LED Drivers for LCD Backlights
Constant Current Backlight Driver
for LCD Panels (Non-step-up Type)
BD1754HFN
No.11040EBT25
●Description
The multi-level brightness control LED works as a constant current driver in 64 steps, so that the driving current can be
adjusted finely. BD1754HFN is best suited to turn on LEDs that require high-accuracy LED brightness control.
●Features
1) Current regulation for LED up to 4 parallels
2) Adjustable constant current 64 steps
3) High accuracy and matching of each current channel (0.5% Typ)
4) Brightness control via a single-line digital control interface (Uni-Port Interface Control = UPIC)
5) 2.9 mm x 3.0 mm HSON8 Small package
●Applications
This driver can be used in various fields such as mobile phones, portable game machines and etc.
●Absolute Maximum Ratings(Ta = 25 ℃)
Parameter
Maximum applied voltage
Power dissipation
Symbol
Ratings
Unit
VMAX
7
V
Pd
630 (*1)
mW
Operating temperature range
Topr
-30 ~
+85
℃
Storage temperature range
Tstg
-55 ~
+150
℃
(*1)
This value is the measurement value when the driver is mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
When using the driver at Ta of 25 ℃ or higher, the power is dissipated by approx. 5.04 mW/℃.
●Recommended Operating Conditions (Ta = -30 ℃ to +85 ℃)
Ratings
Parameter
Symbol
Min
Typ
Operating power supply voltage
Driver pin voltage range
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Max
Unit
Vin
2.7
3.6
5.5
V
VDRV
0.2
-
Vin-1.4
V
1/11
Condition
When Current driver power on.
2011.06 - Rev.B
Technical Note
BD1754HFN
●Electrical Characteristics
(Unless otherwise specified, Ta = 25 ℃ and Vin = 3.6 V)
Parameter
Symbol
Limits
Unit
Condition
Min
Typ
Max
Iq
-
0.1
1
μA
EN=0V
IDD
-
1.2
2.0
mA
Except LED current
Maximum current
ILED-max
29.76
32.0
34.24
mA
RISET = 120kΩ
LED Current accuracy
ILED-diff
-
-
7.0
%
LED Current matching
ILED-match
-
0.5
3.0(*1)
%
Low threshold voltage
VIL
-
-
0.4
V
High threshold voltage
VIH
1.4
-
-
V
‘H’ level input current
IIH
-
0
2
μA
EN=Vin
‘L’ level input current
IIL
-2
0
-
μA
EN=0V
EN ‘H’ time
THI
0.05
-
100
μsec
EN ‘L’ time
TLO
0.3
-
100
μsec
TOFF
1
-
-
msec
VIN supply -> EN active time
TVINON
1
-
-
msec
EN stand-by -> VBAT Off time
TVINOFF
0
-
-
msec
Quiescent current
Circuit current
[Current driver]
When current 16.5 mA setting
RISET = 120kΩ
When current 16.5 mA setting
RISET = 120kΩ
[Logic controller]
EN Off time-out
(*1)
The following formula is used for calculation:
ILED-match = {(Imax - Imin) / (Imax + Imin)} x 100
Imax = Current value in a channel with the maximum current value among all channels
Imin = Current value in a channel with the minimum current value among all channels
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© 2011 ROHM Co., Ltd. All rights reserved.
2/11
2011.06 - Rev.B
Technical Note
BD1754HFN
●Reference Data
1.0
1.0
2.0
1.8
0.8
1.6
0.8
Ta=80 ℃
1.4
0.4
1.2
Ta=25 ℃
1.0
0.8
Ta=-30,25,80 ℃
0.4
Ta=-30 ℃
0.6
0.2
0.6
Ist [µA]
IDD [mA]
Ist [µA]
0.6
Ta=-30,25,80 ℃
0.2
0.4
0.2
0.0
0.0
0.0
2.5
3.0
Fig. 1
3.5
4.0
4.5
VIN [V]
5.0
5.5
2.5
Circuit current (stand-by)
3.0
3.5
Fig. 2
40
4.0
4.5
VIN [V]
5.0
2.5
5.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN [V]
Fig. 3
Circuit current
LED off-leakage current
2.0
40
1.5
1.0
20
Ta=-30,25,80 ℃
10
DNL(L1) [LSB]
30
ILED(L1) [mA]
ILED(L1) [mA]
30
Ta=-30,25,80 ℃
20
0.5
0.0
-0.5
-1.0
10
Ta=-30,25,80 ℃
-1.5
0
0.6
1.2
1.8
2.4
3
L1 Terminal Voltage [V]
-2.0
0
2.5
0
3.6
3.5
4.5
10
VIN [V]
Fig. 4 LED output current vs. LED pin voltage Fig. 5 LED output current vs. VIN
(Vin = 3.6 V, at 32 mA of LED current)
(Vin = 3.6 V, at 32 mA of LED current)
20
30
40
CODE [DEC]
50
60
Fig. 6 LED current characteristics
(Vin = 3.6 V, differential linearity error)
100
5.0
2.0
4.5
1.0
0.5
0.0
-0.5
Ta=-30,25,80 ℃
-1.0
-1.5
80
4.0
3.5
3.0
Ta=80 ℃
2.5
Ta=-30 ℃
2.0
Ta=25 ℃
1.5
ILED(L1) [mA]
L1-L4 Current Matching(%)
1.5
INL(L1) [LSB]
0
5.5
Ta=25 ℃
60
40
20
1.0
0.5
0
0.0
-2.0
0
10
20
30
40
CODE [DEC]
50
60
Fig. 7 LED current characteristics
(Vin = 3.6 V, integral linearity error)
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© 2011 ROHM Co., Ltd. All rights reserved.
64
56
48
40 32 24
Current State
16
8
60
80
100
120 140
RISET [kO]
160
180
200
Fig. 8 LED current relative accuracy
Fig. 9 LED current vs. RISET
(Vin = 3.6 V)
(Vin = 3.6 V, at the maximum current setting)
3/11
2011.06 - Rev.B
Technical Note
BD1754HFN
●Block Diagram and Recommended Circuit Example
Power Supply
L1
L2
L3
L4
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
R ISET
GND
Fig.10
120kΩ
(When
ILED-max=32mA)
BD1754HFN Block Diagram and Recommended Circuit Example
●Terminals
ESD Diode
No.
Pin Name
In/
Out
For Power
For GND
1
EN
In
VIN
GND
2
GND
-
VIN
-
3
ISET
Out
VIN
GND
Bias current
4
VIN
-
-
GND
Power supply voltage input
5
L1
Out
-
GND
Current sink for LED 1
6
L2
Out
-
GND
Current sink for LED 2
7
L3
Out
-
GND
Current sink for LED 3
8
L4
Out
-
GND
Current sink for LED 4
Functions
LED enable and Brightness control signal
Ground
●Description of Operations
(1) UPIC (= Uni-Port Interface Control) interface
BD1754HFN has a single-line digital control interface (UPIC) that can control the power ON/OFF and LED current
value through the EN pin. The LED current decreases by one step depending on the number of rising edges. After the
number of rising edge is reached to the minimum output current (64 rising edges), the next rising edge changes the
output current to the maximum value at startup time. To maintain any output current, the EN pin must be kept at ‘H’
level. To power off, the EN pin must be kept at ‘L’ level for more than 1msec.
THI
TLO
TOFF
EN
(Internal)
State
OFF
ILED
C64
C63
C62
C62
C61
C60
C2
C1
C64
C63
OFF
MAX Current
MAX Current
OFF
OFF
MIN Current
Fig.11
Brightness Control Method
THI
TLO
TOFF
EN
Fig.12
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© 2011 ROHM Co., Ltd. All rights reserved.
UPIC Interface
4/11
2011.06 - Rev.B
Technical Note
BD1754HFN
By following sequence, UPIC can control current driver for MAX current and OFF state only.
TOFF
TOFF
EN
(Internal)
State OFF
C64
ILED
OFF
C64
OFF
MAX
MAX
OFF
OFF
Fig.13
OFF
UPIC Interface usage for MAX current or OFF only
(2) Current Driver
The MAX Current is determined by the ISET resistance and the following formula.
ILED-MAX [mA] = 6.4 x 600 [mV] / RISET [kΩ]
The LED current state can be changed by the EN control signal. When the state is Cn, the output current (ILED) can be
obtained from the following formula (where, n indicates a state number).
ILED [mA] = ILED-MAX x n / 64
The following table is the example of LED current, when ISET resistance is 120 [kΩ].
C64
Output current
[mA]
32.0
C48
Output current
[mA]
24.0
C63
C62
31.5
C47
31.0
C46
C61
30.5
C60
C59
RISET : 120[kΩ]
Output current
[mA]
8.0
C32
Output current
[mA]
16.0
23.5
C31
15.5
C15
7.5
23.0
C30
15.0
C14
7.0
C45
22.5
C29
14.5
C13
6.5
30.0
C44
22.0
C28
14.0
C12
6.0
29.5
C43
21.5
C27
13.5
C11
5.5
C58
29.0
C42
21.0
C26
13.0
C10
5.0
C57
28.5
C41
20.5
C25
12.5
C9
4.5
C56
28.0
C40
20.0
C24
12.0
C8
4.0
C55
27.5
C39
19.5
C23
11.5
C7
3.5
C54
27.0
C38
19.0
C22
11.0
C6
3.0
C53
26.5
C37
18.5
C21
10.5
C5
2.5
C52
26.0
C36
18.0
C20
10.0
C4
2.0
C51
25.5
C35
17.5
C19
9.5
C3
1.5
C50
25.0
C34
17.0
C18
9.0
C2
1.0
C49
24.5
C33
16.5
C17
8.5
C1
0.5
State
State
State
State
C16
When the state is C64 (the maximum value), the output current value can be changed on the ISET resistance value as below.
ISET resistance value (kΩ)
Output current per channel (mA)
240
16.0
State : C64
Total output current of the four
channels (mA)
64.0
120
32.0
128.0
90
42.7
170.8
60
64.0
256.0
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© 2011 ROHM Co., Ltd. All rights reserved.
5/11
2011.06 - Rev.B
Technical Note
BD1754HFN
●Application Circuit Examples
(1) Circuit example when the power supply is separated
Power Supply2=5V
(Ex.)
On the assumption that Vf is 3 V
Power Supply1
L1
L2
L3
L4
The voltage value of L* pin must
be VIN-1.4 V at the maximum
when the LED is powered ON.
(Maximum rating = 7.0 V)
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
Fig.14
120kΩ
(When ILED-max=32mA)
GND
Circuit example when the power supply is separated
This figure shows a circuit example when the power supply for VIN and for LEDs is separated. Apply a voltage of Vf
(threshold voltage value of a white LED) or higher to the LED. In this case, please note that when the LED is powered
ON, the voltage value of L* pin (each pin of L1 to L4) must be VIN-1.4 V at the maximum. If a voltage of higher than
VIN-1.4 V is applied to L* pin, a desired current value cannot be obtained. Also, please pay attention to the voltage
application procedure at start-up. Be sure to power the current driver ON using the UPIC after applying power supply
voltages to the VIN and the LED-anode pins. If the current driver is powered ON prior to applying power supply
voltages to the LED, a rush current occurs in the LED. Determine the resistance value with which the LED current
value is maximized and then connect such resistor between the ISET and the GND pins. The power ON/OFF and the
brightness of the LEDs are controlled through the EN pin in accordance with the UPIC format.
(2) Circuit example when using only two LEDs
Connect to the GND pin.
L1
L2
L3
L4
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
GND
Fig.15
120kΩ
(When
ILED-max=32mA)
Circuit example when using only two LEDs
This figure shows a circuit example when none of L3 and L4 LEDs are used. Connect both of the unused L3 and L4
pins to the GND pin.Likewise, it is possible to make the L1 and/or the L2 pins unused, which allows the back lights to
be used with the one or three LED(s) turned on.In all cases, connect the unused L* pin to the GND pin. Determine the
resistance value with which the LED current value is maximized and then connect such resistor between the ISET and
the GND pins.The power ON/OFF and the brightness of the LEDs are controlled through the EN pin in accordance with
the UPIC format.
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6/11
2011.06 - Rev.B
Technical Note
BD1754HFN
(3) Circuit example when the EN pin is powered on at all times
L1
L3
L2
L4
VIN
Cin
0.1µF
Rs
EN
UPIC
Cs
6
ISET
Current
DAC
RISET
GND
Fig.16
120kΩ
(When
ILED-max=32mA)
Circuit example when the EN pin is powered on at all times
This figure shows a circuit example when the EN pin is powered on at all times. To prevent a rush current from
occurring in the driver, it is necessary to apply voltages to the VIN pin and the LEDs prior to powering the current driver
ON. Mount an RC filter between the VIN and the EN pins to delay the EN pin rising against the power-supply voltage
rising. Determine the resistance value with which the LED current value is maximized and then connect such resistor
between the ISET and the GND pins.
(4) Circuit example when performing a PWM brightness control
L1
L2
L3
L4
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
120kΩ
GND
1MΩ
Fig.17
PWM
Circuit example when performing a PWM brightness control
This figure shows a circuit example when performing a PWM brightness control. Through switching the ISET resistance
value by the PWM input signal, the LED current is outputted under a PWM mode. The EN signal is controlled by an
applied voltage level.In the circuit example shown above, the LED current value is changed to 3.43 mA in 0 % of the
PWM duty cycle, 17.72 mA in 50 % of that and 32 mA in 100 % of that.
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7/11
2011.06 - Rev.B
Technical Note
BD1754HFN
(5) Circuit example when driving a large current with only one LED powered on.
ILED=128mA
L1
L3
L2
L4
VIN
Cin
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
GND
Fig.18
120kΩ
(When
ILED-max=32mA)
Circuit example when driving a large current with only one LED powered on.
This figure shows a circuit example when driving a large current through all of four channels with only one LED
powered on. By shorting out all the LED driver pins, in the example of using 120 kΩ RISET, a current up to 128 mA (32
mA x 4) can be driven. In this example, the brightness can be adjusted in 64 gradations with 2 mA step (0.5 mA
step/channel x 4 channels). For higher current values, using 60 kΩ RISET allows a current up to 256 mA to be driven
into one of the LEDs. The power ON/OFF and the brightness of the LEDs are controlled through the EN pin in
accordance with the UPIC format.
(6) Circuit example when making the eight LEDs available by connecting the two BD1754HFN drivers
ILED=32mA
L1
L2
L3
ILED=32mA
L4
L1
VIN
Cin
0.1µF
EN
L2
L3
L4
VIN
Cin
0.1µF
EN
UPIC
6
6
ISET
Current
DAC
RISET
GND
Fig.19
UPIC
ISET
Current
DAC
120kΩ
(When
ILED-max=32mA)
RISET
GND
120kΩ
(When
ILED-max=32mA)
Circuit example when making the eight LEDs available by connecting the two BD1754HFN drivers
This figure shows a circuit example when making eight LEDs available by connecting two BD1754HFN drivers.
By connecting the control signals to the EN pins in parallel, the eight LED channels can be controlled concurrently.
This parallel connection scheme can increase the number of the LED channels further as necessary (such as twelve,
sixteen, or more). Determine the resistance value with which the LED current value is maximized and then connect
such resistor between the ISET and the GND pins. The power ON/OFF and the brightness of the LEDs are controlled
through the EN pin in accordance with the UPIC format.
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8/11
2011.06 - Rev.B
Technical Note
BD1754HFN
(7) Circuit example when connecting the two LEDs to each of the channels in series
Power Supply2=6.2~7V
(Ex.)
On the assumption that Vf is 3 V
The voltage value of L* pin must
be VIN-1.4 V at the maximum
when the LED is powered ON.
Power Supply1
L1
L2
L3
L4
(Maximum rating = 7.0 V)
VIN
0.1µF
EN
UPIC
6
ISET
Current
DAC
120kΩ
(When ILED-max=32mA)
GND
Fig.20
Circuit example when connecting the two LEDs to each of the channels in series
This figure shows a circuit example when making 8 (2 x 4) LEDs available by connecting two LEDs to each of the
channels in series. In this example, when Vf is set to approx. 3 V in order to ensure the voltage to L1 through L4 pins,
it is necessary to apply a voltage of 6.2 V (3 V x 2 LEDs in series + 0.2 V of the minimum voltage value of the driver
pin) or higher to the LED anode pin as its power supply voltage. Pay attention that the voltage should not exceed the
7.0-V maximum rating of the L1 through L4 pins. Determine the resistance value with which the LED current value is
maximized and then connect such resistor between the ISET and the GND pins. The power ON/OFF and the
brightness of the LEDs are controlled through the EN pin in accordance with the UPIC format.
●Application Component Selection
<Capacitor>
Symbol
Recommended value
Recommended component
Manufacturer
0.1µF
GRM188B31H104KA92B
MURATA
Recommended value
Recommended component
Manufacturer
120kΩ
MCR10PZHZF1203
ROHM
Cin
<Resistor>
Symbol
RISET
●Recommended PCB Layout
Design PCB pattern to provide low impedance for the wiring to the power supply line.
Also, provide a bypass capacitor if needed.
Connect
Cin
input-bypass
capacitor in close proximity
between the VIN and GND pins.
Connect the RISET resistor in
close proximity to the ISET pin.
L4
L3
L2
L1
EN
GND
ISET
VIN
LED_PWR
Cin
LED_PWR
RISET
Cin
RISET
EN
Fig.21
GND
VIN
Layout image of the application components (Top View)
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9/11
EN
Fig.22
GND
VIN
Surface (Top View)
2011.06 - Rev.B
Technical Note
BD1754HFN
●Notes for Use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as applied voltage, temperature range of operating conditions, can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Recommended Operating Conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter. The voltage and temperature
characteristics are also shown under the conditions in respect of electrical ones.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power
supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure that the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure that no terminal is operated at a potential lower than the GND voltage including an
actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can cause a malfunction.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to
the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than that applied to the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In
addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply
voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, it will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual
states of use.
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© 2011 ROHM Co., Ltd. All rights reserved.
10/11
2011.06 - Rev.B
Technical Note
BD1754HFN
●Ordering part number
B
D
1
Part No.
7
5
4
Part No.
1754
H
F
N
-
Package
HFN=HSON8
T
R
Packaging and forming specification
TR: Embossed tape and reel
HSON8
<Tape and Reel information>
(0.05)
(0.3)
(0.2)
1234
5678
(0.45)
(0.2) (1.8)
8 765
2.8 ± 0.1
3.0 ± 0.2
0.475
(2.2)
(0.15)
2.9±0.1
(MAX 3.1 include BURR)
4321
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
+0.1
0.13 –0.05
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
1PIN MARK
S
+0.03
0.02 –0.02
0.6MAX
)
0.1
S
0.65
0.32±0.1
0.08
Direction of feed
M
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
Reel
11/11
∗ Order quantity needs to be multiple of the minimum quantity.
2011.06 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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© 2011 ROHM Co., Ltd. All rights reserved.
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