Thermal Data SDIP 30 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue ( silver filler ) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data SDIP 30 Rth(j-a) (ºC/W) 75 die size 160x80 sq. mils mounted on a low K board (1s 1 Oz.) 1) 70 80x80 sq. mils dissipating area 65 60 80x160 sq. mils dissipating area 55 0 0.5 1 1.5 dissipated power ( Watt ) 2 2.5 Zth( ºC/W) 2) 10 die size 160x80 sq. mils 80x80 sq. mils dissipating area mounted on a low K board (1s 1 Oz.) 0.001 0.01 0.1 1 10 100 1,000 Time (s) 2/2