Connect
Build signal chains at the chip level by interconnecting user
modules to each other and the I/O pins. Perform the selection,
configuration, and routing so that you have complete control over
all on-chip resources.
Generate, Verify, and Debug
When you are ready to test the hardware configuration or move
on to developing code for the project, perform the “Generate
Configuration Files” step. This causes PSoC Designer to
generate source code that automatically configures the device to
your specification and provides the software for the system. The
generated code provides APIs with high-level functions to control
and respond to hardware events at run time, and interrupt
service routines that you can adapt as needed.
A complete code development environment allows you to
develop and customize your applications in C, assembly
language, or both.
The last step in the development process takes place inside
PSoC Designer's Debugger (accessed by clicking the Connect
icon). PSoC Designer downloads the HEX image to the ICE
where it runs at full speed. PSoC Designer debugging capabilities rival those of systems costing many times more. In addition
to traditional single-step, run-to-breakpoint, and watch-variable
features, the debug interface provides a large trace buffer. It
allows you to define complex breakpoint events that include
monitoring address and data bus values, memory locations, and
external signals
Page 6 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Pinouts
This section describes, lists, and illustrates the CY8C20224, CY8C20324, CY8C20424, and CY8C20524 PSoC device pins and pinout
configurations.
The CY8C20x24 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port
pin (labeled with a “P”) is capable of digital I/O and connection to the common analog bus. However, VSS, VDD, and XRES are not
capable of Digital I/O.
16-pin Part Pinout
P0[7], AI
Vdd
P0[3], AI
14
13
P0[1], AI
15
12
QFN
11
(T o p V ie w ) 1 0
5
6
7
8
Vss
AI, DATA, I2C SDA, P1[0]
9
AI, SPI CLK, P1[3]
A I, I2 C S C L , S P I S S , P 1 [7 ]
A I, I2 C S D A , S P I M IS O , P 1 [5 ]
1
2
3
4
CLK, I2C SCL, SPI MOSI P1[1]
A I, P 2 [5 ]
A I, P 2 [1 ]
16
Figure 3. CY8C20224 16-pin PSoC Device
P 0 [4 ], A I
XRES
P 1 [4 ], A I, E X T C L K
P 1 [2 ], A I
Table 1. 16-pin Part Pinout (COL)
Pin No.
1
2
3
Digital
I/O
I/O
IOH
Analog
I
I
I
Name
P2[5]
P2[1]
P1[7]
4
IOH
I
P1[5]
5
6
IOH
IOH
I
I
P1[3]
P1[1]
IOH
I
VSS
P1[0]
IOH
IOH
I
I
7
8
9
10
11
12
13
14
15
16
Power
Input
I/O
I
Power
I/O
I/O
I/O
I
I
I
P1[2]
P1[4]
XRES
P0[4]
VDD
P0[7]
P0[3]
P0[1]
Description
I2C SCL, SPI SS
I2C SDA, SPI MISO
SPI CLK
CLK[1], I2C SCL, SPI MOSI
Ground connection
DATA[1], I2C SDA
Optional external clock input (EXTCLK)
Active high external reset with internal pull-down
Supply voltage
Integrating input
Integrating input
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive
Note
1. These are the ISSP pins, that are not high Z at POR (Power on reset). Refer the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 001-41947 Rev. *L
Page 7 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
24-pin Part Pinout
20
19
10
11
12
P0[7], AI
Vdd
P0[6], AI
P0[1], AI
P0[3], AI
P0[5], AI
23
22
21
18
17
16
15
14
13
P0[4], AI
P0[2], AI
P0[0], AI
P2[0], AI
XRES
P1[6], AI
AI, EXTCLK, P1[4]
Vss
AI, DATA*, I2C SDA, P1[0]
AI, P1[2]
7
8
9
1
2
QFN
3
4 (Top View)
5
6
NC
P2[5]
P2[3]
P2[1]
P1[7]
P1[5]
P1[3]
AI, CLK*, I2C SCL
SPI MOSI, P1[1]
AI,
AI,
AI,
AI, I2C SCL, SPI SS,
AI, I2C SDA, SPI MISO,
AI, SPI CLK,
24
Figure 4. CY8C20324 24-pin PSoC Device
Table 2. 24-pin Part Pinout (QFN [2])
Pin No.
1
2
3
4
Digital
I/O
I/O
I/O
IOH
Analog
I
I
I
I
Name
P2[5]
P2[3]
P2[1]
P1[7]
5
IOH
I
P1[5]
6
7
IOH
IOH
I
I
P1[3]
P1[1]
IOH
I
NC
VSS
P1[0]
IOH
IOH
IOH
I
I
I
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
CP
Power
Input
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
Power
I/O
I/O
I/O
I/O
I
I
I
I
Power
P1[2]
P1[4]
P1[6]
XRES
P2[0]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
P0[7]
P0[5]
P0[3]
P0[1]
Vss
Description
I2C SCL, SPI SS
I2C SDA, SPI MISO
SPI CLK
CLK[3], I2C SCL, SPI MOSI
No connection
Ground connection
DATA[3], I2C SDA
Optional external clock input (EXTCLK)
Active high external reset with internal pull-down
Supply voltage
Integrating input
Integrating input
Center pad is connected to ground
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive
Notes
2. The center pad on the QFN package is connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it is electrically
floated and not connected to any other signal.
3. These are the ISSP pins, that are not high Z at POR (Power on reset). Refer the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 001-41947 Rev. *L
Page 8 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
28-pin Part Pinout
Figure 5. CY8C20524 28-pin PSoC Device
Table 3. 28-pin Part Pinout (SSOP)
Pin No.
1
2
3
4
5
6
7
8
9
10
Digital
Analog
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
Power
IOH
I
Name
P0[7]
P0[5]
P0[3]
P0[1]
P2[7]
P2[5]
P2[3]
P2[1]
VSS
P1[7]
11
IOH
I
P1[5]
12
13
IOH
IOH
I
I
P1[3]
P1[1]
14
15
IOH
I
VSS
P1[0]
IOH
IOH
IOH
I
I
I
16
17
18
19
20
21
22
23
24
25
26
27
28
Power
Input
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I
I
I
I
I
I
Power
P1[2]
P1[4]
P1[6]
XRES
P2[0]
P2[2]
P2[4]
P2[6]
P0[0]
P0[2]
P0[4]
P0[6]
VDD
Description
Integrating input
Integrating input
Ground connection
I2C SCL, SPI SS
I2C SDA, SPI MISO
SPI CLK
CLK[4], I2C SCL, SPL MOSI
Ground connection
Data[4], I2C SDA
Optional external clock input (EXTCLK)
Active high external reset with internal pull-down
Supply voltage
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive
Note
4. These are the ISSP pins, that are not high Z at POR (Power on reset). Refer the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 001-41947 Rev. *L
Page 9 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
32-pin Part Pinout
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
26
25
P0[7], AI
29
27
P0[5], AI
30
28
Vss
P0[3], AI
31
9
11
12
13
14
15
16
AI, CLK*, I2C SCL, SPI MOSI, P1[1]
Vss
AI, DATA*, I2C SDA, P1[0]
AI, P1[2]
AI, EXTCLK, P1[4]
AI, P1[6]
A I, I2 C S C L
Q FN
(T o p V ie w )
24
23
22
21
20
19
18
17
10
A I, P 3 [1 ]
S P I S S , P 1 [7 ]
1
2
3
4
5
6
7
8
AI, SPI CLK, P1[3]
P 0 [1 ]
P 2 [7 ]
P 2 [5 ]
P 2 [3 ]
P 2 [1 ]
P 3 [3 ]
AI, I2C SDA, SPI MISO, P1[5]
A I,
A I,
A I,
A I,
A I,
A I,
32
Figure 6. CY8C20424 32-pin PSoC Device
P 0 [0 ], A I
P 2 [6 ], A I
P 2 [4 ], A I
P 2 [2 ], A I
P 2 [0 ], A I
P 3 [2 ], A I
P 3 [0 ], A I
XRES
Table 4. 32-pin Part Pinout (QFN [5])
Pin No.
Digital
Analog
Name
1
I/O
I
P0[1]
2
I/O
I
P2[7]
3
I/O
I
P2[5]
4
I/O
I
P2[3]
5
I/O
I
P2[1]
6
I/O
I
P3[3]
7
I/O
I
P3[1]
8
IOH
I
P1[7]
I2C SCL, SPI SS
9
IOH
I
P1[5]
I2C SDA, SPI MISO
10
IOH
I
P1[3]
SPI CLK
11
IOH
I
P1[1]
CLK[6], I2C SCL, SPI MOSI
VSS
Ground connection
DATA[6], I2C SDA
12
Power
13
IOH
I
P1[0]
14
IOH
I
P1[2]
15
IOH
I
P1[4]
16
IOH
17
I
Input
Description
Integrating Input
Optional external clock input (EXTCLK)
P1[6]
XRES
18
I/O
I
P3[0]
19
I/O
I
P3[2]
20
I/O
I
P2[0]
21
I/O
I
P2[2]
Active high external reset with internal pull-down
Notes
5. The center pad on the QFN package is connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it is electrically
floated and not connected to any other signal.
6. These are the ISSP pins, that are not high Z at POR (Power on reset). Refer the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 001-41947 Rev. *L
Page 10 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Table 4. 32-pin Part Pinout (QFN [5]) (continued)
Pin No.
Digital
Analog
Name
22
I/O
I
P2[4]
23
I/O
I
P2[6]
24
I/O
I
P0[0]
25
I/O
I
P0[2]
26
I/O
I
P0[4]
27
I/O
I
P0[6]
28
Power
VDD
Description
Supply voltage
29
I/O
I
P0[7]
30
I/O
I
P0[5]
31
I/O
I
P0[3]
Integrating input
32
Power
VSS
Ground connection
CP
Power
VSS
Center pad is connected to ground
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive
Document Number: 001-41947 Rev. *L
Page 11 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
48-pin OCD Part Pinout
The 48-pin QFN part table and pin diagram is for the CY8C20024 On-Chip Debug (OCD) PSoC device. This part is only used for
in-circuit debugging. It is NOT available for production.
NC
NC
38
37
22
23
24
NC
AI, P1[2]
20
21
AI, DATA*, I2C SDA, P1[0]
HCLK
17
18
19
CCLK
AI, SPI CLK, P1[3]
15
16
(Top View)
36
35
34
33
32
31
30
29
28
27
26
25
P0[4], AI
P0[2], AI
P0[0], AI
P2[6], AI
P2[4], AI
P2[2], AI
P2[0], AI
P3[2], AI
P3[0], AI
XRES
P1[6], AI
P1[4], EXTCLK, AI
NC
NC
OCDO
Vdd
P0[6], AI
NC
OCDE
42
41
40
39
P0[7], AI
43
P0[5], AI
45
44
46
OCD
QFN
AI, CLK*, I2C SCL, SPI MOSI, P1[1]
Vss
13
14
1
2
3
4
5
6
7
8
9
10
11
12
NC
NC
NC
AI, P0[1]
AI, P2[7]
AI, P2[5]
AI, P2[3]
AI, P2[1]
AI, P3[3]
AI, P3[1]
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
NC
NC
48
47
NC
Vss
P0[3], AI
Figure 7. CY8C20024 OCD PSoC Device
Table 5. 48-pin OCD Part Pinout (QFN [7])
Pin No.
Digital
Analog
1
Name
NC
Description
No connection
2
I/O
I
P0[1]
3
I/O
I
P2[7]
Integrating Input
4
I/O
I
P2[5]
5
I/O
I
P2[3]
6
I/O
I
P2[1]
7
I/O
I
P3[3]
8
I/O
I
P3[1]
9
IOH
I
P1[7]
I2C SCL, SPI SS
10
IOH
I
P1[5]
I2C SDA, SPI MISO
11
NC
No connection
12
NC
No connection
13
NC
No connection
14
NC
No connection
15
IOH
I
P1[3]
SPI CLK
16
IOH
I
P1[1]
CLK[8], I2C SCL, SPI MOSI
17
Power
Vss
18
19
20
IOH
I
Ground connection
CCLK
OCD CPU clock output
HCLK
OCD high speed clock output
P1[0]
DATA[8], I2C SDA
Notes
7. The center pad on the QFN package is connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it is electrically
floated and not connected to any other signal.
8. These are the ISSP pins, that are not high Z at POR (Power on reset). Refer the PSoC Programmable System-on-Chip Technical Reference Manual for details.
Document Number: 001-41947 Rev. *L
Page 12 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Table 5. 48-pin OCD Part Pinout (QFN [7]) (continued)
Pin No.
Digital
Analog
Name
21
IOH
I
P1[2]
Description
22
NC
No connection
23
NC
No connection
24
NC
No connection
25
IOH
I
P1[4]
26
IOH
I
P1[6]
27
Input
XRES
28
I/O
I
P3[0]
29
I/O
I
P3[2]
30
I/O
I
P2[0]
31
I/O
I
P2[2]
32
I/O
I
P2[4]
33
I/O
I
P2[6]
34
I/O
I
P0[0]
35
I/O
I
P0[2]
36
I/O
I
P0[4]
Optional external clock input (EXTCLK)
Active high external reset with internal pull-down
37
NC
No connection
38
NC
No connection
NC
No connection
39
40
I/O
41
I
Power
VDD
42
43
44
I/O
P0[6]
I
OCD odd data output
OCDE
OCD even data I/O
P0[7]
45
I/O
I
P0[5]
46
I/O
I
P0[3]
47
Power
48
CP
Power
Supply voltage
OCDO
Integrating input
VSS
Ground connection
NC
No connection
VSS
Center pad is connected to ground
A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive.
Document Number: 001-41947 Rev. *L
Page 13 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C20224, CY8C20324, CY8C20424, and CY8C20524 PSoC
devices. For the latest electrical specifications, visit the web at http://www.cypress.com/psoc.
Specifications are valid for –40 °C  TA  85 °C and TJ  100 °C as specified, except where noted.
Refer to Table 16 on page 19 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode.
Figure 8. Voltage versus CPU Frequency and IMO Frequency Trim Options
5.25
5.25
SLIMO SLIMO SLIMO
Mode=1 Mode=1 Mode=0
4.75
Vdd Voltage
Vdd Voltage
lid ng
Va rati n
pe gio
Re
O
4.75
3.60
SLIMO SLIMO
Mode=1 Mode=0
3.00
3.00
2.70
2.70
2.40
2.40
750 kHz
3 MHz
6 MHz
SLIMO
Mode=1
750 kHz
12 MHz
3 MHz
6 MHz
SLIMO
Mode=0
12 MHz
IMO Frequency
CPU Frequency
Absolute Maximum Ratings
Table 6. Absolute Maximum Ratings
Symbol
TSTG
Description
Storage temperature
TA
VDD
VIO
VIOZ
IMIO
ESD
LU
Ambient temperature with power applied
Supply voltage on VDD relative to VSS
DC input voltage
DC voltage applied to tri-state
Maximum current into any port pin
Electrostatic discharge voltage
Latch-up current
Min
–55
Typ
25
Max
+100
Units
°C
–40
–0.5
VSS – 0.5
VSS – 0.5
–25
2000
–
–
–
–
–
–
–
–
+85
+6.0
VDD + 0.5
VDD + 0.5
+50
–
200
°C
V
V
V
mA
V
mA
Min
–40
–40
Typ
–
–
Max
+85
+100
Units
°C
°C
Notes
Higher storage temperatures
reduces data retention time.
Recommended storage
temperature is +25 °C ± 25 °C.
Extended duration storage
temperatures above 65 °C
degrades reliability.
Human Body Model ESD.
Operating Temperature
Table 7. Operating Temperature
Symbol
TA
TJ
Description
Ambient temperature
Junction temperature
Document Number: 001-41947 Rev. *L
Notes
The temperature rise from ambient
to junction is package specific. See
Table 31 on page 30. The user must
limit the power consumption to
comply with this requirement.
Page 14 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
DC Electrical Characteristics
DC Chip Level Specifications
Table 8 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 8. DC Chip Level Specifications
Symbol
VDD
IDD12
Description
Supply voltage
Supply current, IMO = 12 MHz
Min
2.40
–
Typ
–
1.5
Max
5.25
2.5
Units
V
mA
IDD6
Supply current, IMO = 6 MHz
–
1
1.5
mA
ISB27
Sleep (Mode) current with POR, LVD, sleep timer,
WDT, and internal slow oscillator active. Mid
temperature range.
Sleep (Mode) current with POR, LVD, sleep timer,
WDT, and internal slow oscillator active.
–
2.6
4
µA
Conditions are VDD = 3.0 V,
TA = 25 °C, CPU = 12 MHz.
Conditions are VDD = 3.0 V,
TA = 25 °C, CPU = 6 MHz.
VDD = 2.55 V, 0 °C TA  40 °C.
–
2.8
5
µA
VDD = 3.3 V, –40 °C TA  85 °C.
ISB
Notes
DC GPIO Specifications
Unless otherwise noted, Table 9 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges:
4.75 V to 5.25 V and –40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively.
Typical parameters apply to 5 V, 3.3 V, and 2.7 V at 25 °C. These are for design guidance only.
Table 9. 5-V and 3.3-V DC GPIO Specifications
Symbol
RPU
VOH1
VOH2
VOH3
VOH4
VOH5
VOH6
VOH7
VOH8
Description
Pull-up resistor
High output voltage
port 0, 2, or 3 pins
High output voltage
port 0, 2, or 3 pins
High output voltage
port 1 pins with LDO regulator disabled
High output voltage
port 1 pins with LDO regulator disabled
High output voltage
port 1 pins with 3.0 V LDO regulator enabled
High output voltage
port 1 pins with 3.0 V LDO regulator enabled
High output voltage
port 1 pins with 2.4 V LDO regulator enabled
High output voltage
port 1 pins with 2.4 V LDO regulator enabled
Min
4
VDD – 0.2
Typ
5.6
–
Max
8
–
Units
k
V
VDD – 0.9
–
–
V
VDD – 0.2
–
–
V
VDD – 0.9
–
–
V
2.7
3.0
3.3
V
2.2
–
–
V
2.1
2.4
2.7
V
2.0
–
–
V
VOH9
High output voltage
port 1 pins with 1.8 V LDO regulator enabled
1.6
1.8
2.0
V
VOH10
High output voltage
port 1 pins with 1.8 V LDO regulator enabled
1.5
–
–
V
VOL
Low output voltage
–
–
0.75
V
Document Number: 001-41947 Rev. *L
Notes
IOH < 10 µA, VDD > 3.0 V, maximum
of 20 mA source current in all I/Os.
IOH = 1 mA, VDD > 3.0 V, maximum
of 20 mA source current in all I/Os.
IOH < 10 µA, VDD > 3.0 V, maximum
of 10 mA source current in all I/Os.
IOH = 5 mA, VDD > 3.0 V, maximum
of 20 mA source current in all I/Os.
IOH < 10 µA, VDD > 3.1 V, maximum
of 4 I/Os all sourcing 5 mA.
IOH = 5 mA, VDD > 3.1 V, maximum
of 20 mA source current in all I/Os.
IOH < 10 µA, VDD > 3.0 V, maximum
of 20 mA source current in all I/Os.
IOH < 200 µA, VDD > 3.0 V,
maximum of 20 mA source current
in all I/Os.
IOH < 10 µA
3.0 V VDD 3.6 V
0 °C TA85 °C
Maximum of 20 mA source current
in all I/Os.
IOH < 100 µA
3.0 V VDD 3.6 V
0 °C TA85 °C
Maximum of 20 mA source current
in all I/Os.
IOL = 20 mA, VDD > 3.0V, maximum
of 60 mA sink current on even port
pins (for example, P0[2] and P1[4])
and 60 mA sink current on odd port
pins (for example, P0[3] and P1[5]).
Page 15 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Table 9. 5-V and 3.3-V DC GPIO Specifications (continued)
Symbol
IOH2
Description
High level source current port 0, 2, or 3 pins
Min
1
Typ
–
Max
–
Units
mA
IOH4
Notes
VOH = VDD – 0.9, for the limitations
of the total current and IOH at other
VOH levels see the notes for VOH.
VOH = VDD – 0.9, for the limitations
of the total current and IOH at other
VOH levels see the notes for VOH.
VOH = 0.75 V, see the limitations of
the total current in the note for VOL.
3.0 V  VDD  5.25 V
3.0 V  VDD  5.25 V
High level source current
port 1 pins with LDO regulator disabled
5
–
–
mA
IOL
Low level sink current
20
–
–
mA
VIL
VIH
VH
IIL
CIN
Input low voltage
Input high voltage
Input hysteresis voltage
Input leakage (absolute value)
Capacitive load on pins as input
–
2.0
–
–
0.5
–
–
140
1
1.7
0.8
–
–
5
V
V
mV
nA
pF
COUT
Capacitive load on pins as output
0.5
1.7
5
pF
Description
Pull-up resistor
High output voltage
port 1 pins with LDO regulator disabled
High output voltage
port 1 pins with LDO regulator disabled
Low output voltage
Min
4
VDD – 0.2
Typ
5.6
–
Max
8
–
Units
k
V
VDD – 0.5
–
–
V
–
–
0.75
V
IOH2
High level source current
port 1 pins with LDO regulator disabled
2
–
–
mA
IOL
Low level sink current
10
–
–
mA
VOLP1
Low output voltage port 1 pins
–
–
0.4
V
VIL
VIH1
VIH2
VH
IIL
CIN
Input low voltage
Input high voltage
Input high voltage
Input hysteresis voltage
Input leakage (absolute value)
Capacitive load on pins as input
–
1.4
1.6
–
–
0.5
–
–
–
60
1
1.7
0.75
–
–
–
–
5
V
V
V
mV
nA
pF
COUT
Capacitive load on pins as output
0.5
1.7
5
pF
Gross tested to 1 µA
Package and pin dependent
temperature = 25 °C
Package and pin dependent
temperature = 25 °C
Table 10. 2.7-V DC GPIO Specifications
Symbol
RPU
VOH1
VOH2
VOL
Document Number: 001-41947 Rev. *L
Notes
IOH < 10 µA, maximum of 10 mA
source current in all I/Os.
IOH = 2 mA, maximum of 10 mA
source current in all I/Os.
IOL = 10 mA, maximum of 30 mA
sink current on even port pins
(for example, P0[2] and P1[4])
and 30 mA sink current on odd
port pins (for example, P0[3] and
P1[5]).
VOH = VDD – 0.5, for the
limitations of the total current and
IOH at other VOH levels see the
notes for VOH.
VOH = 0.75 V, see the limitations
of the total current in the note for
VOL.
IOL = 5 mA
Maximum of 50 mA sink current
on even port pins (for example,
P0[2] and P3[4]) and 50 mA sink
current on odd port pins (for
example, P0[3] and P2[5]).
2.4 V  VDD  3.0 V
2.4 V  VDD  3.0 V
2.4 V  VDD  2.7 V
2.7 V  VDD  3.0 V
Gross tested to 1 µA
Package and pin dependent
temperature = 25 °C
Package and pin dependent
temperature = 25 °C
Page 16 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
DC Analog Mux Bus Specifications
Table 11 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and –40
°C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 11. DC Analog Mux Bus Specifications
Symbol
RSW
Description
Switch resistance to common analog bus
Min
–
Typ
–
Max
400
800
Units


Notes
Vdd  2.7 V
2.4 V Vdd 2.7 V
DC Low Power Comparator Specifications
Table 12 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V at 25 °C. These are for design guidance only.
Table 12. DC Low Power Comparator Specifications
Symbol
VREFLPC
ISLPC
VOSLPC
Description
Low power comparator (LPC) reference voltage
range
LPC supply current
LPC voltage offset
Min
0.2
Typ
–
Max
VDD – 1.0
Units
V
–
–
10
2.5
40
30
µA
mV
Notes
DC POR and LVD Specifications
Table 13 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 13. DC POR and LVD Specifications
Symbol
Description
VPPOR0
VPPOR1
VPPOR2
VDD value for PPOR trip
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
VLVD0
VLVD1
VLVD2
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
VDD value for LVD trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
Min
Typ
Max
Units
–
–
–
2.36
2.60
2.82
2.40
2.65
2.95
V
V
V
2.39
2.54
2.75
2.85
2.96
–
–
4.52
2.45
2.71
2.92
3.02
3.13
–
–
4.73
2.51[9]
2.78[10]
2.99[11]
3.09
3.20
–
–
4.83
V
V
V
V
V
V
V
V
Notes
VDD is greater than or equal to 2.5
V during startup, reset from the
XRES pin, or reset from Watchdog.
Notes
9. Always greater than 50 mV above VPPOR (PORLEV = 00) for falling supply.
10. Always greater than 50 mV above VPPOR (PORLEV = 01) for falling supply.
11. Always greater than 50 mV above VPPOR (PORLEV = 10) for falling supply.
12. A maximum of 36 × 50,000 block endurance cycles is allowed. This is balanced between operations on 36 × 1 blocks of 50,000 maximum cycles each, 36 × 2 blocks
of 25,000 maximum cycles each, or 36 × 4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36 × 50,000 and that no single block ever
sees more than 50,000 cycles).
13. The 50,000 cycle flash endurance per block will only be guaranteed if the flash is operating within one voltage range. Voltage ranges are 2.4 V to 3.0 V, 3.0 V to 3.6 V
and 4.75 V to 5.25 V.
Document Number: 001-41947 Rev. *L
Page 17 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
DC Programming Specifications
Table 14 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical
parameters apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 14. DC Programming Specifications
Symbol
VDDP
Description
VDD for programming and erase
Min
4.5
Typ
5
Max
5.5
Units
V
VDDLV
Low VDD for verify
2.4
2.5
2.6
V
VDDHV
High VDD for verify
5.1
5.2
5.3
V
VDDIWRITE
Supply voltage for flash write operation
2.7
–
5.25
V
IDDP
VILP
VIHP
IILP
Supply current during programming or verify
Input low voltage during programming or verify
Input high voltage during programming or verify
Input current when applying Vilp to P1[0] or P1[1]
during programming or verify
Input current when applying Vihp to P1[0] or P1[1]
during programming or verify
Output low voltage during programming or verify
Output high voltage during programming or verify
Flash endurance (per block)[13]
–
–
2.2
–
5
–
–
–
25
0.8
–
0.2
mA
V
V
mA
–
–
1.5
mA
–
VDD – 1.0
50,000
–
–
–
VSS + 0.75
VDD
–
V
V
–
1,800,000
–
–
–
10
–
–
Years
IIHP
VOLV
VOHV
FlashENPB
FlashENT
FlashDR
Flash endurance (total)[12]
Flash data retention
Notes
This specification applies to
the functional requirements
of external programmer
tools
This specification applies to
the functional requirements
of external programmer
tools
This specification applies to
the functional requirements
of external programmer
tools
This specification applies to
this device when it is
executing internal flash
writes
Driving internal pull-down
resistor.
Driving internal pull-down
resistor.
Erase/write cycles per
block.
Erase/write cycles.
DC I2C Specifications
Table 15 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 15. DC I2C Specifications[14]
Symbol
VILI2C
Input low level
Description
VIHI2C
Input high level
Min
–
–
0.7 × VDD
Typ
–
–
–
Max
0.3 × VDD
0.25 × VDD
–
Units
V
V
V
Notes
2.4 V VDD  3.6 V
4.75 V  VDD  5.25 V
2.4 V  VDD  5.25 V
Notes
14. All GPIO meet the DC GPIO VIL and VIH specifications found in the DC GPIO Specifications sections. The I2C GPIO pins also meet the above specs.
15. 0 °C to 70 °C ambient, VDD = 3.3 V.
Document Number: 001-41947 Rev. *L
Page 18 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
AC Electrical Characteristics
AC Chip Level Specifications
Table 16 and Table 17 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C respectively. Typical
parameters apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 16. 5-V and 3.3-V AC Chip-Level Specifications
Symbol
FCPU1
F32K1
F32K_U
Description
CPU frequency (3.3 V nominal)
ILO frequency
ILO untrimmed frequency
Min
0.75
15
5
Typ
–
32
–
Max
12.6
64
100
Units
MHz
kHz
kHz
FIMO12
IMO stability for 12 MHz
(Commercial temperature)[15]
11.4
12
12.6
MHz
FIMO6
IMO stability for 6 MHz
(Commercial temperature)
5.5
6.0
6.5
MHz
DCIMO
DCILO
tRAMP
tXRST
tPOWERUP
Duty cycle of IMO
ILO duty cycle
Supply ramp time
External reset pulse width
Time from end of POR to CPU executing code
40
20
0
10
–
50
50
–
–
16
60
80
–
–
100
%
%
µs
µs
ms
tjit_IMO[16]
12 MHz IMO cycle-to-cycle jitter (RMS)
12 MHz IMO long term N cycle-to-cycle jitter
(RMS)
12 MHz IMO period jitter (RMS)
–
–
200
600
1600
1400
ps
ps
–
100
900
ps
Description
CPU frequency (2.7 V nominal)
CPU frequency (2.7 V minimum)
ILO frequency
ILO untrimmed frequency
Min
0.75
0.75
8
5
Typ
–
–
32
–
Max
3.25
6.3
96
–
Units
MHz
MHz
kHz
kHz
FIMO12
IMO stability for 12 MHz
(Commercial temperature)[15]
11.0
12
12.9
MHz
FIMO6
IMO stability for 6 MHz
(Commercial temperature)
5.5
6.0
6.5
MHz
DCIMO
DCILO
tRAMP
tXRST
Duty cycle of IMO
ILO duty cycle
Supply ramp time
External reset pulse width
40
20
0
10
50
50
–
–
60
80
–
–
%
%
µs
µs
Notes
12 MHz only for SLIMO Mode = 0
After a reset and before the M8C starts
to run, the ILO is not trimmed. See the
System Resets section of the PSoC
Technical Reference Manual for details
on this timing.
Trimmed for 3.3 V operation using
factory trim values.
See Figure 8 on page 14,
SLIMO Mode = 0.
Trimmed for 3.3 V operation using
factory trim values.
See Figure 8 on page 14,
SLIMO Mode = 1.
Power up from 0 V. See the System
Resets section of the PSoC Technical
Reference Manual.
N = 32
Table 17. 2.7-V AC Chip Level Specifications
Symbol
FCPU1A
FCPU1B
F32K1
F32K_U
Notes
2.4 V < VDD < 3.0 V.
2.7 V < VDD < 3.0 V.
After a reset and before the M8C starts
to run, the ILO is not trimmed. See the
System Resets section of the PSoC
Technical Reference Manual for details
on this timing.
Trimmed for 2.7 V operation using
factory trim values. See Figure 8 on
page 14, SLIMO Mode = 0.
Trimmed for 2.7 V operation using
factory trim values.
See Figure 8 on page 14,
SLIMO Mode = 1.
Note
16. Refer to Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products - AN5054 for more information
Document Number: 001-41947 Rev. *L
Page 19 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Table 17. 2.7-V AC Chip Level Specifications (continued)
Symbol
tPOWERUP
Description
Min
–
Typ
16
Max
100
Units
ms
tjit_IMO[16]
12 MHz IMO cycle-to-cycle jitter (RMS)
12 MHz IMO long term N cycle-to-cycle jitter
(RMS)
12 MHz IMO period jitter (RMS)
–
–
500
800
900
1400
ps
ps
–
300
500
ps
Notes
Power-up from 0 V. See the System
Resets section of the PSoC Technical
Reference Manual.
N = 32
AC GPIO Specifications
Table 18 an d Table 19 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25V and –40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C respectively. Typical
parameters apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 18. 5 V and 3.3 V AC GPIO Specifications
Symbol
FGPIO
tRise023
tRise1
tFall
Description
GPIO operating frequency
Rise time, strong mode, Cload = 50 pF
ports 0, 2, 3
Rise time, strong mode, Cload = 50 pF
port 1
Fall time, strong mode, Cload = 50 pF
all ports
Min
0
15
Typ
–
–
Max
6
80
Units
MHz
ns
Notes
Normal strong mode, Port 1.
VDD = 3.0 V to 3.6 V and 4.75 V to
5.25 V, 10% to 90%
VDD = 3.0 V to 3.6 V, 10% to 90%
10
–
50
ns
10
–
50
ns
Min
0
Typ
–
Max
1.5
Units
MHz
15
–
100
ns
VDD = 2.4 V to 3.0 V, 10% to 90%
10
–
70
ns
VDD = 2.4 V to 3.0 V, 10% to 90%
10
–
70
ns
VDD = 2.4 V to 3.0 V, 10% to 90%
VDD = 3.0 V to 3.6 V and 4.75 V to
5.25 V, 10% to 90%
Table 19. 2.7 V AC GPIO Specifications
Symbol
FGPIO
Description
GPIO operating frequency
tRise023
Rise time, strong mode, Cload = 50 pF
ports 0, 2, 3
Rise time, strong mode, Cload = 50 pF
port 1
Fall time, strong mode, Cload = 50 pF
all ports
tRise1
tFall
Notes
Normal Strong Mode, Port 1.
Figure 9. GPIO Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TRise023
TRise1
Document Number: 001-41947 Rev. *L
TFall
Page 20 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
AC Comparator Specifications
Table 20 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 20. AC Comparator Specifications
Symbol
tCOMP
Description
Comparator response time, 50 mV overdrive
Min
–
Typ
–
Max
100
200
Units
ns
ns
Notes
VDD  3.0 V
2.4 V < VCC <3.0 V
AC Low Power Comparator Specifications
Table 21 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively. Typical parameters
apply to 5 V at 25 °C. These are for design guidance only.
Table 21. AC Low Power Comparator Specifications
Symbol
tRLPC
Description
LPC response time
Min
–
Typ
–
Max
50
Units
µs
Notes
 50 mV overdrive comparator
reference set within VREFLPC.
AC External Clock Specifications
Table 22, Table 23, and Table 24 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges:
4.75 V to 5.25 V and –40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C, respectively.
Typical parameters apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 22. 5 V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FOSCEXT
Frequency
0.750
–
12.6
MHz
–
High period
38
–
5300
ns
–
Low period
38
–
–
ns
–
Power-up IMO to switch
150
–
–
µs
Min
Typ
Max
Units
Notes
Maximum CPU frequency is 12 MHz
at 3.3 V. With the CPU clock divider
set to 1, the external clock must
adhere to the maximum frequency
and duty cycle requirements.
Table 23. 3.3 V AC External Clock Specifications
Symbol
Description
FOSCEXT
Frequency with CPU clock divide by 1
0.750
–
12.6
MHz
–
High period with CPU clock divide by 1
41.7
–
5300
ns
–
Low period with CPU clock divide by 1
41.7
–
–
ns
–
Power-up IMO to switch
150
–
–
µs
Document Number: 001-41947 Rev. *L
Page 21 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Table 24. 2.7 V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
0
MHz
2.4 V < VDD < 3.0 V. Maximum CPU
frequency is 3 MHz at 2.7 V. With the
CPU clock divider set to 1, the external
clock must adhere to the maximum
frequency and duty cycle requirements.
FOSCEXT1A
Frequency with CPU clock divide by 1
(2.7 V nominal)
0.75
–
3.08
FOSCEXT1B
Frequency with CPU clock divide by 1
(2.7 V minimum)
0.75
–
6.30
MHz
2.7 V < VDD < 3.0 V. Maximum CPU
frequency is 3 MHz at 2.7 V. With the
CPU clock divider set to 1, the external
clock must adhere to the maximum
frequency and duty cycle requirements.
FOSCEXT2A
Frequency with CPU clock divide by 2 or
greater (2.7 V nominal)
1.5
–
6.35
MHz
2.4 V < VDD < 3.0 V. If the frequency of
the external clock is greater than 3 MHz,
the CPU clock divider is set to 2 or
greater. In this case, the CPU clock
divider ensures that the fifty percent duty
cycle requirement is met.
FOSCEXT2B
Frequency with CPU clock divide by 2 or
greater (2.7 V minimum)
1.5
–
12.6
MHz
2.7 V < VDD < 3.0 V. If the frequency of
the external clock is greater than 3 MHz,
the CPU clock divider is set to 2 or
greater. In this case, the CPU clock
divider ensures that the fifty percent duty
cycle requirement is met.
–
High period with CPU clock divide by 1
160
–
5300
ns
–
Low period with CPU clock divide by 1
160
–
–
ns
–
Power-up IMO to switch
150
–
–
µs
AC Programming Specifications
Table 25 lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to 5.25 V and
–40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C respectively. Typical parameters
apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 25. AC Programming Specifications
Symbol
tRSCLK
tFSCLK
tSSCLK
tHSCLK
FSCLK
tERASEB
tWRITE
tDSCLK
tDSCLK3
tDSCLK2
tERASEALL
Description
Rise time of SCLK
Fall time of SCLK
Data set up time to falling edge of SCLK
Data hold time from falling edge of SCLK
Frequency of SCLK
Flash erase time (Block)
Flash block write time
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Data out delay from falling edge of SCLK
Flash erase time (Bulk)
Min
1
1
40
40
0
–
–
–
–
–
–
Typ
–
–
–
–
–
10
40
–
–
–
20
Max
20
20
–
–
8
–
–
45
50
70
–
Units
ns
ns
ns
ns
MHz
ms
ms
ns
ns
ns
ms
tPROGRAM_HOT
tPROGRAM_COLD
Flash block erase + Flash block write time
Flash block erase + Flash block write time
–
–
–
–
100
200
ms
ms
Document Number: 001-41947 Rev. *L
Notes
3.6  VDD
3.0  VDD  3.6
2.4  VDD  3.0
Erase all blocks and protection fields
at once
0 °C  Tj  100 °C
–40 °C  Tj  0 °C
Page 22 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
AC I2C Specifications
Table 26 and Table 27 list the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75 V to
5.25 V and –40 °C  TA  85 °C, 3.0 V to 3.6 V and –40 °C  TA  85 °C, or 2.4 V to 3.0 V and –40 °C  TA  85 °C respectively. Typical
parameters apply to 5 V, 3.3 V, or 2.7 V at 25 °C. These are for design guidance only.
Table 26. AC Characteristics of the I2C SDA and SCL Pins for VDD 3.0 V
Symbol
Description
Standard
Mode
Min Max
0
100
Min
0
Max
400
kHz
Fast Mode
Units
FSCLI2C
SCL clock frequency
tHDSTAI2C
4.0
–
0.6
–
µs
tLOWI2C
Hold time (repeated) START condition. After
this period, the first clock pulse is generated.
LOW period of the SCL clock
4.7
–
1.3
–
µs
tHIGHI2C
HIGH period of the SCL clock
4.0
–
0.6
–
µs
tSUSTAI2C
Setup time for a repeated START condition
4.7
–
0.6
–
µs
tHDDATI2C
Data hold time
0
–
0
–
µs
–
ns
[17]
tSUDATI2C
Data setup time
250
–
tSUSTOI2C
Setup time for STOP condition
4.0
–
0.6
–
µs
tBUFI2C
Bus free time between a STOP and START
condition
Pulse width of spikes are suppressed by the
input filter
4.7
–
1.3
–
µs
–
–
0
50
ns
tSPI2C
100
Notes
Table 27. 2.7-V AC Characteristics of the I2C SDA and SCL Pins (Fast Mode not supported)
Symbol
Description
Standard Mode
Min
Max
0
100
Fast Mode
Min
Max
–
–
Units
FSCLI2C
SCL clock frequency
tHDSTAI2C
4.0
–
–
–
µs
tLOWI2C
Hold time (repeated) START
condition. After this period, the first
clock pulse is generated.
LOW period of the SCL clock
4.7
–
–
–
µs
tHIGHI2C
HIGH period of the SCL clock
4.0
–
–
–
µs
tSUSTAI2C
4.7
–
–
–
µs
tHDDATI2C
Setup time for a repeated START
condition
Data hold time
0
–
–
–
µs
tSUDATI2C
Data setup time
250
–
–
–
ns
tSUSTOI2C
Setup time for STOP condition
4.0
–
–
–
µs
tBUFI2C
Bus free time between a STOP and
START condition
Pulse width of spikes are
suppressed by the input filter.
4.7
–
–
–
µs
–
–
–
–
ns
tSPI2C
Notes
kHz
Note
17. A Fast Mode I2C bus device is used in a Standard Mode I2C bus system but the requirement TSUDAT  250 ns is met. This automatically is the case if the device does
not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax +
TSUDAT = 1000 + 250 = 1250 ns (according to the Standard Mode I2C bus specification) before the SCL line is released.
Document Number: 001-41947 Rev. *L
Page 23 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Figure 10. Definition for Timing for Fast or Standard Mode on the I2C Bus
I2C_SDA
TSUDATI2C
THDSTAI2C
TSPI2C
THDDATI2CTSUSTAI2C
TBUFI2C
I2C_SCL
THIGHI2C TLOWI2C
S
START Condition
Document Number: 001-41947 Rev. *L
TSUSTOI2C
Sr
Repeated START Condition
P
S
STOP Condition
Page 24 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Table 28. SPI Master AC Specifications
Symbol
Parameter
Min
Typ
Max
Units
–
–
12
MHz
SCLK duty cycle
–
50
–
%
MISO to SCLK setup time
40
–
–
ns
tHOLD
SCLK to MISO hold time
40
–
–
ns
tOUT_VAL
SCLK to MOSI valid time
–
–
40
ns
tOUT_H
MOSI high time
40
–
–
ns
Min
Typ
Max
Units
–
–
4
MHz
FSCLK
SCLK clock frequency
DC
tSETUP
Conditions
Table 29. SPI Slave AC Specifications
Symbol
Parameter
Conditions
FSCLK
SCLK clock frequency
tLOW
SCLK low time
41.67
–
–
ns
tHIGH
SCLK high time
41.67
–
–
ns
tSETUP
MOSI to SCLK setup time
30
–
–
ns
tHOLD
SCLK to MOSI hold time
50
–
–
ns
tSS_MISO
SS high to MISO valid
–
–
153
ns
tSCLK_MISO
SCLK to MISO valid
–
–
125
ns
tSS_HIGH
SS high time
–
–
50
ns
tSS_CLK
Time from SS low to first SCLK
2/SCLK
–
–
ns
tCLK_SS
Time from last SCLK to SS high
2/SCLK
–
–
ns
Document Number: 001-41947 Rev. *L
Page 25 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Ordering Information
Table 30 lists the CY8C20224, CY8C20324, CY8C20424, and CY8C20524 PSoC devices key package features and ordering codes.
Table 30. PSoC Device Key Features and Ordering Information
Ordering
Code
Package
Flash
(Bytes)
Maximum Maximum Maximum
SRAM Number of Number of Number of
(Bytes)
Buttons
Sliders
LEDs
Configurable
LED Behavior
(Fade, Strobe)
Proximity
Sensing
16-pin (3 × 3 mm 0.60 Max)
COL
CY8C20224-12LKXI
8K
512
10
1
13
Yes
Yes
16-pin (3 × 3 mm 0.60 Max)
COL (Tape and Reel)
CY8C20224-12LKXIT
8K
512
10
1
13
Yes
Yes
24-pin (4 × 4 mm 0.60 Max)
QFN
CY8C20324-12LQXI
8K
512
17
1
20
Yes
Yes
24-pin (4 × 4 mm 0.60 Max)
QFN (Tape and Reel)
CY8C20324-12LQXIT
8K
512
17
1
20
Yes
Yes
28-pin (210-Mil) SSOP
CY8C20524-12PVXI
8K
512
21
1
24
Yes
Yes
28-pin (210-Mil) SSOP
(Tape and Reel)
CY8C20524-12PVXIT
8K
512
21
1
24
Yes
Yes
32-pin (5 × 5 mm 0.60 Max)
QFN (Sawn)
CY8C20424-12LQXI
8K
512
25
1
28
Yes
Yes
32-pin (5 × 5 mm 0.60 Max)
QFN (Sawn)
CY8C20424-12LQXIT
8K
512
25
1
28
Yes
Yes
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
Ordering Code Definitions
CY 8 C 20 xxx - 12 xx
Package Type:
Thermal Rating:
PX = PDIP Pb-free
C = Commercial
SX = SOIC Pb-free
I = Industrial
PVX = SSOP Pb-free
E = Extended
LFX/LKX/LQX = QFN Pb-free
AX = TQFP Pb-free
Speed: 12 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Company ID: CY = Cypress
Document Number: 001-41947 Rev. *L
Page 26 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Packaging Dimensions
This section illustrates the packaging specifications for the CY8C20224, CY8C20324, CY8C20424, and CY8C20524 PSoC devices,
along with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Figure 11. 16-pin (3 × 3 mm × 0.6 Max) COL
001-09116 *F
Document Number: 001-41947 Rev. *L
Page 27 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Figure 12. 24-pin (4 × 4 × 0.6 mm) QFN
001-13937 *D
Figure 13. 28-pin (210-Mil) SSOP
51-85079 *E
Document Number: 001-41947 Rev. *L
Page 28 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Figure 14. 32-pin (5 × 5 × 0.60 Max) QFN (Sawn)
001-48913 *B
Figure 15. 48-pin (7 × 7 mm) QFN
001-12919 *C
Important For information on the preferred dimensions for mounting the QFN packages, see the following application note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
It is important to note that pinned vias for thermal conduction are not required for the low power 24, 32, and 48-pin QFN PSoC devices.
Document Number: 001-41947 Rev. *L
Page 29 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Thermal Impedances
Table 31. Thermal Impedances Per Package
Package
16-pin COL
24-pin QFN[19]
28-pin SSOP
32-pin QFN[19]
48-pin QFN[19]
Typical JA [18]
46 °C/W
25 °C/W
96 °C/W
27 °C/W
28 °C/W
Solder Reflow Specifications
Table 32 lists the minimum solder reflow peak temperature to achieve good solderability.
Table 32. Solder Reflow Specifications
Package
Maximum Peak Temperature
Time at Maximum Peak Temperature
16-pin COL
260 °C
30 s
24-pin QFN
260 °C
30 s
28-pin SSOP
260 °C
30 s
32-pin QFN
260 °C
30 s
48-pin QFN
260 °C
30 s
Notes
18. TJ = TA + Power x JA.
19. To achieve the thermal impedance specified for the QFN package, the center thermal pad is soldered to the PCB ground plane.
Document Number: 001-41947 Rev. *L
Page 30 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Development Tool Selection
Software
Evaluation Tools
PSoC Designer
All evaluation tools are sold at the Cypress Online Store.
At the core of the PSoC development software suite is PSoC
Designer. Utilized by thousands of PSoC developers, this robust
software has been facilitating PSoC designs for over half a
decade. PSoC Designer is available free of charge at
http://www.cypress.com.
CY3210-MiniProg1
PSoC Programmer
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer. PSoC Programmer software is
compatible with both PSoC ICE-Cube In-Circuit Emulator and
PSoC MiniProg. PSoC Programmer is available free of charge
at http://www.cypress.com.
Development Kits
All development kits are sold at the Cypress Online Store.
CY3215-DK Basic Development Kit
The CY3215-DK is for prototyping and development with PSoC
Designer. This kit supports in-circuit emulation and the software
interface enables users to run, halt, and single step the
processor and view the content of specific memory locations.
PSoC Designer supports the advance emulation features also.
The kit includes:
The CY3210-MiniProg1 kit enables the user to program PSoC
devices via the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
via a provided USB 2.0 cable. The kit includes:
■
MiniProg Programming Unit
■
MiniEval Socket Programming and Evaluation Board
■
28-pin CY8C29466-24PXI PDIP PSoC Device Sample
■
28-pin CY8C27443-24PXI PDIP PSoC Device Sample
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
CY3210-PSoCEval1
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit
includes:
■
Evaluation Board with LCD Module
■
PSoC Designer Software CD
■
MiniProg Programming Unit
■
ICE-Cube In-Circuit Emulator
■
28-pin CY8C29466-24PXI PDIP PSoC Device Sample (2)
■
ICE Flex-Pod for CY8C29x66 Family
■
PSoC Designer Software CD
■
Cat-5 Adapter
■
Getting Started Guide
■
Mini-Eval Programming Board
■
USB 2.0 Cable
■
110 ~ 240 V Power Supply, Euro-Plug Adapter
CY3214-PSoCEvalUSB
■
iMAGEcraft C Compiler (Registration required)
■
ISSP Cable
■
USB 2.0 Cable and Blue Cat-5 Cable
■
Two CY8C29466-24PXI 28-PDIP Chip Samples
The CY3214-PSoCEvalUSB evaluation kit features a
development board for the CY8C24794-24LFXI PSoC device.
Special features of the board include both USB and capacitive
sensing development and debugging support. This evaluation
board also includes an LCD module, potentiometer, LEDs, an
enunciator and plenty of bread boarding space to meet all of your
evaluation needs. The kit includes:
Document Number: 001-41947 Rev. *L
■
PSoCEvalUSB Board
■
LCD Module
■
MIniProg Programming Unit
■
Mini USB Cable
■
PSoC Designer and Example Projects CD
■
Getting Started Guide
■
Wire Pack
Page 31 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Device Programmers
CY3207ISSP In-System Serial Programmer (ISSP)
All device programmers are purchased from the Cypress Online
Store.
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production programming environment.
Note that CY3207ISSP needs special software and is not
compatible with PSoC Programmer. The kit includes:
CY3216 Modular Programmer
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■
CY3207 Programmer Unit
■
PSoC ISSP Software CD
■
Modular Programmer Base
■
110 ~ 240 V Power Supply, Euro-Plug Adapter
■
Three Programming Module Cards
■
USB 2.0 Cable
■
MiniProg Programming Unit
■
PSoC Designer Software CD
■
Getting Started Guide
■
USB 2.0 Cable
Accessories (Emulation and Programming)
Table 33. Emulation and Programming Accessories
Part Number
CY8C20224-12LKXI
Pin Package
Flex-Pod Kit [20]
Foot Kit [21]
Prototyping
Module
Adapter [22]
16-pin COL
Not available
Not available
CY3210-20X34
-
CY8C20324-12LQXI
24-pin QFN
CY3250-20334QFN
CY3250-24QFN-FK
CY3210-20X34
AS-24-28-01ML-6
CY8C20524-12PVXI
28-pin SSOP
CY3250-20534
CY3250-28SSOP-FK
CY3210-20X34
-
Third Party Tools
Build a PSoC Emulator into Your Board
Several tools are specially designed by the following third party
vendors to accompany PSoC devices during development and
production. Specific details of each of these tools are found at
http://www.cypress.com under DESIGN RESOURCES >>
Evaluation Boards.
For details on emulating the circuit before going to volume
production using an on-chip debug (OCD) non-production PSoC
device, refer application note AN2323 “Build a PSoC Emulator
into Your Board”.
Notes
20. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
21. Foot kit includes surface mount feet that is soldered to the target PCB.
22. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters is found at
http://www.emulation.com.
Document Number: 001-41947 Rev. *L
Page 32 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Acronyms
Acronyms Used
Table 34 lists the acronyms that are used in this document.
Table 34. Acronyms Used in this Datasheet
Acronym
AC
Description
Acronym
Description
alternating current
MIPS
million instructions per second
ADC
analog-to-digital converter
OCD
on-chip debug
API
application programming interface
PCB
printed circuit board
complementary metal oxide semiconductor
PGA
programmable gain amplifier
central processing unit
POR
power on reset
CMOS
CPU
EEPROM
GPIO
ICE
IDAC
electrically erasable programmable read-only
memory
PPOR
precision power on reset
general purpose I/O
PSoC®
Programmable System-on-Chip
in-circuit emulator
PWM
current DAC
QFN
pulse width modulator
quad flat no leads
IDE
integrated development environment
SLIMO
slow IMO
ILO
internal low speed oscillator
SPITM
serial peripheral interface
IMO
internal main oscillator
SRAM
static random access memory
I/O
supervisory read only memory
input/output
SROM
ISSP
in-system serial programming
SSOP
LCD
liquid crystal display
USB
LED
light-emitting diode
WLCSP
LVD
low voltage detect
XRES
MCU
microcontroller unit
LDO
WDT
shrink small-outline package
universal serial bus
watchdog timer
wafer level chip scale package
external reset
Reference Documents
PSoC® CY8C20x34 and PSoC® CY8C20x24 Technical Reference Manual (TRM) – 001-13033
Design Aids – Reading and Writing PSoC® Flash – AN2015 (001-40459)
Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages – available at http://www.amkor.com.
Document Number: 001-41947 Rev. *L
Page 33 of 41
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CY8C20424, CY8C20524
Document Conventions
Units of Measure
Table 35 lists the units of measures.
Table 35. Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
°C
degree Celsius
ms
millisecond
pF
picofarad
ns
nanosecond
kHz
kilohertz
ps
picosecond
MHz
megahertz
µV
microvolts
kilohm
mV
millivolts
k

ohm
V
volts
µA
microampere
W
watt
mA
milliampere
mm
nA
nanoampere
%
µs
microsecond
millimeter
percent
Numeric Conventions
Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’).
Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended
lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimals.
Glossary
active high
1. A logic signal having its asserted state as the logic 1 state.
2. A logic signal having the logic 1 state as the higher voltage of the two states.
analog blocks
The basic programmable opamp circuits. These are SC (switched capacitor) and CT (continuous
time) blocks. These blocks can be interconnected to provide ADCs, DACs, multi-pole filters, gain
stages, and much more.
analog-to-digital
(ADC)
A device that changes an analog signal to a digital signal of corresponding magnitude. Typically,
an ADC converts a voltage to a digital number. The digital-to-analog (DAC) converter performs
the reverse operation.
Application
programming
interface (API)
A series of software routines that comprise an interface between a computer application and
lower level services and functions (for example, user modules and libraries). APIs serve as
building blocks for programmers that create software applications.
asynchronous
A signal whose data is acknowledged or acted upon immediately, irrespective of any clock signal.
Bandgap
reference
A stable voltage reference design that matches the positive temperature coefficient of VT with
the negative temperature coefficient of VBE, to produce a zero temperature coefficient (ideally)
reference.
bandwidth
1. The frequency range of a message or information processing system measured in hertz.
2. The width of the spectral region over which an amplifier (or absorber) has substantial gain (or
loss); it is sometimes represented more specifically as, for example, full width at half maximum.
bias
1. A systematic deviation of a value from a reference value.
2. The amount by which the average of a set of values departs from a reference value.
3. The electrical, mechanical, magnetic, or other force (field) applied to a device to establish a
reference level to operate the device.
Document Number: 001-41947 Rev. *L
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CY8C20424, CY8C20524
Glossary (continued)
block
1. A functional unit that performs a single function, such as an oscillator.
2. A functional unit that may be configured to perform one of several functions, such as a digital
PSoC block or an analog PSoC block.
buffer
1. A storage area for data that is used to compensate for a speed difference, when transferring
data from one device to another. Usually refers to an area reserved for I/O operations, into
which data is read, or from which data is written.
2. A portion of memory set aside to store data, often before it is sent to an external device or as
it is received from an external device.
3. An amplifier used to lower the output impedance of a system.
bus
1. A named connection of nets. Bundling nets together in a bus makes it easier to route nets
with similar routing patterns.
2. A set of signals performing a common function and carrying similar data. Typically represented
using vector notation; for example, address[7:0].
3. One or more conductors that serve as a common connection for a group of related devices.
clock
The device that generates a periodic signal with a fixed frequency and duty cycle. A clock is
sometimes used to synchronize different logic blocks.
comparator
An electronic circuit that produces an output voltage or current whenever two input levels simultaneously
satisfy predetermined amplitude requirements.
compiler
A program that translates a high level language, such as C, into machine language.
configuration
space
In PSoC devices, the register space accessed when the XIO bit, in the CPU_F register, is set to
‘1’.
crystal oscillator
An oscillator in which the frequency is controlled by a piezoelectric crystal. Typically a piezoelectric
crystal is less sensitive to ambient temperature than other circuit components.
cyclic redundancy A calculation used to detect errors in data communications, typically performed using a linear
check (CRC)
feedback shift register. Similar calculations may be used for a variety of other purposes such as
data compression.
data bus
A bi-directional set of signals used by a computer to convey information from a memory location
to the central processing unit and vice versa. More generally, a set of signals used to convey
data between digital functions.
debugger
A hardware and software system that allows you to analyze the operation of the system
under development. A debugger usually allows the developer to step through the firmware one
step at a time, set break points, and analyze memory.
dead band
A period of time when neither of two or more signals are in their active state or in transition.
digital blocks
The 8-bit logic blocks that can act as a counter, timer, serial receiver, serial transmitter, CRC
generator, pseudo-random number generator, or SPI.
digital-to-analog
(DAC)
A device that changes a digital signal to an analog signal of corresponding magnitude. The analogto-digital (ADC) converter performs the reverse operation.
duty cycle
The relationship of a clock period high time to its low time, expressed as a percent.
Document Number: 001-41947 Rev. *L
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CY8C20424, CY8C20524
Glossary (continued)
emulator
Duplicates (provides an emulation of) the functions of one system with a different system, so that
the second system appears to behave like the first system.
External Reset
(XRES)
An active high signal that is driven into the PSoC device. It causes all operation of the CPU and
blocks to stop and return to a pre-defined state.
Flash
An electrically programmable and erasable, non-volatile technology that provides you the
programmability and data storage of EPROMs, plus in-system erasability. Non-volatile means
that the data is retained when power is OFF.
Flash block
The smallest amount of Flash ROM space that may be programmed at one time and the smallest
amount of Flash space that may be protected. A Flash block holds 64 bytes.
frequency
The number of cycles or events per unit of time, for a periodic function.
gain
The ratio of output current, voltage, or power to input current, voltage, or power, respectively.
Gain is usually expressed in dB.
I2C
A two-wire serial computer bus by Philips Semiconductors (now NXP Semiconductors). I2C is an
Inter-Integrated Circuit. It is used to connect low-speed peripherals in an embedded system. The
original system was created in the early 1980s as a battery control interface, but it was later used
as a simple internal bus system for building control electronics. I2C uses only two bi-directional
pins, clock and data, both running at +5V and pulled high with resistors. The bus operates at 100
kbits/second in standard mode and 400 kbits/second in fast mode.
ICE
The in-circuit emulator that allows you to test the project in a hardware environment, while
viewing the debugging device activity in a software environment (PSoC Designer).
input/output (I/O) A device that introduces data into or extracts data from a system.
interrupt
A suspension of a process, such as the execution of a computer program, caused by an event
external to that process, and performed in such a way that the process can be resumed.
interrupt service
routine (ISR)
A block of code that normal code execution is diverted to when the M8C receives a hardware
interrupt. Many interrupt sources may each exist with its own priority and individual ISR code
block. Each ISR code block ends with the RETI instruction, returning the device to the point in
the program where it left normal program execution.
jitter
1. A misplacement of the timing of a transition from its ideal position. A typical form of corruption that occurs on
serial data streams.
2. The abrupt and unwanted variations of one or more signal characteristics, such as the interval between
successive pulses, the amplitude of successive cycles, or the frequency or phase of successive cycles.
low-voltage detect A circuit that senses VDD and provides an interrupt to the system when VDD falls lower than a selected threshold.
(LVD)
M8C
An 8-bit Harvard-architecture microprocessor. The microprocessor coordinates all activity inside
a PSoC by interfacing to the Flash, SRAM, and register space.
master device
A device that controls the timing for data exchanges between two devices. Or when devices are
cascaded in width, the master device is the one that controls the timing for data exchanges
between the cascaded devices and an external interface. The controlled device is called the
slave device.
Document Number: 001-41947 Rev. *L
Page 36 of 41
CY8C20224, CY8C20324
CY8C20424, CY8C20524
Glossary (continued)
microcontroller
An integrated circuit chip that is designed primarily for control systems and products. In addition
to a CPU, a microcontroller typically includes memory, timing circuits, and I/O circuitry. The reason
for this is to permit the realization of a controller with a minimal quantity of chips, thus
achieving maximal possible miniaturization. This in turn, reduces the volume and the cost of
the controller. The microcontroller is normally not used for general-purpose computation as is a
microprocessor.
mixed-signal
The reference to a circuit containing both analog and digital techniques and components.
modulator
A device that imposes a signal on a carrier.
noise
1. A disturbance that affects a signal and that may distort the information carried by the signal.
2. The random variations of one or more characteristics of any entity such as voltage, current, or data.
oscillator
A circuit that may be crystal controlled and is used to generate a clock frequency.
parity
A technique for testing transmitting data. Typically, a binary digit is added to the data to make the
sum of all the digits of the binary data either always even (even parity) or always odd (odd parity).
Phase-locked
loop (PLL)
An electronic circuit that controls an oscillator so that it maintains a constant phase angle relative
to a reference signal.
pinouts
The pin number assignment: the relation between the logical inputs and outputs of the PSoC
device and their physical counterparts in the printed circuit board (PCB) package. Pinouts
involve pin numbers as a link between schematic and PCB design (both being computer generated
files) and may also involve pin names.
port
A group of pins, usually eight.
Power on reset
(POR)
A circuit that forces the PSoC device to reset when the voltage is lower than a pre-set level. This is a type of
hardware reset.
PSoC®
Cypress Semiconductor’s PSoC® is a registered trademark and Programmable System-onChip™ is a trademark of Cypress.
PSoC Designer™ The software for Cypress’ Programmable System-on-Chip technology.
pulse width
An output in the form of duty cycle which varies as a function of the applied measurand
modulator (PWM)
RAM
An acronym for random access memory. A data-storage device from which data can be read out
and new data can be written in.
register
A storage device with a specific capacity, such as a bit or byte.
reset
A means of bringing a system back to a know state. See hardware reset and software reset.
ROM
An acronym for read only memory. A data-storage device from which data can be read out, but
new data cannot be written in.
serial
1. Pertaining to a process in which all events occur one after the other.
2. Pertaining to the sequential or consecutive occurrence of two or more related activities in a single device or
channel.
Document Number: 001-41947 Rev. *L
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CY8C20224, CY8C20324
CY8C20424, CY8C20524
Glossary (continued)
settling time
The time it takes for an output signal or value to stabilize after the input has changed from one
value to another.
shift register
A memory storage device that sequentially shifts a word either left or right to output a stream of
serial data.
slave device
A device that allows another device to control the timing for data exchanges between two
devices. Or when devices are cascaded in width, the slave device is the one that allows another
device to control the timing of data exchanges between the cascaded devices and an external
interface. The controlling device is called the master device.
SRAM
An acronym for static random access memory. A memory device where you can store and
retrieve data at a high rate of speed. The term static is used because, after a value is loaded into an SRAM cell,
it remains unchanged until it is explicitly altered or until power is removed from the device.
SROM
An acronym for supervisory read only memory. The SROM holds code that is used to boot the
device, calibrate circuitry, and perform Flash operations. The functions of the SROM may be
accessed in normal user code, operating from Flash.
stop bit
A signal following a character or block that prepares the receiving device to receive the next
character or block.
synchronous
1. A signal whose data is not acknowledged or acted upon until the next active edge of a clock signal.
2. A system whose operation is synchronized by a clock signal.
tri-state
A function whose output can adopt three states: 0, 1, and Z (high-impedance). The function does
not drive any value in the Z state and, in many respects, may be considered to be disconnected
from the rest of the circuit, allowing another output to drive the same net.
UART
A UART or universal asynchronous receiver-transmitter translates between parallel bits of data
and serial bits.
user modules
Pre-build, pre-tested hardware/firmware peripheral functions that take care of managing and
configuring the lower level Analog and Digital PSoC Blocks. User Modules also provide high
level API (Application Programming Interface) for the peripheral function.
user space
The bank 0 space of the register map. The registers in this bank are more likely to be modified
during normal program execution and not just during initialization. Registers in bank 1 are most
likely to be modified only during the initialization phase of the program.
VDD
A name for a power net meaning "voltage drain." The most positive power supply signal. Usually
5 V or 3.3 V.
VSS
A name for a power net meaning "voltage source." The most negative power supply signal.
watchdog timer
A timer that must be serviced periodically. If it is not serviced, the CPU resets after a specified
period of time.
Document Number: 001-41947 Rev. *L
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CY8C20224, CY8C20324
CY8C20424, CY8C20524
Document History Page
Document Title: CY8C20224, CY8C20324, CY8C20424, CY8C20524 CapSense® PSoC® Programmable System-on-Chip™
Document Number: 001-41947
ECN
Orig. of
Change
**
1734104
YHW/AESA
*A
2542938 RLRM/AESA
*B
2610469
SNV/PYRS
11/20/08
Updated VOH5, VOH7, and VOH9 specifications.
*C
2634376
DRSW
01/12/09
Removed the part number CY3250-20234QFN from the 'CY8C20224-12LKXI'
flex-pod kit
Changed title from CapSense™ Multimedia PSoC® Mixed-Signal Array to
CapSense™ Multimedia PSoC® Programmable System-on-Chip™
Added -12 to the CY8C20524 parts in the Ordering Information table
Updated ‘Development Tools’ and ‘Designing with PSoC Designer’ sections on
pages 4 and 5
Updated ‘Development Tools Selection’ section on page 30
Changed status from ‘Preliminary’ to ‘Final’
Changed 16-Pin from QFN to COL
*D
2693024
DPT/PYRS
*E
2717566 DRSW/AESA
06/11/2009 Updated AC Chip-Level, and AC Programming Specifications as follows:
Modified FIMO6 (page 19), TWRITE specifications (page 22) Added IOH & IOL
(page 16), Flash endurance note (page 18), DCILO (page 19), F32K_U (page
19), TPOWERUP (page 19), TERASEALL (page 22), TPROGRAM_HOT (page
22), and TPROGRAM_COLD (page 22) specifications
Added AC SPI Master and Slave Specifications
*F
2899195
CFW/ISW
03/26/2010 Updated Package Diagrams
Updated Ordering Information
*G
3037121
CFW
09/24/2010 Updated title to read AC Comparator Specifications and also updated table
caption to read “AC Comparator Specifications” in the same section.
Minor edits and updated in new template.
*H
3049675
BTK
10/06/2010 Removed AC analog mux bus specifications.
Updated Development Tools and Designing with PSoC Designer sections.
*I
3072668
NJF
10/27/10
Added PSoC Device Characteristics table.
Added DC I2C Specifications table.
Added F32K_U max limit.
Added Tjit_IMO specification, removed existing jitter specifications.
Updated Units of Measure, Acronyms, Glossary, and References sections.
Updated solder reflow specifications.
No specific changed were made to I2C Timing Diagram. Updated for clearer
understanding.
Template and styles update.
*J
3112469
ARVM
12/16/10
Removed pruned part CY8C20424-12LKXIT from the ordering information table.
*K
3182773
MATT
03/01/11
No Change
Revision
Submission
Date
See ECN
Description of Change
New parts and document (Revision **).
07/28/2008 Corrected Ordering Information format. Updated package diagram 001-13937 to
Rev *B. Updated data sheet template.
04/16/2009 Added 32-Pin Sawn QFN package diagram
Added devices CY8C20424-12LQXI and CY8C20424-12LQXIT in the Ordering
Information table
Document Number: 001-41947 Rev. *L
Page 39 of 41
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CY8C20424, CY8C20524
Document Title: CY8C20224, CY8C20324, CY8C20424, CY8C20524 CapSense® PSoC® Programmable System-on-Chip™
Document Number: 001-41947
*L
3638597
BVI
06/06/2012 Updated Getting Started section.
Updated Software under Development Tool Selection section.
Updated Solder Reflow Specifications table.
Updated FSCLK parameter in the Table 29, “SPI Slave AC Specifications,” on
page 25.
Changed tOUT_HIGH to tOUT_H in Table 28, “SPI Master AC Specifications,” on
page 25
Updated package diagrams:
001-09116 to *F
001-13937 to *D
51-85079 to *E
001-12919 to *C
Removed references to obsolete specs 001-17397 and 001-14503 in page 33.
Document Number: 001-41947 Rev. *L
Page 40 of 41
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CY8C20424, CY8C20524
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at Cypress Locations.
Products
Automotive
Clocks & Buffers
Interface
Lighting & Power Control
PSoC Solutions
cypress.com/go/automotive
psoc.cypress.com/solutions
cypress.com/go/clocks
PSoC 1 | PSoC 3 | PSoC 5
cypress.com/go/interface
cypress.com/go/powerpsoc
cypress.com/go/plc
Memory
Optical & Image Sensing
PSoC
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© Cypress Semiconductor Corporation, 2008-2012. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-41947 Rev. *L
Revised June 15, 2012
Page 41 of 41
PSoC Designer™ is a trademark and PSoC® and CapSense® are registered trademarks of Cypress Semiconductor Corporation.
Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided
that the system conforms to the I2C Standard Specification as defined by Philips. As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors.
All products and company names mentioned in this document may be the trademarks of their respective holders.