A Product Line of Diodes Incorporated ZXGD3005E6 ADVANCE INFORMATION 10A (PEAK) GATE DRIVER IN SOT26 Description and Applications Features and Benefits The ZXGD3005E6 is a high-speed non-inverting single gate driver capable of driving up to 10A into a MOSFET or IGBT gate capacitive load from supply voltages up to 25V. With propagation delay times down to <10ns and correspondingly rise/fall times of <20ns. • This gate driver ensures rapid switching of the MOSFET or IGBT to minimize power losses and distortion in high current switching applications. It is ideally suited to act as a voltage buffer between the typically high output impedances of a controller IC and the effectively low impedance on the gate of a power MOSFET or IGBT during switching. Its low input voltage requirement and high current gain allows high current driving from low voltage controller ICs. The ZXGD3005E6 has separate source and sink outputs that enables the turn-on and turn-off times of the MOSFET or IGBT to be independently controlled. In addition, the wide supply voltage range allows full enhancement of the MOSFET or IGBT to minimize on-state losses and permits +15V to -5V gate drive voltage to prevent dV/dt induced false triggering of IGBTs. The ZXGD3005E6 has been designed to be inherently rugged to latch-up and shoot-through issues. The optimized pin-out SOT26 package eases board layout, enabling reduced parasitic inductance of traces. VCC • • • • • Mechanical Data Case: SOT26 Case material: Molded Plastic. “Green” Molding Compound. UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish Weight: 0.018 grams (approximate) Source IN 1 • • • • • • • Power MOSFET and IGBT Gate Driving in: • Synchronous switch-mode power supplies • Power Factor Correction (PFC) in power supplies • Secondary side synchronous rectification • Plasma Display Panel power modules • 1, 2 and 3-phase motor control circuits • Audio switching amplifier power output stages • Solar inverters SOT26 • • • • • Emitter-follower configuration for ultra-fast switching • <10ns propagation delay time • <20ns rise/fall time Non-inverting voltage buffer stage Wide supply voltage up to 25V to minimize on-losses 10A peak current drive into capacitive loads Low input current of 1mA to deliver 4A output current Separate source and sink outputs for independent control of rise and fall time Optimized pin-out to ease board layout and minimize parasitic inductance of traces Rugged design that avoids latch-up or shoot-through issues Near - Zero quiescent and output leakage current “Lead-Free”, RoHS Compliant (Note 1) “Green” Devices (Note 2) Qualified to AEC-Q101 Standards for High Reliability Do Not Connect Sink GND Top View Pin-Out Top View Pin Name Pin Function VCC Driver supply IN Driver input pin GND Ground SOURCE Source current output SINK Sink current output Ordering Information (Note 3) Product ZXGD3005E6TA Notes: Marking 3005 Reel size (inches) 7 Tape width (mm) 8 Quantity per reel 3000 1. No purposefully added lead 2. “Green” devices, Halogen and Antimony Free, Diodes Inc’s “Green” Policy can be found on our website at http://www.diodes.com 3. For packaging details, go to our website at http://www.diodes.com Marking Information 3005 ZXGD3005E6 Document Number DS35095 Rev. 1 – 2 3005 = Product Type Marking Code 1 of 7 www.diodes.com December 2010 © Diodes Incorporated A Product Line of Diodes Incorporated Typical Application Circuit VS VCC VCC Controller IC ADVANCE INFORMATION ZXGD3005E6 SOURCE RSOURCE IN ZXGD3005 SINK RSINK GND Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Supply voltage Input voltage Peak output current Input current Symbol VCC VIN IPK IIN Value 25 25 ±10 ±100 Unit V V A mA Value 1.1 8.8 113 105 -55 to +150 Unit W mW/°C Thermal Characteristics @TA = 25°C unless otherwise specified Characteristic Power Dissipation (Notes 4 & 5) Linear derating factor Thermal Resistance, Junction to Ambient (Notes 4 & 5) Thermal Resistance, Junction to Lead (Note 6) Operating and Storage Temperature Range Notes: Symbol PD RθJA RθJL TJ, TSTG °C/W °C 4. For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured when operating in a steady-state condition. The heatsink is split in half with the pin 1 (VCC) and pin 3 (GND) connected separately to each half. 5. For device with two active die running at equal power. 6. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 3 (GND). ZXGD3005E6 Document Number DS35095 Rev. 1 – 2 2 of 7 www.diodes.com December 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ADVANCE INFORMATION ZXGD3005E6 Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Output voltage, high Output voltage, low Source output leakage current (Quiescent supply) Sink output leakage current Source current Sink current Symbol BVOH BVOL IL(source) IL(sink) I(source) I(sink) Source current with varying input resistances I(source) Sink current with varying input resistances I(sink) td(rise) tr td(fall) tf td(rise) tr td(fall) tf td(rise) tr td(fall) tf Switching times with low input resistance Switching times with high input resistance Switching times with asymmetric source and sink resistance Min - Typ VCC - 0.79 0.78 4.0 3.8 Max 50 50 - Unit - 6.4 5.5 3.9 2.2 0.44 - A - 7.7 6.5 4.4 2.3 0.46 - A - 8 48 16 35 - ns - 46 419 47 467 - ns Test Condition ISOURCE = 1μA ISINK = 1μA VCC= 25V, VIN = 0V VCC= 25V,VIN = VCC VCC= 5V, IIN= 1mA, VOUT= 0V VCC= 5V, IIN=-1mA, VOUT= 5V CL = 100nF RIN = 200Ω RL = 0.18Ω RIN = 1kΩ VCC = 15V RIN = 10 kΩ VIN = 15V RIN = 100 kΩ RSOURCE = 0 Ω RIN = 1000 kΩ RSINK = 0 Ω CL = 100nF RIN = 200Ω RL = 0.18Ω RIN = 1 kΩ VCC = 15V RIN = 10 kΩ VIN = 15V RIN = 100 kΩ RSOURCE = 0 Ω RIN = 1000 kΩ RSINK = 0 Ω RIN = 1kΩ, CL = 10nF RL = 0.18Ω, VCC = 15V VIN = 15V, RSOURCE = 0 Ω, RSINK = 0 Ω RIN = 1kΩ, CL = 100nF RL = 0.18Ω, VCC = 15V VIN = 15V, RSOURCE = 0 Ω, RSINK = 0 Ω RIN= 1kΩ CL = 10nF RL = 0.18Ω, VCC = 15V VEE = -5V, VIN =-5V to 15V RSOURCE=4.7Ω, RSINK=0Ω V nA A 24 133 16 37 ns Switching Test Circuit and Timing Diagram VCC 90% VCC VIN RIN 50Ω SOURCE IN ZXGD3005 V RSOURCE 10% SINK td(fall) td(rise) RSINK 50Ω VIN VOUT CL 90% GND RL 90% VOUT 10% 10% tr ZXGD3005E6 Document Number DS35095 Rev. 1 – 2 3 of 7 www.diodes.com tf December 2010 © Diodes Incorporated A Product Line of Diodes Incorporated Typical Gate Driver Switching Characteristics T A = 25°C 15 VOUT VIN 5 CL = 10nF RL = 0.18Ω Voltage (V) Voltage (V) RIN = 1kΩ 10 T A = 25°C 15 VCC= 15V VIN = 15V VCC= 15V VIN = 15V RIN = 1kΩ 10 CL = 100nF VIN VOUT RL = 0.18Ω 5 0 0 0 0.0 100 200 300 400 500 600 700 800 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Time (μs) Time (ns) Switching Speed Switching Speed 10 15 T A = 25°C VEE=V-IN=-5V 10 RIN = 1kΩ 5 VOUT VIN CL = 10nF RL = 0.18Ω RSOURCE=4.7Ω 0 RSINK = 0Ω -5 Supply Current (A) TA = 25°C VCC=V+IN=15V Voltage (V) ADVANCE INFORMATION ZXGD3005E6 1 CL=100nF VCC= 15V VIN = 15V 0.1 0.01 Square Wave CL=1μF CL=1nF 1E-3 CL=10nF 1E-4 0 100 200 300 400 500 600 700 800 Time (ns) Switching Speed Asymmetric Source and Sink Resistance ZXGD3005E6 Document Number DS35095 Rev. 1 – 2 4 of 7 www.diodes.com 10 100 1k 10k 100k 1M (Frequency (Hz)) Supply Current December 2010 © Diodes Incorporated A Product Line of Diodes Incorporated Typical Gate Driver Switching Characteristics 10 CL=1uF 1 CL=100nF T A = 25°C 0.1 VCC= 15V CL=10nF VIN = 15V RL = 0.18Ω CL=1nF 0.01 1k 10k 100k 1M Peak Sink Current (A) Peak Source Current (A) 10 CL=1uF 1 CL=100nF T A = 25°C 0.1 VIN = 15V RL = 0.18Ω 10M 1k RIN Input Resistance (Ω) 100k 1M 10M RIN=1MΩ 1000 RIN=100kΩ td(fall) (ns) td(rise) (ns) 10k RIN Input Resistance (Ω) 100 RIN=100kΩ 100 TA = 25°C 10 RIN=200Ω 1 CL=1nF Sink Current vs. Input Resistance RIN=1MΩ 1000 CL=10nF VCC= 15 0.01 Source Current vs. Input Resistance 1 RIN=1kΩ VCC= 15V RIN=10kΩ VIN = 15V RIN=200Ω RL = 0.18Ω 10 TA = 25°C 10 100 1 1k 1 CL Load Capacitance (nF) 10000 RIN=100kΩ 1000 RIN=10kΩ 100 TA = 25°C RIN=200Ω 10 1 tf (ns) 1000 10 RIN=1kΩ 100 1k RIN=1MΩ RIN=100kΩ T A = 25°C RIN=1kΩ VIN = 15V 10 RL = 0.18Ω 1k 1 RIN=200Ω 10 VCC= 15V VIN = 15V RL = 0.18Ω 100 1k CL Load Capacitance (nF) Turn-On Rise Time Document Number DS35095 Rev. 1 – 2 10 100 RIN=10kΩ CL Load Capacitance (nF) ZXGD3005E6 VIN = 15V RL = 0.18Ω VCC= 15V 100 VCC= 15V RIN=10kΩ Turn-Off Delay Time RIN=1MΩ 10000 RIN=1kΩ CL Load Capacitance (nF) Turn-On Delay Time tr (ns) ADVANCE INFORMATION ZXGD3005E6 Turn-Off Fall Time 5 of 7 www.diodes.com December 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ADVANCE INFORMATION ZXGD3005E6 Package Outline Dimensions A B C H K M J L D SOT26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0° 8° α ⎯ All Dimensions in mm Suggested Pad Layout C2 Z C2 C1 G Y Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 2.40 C2 0.95 X ZXGD3005E6 Document Number DS35095 Rev. 1 – 2 6 of 7 www.diodes.com December 2010 © Diodes Incorporated A Product Line of Diodes Incorporated ADVANCE INFORMATION ZXGD3005E6 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 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