VISHAY 50MT060WHTAPBF

50MT060WHTAPbF
Vishay High Power Products
"Half Bridge" IGBT MTP (Warp Speed IGBT), 114 A
FEATURES
• Generation 4 warp speed IGBT technology
• HEXFRED® antiparallel diodes with ultrasoft
reverse recovery
• Very low conduction and switching losses
• Optional SMD thermistor (NTC)
• Very low junction to case thermal resistance
• UL approved file E78996
MTP
• Speed 60 kHz to 100 kHz
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
BENEFITS
PRODUCT SUMMARY
VCES
600 V
• Optimized for welding, UPS and SMPS applications
VCE(on) typical at VGE = 15 V
2.3 V
• Low EMI, requires less snubbing
IC at TC = 25 °C
114 A
• Direct mounting to heatsink
• PCB solderable terminals
• Very low stray inductance design for high speed operation
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
TC = 25 °C
TC = 109 °C
MAX.
UNITS
600
V
114
50
Pulsed collector current
ICM
350
Peak switching current
ILM
350
Diode continuous forward current
IF
A
TC = 109 °C
34
Peak diode forward current
IFM
200
Gate to emitter voltage
VGE
± 20
RMS isolation voltage
VISOL
Maximum power dissipation
Document Number: 94468
Revision: 01-Mar-10
PD
V
Any terminal to case, t = 1 minute
2500
TC = 25 °C
658
TC = 100 °C
263
For technical questions, contact: [email protected]
W
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1
50MT060WHTAPbF
Vishay High Power Products "Half Bridge" IGBT MTP
(Warp Speed IGBT), 114 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Collector to emitter voltage
Gate threshold voltage
Collector to emitter leaking current
Diode forward voltage drop
Gate to emitter leakage current
SYMBOL
V(BR)CES
VCE(on)
VGE(th)
ICES
VFM
IGES
TEST CONDITIONS
VGE = 0 V, IC = 500 μA
MIN.
TYP.
MAX.
UNITS
600
-
-
V
VGE = 15 V, IC = 50 A
-
2.3
3.15
VGE = 15 V, IC = 100 A
-
2.5
3.2
VGE = 15 V, IC = 50 A, TJ = 150 °C
-
1.72
2.17
IC = 0.5 mA
3
-
6
VGE = 0 V, IC = 600 A
-
-
0.4
VGE = 0 V, IC = 600 A, TJ = 150 °C
-
-
10
IF = 50 A, VGE = 0 V
-
1.58
1.80
IF = 50 A, VGE = 0 V, TJ = 150 °C
-
1.49
1.68
IF = 100 A, VGE = 0 V, TJ = 25 °C
-
1.9
2.17
VGE = ± 20 V
-
-
± 250
nA
MIN.
TYP.
MAX.
UNITS
-
331
385
VCC = 400 V
VGE = 15 V
-
44
52
-
133
176
Internal gate resistors (see electrical diagram)
IC = 50 A, VCC = 480 V, VGE = 15 V, L = 200 μH
Energy losses include tail and diode reverse
recovery, TJ = 25 °C
-
0.26
-
-
1.2
-
-
1.46
-
Internal gate resistors (see electrical diagram)
IC = 50 A, VCC = 480 V, VGE = 15 V, L = 200 μH
Energy losses include tail and diode reverse
recovery, TJ = 150 °C
-
0.73
-
-
1.66
-
-
2.39
-
-
7100
-
-
510
-
-
140
-
-
82
97
ns
-
8.3
10.6
A
-
340
514
nC
V
mA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Total gate charge (turn-on)
Qg
Gate to emitter charge (turn-on)
Qge
Gate to collector charge (turn-on)
Qgc
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Ets
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Ets
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
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TEST CONDITIONS
IC = 52 A
VGE = 0 V
VCC = 30 V
f = 1.0 MHz
VCC = 200 V, IC = 50 A
dI/dt = 200 A/μs
VCC = 200 V, IC = 50 A
dI/dt = 200 A/μs
TJ = 125 °C
For technical questions, contact: [email protected]
nC
mJ
mJ
pF
-
137
153
ns
-
12.7
14.8
A
-
870
1132
nC
Document Number: 94468
Revision: 01-Mar-10
50MT060WHTAPbF
"Half Bridge" IGBT MTP Vishay High Power Products
(Warp Speed IGBT), 114 A
THERMISTOR SPECIFICATIONS
PARAMETER
SYMBOL
Resistance
(1)
β (1)(2)
R0
Sensitivity index of the
thermistor material
TEST CONDITIONS
MIN.
TYP.
MAX.
UNITS
T0 = 25 °C
-
30
-
kΩ
T0 = 25 °C
T1 = 85 °C
-
4000
-
K
MIN.
TYP.
MAX.
UNITS
- 40
-
150
- 40
-
125
Notes
(1) T , T are thermistor´s temperatures
0
1
R0
1
1
------- = exp β ⎛⎝ ------ – ------⎞⎠ , temperature in Kelvin
T0 T1
R1
(2)
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Operating junction
temperature range
SYMBOL
TEST CONDITIONS
IGBT, Diode
Thermistor
TJ
- 40
-
125
-
-
0.38
-
-
0.8
Heatsink compound thermal conductivity = 1 W/mK
-
0.06
-
Clearance (1)
External shortest distance in air between 2 terminals
5.5
-
-
Creepage (1)
Shortest distance along the external surface of the
insulating material between 2 terminals
8
-
-
Mounting torque to heatsink
A mounting compound is recommended and the
torque should be checked after 3 hours to allow for
the spread of the compound. Lubricated threads.
Storage temperature range
TStg
IGBT
Junction to case
Diode
Case to sink per module
RthJC
RthCS
°C
°C/W
mm
3 ± 10 %
Nm
66
g
Weight
Note
Standard version only i.e. without optional thermistor
100
94468_01
Maximum DC Collector Current (A)
IC - Collector to Emitter Current (A)
(1)
VGE = 15 V
20 μs pulse width
10
TJ = 150 °C
TJ = 25 °C
1
0.1
1.0
100
80
60
40
20
0
10
VCE - Collector to Emitter Voltage (V)
Fig. 1 - Typical Output Characteristics
Document Number: 94468
Revision: 01-Mar-10
120
25
94468_02
50
75
100
125
150
TC - Case Temperature (°C)
Fig. 2 - Maximum Collector Current vs. Case Temperature
For technical questions, contact: [email protected]
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50MT060WHTAPbF
Vishay High Power Products "Half Bridge" IGBT MTP
(Warp Speed IGBT), 114 A
160
IC = 50 A
2.0
120
100
IF = 50 A, TJ = 25 °C
1.5
80
IC = 20 A
20
40
60
80
100
120
140
60
100
160
TJ - Junction Temperature (°C)
94468_03
1000
dIF/dt (A/µs)
94468_06
Fig. 3 - Typical Collector to Emitter Voltage vs.
Junction Temperature
Fig. 6 - Typical Reverse Recovery Time vs. dIF/dt
100
20
VR = 200 V
VCC = 400 V
IC = 52 A
VGE - Gate to Emitter Voltage (V)
IF = 50 A, TJ = 125 °C
IC = 100 A
1.0
16
IF = 50 A, TJ = 125 °C
IRRM (A)
12
8
10
IF = 50 A, TJ = 25 °C
4
1
100
0
0
100
200
300
400
OG - Typical Gate Charge (nC)
94468_04
1000
dIF/dt (A/µs)
94468_07
Fig. 4 - Typical Gate Charge vs.
Gate to Emitter Votlage
Fig. 7 - Typical Reverse Recovery Current vs. dIF/dt
100
2000
VR = 200 V
1500
Qrr (nC)
IF - Instantaneous Forward Current (A)
VR = 200 V
140
2.5
trr (ns)
VCE - Typical Collector to Emitter
Voltage (V)
3.0
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
IF = 50 A, TJ = 125 °C
1000
500
IF = 50 A, TJ = 25 °C
1
0.4
0.8
1.2
1.6
2.0
VFM - Forward Voltage Drop (V)
94468_05
Fig. 5 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
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4
0
100
2.4
1000
dIF/dt (A/μs)
94468_08
Fig. 8 - Typical Stored Charge vs. dIF/dt
For technical questions, contact: [email protected]
Document Number: 94468
Revision: 01-Mar-10
50MT060WHTAPbF
"Half Bridge" IGBT MTP Vishay High Power Products
(Warp Speed IGBT), 114 A
3, 4
3, 4
2
T
10 Ω
11
11
12
10 Ω
12
R
5, 6
1
5, 6
10 Ω
9
Thermistor
option
9
10
10 Ω
10
7, 8
7, 8
Fig. 9 - Functional Diagram
Fig. 10 - Electrical Diagram
ORDERING INFORMATION TABLE
Device code
50
MT
060
W
H
T
A
PbF
1
2
3
4
5
6
7
8
1
-
Current rating (50 = 50 A)
2
-
Essential part number
3
-
Voltage rating (060 = 600 V)
4
-
Speed/type (W = Warp IGBT)
5
-
Circuit configuration (H = Half bridge)
6
-
T = Thermistor
7
-
A = Al2O3 substrate
8
-
Lead (Pb)-free
CIRCUIT CONFIGURATION
LINKS TO RELATED DOCUMENTS
Dimensions
Document Number: 94468
Revision: 01-Mar-10
www.vishay.com/doc?95175
For technical questions, contact: [email protected]
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Outline Dimensions
Vishay Semiconductors
MTP
Ø 1.1
20.5
12 ± 0.5
2.5
4
Ø5
3.5
DIMENSIONS in millimeters
31.8
33
2
8 7
6 5
4 3
1
13
9
10
11
1.8
12
8.1
1.2 ± 0.1
7.2 ± 0.1
7.8 ± 0.1
R2.6 (x 3)
5.7 ± 0.1
11.35
± 0.1
5.4 ± 0.1
11.35
± 0.1
27.5
3 ± 0.1
45°
8.7 ± 0.1
R5.8 (x 2)
8.5 ± 0.1
6 ± 0.1
3 ± 0.1
39.5 ± 0.1
44.5
48.7
1.3
63.5 ± 0.25
Note
• Unused terminals are not assembled in the package
Document Number: 95175
Revision: 18-Mar-08
For technical questions, contact: [email protected]
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Document Number: 91000
Revision: 11-Mar-11
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