ONSEMI NCN9252_11

NCN9252
High-Speed USB 2.0
(480 Mbps) DP3T Switch
for USB/UART/Data
Multiplexing
http://onsemi.com
Brief Description
MARKING
DIAGRAM
1
AD M
G
UQFN12
MU SUFFIX
CASE 523AE
AD = Specific Device Code
M = Date Code
G
= Pb−Free Package
APPLICATION DIAGRAM
NCN9252
D+
R
D−
L
USB 2.0 Signal Routing
−3 dB Bandwidth: 525 MHz
RON: 4 W Max @ VCC = 4.2 V
CON: < 20 pF @ VCC = 3.3 V
OVT Protection up to 5.25 V on Common Pins
VCC Range: 1.65 V to 4.5 V
3 kV ESD Protection
1.7 x 2.0 x 0.5 mm UQFN12 Package
This is a Pb−Free Device
IN[1:0]
March, 2011 − Rev. 1
UART
XCVR
From Baseband
ORDERING INFORMATION
Device
NCN9252MUTAG
Package
Shipping†
UQFN12
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
USB/UART/Data Multiplexing
Shared USB Connector
Mobile Phones
Portable Devices
© Semiconductor Components Industries, LLC, 2011
Remote
Data
Tx
Typical Applications
•
•
•
•
USB
XCVR
Rx
Features
•
•
•
•
•
•
•
•
•
D+
D−
USB
Connector
The NCN9252 is a DP3T switch for combined UART and USB 2.0
high−speed data applications. It allows portable systems to use a single
external port to transmit and receive signals to and from three separate
locations within the portable system. It is comprised of two switches,
each with a single common I/O that alternates between 3 terminals.
They are operated together to allow three data sources, such as a USB
or UART transceiver, to pass differential data through a shared USB
connector port.
The NCN9252 features low RON− 4 W (max) at 4.2 V VCC, 5 W
(typ) at a 3.3 V VCC. It also features low CON, < 30 pF (max) across
the supply voltage range. This performance makes it ideal for both
USB full−speed and high−speed applications that require both low
RON and CON for effective signal transmission.
The NCN9252 is capable of accepting control input signals down to
1.4 V, over a range of VCC supply voltages with minimal leakage
current. The NCN9252 is offered in a Pb−Free, 12 pin, 1.7 x 2.0 x
0.5 mm, UQFN package. An Evaluation Board specifically designed
for the NCN9252 is available and features USB connectors and test
points to allow straightforward testing of the device. Please see part
number NCN9252MUGEVB.
1
Publication Order Number:
NCN9252/D
NCN9252
FUNCTIONAL BLOCK DIAGRAM AND PINOUT
1S1
1S2
1
1S3
2
VCC
3
2S3
4
2S2
12
Control
Logic
5
6
PIN DESCRIPTIONS
IN1
11
10
COM1
9
GND
8
COM2
IN2
7
2S1
Pin#
Name
Direction
1
1S2
I/O
Switch #1 Position 2 Signal
Line
2
1S3
I/O
Switch #1 Position 3 Signal
Line
3
VCC
Input
4
2S3
I/O
Switch #2 Position 3 Signal
Line
5
2S2
I/O
Switch #2 Position 2 Signal
Line
6
2S1
I/O
Switch #2 Position 1 Signal
Line
7
IN2
Input
8
COM2
I/O
9
GND
Input
10
COM1
I/O
11
IN1
Input
12
1S1
I/O
(Top View)
Figure 1. Internal Block Diagram
Description
Power Supply
Bit 1 Control Input Select
Line
Switch #2 Common Signal
Line
Ground
Switch #1 Common Signal
Line
Bit 0 Control Input Select
Line
Switch #1 Position 1 Signal
Line
FUNCTION TABLE
IN1 [0]
IN2 [1]
COM1 Closed to:
COM2 Closed to:
0
0
No Connect
No Connect
1
0
1S1
2S1
0
1
1S2
2S2
1
1
1S3
2S3
1S1
1S2
COM1
1S3
2S1
COM2
2S2
2S3
IN1
IN2
Control
Logic
Figure 2. Functional Block Diagram
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2
NCN9252
OPERATING CONDITIONS
MAXIMUM RATINGS
Symbol
Pins
VCC
VCC
VIS
1Sx, 2Sx
Parameter
Value
Positive DC Supply Voltage
Analog Signal Voltage
COMx
VIN
IN1, IN2
Condition
Unit
−0.5 to +5.5
V
−0.5 to VCC + 0.3
V
−0.5 to 5.3
Control Input Voltage
−0.5 to 4.6
ICC
VCC
IIS_CON
1Sx, 2Sx
COMx
Analog Signal Continuous Current
$300
Closed Switch
mA
IIS_PK
1Sx, 2Sx
COMx
Analog Signal Peak Current
$500
10% Duty Cycle
mA
IIN
IN1, IN2
Control Input Current
$20
mA
−65 to 150
°C
TSTG
Positive DC Supply Current
V
50
Storage Temperature Range
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Pins
VCC
VCC
VIS
1Sx, 2Sx
Parameter
Value
Positive DC Supply Voltage
Analog Signal Voltage
COMx
VIN
IN1, IN2
TA
Condition
Unit
1.65 to 4.5
V
GND to VCC
V
GND to 4.5
Control Input Voltage
Operating Temperature Range
GND to VCC
V
−40 to 85
°C
Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where applicable.
These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions.
ESD PROTECTION
Pins
All Pins
Description
Human Body Model
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3
Minimum Voltage
3 kV
NCN9252
DC ELECTRICAL CHARACTERISTICS
CONTROL INPUT (TYPICAL: T = 255C; VCC = 3.3 V)
Symbol
Pins
Parameter
Test Conditions
VCC
Min
VIH
INx
Control Input High
Figure 3
2.7 V
3.3 V
4.2 V
1.25
1.35
1.50
VIL
INx
Control Input Low
Figure 3
2.7 V
3.3 V
4.2 V
IIN
INx
Control Input Leakage
Typ
Max
Unit
V
VIS = GND
0.4
0.4
0.5
V
$1.0
mA
Max
Unit
$1.0
mA
$1.0
mA
SUPPLY CURRENT AND LEAKAGE (TYPICAL: T = 255C; VCC = 3.3 V, VIN = VCC or GND)
Symbol
Pins
INO/NC (OFF)
NC, NO
OFF State Leakage
ICOM (ON)
COM
ON State Leakage
ICC
VCC
Quiescent Supply
VIS = VCC or GND, ID = 0;
1.0
mA
Power OFF Leakage
VIS = GND
1.0
mA
Typ
Max
Unit
5
4
3.5
6
5
4.5
W
1.3
1.4
1.6
W
IOFF
Parameter
Test Conditions
VCC
Min
Typ
VCOM = 3.6 V
VNC = 1.0 V
ON RESISTANCE (TYPICAL: T = 255C; VCC = 3.3 V)
Symbol
RON
Pins
Parameter
Test Conditions
VCC
1Sx, 2Sx COMx ON Resistance
ION = −8 mA, VIS = 0 to VCC;
2.7 V
3.3 V
4.2 V
RFLAT
1Sx, 2Sx COMx RON Flatness
ION = −8 mA, VIS = 0 to VCC;
2.7 V
3.3 V
4.2 V
DRON
1Sx, 2Sx COMx RON Matching
ION = −8 mA, VIS = 0 to VCC;
2.7 V
3.3 V
4.2 V
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4
Min
0.35
W
NCN9252
AC ELECTRICAL CHARACTERISTICS
TIMING/FREQUENCY (TYPICAL: T = 255C; VCC = 3.3 V, RL = 50 W, CL = 5 pF, f = 1 MHz)
Symbol
Pins
Parameter
Test Conditions
Min
Typ
Max
Unit
BW
−3 dB Bandwidth
Power level = 0 dBm
525
MHz
THD
Total Harmonic Distortion
20 Hz to 20 kHz, 1.0 VPP
0.01
%
tON
1Sx to 1Sy,
2Sx to 2Sy
Turn On Time
13
30
nS
tOFF
1Sy to 1Sx,
2Sy to 2Sx
Turn Off Time
12
25
nS
tBBM
1Sx to 1Sy,
2Sx to 2Sy
Break Before Make
2.0
nS
CROSSTALK: (TYPICAL: T = 255C; VCC = 3.3V, RL = 50 W, CL = 35 pF, f = 1MHz)
Symbol
Pins
OIRR
1Sx or 2Sx
Xtalk
Parameter
Off Isolation
Test Conditions
Min
VIN = 0
COMx to COMy Non−Adjacent Channel
Typ
Max
Unit
−60
dB
−60
dB
CAPACITANCE (TYPICAL: T = 255C; VCC = 3.3V, RL = 50 W, CL = 5 pF, f = 1 MHz)
Symbol
Pins
CIN
INx
CON
1Sx or 2Sx
to COM
COFF
Parameter
Test Conditions
Min
Typ
Control Input
VCC = 0 V
3
Through Switch
VCC = 3.3 V, VIN = 0 V
16
VCC = VIN = 3.3 V
8
1Sx, 2Sx COMx Unselected Port
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5
Max
Unit
pF
20
pF
pF
NCN9252
Detailed Description
Control Inputs Select Logic
The NCN9252 is a DP3T switch designed for applications
where a single USB connector is used for multiple data
applications within a portable system. Two differential
signals from a USB connector can be routed to 3 different
end locations. The first, channel 1, is optimized for a
high−speed, USB 2.0 transceiver. The second and third,
channels 2 and 3, are optimized for UART or remote data
applications.
The NCN9252 is made up of two, triple−throw switches
operating off of the same internal enable signal. For each
switch, a signal can pass from the common pin to any of
three terminals. Whenever COM1 is closed to terminal 1S2,
COM2 will respectively be closed to terminal 2S2. The
select logic is controlled by two inputs, IN1 and IN2,
connecting the common pins to the terminals according to
the function table found on page 2. Since there are four
possible control states but only 3 possible terminals, the first
combination results in a open connection for all three
terminals.
VIH and VIL Levels
200
190
180
170
VCC = 4.2 V
160
150
140
130
ICC (mA)
120
110
100
90 V = 3.3 V
CC
80
70
60
50
40
30
VCC =
2.7 V
20
10
0
0
0.4
0.8
1.2
1.6
2.0
VIN (V)
2.4
Figure 3. ICC Leakage Current vs. VIN
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6
2.8
3.2
NCN9252
4.5
5
4.5
85°C
4
4
25°C
3.5
25°C
3
3
−40°C
RON (W)
RON (W)
3.5
85°C
2.5
2
−40°C
2.5
2
1.5
1.5
1
1
0.5
0.5
0
0
0.5
1
1.5
2
0
2.5
0
0.5
1
1.5
VIN (V)
0
−1
25°C
3
−2
−40°C
BW (dB)
RON (W)
2.5
2
1.5
−3
−4
−5
1
−6
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
−7
1E06
4
1E07
Figure 6. On−Resistance vs. Input Voltage
@ VCC = 4.2 V
1E09
Figure 7. Bandwidth vs. Frequency
0
0.009
−10
0.008
−20
0.007
−30
0.006
THD (%)
−40
−50
−60
0.005
0.004
0.003
−70
−80
0.002
−90
0.001
−100
10000
1E08
FREQUENCY (Hz)
VIN (V)
MAGNITUDE (dB)
3
Figure 5. On−Resistance vs. Input Voltage
@ VCC = 3.3 V
85°C
3.5
2.5
VIN (V)
Figure 4. On−Resistance vs. Input Voltage
@ VCC = 2.7 V
4
2
100000
1E06
1E07
1E08
1E09
0
10
100
1000
10000
100000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8. Cross Talk vs. Frequency
@ 255C
Figure 9. Total Harmonic Distortion vs.
Frequency
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7
NCN9252
Figure 10. Channel 1S1/2S1 USB2.0 Near End Eye
Diagram (VCC = 3.3 V, IN1 = 1, IN2 = 0, Temp = 255C)
Figure 11. Channel 1S2/2S2 USB2.0 Near End Eye
Diagram (VCC = 3.3 V, IN1 = 0, IN2 = 1, Temp = 255C)
Figure 12. Channel 1S3/2S3 USB2.0 Near End Eye
Diagram (VCC = 3.3 V, IN1 = 1, IN2 = 1, Temp = 255C)
Figure 13. Channel 1S1/2S1 USB2.0 Far End Eye
Diagram (VCC = 3.3 V, IN1 = 1, IN2 = 0, Temp = 255C)
Figure 14. Channel 1S2/2S2 USB2.0 Far End Eye
Diagram (VCC = 3.3 V, IN1 = 0, IN2 = 1, Temp = 255C)
Figure 15. Channel 1S3/2S3 USB2.0 Far End Eye
Diagram (VCC = 3.3 V, IN1 = 1, IN2 = 1, Temp = 255C)
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8
NCN9252
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE−01
ISSUE A
ÉÉ
ÉÉ
ÉÉ
D
PIN 1 REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
L1
DETAIL A
E
NOTE 5
TOP VIEW
DIM
A
A1
A3
b
D
E
e
K
L
L1
L2
DETAIL B
A
0.05 C
12X
0.05 C
A1
A3
8X
C
SIDE VIEW
SEATING
PLANE
K
5
7
DETAIL A
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
e
1
12X
DETAIL B
OPTIONAL
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.70 BSC
2.00 BSC
0.40 BSC
0.20
---0.45
0.55
0.00
0.03
0.15 REF
11
L
2.00
12X
L2
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
1
NOTE 3
0.32
2.30
0.40
PITCH
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCN9252/D