BVLED BVS-166UG2-12

BRIGHT VIEW
ELECTRONICS CO.,LTD
SUPER BRIGHTNESS SMD LED
BVS-166UG2-12
Cathode mark
LED die
0.8
PACKAGE CONFIGURATION
0.6
Soldering terminal
Cathode line
1.6
1.0
Soldering Pattem
0.8
0.8
1.0
P C .board
0.3
0.4
Resin
0.8
Polarity
0.7
0.8
0.4
Soldering terminal
Tolerance ± 0.1 р
DESCRIPTION
Dice Material : AlGaInP/GaAs Yellow Green
Light Color : Yellow Green Color
Lens Color : Milky Diffused
ABSOLUTE MAXIMUM RATINGS AT Ta = 25
к
PARAMETER
Power Dissipation
Continuous Forward Current
Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width )
Reverse Voltage
Derating Linear From 25 к
Operating Temperature Range
Storage Temperature Range
Infrared Soldering Condition 260 к for 5 seconds
Reflow Soldering Condition 230 к for 10 seconds
ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25
SYMBOL
VF
IR
ӳp
ӳd
2Ӱ1/2
PARAMETER
Forward Voltage
Reverse Current
Peak Emission Wavelength
Dominant Wavelength
Viewing Angle
TEST COND.
I F = 20 mA
V R = 5V
I F = 20 mA
I F = 20 mA
I F = 20 mA
MIN.
MAX.
55
20
100
5
0.35
Ё30 to Ѐ 80
Ё40 to Ѐ 85
UNIT
mW
mA
mA
V
mA/oC
o
C
o
C
к
TYP.
2.1
MAX.
2.6
100
575
570
130
UNIT
V
ӴA
nm
nm
Deg
BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd
Bin
Min.
Max.
x
35
42
y
42
50
z
50
60
A
B
C
60
70
84
70
84
100
Tolerance ± 15%mcd
*Bright View reserves the rights to alter specifications and remove availability of products at any time without notice.
*Dominant Wavelength, ӳd is according to CIE Chromaticity Diagram base on color of lamps.
*Ӱ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
2004/9/8 – A
BRIGHT VIEW
ELECTRONICS CO.,LTD
SMD APPLICATION ( PB FREE SOLDERING )
Apply to BVS-3XXΕ1XX series.
Description:
(1) Manual soldering (We do not recommend this method strongly.)
(1.1) To prevent cracking,please bake (65к,24hrs)before soldering.
(1.2) Temperature at tip of iron: 250к Max.(25W)
(1.3) It's banned to load any stress on the resin during soldering.
(1.4) Soldering time: 3 sec. Max.(one time only)
(2) Reflow Soldering
(2.1) To prevent cracking,please bake (65к,24hrs)before soldering.
(2.2) When soldering,do not put stress on the LEDs during heating.
(2.3) Never take next process until the component is cooled down to room
temperature after reflow.
(2.4) After soldering,do not warp the circuit board.
(2.5) The recommended reflow soldering profile(measuring on the surface
of the LED resin)is following:
10 SEC. MAX.
245 C MAX.
0.5к/SEC MAX.
217к
217к
TEMPERATURE
150к
1к/SEC. MAX.
50 SEC. MAX.
~75к
~25к
210 SEC. MIN.
100 SEC. MAX.
TIME
The reflow temperature 240к~245к is recommended and the soldering temperature
should be not higher than 245к(one time only)
2005 / 10 / 20 - B
BRIGHT VIEW
CHIP LEDS PACKING
ELECTRONICS CO.,LTD
BVS-166/167 Series
2.0
Cathode mark
0.05
4.0 0.10
4.0
1.5
0.10
0.10
0.23 0.05
1.75 0.10
3.5 0.05
1.80 0.10
8.0 0.20
Feeding direction
UNIT : mm
0.75 0.10 - BVS-166
0.60 0.10 - BVS-167
178 1.0
60 0.5
Reel : 4,000PCS
12
0.5
UNIT : mm
Label 2
Bright View
Label 1
Bright View
PART NO.:
PART NO.:
Electronics Co.,Ltd.
BVS-16XXXX
LOT NO.:
GRADE:
Q'ty
LOT NO.:
GRADE:
Q'ty
X-
pcs
QA
ńłŖŕŊŐŏ
pcs
Electronics Co.,Ltd.
QA
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN OR HANDLE EXCEPT
AT A STATIC-FREE WORKSTATION
24
Anti-electrostatic bag
Normal
X: Bin grade
: Wavelength
: Vf
39
RE
CARTON
Dimension(cm): 39*24*22
22
ITEM NO.
DEVICE:
Q'TY
N. W.:
G. W.:
Y
PCS.
KGS.
KGS.
Carton : 30 Reels
Total : 120,000PCS
2003 / 11 / 12 - A