VISHAY EGP50C

EGP50A thru EGP50G
Vishay General Semiconductor
Glass Passivated Ultrafast Rectifier
FEATURES
• Cavity-free glass-passivated junction
®
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low leakage current
d*
e
t
n
e
Pat
• Low switching losses, high efficiency
• High forward surge capability
GP20
*Glass Encapsulation
technique is covered by
Patent No. 3,996,602,
brazed-lead assembly to
Patent No. 3,930,306
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in high frequency rectification and
freewheeling application in switching mode converters
and inverters for consumer, computer and
telecommunication.
PRIMARY CHARACTERISTICS
IF(AV)
5.0 A
VRRM
50 V to 400 V
IFSM
150 A
trr
50 ns
VF
0.95 V, 1.25 V
TJ max.
150 °C
MECHANICAL DATA
Case: GP20, molded epoxy over glass body
Epoxy meets UL 94V-0 flammability rating
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test, HE3 suffix for high reliability grade
(AEC Q101 qualified), meets JESD 201 class 2
whisker test
Polarity: Color band denotes cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
EGP50A
EGP50B
EGP50C
EGP50D
EGP50F
EGP50G
UNIT
Maximum repetitive peak reverse voltage
VRRM
50
100
150
200
300
400
V
Maximum RMS voltage
VRMS
35
70
105
140
210
280
V
Maximum DC blocking voltage
VDC
50
100
150
200
300
400
V
Maximum average forward rectified current
0.375" (9.5 mm) lead length at TL = 55 °C
IF(AV)
5
A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
150
A
TJ, TSTG
- 65 to + 150
°C
Operating and storage temperature range
Document Number: 88585
Revision: 20-Aug-07
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
1
EGP50A thru EGP50G
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
Maximum instantaneous
forward voltage
5.0 A
SYMBOL EGP50A EGP50B EGP50C EGP50D EGP50F EGP50G UNIT
VF
0.95
1.25
V
TA = 25 °C
TA = 125 °C
IR
5.0
50
µA
Maximum reverse
recovery time
IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A
trr
50
ns
Typical junction capacitance
4.0 V, 1 MHz
CJ
Maximum DC reverse current
at rated DC blocking voltage
95
75
pF
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL EGP50A EGP50B EGP50C EGP50D EGP50F EGP50G UNIT
RθJA
RθJL
Typical thermal resistance (1)
20
5.0
°C/W
Note:
(1) Thermal resistance from junction to ambient, and from junction to lead at 0.375" (9.5 mm) lead length, P.C.B. mounted
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
EGP50G-E3/54
1.01
54
1400
13" diameter paper tape and reel
EGP50G-E3/73
1.01
73
1000
Ammo pack packaging
EGP50GHE3/54 (1)
1.01
54
1400
13" diameter paper tape and reel
EGP50GHE3/73 (1)
1.01
73
1000
Ammo pack packaging
Note:
(1) Automotive grade AEC Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
175
Resistive or Inductive Load
Peak Forward Surge Current (A)
Average Forward Rectified Current (A)
6.0
5.0
4.0
Copper Heatsinks
3.0
2.0
TL
L
0.375" (9.5 mm)
Lead Length
1.0
TJ = TJ Max.
8.3 ms Single Half Sine-Wave
150
125
100
75
50
25
0
0
0
25
50
75
100
125
150
175
1
10
100
Lead Temperature (°C)
Number of Cycles at 60 Hz
Figure 1. Maximum Forward Current Derating Curve
Figure 2. Maximum Non-Repetitive Peak Forward Surge Current
www.vishay.com
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 88585
Revision: 20-Aug-07
EGP50A thru EGP50G
Vishay General Semiconductor
210
Pulse Width = 300 µs
1 % Duty Cycle
10
TJ = 150 °C
1
TJ = 25 °C
0.1
120
90
60
EGP50A - EGP50D
EGP50F & EGP50G
0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.1
1
10
100
1000
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Figure 3. Typical Instantaneous Forward Characteristics
Figure 5. Typical Junction Capacitance
100
100
Transient Thermal Impedance (°C/W)
Instantaneous Reverse Leakage
Current (µA)
150
30
EGP50A - EGP50D
EGP50F & EGP50G
0.01
0.2
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
180
Junction Capacitance (pF)
Instantaneous Forward Current (A)
100
TJ = 150 °C
10
TJ = 125 °C
1
TJ = 75 °C
0.1
TJ = 25 °C
0.01
0.001
0
20
40
60
80
10
1
0.1
0.01
100
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
t - Pulse Duration (s)
Figure 4. Typical Reverse Leakage Characteristics
Figure 6. Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
GP20
1.0 (25.4)
MIN.
0.210 (5.3)
0.190 (4.8)
DIA.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
MIN.
0.042 (1.07)
0.037 (0.94)
DIA.
Document Number: 88585
Revision: 20-Aug-07
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
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