PANJIT B8S

DATA SHEET
B1S~B10S
MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
VOLTAGE - 100 to 1000 Volts
CURRENT - 0.5 Amperes
Unit: inch ( mm )
FEATURES
MDI
• Plastic material used carries Underwriters
.275 (7) MAX
.106 (2.7)
.090 (2.3)
.165 (4.2)
.106 (2.7)
.193 (4.9)
• Ideal for printed circuit board
.150 (3.8)
• Exceeds environmental standards of MIL-S-19500
.177 (4.5)
• Surge overload rating-- 30 amperes peak
.0191 (0.5)
.0310 (0.8)
• Low leakage
.090 (2.3)
• Laboratory recognition 94V-O
MECHANICAL DATA
.051 (1.3)
Case: Reliable low cost construction utilizing molded plastic technique results in
inexpensive product
.067 (1.7)
.057 (1.3)
.014 (0.35)
.006 (0.15)
Terminals: Lead solderable per MIL-STD-202, Method 208.
Polarity: Polarity symbols molded or marking on body.
Mounting Position: Any.
.035 (0.9)
C .02(5)
.008 (.20)
Weight: 0.008 ounce, 0.22 gram.
.043 (1.1)
.027 (0.7)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
UNIT
B1S
B2S
B4S
Maximum Recurrent Peak Reverse Voltage
100
200
400
600
800
1000
V
Maximum RMS Bridge input Voltage
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
100
200
400
600
800
1000
V
Maximum Average Forward on glass-epoxy P.C.B (Note 1)
Current TA=30°C
on aluminum substrate (Note 3)
Peak Forward Surge Current, 8.3ms singlehalf sine-wave
B6S
B8S
B10S
0.5
A
0.8
30.0
A
superimposed on rated load
I 2t Rating for fusing ( t < 8.35 ms)
Maximum Forward Voltage Drop per Bridge Element at 0.5A
Maximum Reverse Current at Rated TJ= 25°C
5.0
A2t
1.00
V
µA
5.0
mA
DC Blocking Voltage per element TJ=125°C
Typical Junction capacitance per leg (Note 1) CJ
25.0
Typical Thermal resistance per leg (Note 2) RθJA
85.0
Typical Thermal resistance per leg (Note 2) RθJA
Operating Temperature Range TJ
Storage Temperature Range TA
pF
°C/W
-55 to 150
°C
-55 to 150
°C
NOTES:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.05 X 0.05"(13 x 13mm) copper pads.
3. On alum: substrate P.C.B with an rea of 0.8 x 0.8 x 0.25” ( 20 x 20 x 6.4mm ) mounte on 0.05 x 0.05 “( 13 x 13 mm ) solder pad.
PAGE . 1
0.8
RATING AND CHARACTERISTIC CURVES
On aluminun substtrate
AVERAGE FORWARD OUTPUT
CURRENT, AMPERES
FORWARD SURGE CURRENT, AMPERES pk
(HALF-SINE WAVE)
0.6
50
40
30
20
0.4
On Glass P.C.B
0.2
10
1
2
4
6
8 10
20
40
0
60 80 100
20
40
60
80
100
120
NUMBER OF CYCLES AT 60Hz
AMBIENT TEMPERATURE, OC
Fig.1-MAXIMUM NON-REPETITIVE
SURGE CURRENT
Fig.2-DERATING CURVE FOR
OUTPUT RECTIFIED CURRENT
140
160
10
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
INSTANTANEOUS FORWARK CURRENT, AMPERES
10
1.0
0.1
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.0
0.1
0.01
0
20
40
60
80
100
120
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
PERCENT OF PEAK REVERSE VOLTAGE
Fig.3-TPICAL FORWARD
CHARACTERISTICS
Fig.4-TYPICAL REVERSE
CHARACTERISTICS
140
PAGE . 2