TOSHIBA CRS15

CRS15
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS15
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
Unit: mm
Forward current (DC): IF (DC) = 3.0 A
•
Repetitive peak reverse voltage: VRRM = 30 V
•
Suitable for high-density board assembly due to the use of a small
surface-mount package, “S-FLATTM”
0.9 ± 0.1
Rating
Unit
Repetitive peak reverse voltage
VRRM
30
V
Forward current (DC)
IF (DC)
3.0 (Note 1)
A
IFSM
30 (50 Hz)
A
Junction temperature
Tj
−40 to 150
°C
Storage temperature
Tstg
−40 to 150
°C
Note 1: Ta = 69°C : Device mounted on a ceramic board
Board size : 50 mm × 50 mm
Soldering size : 2 mm × 2 mm
Board thickness : 0.64 mm
DC waveform (VR = 0 V)
①
0 ~ 0.1
Symbol
Peak one cycle surge forward current
(non-repetitive)
0.16
+ 0.2
1.6 − 0.1
0.98 ± 0.1
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
0.65 ± 0.2
Forward voltage: VFM = 0.52 V (max) @ IF = 3.0 A
•
2.6 ± 0.1
3.5 ± 0.2
•
0.65 ± 0.2
②
① ANODE
② CATHODE
JEDEC
⎯
JEITA
⎯
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
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Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance (junction to ambient)
Symbol
Test Condition
Min
Typ.
Max
VFM (1)
IFM = 0.1 A (pulse test)
⎯
0.35
⎯
VFM (2)
IFM = 1.0 A (pulse test)
⎯
0.415
⎯
VFM (3)
IFM = 3.0 A (pulse test)
⎯
0.47
0.52
IRRM (1) VRRM = 5.0 V (pulse test)
⎯
0.8
⎯
IRRM (2) VRRM = 30 V (pulse test)
⎯
10
50
VR = 10 V, f = 1.0 MHz
⎯
90
⎯
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
⎯
⎯
70
Cj
Rth (j-a)
(soldering land: 6 mm × 6 mm)
V
μA
pF
°C/W
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
Unit
⎯
⎯
140
⎯
⎯
20
(board thickness: 1.6 mm)
Thermal resistance (junction to lead)
⎯
Rth (j-ℓ)
2
°C/W
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CRS15
Marking
Part No.(or abbreviation code)
Abbreviation Code
Part No.
SE
CRS15
Anode
Cathode
SE
Cathode mark and Lot code
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even for a
moment. Do not exceed any of these ratings. The following are the general derating methods that we recommend
when you design a circuit with a device.
VRRM:
Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
IF(AV) and IF(DC): We recommend that the worst case current be no greater than 80% of the absolute
maximum rating of IF(AV) and Tj be below 120°C. When using this device, take the margin into
consideration by using an allowable Ta max-IF(AV) curve.
IFSM:
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Tj:
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a Tj of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
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PF (AV) – IF (AV)
3
Tj = 150°C
125°C
1
75°C
25°C
0.3
0.1
0.03
1.2
120°
0.8
Rectangular
waveform
0.6
0.4
0° α 360°
0.2
Conduction angle α
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Instantaneous forward voltage vF
(V)
0
0.0
0.8
0.6
1.2
160
Rectangular waveform
3.0
3.6
IF (AV) (A)
Rectangular waveform
140
Maximum allowable temperature
Ta max (°C)
0° α 360°
IF (AV)
Conduction angle α
VR = 15 V
120
100
DC
80
60
180°
40
120°
α = 60°
0
0.0
0.6
1.2
1.8
2.4
Average forward current
3.0
0° α 360°
IF (AV)
Conduction angle α
VR = 15 V
120
100
80
60
40
DC
20
20
α = 60°
0
0.0
3.6
IF (AV) (A)
180°
120°
0.6
1.2
1.8
2.4
Average forward current
3.0
3.6
IF (AV) (A)
rth (j-a) – t
Tℓ max – IF (AV)
1000
160
500
140
Transient thermal impedance
rth (j-a) (°C/W)
DC
120
100
180°
120°
α = 60°
80
Rectangular waveform
40
20
2.4
Ta max – IF (AV)
Glass-epoxy substrate (substrate size:
50 mm × 50 mm, soldering land: 6 mm × 6 mm)
140
60
1.8
Average forward current
50 mm × 50 mm, soldering land: 2 mm × 2 mm)
160
Maximum allowable lead temperature
Tℓ max (°C)
DC
α = 60°
1.0
Ta max – IF (AV)
Ceramic substrate (substrate size:
Maximum allowable temperature
Ta max (°C)
180°
1.4
Average forward power dissipation
PF (AV) (W)
Instantaneous forward current
iF
(A)
iF – vF
10
0° α 360°
IF (AV)
Conduction angle α
VR = 15 V
0
0.0
0.6
1.2
300
100
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
50
30
10
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
5
3
1.8
Average forward current
2.4
3.0
1
0.001
3.6
0.01
0.1
1
10
100
Time t (s)
IF (AV) (A)
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Surge forward current
(non-repetitive)
Cj – VR
f = 1 MHz
(pF)
Ta = 25°C
f = 50 Hz
20
10
1
3
5
10
30
50
Ta = 25°C
500
Cj
30
0
300
100
50
30
10
1
100
3
Number of cycles
IR – Tj
(typ.)
VR = 30 V
1
20 V
10 V
5V
3V
0.001
0.0001
0
20
40
60
80
100
Junction temperature
30
120
Tj
VR
50
140
0°
0.5
0.4
(V)
(°C)
VR
DC
Conduction angle α
Tj = 150°C
300°
240°
180°
120°
60°
0.2
0.1
0
4
8
12
16
Reverse voltage
5
(typ.)
Rectangular
waveform
360°
0.3
0
160
100
0.6
(W)
(mA)
10
0.7
PR (AV)
Average reverse power dissipation
Pulse test
0.1
10
PR (AV) – VR
0.8
0.01
5
Reverse voltage
100
Reverse current IR
(typ.)
1000
Junction capacitance
Peak surge forward current
IFSM (A)
40
20
VR
24
28
(V)
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
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noncompliance with applicable laws and regulations.
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