MASW2040 GaAs DPDT Switch DC - 2.0 GHz Rev. V3 Features • • • • • Pad Layout Cascadable Low Insertion Loss Low DC Power Consumption Low Distortion Operation (Quiet Mode) Useful as a Building Block for -Digital Attenuators -Digital Delay Lines -Digital Phase Shifters -Digital Switched Filter Elements RFA1 RFA2 RFB1 RFB2 Description M/A-COM’s MASW2040 is a GaAs MMIC DPDT switch die. The MASW2040 is ideally suited for use where low power consumption is required. Typical applications include transmit/receive switching, switch matrices, and switched filter banks in systems such as radio and cellular equipment, PCM, GPS, fiber optic modules, and other battery powered radio equipment. Die Size—Inches (mm) Ordering Information Bond Pad Dimensions 0.043 x 0.037 x 0.010 (1.10 x 0.94 x 0.25) Part Number Package Bond Pad Dimensions - Inches (mm) MASW2040 DIE RF1, RF2 0.004 x 0.007 (0.102 x0.182) RFA1, RFB1 0.005 x 0.004 (0.133 x 0.100) RFA2, RFB2 0.005 x 0.004 (0.133 x 0.100) A, B, Ac, Bc 0.004 x 0.004 (0.100 x 0.100) Absolute Maximum Rating 1,2 Parameter Absolute Maximum Control Value (A or B) -8.5 Vdc Max Input RF Power +34 dBm Storage Temperature -65°C to +175°C Max Operating Temperature +175°C Schematic 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM does not recommend sustained operation near these survivability limits. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2040 GaAs DPDT Switch DC - 2.0 GHz Rev. V3 Electrical Specifications: 0 / -5 Vdc, -55°C to +85°C Parameter Test Conditions Units Min. Typ. Max. Insertion Loss DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz dB dB dB — — — — — — 0.4 0.4 0.6 Isolation DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz dB dB dB 25 20 15 — — — — — — VSWR DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz Ratio Ratio Ratio — — — — — — 1.1:1 1.2:1 1.2:1 Input P-1dB 0.05 GHz (0 / -5 V, 0 / -8V) 0.5 - 2.0 GHz (0 / -5 V, 0 / -8V) dBm dBm — — +24, +25 +30, +33 — — IP2 Two Tone Input Power up to +5 dBm 0.05 GHz 0.5 - 2.0 GHz dBm dBm — — +62 +68 — — IP3 Two Tone Input Power up to +5 dBm 0.05 GHz 0.5 - 2.0 GHz dBm dBm — — +39 +46 — — Control Current VIN Low (0 to -0.2 V) VIN High (-5 V @ 25 µA Typ to -8 V) µA µA — — — — 9 75 T-rise, T-fall 10% to 90% RF and 90% to 10% RF ns — 3 — TON, TOFF 50% control to 90% RF, and 50% control to 90% RF ns — 6 — Transients In Band mV — 20 — Truth Table 3 Control Handling Procedures Please observe the following precautions to avoid damage: Condition of Switch A B RF1RFA1 RF1RFB1 RF2RFA2 RF2RFB2 1 0 Off On Off On 0 1 On Off On Off 3. 0 = 0 to –0.2 V, 1 = -5 V. Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2040 GaAs DPDT Switch DC - 2.0 GHz Rev. V3 Typical Performance @ 25°C VSWR vs. Frequency Insertion Loss vs. Frequency 1.0 1.5 1.4 0.75 1.3 0.50 1.2 0.25 1.1 0.0 0.0 0.5 1.0 1.5 2.0 Frequency (GHz) 1.0 0.0 0.5 1.0 1.5 2.0 Frequency (GHz) Isolation vs. Frequency 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW2040 GaAs DPDT Switch DC - 2.0 GHz Rev. V3 Handling Precautions Wire Bonding Permanent damage to the MASW2040 may occur if the following precautions are not adhered to: A. Cleanliness - The MASW2040 should be handled in a clean environment. DO NOT attempt to clean unit after the MASW2040 is installed. B. Static Sensitivity - All chip handling equipment and personnel should be DC grounded. C. Transient - Avoid instrument and power supply transients while bias is applied to the MASW2040. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply Voltage to either control port A or B only when the other is grounded. Neither port should be allowed to “float.” E. General Handling - It is recommended that the MASW2040 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. A. Ball or wedge with 1.0 mil diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. Mounting The MASW2040 is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be diemounted with AuSn eutectic performs or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290°C. B. DO NOT expose the MASW2040 to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds for scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW2040 into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer’s recommended schedule. C. Electrically conductive epoxy may be used by is not required. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.