STAR1000
STAR1000 1M Pixel Radiation Hard
CMOS Image Sensor
Key Features
The STAR1000 sensor has the following characteristics:
• Integrating 3-transistor Active Pixel Sensor.
• 1024 by 1024 pixels on 15 µm pitch.
• Radiation tolerant design.
• On-chip double sampling circuit to cancel Fixed Pattern
Noise.
• Electronic shutter.
• Read out rate: up to 11 full frames per second.
• Region Of Interest (ROI) windowing.
• On-chip 10-bit ADC.
• Programmable gain amplifier.
• Ceramic JLCC-84 package.
• Available with BK7G18 glass and with N2 filled cavity.
Sensor Description
The STAR1000 is a CMOS image sensor with 1024 by 1024
pixels on a 15 mm pitch. It features on-chip Fixed Pattern
Noise (FPN) correction, a programmable gain amplifier, and a
10-bit Analog-to-Digital Converter (ADC).
All circuits are designed using the radiation tolerant design
rules for CMOS image sensors, to allow a high tolerance
against total dose effects.
Registers that are directly accessed by the external controller
contain the X- and Y- addresses of the pixels to be read. This
architecture provides flexible operation and allows different
operation modes such as (multiple) windowing, subsampling,
etc.
Two versions od sensors are available: STAR1000 and
STAR1000BK7. The STAR1000 has a quartz glass lid and the
cavity between the die and the lid is filled with air. The
STAR1000BK7 has a BK7G18 glass lid and the cavity is filled
with N2 which increases the temperature operating range.
Cypress Semiconductor Corporation
Document Number: 38-05714 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised January 5, 2007
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STAR1000
Image Sensor Specifications
General Specifications
Table 1. General Specification of the STAR1000 Sensor
Parameter
Specification
Detector technology
CMOS active pixel sensor
Pixel structure
3-transistor active pixel
Photodiode
Radiation-tolerant pixel design.
High fill factor photodiode
Sensitive area format
Using N-well technique.
1024 x 1024 pixels
15 x15 µm2
Pixel size
Pixel output rate
Windowing
Comment
12 MHz
Speed can be exchanged for power consumption.
X- and Y- addressing random programmable
Electronic shutter
Electronic rolling shutter.
Range: 1:1024
Total dose radiation
tolerance
Integration time is variable in time steps equal to the
row readout time.
> 250 Krad (Si)
Pixel test structures with a similar design have
shown total dose tolerance up to several Mrad.
Note: Dark current and DSNU are dependent of
radiation dose.
2,4.1011 proton/cm2
At 60 MeV
Proton radiation tolerance
> 127,8 MeV cm3 mg-1
SEU tolerance
Electro-optical Specifications
Table 2. Electro-optical Specifications of the STAR1000 Sensor
Value
Parameter
Spectral range
Comment
Typical Value
Unit
400 - 1000
nm
Quantum efficiency x fill
factor
20%
Average over the visual range. See spectral
response curve.
Full well capacity
135.000
e-
Saturation capacity to
meet non-linearity within
+ 5%
99.000
e-
Output signal swing
1.1
V
Conversion gain
11.4
µV/e-
kTC noise
47
e-
Dynamic range
69
dB
Fixed pattern noise
Local: 1 σ < 0.30%
Global: 1σ <0.56%
of full well
Photo response
non-uniformity at Sat/2
(RMS)
Local: 1 σ < 0.67%
Global: σ <3.93%
of full well
Document Number: 38-05714 Rev. *B
Page 2 of 21
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STAR1000
Table 2. Electro-optical Specifications of the STAR1000 Sensor (continued)
Value
Parameter
Comment
Typical Value
Unit
Average dark current at
293K
223
ρA/cm2
Dark current signal
3135
e-/s
DSNU signal
Optical cross-talk
at 600 nm
1.055% of Vsat
DSNU rises 14 e-/s per Krad.
Vertical: 16%
Horizontal: 17.5%
Anti-blooming capacity
Output amplifier gain
x 1000
x1, x2.47, x4.59 and x8.64
Analogue input
bandwidth
Controlled by 2 bits.
9.5
MHz
0.1 to 4.9
V
10
bit
ADC Differential
Non-Linearity (DNL)
<= ±3.5
LSB
ADC Integral
Non-Linearity (INL)
<= ±5.8
LSB
5
V
< 350
< 100
mW
Analogue input signal
range
Dark current rises 425 e-/s per Krad.
Analog-to-Digital
converter
Supply voltage
Power dissipation
Document Number: 38-05714 Rev. *B
Radiation-tolerant version of the ADC on Ibis4 and
other image sensors.
Integral non-linearity of ADC is better than linearity
of image sensor.
Digital input signals are 3.3V compatible.
With internal ADC powered.
Without internal ADC powered.
Both values measured at nominal speed (12 MHz).
Page 3 of 21
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STAR1000
Spectral Response
Figure 1. Spectral Response Curve
0.16
QE 0.3
0.14
QE 0.2
Spectral response [A/W]
0.12
0.1
0.08
QE 0.1
0.06
QE 0.05
0.04
0.02
QE 0.01
0
400
500
600
700
800
900
1000
Wavelenght [nm]
Photo-Voltaic Response
Figure 2. Photo Voltaic Response Curve
Voltage swing at output [V]
1,2
1
0,8
0,6
0,4
0,2
0
0
20000
40000
60000
80000
100000 120000 140000 160000 180000
Number of electrons
Document Number: 38-05714 Rev. *B
Page 4 of 21
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STAR1000
Absolute Maximum Ratings
Table 3. Absolute Maximum Ratings STAR1000
Limits
Characteristics
Units
Remarks
Min
Max
Any supply voltage
-0.5
+7
V
Voltage on any input terminal
-0.5
Vdd + 0.5
V
0
+60
°C
Temperature range confirmed by
evaluation testing.
Storage temperature
-10
+60
°C
Not longer than 1 hour. Temperature range
confirmed by evaluation testing.
Sensor soldering temperature
NA
125
°C
Hand soldering only. The sensor’s temperature may not rise above this limit. Please
read the soldering and handling section for
more information.
Units
Remarks
Operating temperature
R
Table 4. Absolute Maximum Ratings STAR1000BK7
Limits
Characteristics
Min
Max
Any supply voltage
-0.5
+7
V
Voltage on any input terminal
-0.5
Vdd + 0.5
V
Operating temperature
-40
+85
°C
Temperature range confirmed by
evaluation testing.
Storage temperature
-40
+85
°C
Temperature range confirmed by
evaluation testing.
-40
+120
NA
125
Sensor soldering temperature
Document Number: 38-05714 Rev. *B
Maximum 1 hour.
°C
Hand soldering only. The sensor’s temperature may not rise above this limit. Please
read the soldering and handling section for
more information.
Page 5 of 21
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STAR1000
DC Operating Conditions
Table 5. DC Operating Conditions
Limits
Symbol
Parameter
Units
Min
Typ
Max
VDDA
Analog supply of the image core.
5
V
VDDD
Digital supply of the image core.
5
V
VDD_ADC_ANA
Analog supply of the ADC circuitry.
5
V
VDD_ADC_DIG
Digital supply of the ADC circuitry.
5
V
VDD_DIG_OUT
Power supply of ADC digital output stage.
5
V
VRES
Reset level for RESET signal.
5
V
VREF
Reset level for RESET_DS signal.
GNDA
Analog ground of the image core.
0
V
GNDD
Digital ground of the image core.
0
V
GND_ADC_ANA
Analog ground of the ADC circuitry.
0
V
GND_ADC_DIG
Digital ground of the ADC circuitry.
0
V
4
5
V
VIH
Logical '1' input voltage.
1.8
VDDD
V
VIL
Logical '0' input voltage.
0
1
V
VOH
Logical '1' output voltage.
4.25
VDDD
V
VOL
Logical '0' output voltage.
1
V
Document Number: 38-05714 Rev. *B
Page 6 of 21
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STAR1000
Architecture
Floor Plan
Figure 3. Star1000 Floor Plan
1024
Reset
10
Pixel Array
1024 x 1024 pixels
Reset_DS
D0...D9
Rst
Vref
Ld_Y
10
Y Address
Decoder
and Logic
Col
10-bit ADC
Rst
1024
Clk_ADC
Rd
Latch
A0....A9
Rd
Ain
1024
10
S
R
Column Amplifiers
Rst
1024
1024
Sig
Progr. Gain
Amplifier
Multiplexer
1024
X Register
Clk_X
Buffer
Aout
1024
10
Ld_X
The image sensor contains five sections: the pixel array, the
X- and Y- addressing logic, the column amplifiers, the output
amplifier and the ADC. Figure 3. shows an outline diagram of
the sensor, including an indication of the main control signals.
The following paragraphs explain in more detail the function
and operation of the different imager parts.
Sel1
Sel0
Ain1
Ain2
Ain3
G0f
G1
Blackref
Cal
Latch
X Address Decoder
The reset lines and the read lines of the pixels in a row are
connected together to the Y- decoder logic; the outputs of the
pixels in a column are connected together to a column
amplifier.
Figure 4. Architecture of the 3T Pixel
Pixel Array
The photo diode is always in reverse bias. At the beginning of
the integration cycle, a pulse is applied to the reset line (gate
of T1) bringing the cathode of D1 to the reset voltage level.
During the integration period, photon-generated electrons
accumulate on the diode capacitance reducing the voltage on
the gate of T2. The real illumination dependent signal is the
difference between the reset level and the output level after
integration. This difference is created in the column amplifiers.
T2 acts as a source follower and T3 allows connection of the
pixel signal (reset level and output level) to the vertical output
bus.
Document Number: 38-05714 Rev. *B
T1
Read
Reset
T2
Column Bus
The pixel array contains 1024 by 1024 active pixels at 15 µm
pitch. Each pixel contains one photo diode and three
transistors (Figure 4.).
T3
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STAR1000
Addressing Logic
The addressing logic allows direct addressing of rows and
columns. Instead of the one-hot shift registers that are often
used, address decoders are implemented. One can select a
line by presenting the required address to the address input of
the device and latching it to the Y- decoder logic. Presenting
the X- address to the device address input and latching it to
the X- address decoder can select a column.
A typical line read out sequence will first select a line by
applying the Y-address to the Y-decoder. Activation of the
LD_Y input on the Y-logic connects the pixel outputs of the
selected line to the column amplifiers. The individual column
amplifier outputs are connected to the output amplifier by
applying the respective X- addresses to the X- address
decoder. Applying the appropriate Y- address to the Ydecoder and activating the “Reset” input reset a line. The
integration time of a row is the time between the last reset of
this row and the time when it is selected for read out.
The Y- decoder logic has two different reset inputs: RESET
and RESET_DS. Activation of RESET resets the pixel to the
Vdd level; activation of RESET_DS resets the pixel to the
voltage level on the VREF input. This feature allows the application of the so called dual slope integration. If dual slope
integration is not needed, VREF is tied to Vdd and RESET_DS
must never be activated.
Column Amplifiers
All outputs from the pixels in a column are connected in parallel
to a column amplifier. This amplifier samples the output
voltage and the reset level of the pixel whose row is selected
at that moment and presents these voltage levels to the output
Document Number: 38-05714 Rev. *B
amplifier. As a result, the pixels are always reset immediately
after read out as part of the sample procedure. Note that the
maximum integration time of a pixel is the time between two
read cycles.
Output Amplifier and Analog Multiplexer
The output amplifier combines subtraction of pixel signal level
from reset level with a programmable gain amplifier. Since the
amplifier is AC coupled, it also contains a provision to maintain
and restore the proper DC level.
An analog signal multiplexing feeds the pixel signal to the final
unity gain buffer, providing the required drive capability. Apart
from the pixel signal, three other external analog signals can
be fed to the output buffer. All these signals can be digitalised
by the on-chip ADC if the output of this buffer is externally
connected to the input of the ADC.
The purpose of the additional analog inputs (A_IN1, A_IN2,
and A_IN3) is to allow the possibility of processing other
analog signals through the image sensors signal path. These
signals can then be converted by the ADC and processed by
the image controller FPGA. The additional analog inputs are
intended for low frequency or DC signals and have a reduced
bandwidth compared with the image signal path.
ADC
The image sensor has a 10-bit ADC that is electrically
separated from the rest of the image sensor circuits and can
be powered down if an external ADC is used. The conversion
takes place at the falling edge of the clock and the output pins
can be disabled to allow operation of the device in a bus
structure.
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STAR1000
Timing and Control Signals
Row Selection and Reset Timing
Figure 5. shows the timing of the line sequence control signals.
The timing constraints are presented in Table 6.
The pixels addressing is done by direct addressing of rows
and columns. This approach has the advantage of full flexibility
when accessing the pixel array: multiple windowing and
subsampled read out are possible by proper programming.
The address, presented at the address IO pins (A0…A9) is
latched in with the LD-Y pulse (active low). After latching; the
external controller already produces a new address.
The following paragraphs clarify the timing for row and column
readout.
Figure 5. Line Selection and Reset Sequence
A0......A9
Read Address
Reset Address
k
k
l
m
m
l
LD_Y
INTERNAL
Row Selected for Reset
Row Selected for Readout
a
b
S
c
d
f
g
d
RESET
e
b
R
h
i
CAL
(Once each
frame)
ROW
READOUT
Time Available for Readout of Row Y-1
Latching in a Y- address selects the addressed row and
connects the pixel outputs of that row to the column amplifiers.
Through the sequence of the S and R pulse and the reset
pulse in between the pixel output signal and reset level are
Document Number: 38-05714 Rev. *B
Idle
Time Available for X-readout of Row Y
sampled and produced at the output of the column amplifier
(to do the FPN double sampling correction).
At this time horizontal read out of the selected row is started
and another row is reset to effectuate reduced integration time
(electronic rolling shutter).
Page 9 of 21
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STAR1000
Table 6. Timing Constraints of Line Sequence
Symbol
Min
a
3.6 µs
Delay between selection of a new row and falling edge on S.
Minimal value: For maximum, speed a new row can already be selected
during X- read out of the previous row.
b
0.4 µs
Duration of S and R pulse.
c
0
d
200 ns
Minimum duration of reset pulse.
e
1.6 µs
Delay between falling edge of reset and falling edge of R.
f
0
g
Typ
100 ns
100 ns
g
Description
Delay between falling edge of S and rising edge of reset.
Minimum delay between falling edge on LD_Y and rising edge of reset.
Minimum required extension of Y- address after falling edge of reset pulse.
h
100 ns
200 ns
Position of cal pulse after rising edge of S.
The cal pulse must only be given once per frame.
i
100 ns
1 µs
k
10 ns
Address set up time.
l
20 ns
Load register value.
m
10 ns
Address stable after load.
Duration of cal pulse.
Pixel Read Out Timing
Figure 6. shows the timing of the pixel readout sequence. The
external digital controller presents a column address that is
latched by the rising edge of the LD_X pulse. After decoding
the X- address the column selection is clocked in the Xregister by CLK-X. The output amplifier uses the same pulse
to subtract the pixel output level from the pixel reset level and
the signal level. This causes a pipeline effect such that the
analog output of the first pixel is effectively present at the
device output terminal at the third rising edge of the X-CLK
signal.
Document Number: 38-05714 Rev. *B
The ADC conversion starts at the falling edge of the CLK-ADC
signal and produces a valid digital output 20 ns after this edge.
The timing constraints are given in Table 7.
Important note: The values of the X shift-register tend to leak
away after a while. Therefore it is very important to keep the
CLK_X signal asserted for as long as the sensor is powered
up. If the sensor sits idle and CLK_X is not asserted, the
leakage of the X shift-register will cause multiple columns to
be selected at once. This forces high current through the
sensor and may cause damage.
Page 10 of 21
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STAR1000
Figure 6. Column Selection and Read Out Sequence
Row Idle Time
A0......A9
X1
X2
X3
X5
X4
X6
X8
X7
LD_X
a
b
CLK_X
X1
X2
X3
Undefined Output Level
ANALOG
OUTPUT
X4
X5
X6
CLK_ADC
c
X1
D9......D0
X2
X3
X4
Table 7. Timing Constraints of Column Read Out
Symbol
Min
a
20 ns
Address setup time.
b
40 ns
Address valid time.
c
0
Document Number: 38-05714 Rev. *B
Typ
20 ns
Description
ADC output valid after falling edge of CLK_ADC.
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STAR1000
Pin List
Figure 7. displays the pin connections of the STAR1000. The
tables that follow group the connections by their functionality.
Figure 7. STAR1000 Pin Connections
Table 8. Pin List of the STAR1000 Sensor
Pin
Pin Name
Pin Type
1
A3
Input
2
A4
Input
3
A5
Input
4
A6
Input
5
A7
Input
6
A8
Input
7
A9
Input
8
LD_Y
Input
Document Number: 38-05714 Rev. *B
Pin Description
Digital input.Address inputs for row and column addressing. A9=LSB,
A0=MSB.
Digital Input. Latch address (A0…A9) to Y-register (0 = track, 1 = hold).
Page 12 of 21
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STAR1000
Table 8. Pin List of the STAR1000 Sensor (continued)
Pin
Pin Name
Pin Type
9
LD_X
Input
10
VDDA
Supply
Analog power supply of the imager (typical 5V).
11
GNDD
Ground
Digital ground of the imager.
12
GNDA
Ground
Analog ground of the imager.
13
CLK_X
Input
Digital input. Clock X-register (output valid & stable when CLK_X is high).
14
RESET_DS
Input
Digital input (high active). Resets row indicated by Y-address (see sensor
timing diagram).
RESET_DS is used for dual-slope integration (see FAQ).
GND is used for normal operation.
15
VDDD
Supply
16
RESET
Input
Digital input (high active). Resets row indicated by Y-address (see sensor
timing diagram).
17
S
Input
Digital input (high active). Control signal for column amplifier (see sensor
timing diagram).
18
R
Input
Digital input (high active). Control signal for column amplifier (see sensor
timing diagram).
19
NBIAS_DEC
Input
Analog input. Biasing of address decoder.
Connect with 100 kΩ to VDDA and decouple with 100 to GND.
20
A_IN2
Input
21
A_IN3
Input
Additional analog inputs. For proper conversion with on-chip ADC, the
input signal must lie within the output signal range of the image sensor
(approximately +2V to +4V).
22
A_IN1
Input
23
A_SEL1
Input
24
A_SEL0
Input
25
NBIAS_OAMP
Input
Analog input. Bias of output amplifier (speed/power control).
Connect with 100 kΩ to VDDA and decouple with 100 nF to GND for 12.5
MHz output rate (lower resistor values yield higher maximal pixel rates at
the cost of extra power dissipation).
26
PBIAS
Input
Analog input. Biasing of the multiplexer circuitry.
Connect with 20 kω to GND and decouple with 100 nF to VDD.
27
G1
Input
28
G0
Input
Digital input. Select output amplifier gain value: G0 = LSB, G1 = MSB ('00'
= unity gain, '01' = x2, '10'= x4, '11'=x8).
29
CAL
Input
Digital input (active high). Initialization of output amplifier. Output amplifier
outputs BLACKREF in unity gain mode when CAL is high (1).
Apply pulse pattern (see sensor timing diagram).
30
OUT
Output
Analog Output Video Signal. Connected to the analog input of the internal
(pin 52) 10-bit ADC or an external ADC.
31
BLACKREF
Input
Analog input. Control voltage for output signal offset level. Buffered
on-chip, the reference level can be generated by a 100 kω resistive divider.
Connect to 2V DC for use with on-chip ADC.
32
VDDA
Supply
Analog power supply of image core (typical 5V).
33
VDDD
Supply
Digital power supply of image core (typical 5V).
Document Number: 38-05714 Rev. *B
Pin Description
Digital input. Latch address (A0…A9) to X-register (0 = track, 1 = hold).
Digital supply of the image sensor.
Selection of analog channel: '00' selects image sensor ('01' selects A_IN1,
'10' A_IN2, and '11' A_IN3).
Page 13 of 21
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STAR1000
Table 8. Pin List of the STAR1000 Sensor (continued)
Pin
Pin Name
Pin Type
Pin Description
34
GNDA
Ground
Analog ground of image core.
35
GNDD
Ground
Digital ground of image core.
36
NBIAS_ARRAY
Input
37
TESTPIX_OUT
Output
38
TESTPIX_RESET
Input
Digital input (active high). Reset signal of single test pixel. Used to reset
the single test pixel during electro-optical evaluation.
39
n.c.
40
n.c.
41
n.c.
42
n.c.
43
n.c.
44
n.c.
45
n.c.
46
n.c.
47
n.c.
48
TESTPIXARRAY
Output
Analog output of an array of 20 x 35 test pixels where all photodiodes are
connected in parallel. Is used for electro-optical evaluation.
49
PHOTODIODE
Output
Plain Photo Diode (without circuitry). Area of the photodiode = 20 x 35
pixels. Is used for electro-optical evaluation.
50
NBIAS_ANA
Input
51
NBIAS_ANA2
Input
52
IN_ADC
Input
53
VDD_ADC_ANA
Supply
Analog power supply of the ADC (typical 5V).
54
GND_ADC_ANA
Ground
Analog ground of the ADC.
55
VLOW_ADC
Input
Low reference voltage of internal ADC. Nominal input range of the ADC
is between 2V and 4V. The resistance between VLOW_ADC and
VHIGH_ADC is approximately 1.5 kΩ. Connect with 1k 5Ω to GND and
decouple with 100 nF to GND.
56
n.c.
57
PBIASDIG2
Input
Connect with 20K to GND and decouple with 100 nF to VDDA.
Analog input. Biasing of the pixel array. Connect with 1MΩ to VDDA and
decouple with 100 nF capacitor to GND.
Output of single test pixel. Is used for electro-optical evaluation.
Analog input. Analog biasing of the ADC circuitry. Connect with 100 kΩ to
VDDA and decouple with 100 nF to GND.
Analog input of the internal ADC. Connect to analog output of image
sensor (pin 30).
Input range (typically 2V and 4V) of the internal ADC is set between by
VLOW_ADC (pin 55) and VHIGH_ADC (pin 62).
58
BITINVERT
Input
Digital input. Inversion of the ADC output bits. 0 = invert output bits (0 =>
black, 1023; white, 0), 1 = no inversion of output bits (black, 0; white, 1023).
59
TRI_ADC
Input
Digital input. Tri-state control of digital ADC outputs (1 = tri-state, 0 =
normal mode).
60
D0
Input
ADC output bits.#D0 = LSB, D9=MSB.
61
CLK
Input
Digital input. ADC clock. ADC converts on falling edge.
Document Number: 38-05714 Rev. *B
Page 14 of 21
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STAR1000
Table 8. Pin List of the STAR1000 Sensor (continued)
Pin
Pin Name
Pin Type
Pin Description
62
VHIGH_ADC
Input
High reference voltage of internal ADC. Nominal input range of the ADC
is between 2V and 4V. The resistance between VLOW_ADC and
VHIGH_ADC is about 1.5 kΩ.
Connect with 1k 1 Ω to VDDA and decouple with 100 nF to GND.
63
GND_ADC_ANA
Ground
Analog ground of the ADC circuitry.
64
VDD_ADC_ANA
Supply
Analog supply of the ADC circuitry (typical 5V).
65
VDD_ADC_DIG
Supply
Digital supply of the ADC circuitry (typical 5V).
66
GND_ADC_DIG
Output
Digital ground of the ADC circuitry.
67
VDD_DIG_OUT
Supply
Power supply of ADC digital output. Connect to 5V for normal operation.
Can be brought to lower voltage when image sensor must be interfaced
to low voltage periphery.
68
D1
Output
ADC output bits. #D0 = LSB, D9=MSB.
69
D2
Output
70
D3
Output
71
D4
Output
72
D5
Output
73
VDDA
Supply
Analog supply of the image core (typical 5V).
74
GNDA
Ground
Analog ground of the image core (typical 5V).
75
GND_AB
Supply
Anti-blooming drain control voltage. Default: connect to ground where the
anti-blooming is operational but not maximal. Apply 1V DC for improved
anti-blooming.
76
VREF
Supply
Analog supply. Reset level for RESET_DS. Is used for extended optical
dynamic range. See FAQ for more details.
77
VRES
Supply
Analog supply. Reset level for RESET (typical 5V).
78
D6
Output
ADC output bits.#D0 = LSB, D9=MSB.
79
D7
Output
80
D8
Output
81
D9
Output
82
A0
Input
83
A1
Input
84
A2
Input
Digital input. Address inputs for row and column addressing. A9=LSB,
A0=MSB.
Notes
1. All pins with the same name can be connected together.
2. Unused inputs must always be tied to an appropriate level, e.g., VDD or GND.
3. Note on power up behavior: At power on, the image sensor is in an undefined state. It is advised that after start up an address is latched as soon as possible
into the Y- decoder and the X- decoder to prevent high current consumption.
4. There is no on-chip power supply rejection. This means that every noise signal on the analog supply voltages is copied directly to the analog video signal
(decoupling of the supply voltages as close as possible to the image sensor is recommended).
Document Number: 38-05714 Rev. *B
Page 15 of 21
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Packaging and Geometrical Constraints
Package Drawing
The detector is packaged in an 84-pin J-leaded package.
The detector is mounted into position with thermally and
electrically conductive adhesive. The bottom plate of the cavity
is electrically connected to a ground pin.
The detector is positioned into the cavity such that the optical
center of the detector coincides with the geometrical center of
the cavity within a tolerance of ± 50 µm in X- and Y direction.
The tolerance on the parallelism of the detector is ± 50 µm in
X- and Y- direction.
Note: The dimensions in Figure 8.are in inches.
Figure 8. Package Drawing
Document Number: 38-05714 Rev. *B
Page 16 of 21
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STAR1000
Die Alignment
Figure 9. Die Alignment
Parallelism in
X and Y within
+ 50 mm
200 P
Y
Pin 1
Centre of Cavity
and of FPA
Centre of
Silicium
A
52 P
Bonding Cavity:
0.508+0.051
X
Offset Between Centre of
Silicium and Centre of
Cavity:
X: 52 Pm
Y: 200 Pm
Die:
0.508+0.01
A
Glass Window:
1.0+/-0.05
Window Adhesive:
0.08+0.02
Die Cavity:
0.508+0.051
A-
Die Adhesive:
0.08+0.02
Section A
Drawing Not to Scale
Glass Lids
There are 2 glass lid versions available:
• STAR1000 - Quartz glass with air inside the cavity
• STAR1000BK7 - BK7G18 glass with N2 inside the cavity
Document Number: 38-05714 Rev. *B
Page 17 of 21
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Soldering and Handling
Use a soldering iron with temperature control at the tip. The
soldering iron tip temperature should not exceed 350°C.
Soldering and Handling Conditions
The soldering period for each pin should be less than five
seconds.
Take special care when soldering image sensors onto a circuit
board. Prolonged heating at elevated temperatures may result
in deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor
performance is not compromised during end users' assembly
processes.
Board Assembly
The STAR250 is very sensitive to ESD. Device placement onto
boards should be done in accordance with strict ESD controls
for Class 0, JESD22 Human Body Model, and Class A,
JESD22 Machine Model devices. Assembly operators need to
always wear all designated and approved grounding
equipment; grounded wrist straps at ESD protected
workstations are recommended including the use of ionized
blowers. All tools should be ESD protected.
Manual Soldering
When a soldering iron is used the following conditions should
be observed:
Reflow Soldering
Reflow soldering is not allowed.
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be harmed by
the flux. Avoid mechanical or particulate damage to the cover
glass.
Use isopropyl alcohol (IPA) as a solvent for cleaning the image
sensor glass lid. When using other solvents, it should be
confirm whether the solvent will dissolve the package and/or
the glass lid.
RoHS (lead free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 9. Chemical Substances in STAR250 Sensor
Any intentional content
If there is any intentional content, in which portion
is it contained?
Lead
NO
-
Cadmium
NO
-
Mercury
NO
-
Hexavalent chromium
NO
-
PBB (Polybrominated biphenyls)
NO
-
PBDE (Polybrominated diphenyl ethers)
NO
-
Chemical Substance
Information on Lead Free Soldering
to produce and maintain the required performance and
function of the intended product
2. A case that the above material, which is used intentionally
in the manufacturing process, is contained in or adhered to
the inquired product.
The product cannot withstand a lead free soldering process.
Reflow or wave soldering Is not recommended. Hand
soldering is needed for this part type. Solder 1 pin on each side
and let the sensor cool down for minimum 1 minute before
continuing.
The following case is not treated as "intentional content":
Note: "Intentional content" is defined as any material
demanding special attention is contained into the inquired
product by these cases:
1. A case that the above material is added as a chemical
composition into the inquired product intentionally in order
A case that the above material is contained as an impurity into
raw materials or parts of the intended product. The impurity is
defined as a substance that cannot be removed industrially, or
it is produced at a process like chemical composing or reaction
and it cannot be removed technically.
Document Number: 38-05714 Rev. *B
Page 18 of 21
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STAR1000
Ordering Information
Table 10. Ordering Information
FillFactory Part Number
Cypress Part Number
Package
Glass Lid
Mono/Color
STAR1000
CYIS1SM1000AA-HQC
84-pin JLCC
Quartz
Mono
STAR1000-BK7
CYIS1SM1000AA-HHC
84-pin JLCC
BK7G18
Mono
Disclaimer
FillFactory image sensors are only warranteed to meet the
specifications as described in the production data sheet.
Document Number: 38-05714 Rev. *B
FillFactory reserves the right to change any information
contained herein without notice.
Please contact [email protected] for more information.
Page 19 of 21
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STAR1000
APPENDIX A: STAR1000 Evaluation System
For evaluating purposes, a STAR1000 evaluation kit is
available.
The STAR1000 evaluation kit consists of a multifunctional
digital board (memory, sequencer, and IEEE 1394 Fire Wire
interface) and an analog image sensor board.
Visual Basic software (under Windows 2000 or XP) allows the
grabbing and display of images from the sensor. All acquired
images can be stored in different file formats (8 or 16-bit). All
settings can be adjusted dynamically to evaluate the sensors
specs. Default register values can be loaded to start the
software in a desired state.
All products and company names mentioned in this document
may be the trademarks of their respective holders.
Document Number: 38-05714 Rev. *B
Page 20 of 21
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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Document History Page
Document Title: STAR1000 1M Pixel Radiation Hard CMOS Image Sensor
Document Number: 38-05714
REV.
ECN NO.
ISSUE
DATE
ORIG. OF
CHANGE
DESCRIPTION OF CHANGE
**
310213
SEE ECN
SIL
*A
603177
SEE ECN
QGS
Converted to Framemaker Format
*B
649371
SEE ECN
FPW
Package spec label update + ordering information update
Document Number: 38-05714 Rev. *B
Initial Cypress release
Page 21 of 21
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