1/4 STRUCTURE PRODUCT NAME ： ： Silicon Monolithic Integrated Circuit MODEL NAME ： BD8676KN BLOCK DIAGRAM ◎ FEATURES： ： Fig. - 2 DC/DC converter IC for camera module for car navigation system ・ +3.3V output synchronous step down DC/DC converter ・ +1.2V output synchronous step down DC/DC converter ・ +15V output boost DC/DC converter and LDO regulator ・ -5.5V output Voltage control charge pump (negative voltage) ・Soft start function ・Reset function ・Building in low voltage and over voltage protection function ・Building in terminal RT OPEN/SHORT protection ・The frequency can be set by external resistance ・Protection control with built-in sequencer ・VQFN-36 package (6.2mm□ Package) ◎ ABSOLUTE MAXIMUM RATING:（ Ta=25℃） Parameter VIN supply voltage PVIN supply voltage V33IN Input terminal voltage V16 terminal voltage CP terminal voltage MV66 terminal voltage Terminal voltage 1*2*3 Terminal voltage 2*4 Terminal voltage 3*5 Terminal voltage 4*6 Terminal voltage 5*7 Power dissipation Operating temperature Storage temperature Symbol VIN PVIN V33IN V16 CP MV66 VINOUT1 VINOUT2 VOUT3 VOUT4 VOUT5 Pd Topr Tstg -0.3 -0.3 -0.3 -0.3 V33IN-0.3 -10.0 -0.3 -0.3 -0.3 -0.3 MV66-0.3 -40 -55 Limits ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ 0.875*1 ～ ～ +18.0 VIN+0.3 5.0 +20.0 +10.0 +0.3 VIN+0.3 V33IN+0.3 V16+0.3 CP +0.3 +85 +150 Unit V V V V V V V V V V V W ℃ ℃ *1 70mm×70mm, thickness1.6mm, less than 3% share of copper foil when implementing glass epoxy board. Operating at higher than Ta=25℃, 7.0mW shall be reduced per 1 *2 Input terminal voltage:CTL1(32pin), CTL2(33pin), CTL3(34pin), CTL4(35pin), TEST1(9pin), TEST2(10pin), V33(6pin),V12(14pin) *3 Output terminal voltage: RT(1pin),RSTO(3pin),RSTDLY(4pin),SS33(5pin),SS12(13pin),SS16(25pin),FC33(7pin), FC12(15pin),FC16(28pin),TEST3(31pin),SW33(11pin),V33(6pin) *4 SW12(17pin) terminal voltage *5 SW16(30pin), V15(26pin) terminal voltage *6 CM(20pin) terminal voltage *7 CR(22pin), MV5(24pin) terminal voltage ◎ OPERATION CONDITION (Please set the power-supply voltage in consideration of a power dissipation.) Parameter Symbol VIN supply voltage VIN PVIN supply voltage PVIN V33IN terminal voltage V33IN This product is not designed for protection against radioactive rays. MIN 4.5 4.5 2.7 REV. A TYP 6.0 6.0 3.3 MAX 9.0 9.0 3.6 Unit V V V 2/4 ◎ ELECTRICAL CHARACTERISTICS (Unless otherwise noted Ta=25℃ , VIN=6.0V,PVIN=6.0V,CTL1,2,3,4=6.0V,GND=0V) specification value Parameter Symbol MIN TYP MAX VIN,PVIN Circuit current 1 IQ1 VIN,PVIN Circuit current 2 IQ2 Range of DC/DC converter oscillation frequency setting FOSC - 0 50 UNIT μA - - 20 mA 500 1000 1200 kHz Condition CTL1,2,3,4=0V CTL1,2,3,4=VIN、 V33=3.5V V16=17.0V 、V12=1.4V possible to setup at RT terminal. < 3.3V output Step-down DC/DC converter > 3.3V output voltage V033 3.234 3.300 3.366 V RV33DIS 270 390 500 Ω SS33 Terminal Charging current ISS33 -4.0 -2.5 -1.0 μA VSS33=1.0V SS33 Terminal Threshold voltage VSS33TH 1.0 1.1 1.2 V VSS33voltage、VV33=3.3V SS33 Terminal Standby voltage VSS33STB 0.11 0.15 0.19 V VSS33 voltage (L→H) SS33 Terminal Protection circuit start voltage VSS33PON 1.0 1.1 1.2 V VSS33 voltage (L→H) V33 Terminal Low voltage detection voltage VV33LVP 1.11 1.32 1.53 V VV33 voltage (H→L) V33 Terminal Over voltage detection voltage VV33OVP 4.45 4.95 5.45 V VV33 voltage CTL1,2=VIN V33 Terminal Discharge resistance CTL1=VIN < 1.2V output Step-down DC/DC converter > 1.2V output voltage V012 1.176 1.200 1.224 V RV12DIS 270 390 500 Ω SS12 Terminal Charging current ISS12 -4.0 -2.5 -0.1 μA VSS12=1.0V SS12 Terminal Threshold voltage VSS12TH 1.0 1.1 1.2 V VSS12voltage、VV12=1.2V SS12 Terminal Standby voltage VSS12STB 0.11 0.15 0.19 V VSS12 voltage (L→H) SS12 Terminal Protection circuit start voltage VSS12PON 1.0 1.1 1.2 V VSS12 voltage (L→H) V12 Terminal Low voltage detection voltage VV12LVP 0.40 0.48 0.56 V VV12 voltage (H→L) V12 Terminal Overvoltage detection voltage VV12OVP 1.62 1.8 0.98 V VV12 voltage V16 output voltage V016 15.65 16.50 17.35 V CTL1,2,3=VIN SS16 Terminal Charging current ISS16 -4.0 -2.5 -1.0 μA VSS16=1.0V SS16 Terminal Threshold voltage VSS16TH 1.0 1.1 1.2 V VSS16voltage、VV15=15.0V SS16 Terminal Standby voltage VSS16STB 0.11 0.15 0.19 V VSS33 voltage (L→H) SS16 Terminal Protection circuit start voltage VSS16PON 1.0 1.1 1.2 V VSS16 voltage (L→H) CTL1,3=VIN V12 Terminal Discharge resistance < 16.5V output Boost DC/DC converter > < 15V output LDO > V15 output voltage V015 14.70 15.00 15.30 V V15 Terminal Discharge resistance RV15DIS 270 390 500 Ω V15 Terminal Overvoltage detection voltage VV15OVP 16.20 18.00 19.80 V V15 Terminal Low voltage detection voltage VV15LVP 5.4 6.0 6.6 V < -5.5V output reversing charge pump > MV5 output voltage VMV5 -5.61 -5.50 -5.39 V MV5 Terminal Discharge resistance RMV5DIS 330 470 610 Ω CTL1,2,4=VIN CTL4=0V MV5 Terminal Overvoltage detection voltage VMV5OVP -8.25 -7.50 -6.75 V VMV5 voltage、VV33=3.3V MV5 Terminal Protection circuit start voltage VMV5PON -4.5 -3.5 -2.5 V VMV5 voltage (H→L)、VV33=3.3V MV5 Terminal Low voltage detection voltage VMV5LVP -2.5 -2.0 -1.5 V VMV5 voltage (L→H)、VV33=3.3V Reset voltage VRST1 2.673 2.700 2.727 V VV33 (H→L) Reset release voltage VRST2 2.850 3.000 3.150 V VV33 (L→H) RSTDLY Terminal detection voltage VRSTDLY 0.800 0.900 1.000 V VRSTDLY (L→H)、VV33=3.3V RSTO Terminal Low output voltage VRSTOL - - 0.5 V IRSTO =4mA CTL Terminal input voltage H level voltage VIHCTL 2.5 - VIN V CTL1,2,3,4 CTL Terminal input voltage L level voltage VILCTL - - 0.5 V CTL1,2,3,4 < Reset > < Other > CTL Terminal input current VIFNL 20 35 μA CTL1,2,3,4=VIN ●VV33 ： V33 voltage、VVSS33 ： SS33 voltage、VV12： V12 voltage、VSS12 ： SS12 voltage、VSS16 ： SS16 voltage、 VV15IN：V15 voltage、VMV5 ： MV5 voltage、VRSTDLY ： RSTDLY voltage、IRSTO ： RSTO input current ●This product is not designed for protection against radioactive rays. ●The current ability must not exceed Pd. REV. A 3/4 ◎ PIN ASSIGNMENT No. Symbol Description No. Symbol Description 1 RT Frequency adjustment resistance connection terminal 19 CP 3.3V and 6.6V switch 2 GND GND(0V connection) 20 CM 0V and 6.6V switch 3 RSTO Reset output 21 PGNDCP 4 RSTDLY Reset release delay element connection terminal 22 CR 5 SS33 6 V33 7 8 9 TEST1 10 TEST2 Test terminal 2(0V connection). 28 FC16 Error amplifier output terminal for 16VDC/DC 11 SW33 Coil connection terminal for 3.3VDC/DC 29 PGND16 Power GND for 16VDC/DC (0V connection) 12 PGND33 13 SS12 14 V12 Power GND for Charge pump (0V connection) 0V and -6.6V switch Soft start adjustment capacity connection terminal for 3.3VDC/DC 23 MV66 -6.6V charge pump output Feedback terminal for 3.3VDC/DC 24 MV5 -5.5V LDO output capacity connection terminal FC33 Error amplifier output terminal for 3.3VDC/DC 25 SS16 PVIN Power supply input terminal for 3.3VDC/DC 26 V15 15.0V LDO output Test terminal 1(0V connection). 27 V16 Feedback terminal for 16VDC/DC Soft start adjustment capacity connection terminal for 16VDC/DC Power GND for 3.3VDC/DC (0V connection) 30 SW16 Coil connection terminal for 16VDC/DC Soft start adjustment capacity connection terminal for 1.2VDC/DC 31 TEST3 Test terminal 3 (open) Feedback terminal for 1.2VDC/DC 32 CTL1 3.3VDC/DC control terminal 15 FC12 Error amplifier output terminal for 1.2VDC/DC 33 CTL2 1.2VDC/DC control terminal 16 PGND12 Power GND for 1.2VDC/DC (0V connection) 34 CTL3 15.0V LDO control terminal 17 SW12 Coil connection terminal for 1.2VDC/DC 35 CTL4 -5.5V LDO control terminal 18 V33IN Power supply input terminal for 1.2VDC/DC 36 VIN Power supply input terminal ◎ PACKAGE OUTLINE ◎ BLOCK DIAGRAM Product number BD8676 1pin mark Lot No. package: VQFN36(Unit：mm) Fig.-１ PACKAGE OUTLINE Fig.-2.BLOCK DIAGRAM REV. A 4/4 ◎ NOTE ON USE 1．About the absolute maximum rating Attention is brushed off enough to the quality control, it is likely to destroy when the absolute maximum rating such as impressed voltages (VCC_IN,DCIN) and ranges (Topr) of the operating temperature as it is exceeded, the mode of breakings of the short or the opening, etc. cannot be specified, and examine it in this IC to give physical measures for safety such as fuses when a special mode that exceeds the absolute maximum rating is assumed. 2．About the reverse-connection of the power supply connector IC might destroy it by reversely connecting the power supply connector. Give measures such as putting the diode between power supply terminals of power supply and IC outside for the reverse-touching destruction protection. 3．Power supply line Please do measures such as putting the bypass capacitor in power supply-GND nearest pin of this IC as the route of the resurrection current to cause the return of the current in which it resurrected it by the counter electromotive force of the coil. Please confirm the characteristic of the electrolytic capacitor enough as the capacity omission etc. at the low temperature never happen, and decide it. 4．About grand potential Any state of operation must become the lowest potential about the potential of the terminal GND. Moreover, confirm whether there is terminal that is actually the voltage of GND or less including transients. [Negative power supply terminal CR(22pin) MV66(23pin) MV5(24pin) is excluded.] 5．About the heat design Think about permissible loss (Pd) in an actual state of use, and do the heat design with the margin enough. 6．About the short and the miss-installation between terminals Note the direction and the miss-registration of IC enough when you install it in the set substrate. IC might destroy it as well as reversely connecting the power supply connector when installing it by mistake. Moreover, there is fear of destruction when the foreign body enters between terminals, the terminal, the power supply, and grandeur and it is short-circuited. 7．About operation in strong electromagnetic field In use in strong electromagnetic field, note that there is a possibility of malfunctioning. 8．About the capacitor during output-GND The current charged the capacitor with when VCC is 0V or is GND and is short-circuited when a big capacitor is connected between GND output by some factors flows into the output and it is likely to destroy it. Give the capacitor between GND output to 0.1μF or less. 9．About the inspection by the set substrate It is likely to suffer stress to IC and discharge electricity every one process when you connect the capacitor with the pin with low impedance when inspecting it in the set substrate. Moreover, detach it after connecting after the power supply is turned off without fail when detaching it to G in the inspection process, inspecting, and turning off the power supply. n addition, be give the earth to the assembly process as a static electricity measures, and careful enough when it transports and you preserve it. 10．About each input terminal This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other. This P layer and an N layer in each element form a PN junction to construct various parasitic elements. For instance, the potential difference operates in resistance as shown in the figure below when resistance and the transistor connect it with the terminal and the playground (GND) >(terminal B) joint of PN operates as a parasitic diode in playground (GND) >(terminal A) transistor (NPN). In addition, the NPN transistor of parasitism works with N layer of the element of the above-mentioned parasitic diode and the neighborhood and others in transistor (NPN). A parasitic element in IC composition is inevitably formed because of the potential relation. A parasitic element can operate, the interference with the circuit operation be caused, it malfunction, and, consequently, it cause destruction. Therefore, do not do the usage that a parasitic element operates as a voltage that is lower than the playground (GND;P substrate) is impressed to the input terminal enough. Moreover, do not impress the voltage to the input terminal when you do not impress the power-supply voltage to IC. Give each input terminal to me the voltage below the power-supply voltage or in the guarantee value of an electric characteristic when you similarly impress the power-supply voltage. Example of IC of simple structure 11．Earth wiring pattern If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current not to change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned. 12．Thermal Shut-Down When a thermal shutdown operates, the DC/DC converter controller of all Ch is turned off. When a thermal shutdown is released, the DC/DC converter controller of all Ch becomes an operation beginning from turning off. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). 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