CYPRESS CY7C1019D_10

CY7C1019D
1-Mbit (128K x 8) Static RAM
Functional Description [1]
Features
• Pin- and function-compatible with CY7C1019B
The CY7C1019D is a high-performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE), an
active LOW Output Enable (OE), and tri-state drivers. This
device has an automatic power-down feature that significantly
reduces power consumption when deselected. The eight input
and output pins (IO0 through IO7) are placed in a
high-impedance state when:
• High speed
— tAA = 10 ns
• Low active power
— ICC = 80 mA @ 10 ns
• Low CMOS standby power
— ISB2 = 3 mA
• Deselected (CE HIGH)
• Outputs are disabled (OE HIGH)
• When the write operation is active (CE LOW, and WE LOW).
• 2.0V Data retention
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Center power/ground pinout
• Easy memory expansion with CE and OE options
• Functionally equivalent to CY7C1019B
• Available in Pb-free 32-pin 400-Mil wide Molded SOJ and
32-pin TSOP II packages
Write to the device by taking Chip Enable (CE) and Write
Enable (WE) inputs LOW. Data on the eight IO pins (IO0
through IO7) is then written into the location specified on the
address pins (A0 through A16).
Read from the device by taking Chip Enable (CE) and Output
Enable (OE) LOW while forcing Write Enable (WE) HIGH.
Under these conditions, the contents of the memory location
specified by the address pins appears on the IO pins.
Logic Block Diagram
IO0
INPUT BUFFER
IO1
128K x 8
ARRAY
IO2
SENSE AMPS
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
A7
A8
IO3
IO4
IO5
IO6
CE
COLUMN DECODER
WE
A9
A10
A11
A12
A13
A14
A15
A16
OE
IO7
POWER
DOWN
Note
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05464 Rev. *F
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised December 14, 2010
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CY7C1019D
Pin Configuration
SOJ/TSOPII
Top View
A0
A1
A2
A3
CE
IO 0
IO 1
VCC
V SS
IO 2
IO 3
WE
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A15
A14
A13
OE
IO 7
IO 6
VSS
VCC
IO 5
IO 4
A12
A11
A10
A9
A8
Selection Guide
–10 (Industrial)
Unit
Maximum Access Time
10
ns
Maximum Operating Current
80
mA
Maximum Standby Current
3
mA
Document #: 38-05464 Rev. *F
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CY7C1019D
Maximum Ratings
Current into Outputs (LOW) ........................................ 20 mA
Exceeding the maximum ratings may impair the useful life of
the device. These user guidelines are not tested.
Storage Temperature ................................. –65C to +150C
Ambient Temperature with
Power Applied............................................. –55C to +125C
Supply Voltage on VCC to Relative GND [2] ... –0.5V to +6.0V
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current .................................................... > 200 mA
Operating Range
DC Voltage Applied to Outputs
in High-Z State [2] ...................................–0.5V to VCC + 0.5V
Range
Ambient
Temperature
VCC
Speed
Industrial
–40C to +85C
5V  0.5V
10 ns
DC Input Voltage [2]................................–0.5V to VCC + 0.5V
Electrical Characteristics (Over the Operating Range)
Parameter
Description
–10 (Industrial)
Test Conditions
VOH
Output HIGH Voltage
IOH = –4.0 mA
VOL
Output LOW Voltage
IOL = 8.0 mA
VIH
Input HIGH Voltage
Min
Max
2.4
[2]
Unit
V
0.4
V
2.2
VCC + 0.5
V
–0.5
0.8
V
VIL
Input LOW Voltage
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
A
IOZ
Output Leakage Current
GND < VI < VCC, Output Disabled
–1
+1
A
ICC
VCC Operating Supply Current
VCC = Max,
IOUT = 0 mA,
f = fmax = 1/tRC
100 MHz
80
mA
83 MHz
72
mA
66 MHz
58
mA
40 MHz
37
mA
ISB1
Automatic CE Power-Down
Current—TTL Inputs
Max VCC, CE > VIH
VIN > VIH or VIN < VIL, f = fmax
10
mA
ISB2
Automatic CE Power-Down
Current—CMOS Inputs
Max VCC, CE > VCC – 0.3V,
VIN > VCC – 0.3V, or VIN < 0.3V, f = 0
3
mA
Note
2. VIL (min) = –2.0V and VIH(max) = VCC + 1V for pulse durations of less than 5 ns.
Document #: 38-05464 Rev. *F
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CY7C1019D
Capacitance [3]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
Max
Unit
6
pF
8
pF
TA = 25C, f = 1 MHz, VCC = 5.0V
Thermal Resistance [3]
Parameter
Description
JA
Thermal Resistance
(Junction to Ambient)
JC
Thermal Resistance
(Junction to Case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
400-Mil
Wide SOJ
TSOP II
Unit
56.29
62.22
C/W
38.14
21.43
C/W
AC Test Loads and Waveforms [4]
ALL INPUT PULSES
3.0V
Z = 50
90%
OUTPUT
50 
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
30 pF*
90%
10%
10%
GND
1.5V
Rise Time: 3 ns
(a)
(b)
Fall Time: 3 ns
High-Z characteristics:
R1 480
5V
OUTPUT
INCLUDING
JIG AND
SCOPE
R2
255
5 pF
(c)
Notes
3. Tested initially and after any design or process changes that may affect these parameters.
4. AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load
shown in Figure (c).
Document #: 38-05464 Rev. *F
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CY7C1019D
Switching Characteristics (Over the Operating Range) [5]
Parameter
Description
–10 (Industrial)
Min
Max
Unit
Read Cycle
tpower [6]
VCC(typical) to the first access
100
s
tRC
Read Cycle Time
10
ns
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
10
ns
CE LOW to Data Valid
10
ns
tDOE
OE LOW to Data Valid
5
ns
tLZOE
OE LOW to Low Z
tHZOE
tLZCE
tHZCE
ns
0
OE HIGH to High Z
CE LOW to Low Z
3
[7, 8]
[8]
CE HIGH to High Z
5
3
[7, 8]
tPU
[9]
CE LOW to Power-Up
tPD
[9]
CE HIGH to Power-Down
ns
ns
ns
5
0
ns
ns
10
ns
Write Cycle [10, 11]
tWC
Write Cycle Time
10
ns
tSCE
CE LOW to Write End
7
ns
tAW
Address Set-Up to Write End
7
ns
tHA
Address Hold from Write End
0
ns
tSA
Address Set-Up to Write Start
0
ns
tPWE
WE Pulse Width
7
ns
tSD
Data Set-Up to Write End
6
ns
tHD
Data Hold from Write End
0
ns
3
ns
tLZWE
tHZWE
WE HIGH to Low Z
[8]
WE LOW to High Z
[7, 8]
5
ns
Notes
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
6. tPOWER gives the minimum amount of time that the power supply should be at typical VCC values until the first memory access can be performed.
7. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in (c) of “AC Test Loads and Waveforms [4]” on page 4. Transition is measured when the outputs enter a
high impedance state.
8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
9. This parameter is guaranteed by design and is not tested.
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of
these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
11. The minimum write cycle time for Write Cycle no. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 38-05464 Rev. *F
Page 5 of 13
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CY7C1019D
Data Retention Characteristics (Over the Operating Range)
Parameter
Description
Conditions
VDR
VCC for Data Retention
ICCDR
Data Retention Current
tCDR [3]
Chip Deselect to Data Retention Time
tR
[12]
Min
Max
2.0
VCC = VDR = 2.0V, CE > VCC – 0.3V,
VIN > VCC – 0.3V or VIN < 0.3V
V
3
Operation Recovery Time
Unit
mA
0
ns
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
4.5V
VCC
VDR > 2V
4.5V
tR
tCDR
CE
Switching Waveforms
Read Cycle No. 1 (Address Transition Controlled) [13, 14]
tRC
RC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled) [14, 15]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
DATA OUT
tLZOE
HIGH IMPEDANCE
tHZCE
DATA VALID
tLZCE
VCC
SUPPLY
CURRENT
HIGH
IMPEDANCE
tPD
tPU
50%
ICC
50%
ISB
Notes
12. Full device operation requires linear VCC ramp from VDR to VCC(min) > 50 s or stable at VCC(min) > 50 s.
13. Device is continuously selected. OE, CE = VIL.
14. WE is HIGH for Read cycle.
15. Address valid prior to or coincident with CE transition LOW.
Document #: 38-05464 Rev. *F
Page 6 of 13
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CY7C1019D
Switching Waveforms (continued)
Write Cycle No. 1 (CE Controlled) [16, 17]
tWC
ADDRESS
tSCE
CE
tSA
tSCE
tAW
tHA
tPWE
WE
tSD
DATA IO
tHD
DATA VALID
Write Cycle No. 2 (WE Controlled, OE HIGH During Write) [16, 17]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
OE
tSD
DATA IO
tHD
DATAIN VALID
NOTE 18
tHZOE
Notes
16. Data IO is high impedance if OE = VIH.
17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
18. During this period the IOs are in the output state and input signals should not be applied.
Document #: 38-05464 Rev. *F
Page 7 of 13
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CY7C1019D
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled, OE LOW) [11, 17]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
tSD
DATA IO
NOTE 18
tHD
DATA VALID
tLZWE
tHZWE
Truth Table
CE
OE
WE
IO0–IO7
H
X
X
High Z
Power-Down
Standby (ISB)
L
L
H
Data Out
Read
Active (ICC)
L
X
L
Data In
Write
Active (ICC)
L
H
H
High Z
Selected, Outputs Disabled
Active (ICC)
Document #: 38-05464 Rev. *F
Mode
Power
Page 8 of 13
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CY7C1019D
Ordering Information
Speed
(ns)
10
Ordering Code
Package
Diagram
Package Type
CY7C1019D-10VXI
51-85033
32-pin (400-Mil) Molded SOJ (Pb-free)
CY7C1019D-10ZSXI
51-85095
32-pin TSOP Type II (Pb-free)
Operating
Range
Industrial
Ordering Code Definitions
CY 7 C 1 01 9 D - 10 XXX I
Temperature Range:
I = Industrial
Package Type: XXX = VX or ZSX
VX = 32-pin Molded SOJ (Pb-free)
ZSX = 32-pin TSOP Type II (Pb-free)
Speed: 10 ns
D = C9, 90 nm Technology
9 = Data width × 8-bits
01 = 1-Mbit density
1 = Fast Asynchronous SRAM family
Technology Code: C = CMOS
7 = SRAM
CY = Cypress
Please contact your local Cypress sales representative for availability of these parts.
Document #: 38-05464 Rev. *F
Page 9 of 13
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CY7C1019D
Package Diagrams
Figure 1. 32-pin (400-Mil) Molded SOJ (51-85033)
51-85033 *C
Document #: 38-05464 Rev. *F
Page 10 of 13
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CY7C1019D
Package Diagrams (continued)
Figure 2. 32-pin Thin Small Outline Package Type II (51-85095)
51-85095 *A
All product or company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05464 Rev. *F
Page 11 of 13
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CY7C1019D
Document History Page
Document Title: CY7C1019D, 1-Mbit (128K x 8) Static RAM
Document Number: 38-05464
REV.
ECN NO.
Issue Date
Orig. of
Change
**
201560
See ECN
SWI
Advance Information data sheet for C9 IPP
*A
233715
See ECN
RKF
DC parameters are modified as per EROS (Spec # 01-2165)
Pb-free offering in the Ordering Information
*B
262950
See ECN
RKF
Added Tpower Spec in Switching Characteristics table
Added Data Retention Characteristics table and waveforms
Shaded Ordering Information
*C
307598
See ECN
RKF
Reduced Speed bins to -10 and -12 ns
*D
520647
See ECN
VKN
Converted from Preliminary to Final
Removed Commercial Operating range
Removed 12 ns speed bin
Added ICC values for the frequencies 83MHz, 66MHz and 40MHz
Updated Thermal Resistance table
Updated Ordering Information Table
Changed Overshoot spec from VCC+2V to VCC+1V in footnote #2
*E
802877
See ECN
VKN
Changed ICC spec from 60 mA to 80 mA for 100MHz, 55 mA to 72 mA
for 83MHz, 45 mA to 58 mA for 66MHz, 30 mA to 37 mA for 40MHz
*F
3110052
12/14/2010
AJU
Added Ordering Code Definitions.
Updated Package Diagrams.
Document #: 38-05464 Rev. *F
Description of Change
Page 12 of 13
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CY7C1019D
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the
office closest to you, visit us at cypress.com/sales.
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© Cypress Semiconductor Corporation, 2004-2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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