VISHAY SUP60N02-4M5P-E3

SUP60N02-4m5P
Vishay Siliconix
N-Channel 20-V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)a
0.0045 at VGS = 10 V
60
0.0065 at VGS = 4.5 V
60
V(BR)DSS (V)
20
•
•
•
•
TrenchFET® Power MOSFET
175 °C Junction Temperature
100 % Rg Tested
100 % UIS Tested
RoHS
COMPLIANT
APPLICATIONS
• OR-ing
TO-220AB
D
DRAIN connected to TAB
G
G D S
Top View
S
N-Channel MOSFET
Ordering Information: SUP60N02-4m5P-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 100 °C
ID
IDM
Pulsed Drain Current
Single Pulse Avalanche Current
L = 0.1 mH
Single Pulse Avalanche Energy
TC = 25 °C
Maximum Power Dissipationb
TA = 25
Operating Junction and Storage Temperature Range
°Cd
Unit
V
60a
60a
120
IAS
50
EAS
125
A
mJ
c
PD
120
3.75
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
d
Junction-to-Case
RthJA
40
RthJC
1.25
°C/W
Notes:
a. Package limited.
b. Duty cycle ≤ 1 %.
c. See SOA curve for voltage derating.
d. When mounted on 1" square PCB (FR-4 material).
Document Number: 69821
S-80182-Rev. A, 04-Feb-08
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SUP60N02-4m5P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VDS = 0 V, ID = 250 µA
20
VGS(th)
VDS = VGS, ID = 250 µA
1.0
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
ID(on)
± 100
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 125 °C
50
VDS = 20 V, VGS = 0 V, TJ = 175 °C
250
VDS ≥ 5 V, VGS = 10 V
100
VGS = 10 V, ID = 20 A
Drain-Source On-State Resistancea
a
Forward Transconductance
rDS(on)
gfs
3
V
nA
µA
A
0.0036
0.0045
VGS = 10 V, ID = 20 A, TJ = 125 °C
0.0068
VGS = 10 V, ID = 20 A, TJ = 175 °C
0.008
VGS = 4.5 V, ID = 20 A
0.0052
VDS = 10 V, ID = 20 A
95
Ω
0.0065
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargeb
Qg
b
Gate-Source Charge
Qgs
Gate-Drain Chargeb
Qgd
b
Rise Timeb
Turn-Off Delay Time
33
VDS = 10 V, VGS = 4.5 V, ID = 50 A
b
Fall Timeb
td(off)
50
nC
18
7
0.75
td(on)
tr
pF
985
365
Rg
Gate Resistance
Turn-On Delay Time
5950
VGS = 0 V, VDS = 10 V, f = 1 MHz
VDD = 10 V, RL = 0.2 Ω
ID ≅ 50 A, VGEN = 10 V, Rg = 1.0 Ω
tf
1.5
2.3
15
25
7
11
35
55
8
12
Ω
ns
Source-Drain Diode Ratings and Characteristics TC = 25 °Cc
IS
60
Pulsed Current
ISM
100
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
IF = 20 A, VGS = 0 V
trr
Peak Reverse Recovery Current
IRM
Reverse Recovery Charge
Qrr
IF = 20 A, di/dt = 100 A/µs
A
0.85
1.5
V
45
90
ns
1.7
3.4
A
0.039
0.155
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Independent of operating temperature.
c. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 69821
S-80182-Rev. A, 04-Feb-08
SUP60N02-4m5P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
120
120
VGS = 4 V
VGS = 10 thru 5 V
100
I D - Drain Current (A)
I D - Drain Current (A)
90
60
80
60
TC = 25 °C
40
30
20
TC = 125 °C
VGS = 3 V
TC = - 55 °C
0
0
0
1
2
3
4
5
0
1
VDS - Drain-to-Source Voltage (V)
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.010
200
120
r DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
TC = -55 °C
160
TC = 25 °C
80
TC = 125 °C
40
0.008
VGS = 4.5 V
0.006
VGS = 10 V
0.004
0.002
0
0
0
10
20
30
40
0
50
20
60
80
100
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
7500
0.020
ID = 20 A
Ciss
6000
0.016
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
40
ID - Drain Current (A)
0.012
0.008
TA = 150 °C
4500
3000
Coss
1500
0.004
TA = 25 °C
Crss
0
0
0
2
4
6
8
10
0
2
4
6
8
10
12
14
16
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Capacitance
Document Number: 69821
S-80182-Rev. A, 04-Feb-08
18
20
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SUP60N02-4m5P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
2.0
ID = 20 A
VDS = 10 V
8
1.7
VDS = 16 V
6
4
r DS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
ID = 50 A
2
VGS = 10 V
1.4
VGS = 4.5 V
1.1
0.8
0
0
20
40
60
0.5
- 50
80
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Qg - Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
Gate Charge
0.5
100
TJ = 150 °C
0.0
VGS(th) Variance (V)
I S - Source Current (A)
10
TJ = 25 °C
1
0.1
ID = 5 mA
- 0.5
ID = 250 µA
- 1.0
0.01
0.001
0.0
0.2
0.4
0.6
0.8
1.0
- 1.5
- 50
1.2
- 25
0
VSD - Source-to-Drain Voltage (V)
25
50
75
100
125
150
175
TJ - Temperature (°C)
Threshold Voltage
Source-Drain Diode Forward Voltage
33
100
32
30
I DAV (A)
Typical Drain-Source
Brakdown Voltage
ID = 1 mA
31
29
TJ = 25 °C
TJ = 150 °C
10
28
27
26
- 50
- 25
0
25
50
75
100
125
150
TJ - Temperature (°C)
Typical Drain-source Brakdown Voltage
vs. Junction Temperature
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175
1
0.00001
0.0001
0.001
0.01
0.10
1
t in (s)
Single Pulse Avalanche Current vs. Time
Document Number: 69821
S-80182-Rev. A, 04-Feb-08
SUP60N02-4m5P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
150
1000
Limited by rDS(on)*
120
10 µs, 100 µs
I D - Drain Current (A)
I D - Drain Current (A)
100
90
Package Limited
60
1 ms
10 ms
10
100 ms
1 s, 10 s
1
30
TA = 25 °C
Single Pulse
0
0
25
50
75
100
125
150
175
0.1
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
TA - Ambient Temperature (°C)
Drain Current vs. Ambient Temperature
Safe Operating Area
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?69821.
Document Number: 69821
S-80182-Rev. A, 04-Feb-08
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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