CYPRESS CY2314ANZ_08

CY2314ANZ
14 Output, 3.3V SDRAM Buffer for
Desktop PCs with 3 DIMMs
Features
Functional Description
■
One input to 14 output buffer or driver
■
Supports up to three SDRAM DIMMs
■
Two additional outputs for feedback
■
Serial interface for output control
The CY2314ANZ is a 3.3V buffer designed to distribute high
speed clocks in desktop PC applications. The part has 14
outputs, 12 of which can be used to drive up to three SDRAM
DIMMs. The remaining can be used for external feedback to a
PLL. The device operates at 3.3V and outputs can run up to 100
MHz.
■
Low skew outputs
■
Up to 100 MHz operation
■
Multiple VDD and VSS pins for noise reduction
■
Dedicated OE pin for testing
■
Low EMI outputs
■
28-pin SOIC (300-mil) package
■
3.3V operation
The CY2314ANZ also includes a serial interface which can
enable or disable each output clock. On power up, all output
clocks are enabled. A separate Output Enable pin facilitates
testing on ATE.
Logic Block Diagram
BUF_IN
SDRAM0
SDRAM1
SDRAM2
SDRAM3
SDATA
SDRAM4
SDRAM5
SDRAM6
SDRAM7
SDRAM8
SDRAM9
SDRAM10
SDRAM11
SDRAM12
SDRAM13
Serial Interface
Decoding
SCLOCK
OE
Cypress Semiconductor Corporation
Document #: 38-07143 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised November 10, 2008
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CY2314ANZ
Pin Configuration
Figure 1. 28-Pin SOIC Top View
VDD
SDRAM0
SDRAM1
VSS
VDD
SDRAM2
SDRAM3
VSS
BUF_IN
SDRAM4
SDRAM5
SDRAM12
VDDIIC
SDATA
1
2
V DD
SDRAM11
SDRAM10
V SS
V DD
SDRAM9
SDRAM8
V SS
OE
SDRAM7
SDRAM6
SDRAM13
V SSIIC
SCLK
28
27
3
4
26
5
6
24
7
22
8
21
9
10
20
19
11
18
12
17
13
16
14
15
25
23
Device Functionality
OE
SDRAM [0-13]
0
High-Z
1
1 x BUF_IN
Serial Configuration Map
■
The serial bits are read by the clock driver in the following order:
Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0
Table 2. Byte 1: SDRAM Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0
Bit
Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0
Bit 7
27
SDRAM11 (Active/Inactive)
Pin #
Description
■
Reserved and unused bits should be programmed to “0”
Bit 6
26
SDRAM10 (Active/Inactive)
■
Serial interface address for the CY2314ANZ is:
Bit 5
23
SDRAM9 (Active/Inactive)
Bit 4
22
SDRAM8 (Active/Inactive)
Bit 3
--
Reserved, Drive to 0
Bit 2
--
Reserved, Drive to 0
Bit 1
19
SDRAM7 (Active/Inactive)
Bit 0
18
SDRAM6 (Active/Inactive)
A6
A5
A4
A3
A2
A1
A0
R/W
1
1
0
1
0
0
1
----
Table 1. Byte 0: SDRAM Active/Inactive Register
(1 = Enable, 0 = Disable), Default = Enabled
Bit
Pin #
Description
Bit 7 11
SDRAM5 (Active/Inactive)
Bit 6 10
SDRAM4 (Active/Inactive)
Bit 5 --
Reserved, Drive to 0
Bit 4 --
Reserved, Drive to 0
Bit 3 7
SDRAM3 (Active/Inactive)
Bit 2 6
SDRAM2 (Active/Inactive)
Bit 1 3
SDRAM1 (Active/Inactive)
Bit 0 2
SDRAM0 (Active/Inactive)
Document #: 38-07143 Rev. *B
Table 3. Byte 2: SDRAM Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit
Pin #
Description
Bit 7
17
SDRAM13 (Active/Inactive)
Bit 6
12
SDRAM12 (Active/Inactive)
Bit 5
--
Reserved, Drive to 0
Bit 4
--
Reserved, Drive to 0
Bit 3
--
Reserved, Drive to 0
Bit 2
--
Reserved, Drive to 0
Bit 1
--
Reserved, Drive to 0
Bit 0
--
Reserved, Drive to 0
Page 2 of 8
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CY2314ANZ
Maximum Ratings
Supply Voltage to Ground Potential................–0.5V to +7.0V
Storage Temperature ................................. –65°C to +150°C
DC Input Voltage (Except BUF_IN) ....... –0.5V to VDD + 0.5V
Junction Temperature................................................. 150°C
DC Input Voltage (BUF_IN) ............................–0.5V to +7.0V
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ............................. >2000V
Operating Conditions [1]
Parameter
Description
VDD
Supply Voltage
Min
Max
Unit
3.135
3.465
V
0
TA
Operating Temperature (Ambient Temperature)
70
°C
CL
Load Capacitance
30
pF
CIN
Input Capacitance
7
pF
tPU
Power up time for all VDDs to reach minimum specified voltage
(power ramps must be monotonic)
0.05
50
ms
Min
Max
Unit
0.8
V
0.7
V
Electrical Characteristics Over the Operating Range
Parameter
Description
Voltage[2]
Test Conditions
VIL
Input LOW
VILiic
Input LOW Voltage
VIH
Input HIGH Voltage[2]
IIL
Input LOW Current
(BUF_IN input)
VIN = 0V
IIL
Input LOW Current
(Except BUF_IN Pin)
VIN = 0V
IIH
Input HIGH Current
VIN = VDD
VOL
VOH
Except serial interface pins
For serial interface pins only
2.0
Output LOW
Voltage[3]
IOL = 25 mA
Output HIGH
Voltage[3]
IOH = –36 mA
Current[3]
IDD
Supply
IDD
Supply Current[3]
IDD
–10
–10
V
10
μA
100
μA
10
μA
0.4
V
2.4
V
Unloaded outputs, 100 MHz
200
mA
Loaded outputs, 100 MHz
290
mA
Supply
Current[3]
Unloaded outputs, 66.67 MHz
150
mA
IDD
Supply
Current[3]
Loaded outputs, 66.67 MHz
185
mA
IDDS
Supply Current
BUF_IN=VDD or VSS
All other inputs at VDD
500
μA
Notes
1. Electrical parameters are guaranteed under the operating conditions specified.
2. BUF_IN input has a threshold voltage of VDD/2.
3. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Document #: 38-07143 Rev. *B
Page 3 of 8
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CY2314ANZ
Switching Characteristics[4] Over the Operating Range
Parameter
Name
Test Conditions
Min
Typ
Maximum Operating Frequency
[3, 5]
Duty Cycle
= t2 ÷ t1
Max
Unit
100
MHz
Measured at 1.5V
45.0
50.0
55.0
%
t3
Rising Edge Rate
[3]
Measured between 0.4V and 2.4V
0.9
1.5
4.0
V/ns
t4
Falling Edge Rate[3]
Measured between 2.4V and 0.4V
0.9
1.5
4.0
V/ns
+250
ps
[3]
t5
Output to Output Skew
t6
SDRAM Buffer LH Propogation
Delay[3]
Input edge greater than 1 V/ns
1.0
3.5
5.0
ns
t7
SDRAM Buffer HL Propogation
Delay[3]
Input edge greater than 1 V/ns
1.0
3.5
5.0
ns
t8
SDRAM Buffer Enable Delay[3]
Input edge greater than 1 V/ns
1.0
5
12
ns
t9
Delay[3]
Input edge greater than 1 V/ns
1.0
20
30
ns
SDRAM Buffer Disable
All outputs equally loaded
–250
Switching Waveforms
Figure 2. Duty Cycle Timing
t1
t2
1.5V
1.5V
1.5V
Figure 3. All Outputs Rise/Fall Time
OUTPUT
2.4V
0.4V
2.4V
0.4V
t3
3.3V
0V
t4
Figure 4. Output-Output Skew
OUTPUT
1.5V
1.5V
OUTPUT
t5
Notes
4. All parameters specified with loaded outputs.
5. Duty cycle of input clock is 50%. Rising and falling edge rate of the input clock is greater than 1 V/ns.
Document #: 38-07143 Rev. *B
Page 4 of 8
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CY2314ANZ
Switching Waveforms (continued)
Figure 5. SDRAM Buffer LH and HL Propagataion Delay
INPUT
OUTPUT
t6
t7
Figure 6. SDRAM Buffer Enable and Disable Times
OE
Three-State
OUTPUTS
t8
Active
t9
Test Circuit
VDD
0.1 μF
OUTPUTS
CLK out
CLOAD
GND
Document #: 38-07143 Rev. *B
Page 5 of 8
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CY2314ANZ
Application Information
Clock traces must be terminated with either series or parallel termination, as is normally done.
Figure 7. Application Circuit
Rs
CPUCLK
BUF_IN
PCICLK
USBCLK
REF
Rs
SDATA
SDATA
SCLK
SDRAM(0-13)
SDRAM(0-13)
SCLK
V DD 3.3V
APIC
Ct
V DD
* CY2280 48 Pin SSOP
(or CY2281 or CY2282)
Cd
0.1uF
VSS
CY 2314 28 Pin SOIC
* This Frequency Synthesizer is used to generate
CPU, PCI, USB, REF, and APIC Clocks
Cd = DECOUPLING CAPACITORS
Ct = OPTIONAL EMI- REDUCING CAPACITORS
Rs = SERIES TERMINATING RESISTORS
Recommendation
■
Surface mount, low ESR,and ceramic capacitors must be used for filtering. Typically, these capacitors have a value of 0.1 μF. In
some cases, smaller value capacitors may be required.
■
The value of the series terminating resistor satisfies the following equation, where Rtrace is the loaded characteristic impedance of
the trace, Rout is the output impedance of the buffer (typically 25Ω), and Rseries is the series terminating resistor.
Rseries > Rtrace – Rout
■
Footprints must be laid out for optional EMI reducing capacitors, which should be placed as close to the terminating resistor as is
physically possible. Typical values of these capacitors range from 4.7 pF to 22 pF.
■
A ferrite bead may be used to isolate the board VDD from the clock generator VDD island. Ensure that the ferrite bead offers greater
than 50Ω impedance at the clock frequency, under loaded DC conditions. Refer to the application note Layout and Termination
Techniques for Cypress Clock Generators for more details.
■
If a ferrite bead is used, a 10 μF to 22 μF tantalum bypass capacitor should be placed close to the ferrite bead. This capacitor
prevents power supply droop during current surges.
Ordering Information
Ordering Code
Package
Name
Package Type
Operating
Range
Pb-Free
CY2314ANZSXC-1
SZ283
28-Pin SOIC
Commercial
CY2314ANZSXC-1T
SZ283
28-Pin SOIC - Tape and Reel
Commercial
Document #: 38-07143 Rev. *B
Page 6 of 8
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CY2314ANZ
Package Diagram
Figure 8. 28-Pin (300-Mil) Molded SOIC SZ283
51-85026-A
Document #: 38-07143 Rev. *B
Page 7 of 8
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CY2314ANZ
Document History Page
Document Title: CY2314ANZ 14 Output, 3.3V SDRAM Buffer for Desktop PCs with 3 DIMMs
Document Number: 38-07143
Rev.
ECN No.
Orig. of
Change
Submission Description of Change
Date
**
110252
DSG
11/18/01
Change from Spec number: 38-00687 to 38-07143
*A
121830
RBI
12/14/02
Power up requirements added to Operating Conditions Information
*B
2606695
KVM/PYRS
11/13/08
Update Ordering Information Table:
Remove CY2314ANZSC-1
Add Pb-free devices CY2314ANZSXC-1 and CY2314ANZSXC-1T
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© Cypress Semiconductor Corporation, 2005-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-07143 Rev. *B
Revised November 10, 2008
Page 8 of 8
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document
are the trademarks of their respective holders.
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