DIODES ZHCS400

ZHCS400
SOD323 SILICON HIGH CURRENT SCHOTTKY BARRIER DIODE
“SuperBAT”
FEATURES
PINOUT - TOP VIEW
• Low VF
SOD323
• High current capability
• Miniature surface mount package
APPLICATIONS
• DC - DC converters
• Mobile telecomms
• PCMCIA
DEVICE MARKING
Partmark is for example only
• Partmark detail - BD
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
UNIT
Continuous Reverse Voltage
VR
40
V
Forward Current (Continuous)
IF
400
mA
Forward Voltage @ I F =400mA
VF
500
mV
Average Peak Forward Current; D.C. = 50%
I FAV
1000
mA
Non Repetitive Forward Current
I FSM
6.75
3
A
A
Power Dissipation at T amb =25°C
P tot
250
mW
Storage Temperature Range
T stg
-55 to +150
°C
tⱕ100μs
tⱕ10ms
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated)
PARAMETER
SYMBOL
MIN.
Reverse Breakdown Voltage
V (BR)R
40
Forward Voltage
VF
Reverse Current
Diode Capacitance
TYP.
MAX.
UNIT
V
I R =200μA
270
300
370
425
550
640
810
440
300
350
460
500
670
780
1050
mV
mV
mV
mV
mV
mV
mV
mV
I F =50mA
I F =100mA
I F =250mA
I F =400mA
I F =750mA
I F =1000mA
I F =1500mA
I F =500mA, T amb =100°C
IR
15
40
CD
20
60
CONDITIONS
μA
V R =30V
pF
f=1MHz,V R =25V
Issue 5 - February 2008
SEMICONDUCTORS
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ZHCS400
TYPICAL CHARACTERISTICS
Issue 5 - February 2008
SEMICONDUCTORS
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ZHCS400
TYPICAL CHARACTERISTICS (Cont.)
Issue 5 - February 2008
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SEMICONDUCTORS
ZHCS400
NOTES:
Issue 5 - February 2008
SEMICONDUCTORS
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ZHCS400
Definitions
Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service.
Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's
application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with
respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or
otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence),
breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use
of these circuit applications, under any circumstances.
Life support
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Reproduction
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in
writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating
to the products or services concerned.
Terms and Conditions
All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the
terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.
Quality of product
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally
authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales
channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The
possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage
can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of
being affected should be replaced.
Green compliance
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory
requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of
hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and
ELV directives.
Product status key:
"Preview"Future device intended for production at some point. Samples may be available
"Active"Product status recommended for new designs
"Last time buy (LTB)"Device will be discontinued and last time buy period and delivery is in effect
"Not recommended for new designs"Device is still in production to support existing designs and production
"Obsolete"Production has been discontinued
Datasheet status key:
"Draft version"This term denotes a very early datasheet version and contains highly provisional
information, which may change in any manner without notice.
"Provisional version"This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to
the test conditions and specifications may occur, at any time and without notice.
"Issue"This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and
without notice.
Issue 5 - February 2008
5
SEMICONDUCTORS
ZHCS400
PACKAGE DIMENSIONS
PACKAGE OUTLINE
Millimeters
DIM
Millimeters
DIM
Min
Max
Min
Max
A
-
1.150
D
1.520
1.800
A1
0.000
0.100
D1
2.300
2.700
A2
0.800
-
E
1.150
1.450
b
0.250
0.400
L
0.100
0.400
c
0.080
0.200
-
-
-
© Zetex Semiconductors plc 2008
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These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
Issue 5 - February 2008
SEMICONDUCTORS
6