ONSEMI 848AB-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB-01
ISSUE C
DATE 17 DEC 2007
SCALE 2:1
4X
0.15 C
TERMINAL 1
INDICATOR
A
D
D1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
B
E2
H E1
DIM
A
A1
A2
A3
b
D
D1
D2
D3
E
E1
E2
E3
e
H
L
R
E
D2
TOP VIEW
A3
A2
0.10 C
A
SIDE VIEW
A1
C
SEATING
PLANE
MIN
1.70
0.08
1.30
6.17
6.66
4.37
4.65
1.17
MILLIMETERS
NOM
MAX
1.80
1.90
0.70 REF
0.36 REF
0.10
0.12
1.40
1.50
7.00 BSC
6.20
6.23
6.81
6.96
5.08 BSC
5.00 BSC
4.40
4.43
4.80
4.95
3.49 BSC
2.54 BSC
1.80 REF
1.27
1.37
0.70 REF
GENERIC
MARKING DIAGRAM*
D3
e
2
1
3
XXXXXXXXX
XXXXXXXXXXXXX
AWLYYWWG
R
E3
0.10 C A B
0.05 C 6X b
6
5
1
4
6X
L
BOTTOM VIEW
SOLDERING FOOTPRINT*
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb-Free indicator, “G” or microdot “ G”,
may or may not be present.
6X
1.50
5.06
6X
2.54
PITCH
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON23467D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
6 PIN CLCC, 7X5, 2.54P
DESCRIPTION:
October, 2002
- Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON23467D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY C. REBELLO.
20 OCT 2006
A
CORRECTED DEVICE MARKING. REQ. BY C. REBELLO.
13 MAR 2007
B
REVISED DEVICE MARKING. REQ. BY C. REBELLO.
05 SEP 2007
C
ADDED BEVELS TO SIDES OF PACKAGE ON TOP AND BOTTOM VIEWS. ADDED
H DIMENSION. REQ. BY P. CELAYA.
17 DEC 2007
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2007
December, 2007 - Rev. 01C
Case Outline Number:
848AB