Data Port EMI Filter Array with ESD Protection CM1454 Features • • • • • • • • • Optiguard™ coated for improved reliability Eight channels of EMI filtering Three C-L-C filters with ESD protection for stereo speaker port Five C-R-C filters with ESD protection for microphone and data ports +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package (CSP) features extremely low parasitic inductance for optimum filter and ESD performance 20 bump, 3.960mm x 1.586mm footprint CSP RoHS compliant (lead-free) Applications • • • • • Combination I/O data port that has I/Os for data, microphone and speaker I/O port protection for mobile handsets, notebook computers, PDAs etc "EMI filtering for data ports in cell phones, PDAs or notebook computers Wireless Handsets Handheld PCs / PDAs Product Description The CM1454 is an EMI filter array with ESD protection in a CSP form factor for the data port of a mobile handset. The CM1454-08 is configured in an 8 channel format and combines both resistorcapacitor (R-C) and inductor-capacitor (L-C) filters in the chip. There are five C-R-C filters with component values of 30pF-100 -30pF which are used for the microphone and data ports. There are also three CL-C filters with values of 80pF-3nH-80pF which are designed for the stereo speaker port. The CM1454's C-RC filters have a cut-off frequency of 60MHz and an attenuation of better than 35dB over the 800MHz to 2.7GHz frequency range. The C-L-C filters have a cut-off frequency of 21MHz with an attenuation of 40dB at 1Ghz. The parts integrate ESD protection diodes on every pin that provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, which is beyond the Level 4 requirement of the IEC61000-4-2 international standard. In accordance with MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are also protected for contact discharges at greater than ±30kV. The CM1454 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1454 is available in a space saving, low profile Chip Scale Package with, RoHS compliant, lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1454/D CM1454 Electrical Schematic Figure 1. CM1454 Schematic Diagram of R-C and L-C Filter Arrays with ESD Rev. 2 | Page 2 of 10 | www.onsemi.com CM1454 PIN DESCRIPTIONS PIN DESCRIPTION PIN NUMBER PIN NUMBER PIN DESCRIPTION A1 Filter #1 (Microphone) B3 GND A2 Filter #2 (Microphone) B4 GND A3 Filter #3 (Stereo Headphone) C1 Filter #1 A4 Filter #4 (Left Speaker) C2 Filter #2 A5 Filter #5 (Right Speaker) C3 Filter #3 A6 Filter #6 (Accessory ID) C4 Filter #4 A7 Filter #7 (Data) C5 Filter #5 A8 Filter #8(Data) C6 Filter #6 B1 GND C7 Filter #7 B2 GND C8 Filter #8 Rev. 2 | Page 3 of 10 | www.onsemi.com CM1454 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps Package 20 CSP 1 Ordering Part Number Part Marking CM1454-08CP N548 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC current per Inductor 30 mA DC Package Power Rating 0.5 W RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 10 | www.onsemi.com CM1454 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 80 100 120 Ω 24 30 36 pF R Resistance C1 Capacitance L Inductance 3.0 nH RE Equivalent Series Resistance of Inductor 0.25 Ω C2 Capacitance 2.5V dc; 1MHz, 30mV ac 0V dc; 1MHz, 30mV ac; 100 125 150 pF 2.5V dc; 1MHz, 30mV ac; 64 80 96 pF fRC Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω 60 MHz fLC Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω 21 MHz VST Stand-off Voltage I = 10μA 6.0 V ILEAK Diode Leakage Current VIN = 3.3V 0.1 1.0 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD RDYN In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 5.6 -1.5 Notes 2 and 3 Dynamic Resistance Positive Negative ±30 kV ±15 kV 2.3 0.9 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open. Rev. 2 | Page 5 of 10 | www.onsemi.com Ω Ω CM1454 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 2. Attenuation Curve for CM1454 RC Filters: 1, 2, 6, 7, and 8 Figure 3. Attenuation Curve for CM1454 RC Filters: 3, 4, and 5 Rev. 2 | Page 6 of 10 | www.onsemi.com CM1454 Diode Characteristics (nominal conditions unless specified otherwise) Figure 4. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) Rev. 2 | Page 7 of 10 | www.onsemi.com CM1454 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 8 of 10 | www.onsemi.com 260°C CM1454 Mechanical Specifications CM1454 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.915 3.960 4.005 0.1541 0.1559 0.1577 A2 1.541 1.586 1.631 0.0607 0.0624 0.0642 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.308 0.358 0.408 0.0121 0.0141 0.0161 D1 0.574 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1454-08CP Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 9 of 10 | www.onsemi.com CM1454 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1454-08CP 3.96 X 1.586X 0.640 4.06 X 1.98 X 0.76 12mm 330mm (13") 3500 4mm 4mm + + + ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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