ONSEMI CM1453-08CP

Praetorian® 8-Channel EMI Filter
Array with ESD Protection
CM1453-08CP
Features
•
•
•
•
•
•
•
•
Eight channels of EMI filtering
±15kV ESD protection
(IEC 61000-4-2, contact discharge)
±30kV ESD protection (HBM)
Greater than -40dB of attenuation at 1GHz
Chip Scale Package (CSP) with 0.40mm pitch
and 0.25mm CSP solder ball which features
extremely low parasitic inductance for optimum
filter and ESD performance
OptiGuard™ Coating for improved reliability at
assembly
RoHS compliant
Applications
•
•
•
•
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs
or notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
Product Description
The CM1453-08CP is a pi-style EMI filter array with
ESD protection, which integrates eight filters (C-L-C)
in CSP form factor with 0.40mm pitch. Each EMI
filter channel of the CM1453-08CP is implemented as
a 3-pole L-C filter where the component values are
9.5pF-20nH-9.5pF. The roll-off frequency at -6dB
attenuation is 380MHz and can be used in
applications where the data rates are as high as
160Mbps while providing greater than -35dB over the
800MHz to 2.7GHz frequency range. The parts
include ESD diodes on every I/O pin and provide a
high level of protection against electrostatic discharge
(ESD). The ESD protection diodes connected to the
filter ports are designed and characterized to safely
dissipate ESD strikes of ±15kV, beyond the
maximum requirement of the IEC61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact
discharges at greater than ±30kV.
This device is particularly well suited for wireless
handsets, mobile LCD modules and PDAs because
of its small package format and easy-to-use pin
assignments. In particular, the CM1453-08CP is
ideal for EMI filtering and protecting data and control
lines for the LCD display and camera interface in
mobile handsets.
The CM1453-08CP incorporates OptiGuard™ which
results in improved reliability at assembly. It is
manufactured with a 0.40mm pitch and 0.25mm CSP
solder ball to provide up to 28% board space savings
vs. competing CSP devices with 0.50mm pitch and
0.30mm CSP solder ball.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1453-08CP/D
CM1453-08CP
Electrical Schematic
m
1 of 8 Channels
Rev. 2 | Page 2 of 12 | www.onsemi.com
CM1453-08CP
PIN DESCRIPTIONS
PIN NUMBER
PIN
DESCRIPTION
PIN NUMBER
A1
Filter #1
C1
Filter #1
A2
Filter #2
C2
Filter #2
A3
Filter #3
C3
Filter #3
A4
Filter #4
C4
Filter #4
A5
Filter #5
C5
Filter #5
A6
Filter #6
C6
Filter #6
A7
Filter #7
C7
Filter #7
A8
Filter #8
C8
Filter #8
B1
GND
–
B2
GND
–
B3
GND
–
B4
GND
–
-08
PIN
DESCRIPTION
-08
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Bumps
Package
Ordering Part Number1
Part Marking
20
CSP
CM1453-08CP
N538
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Rev. 2 | Page 3 of 12 | www.onsemi.com
CM1453-08CP
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC current per Inductor
30
mA
DC Package Power Rating
0.5
W
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 2 | Page 4 of 12 | www.onsemi.com
CM1453-08CP
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
LTOT
Total Channel Inductance
CTOT
Total Channel Capacitance (C1 x 2)
2.5V dc; 1MHz, 30mV ac
C1
Capacitance
2.5V dc; 1MHz, 30mV ac
VST
Stand-off Voltage
I = 10μA
ILEAK
Diode Leakage Current
VIN = 3.3V
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
VESD
MIN
TYP
MAX
20
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
15.2
19
nH
22.8
9.5
pF
pF
5.5
5.6
-1.5
UNITS
V
0.1
1.0
μA
6.8
-0.8
9.0
-0.4
V
V
Notes 2 and 3
± 30
kV
±15
kV
fC
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
300
MHz
fC
Roll-off frequency at -6dB Attenuation
ZSOURCE = 50Ω, ZLOAD = 50Ω
380
MHz
2.3
0.9
Ω
Ω
RDYN
Dynamic Resistance
Positive
Negative
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Unused pins are left open.
Rev. 2 | Page 5 of 12 | www.onsemi.com
CM1453-08CP
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (CM1453-08: Filter 1)
Figure 2. Insertion Loss VS. Frequency (CM1453-08: Filter 2)
Rev. 2 | Page 6 of 12 | www.onsemi.com
CM1453-08CP
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (CM1453-08: Filter 3)
Figure 4. Insertion Loss VS. Frequency (CM1453-08: Filter 4)
Rev. 2 | Page 7 of 12 | www.onsemi.com
CM1453-08CP
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. Insertion Loss VS. Frequency (CM1453-08: Filter 5)
Figure 6. Insertion Loss VS. Frequency (CM1453-08: Filter 6)
Rev. 2 | Page 8 of 12 | www.onsemi.com
CM1453-08CP
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 7. Insertion Loss VS. Frequency (CM1453-08: Filter 7)
Figure 8. Insertion Loss VS. Frequency (CM1453-08: Filter 8)
Rev. 2 | Page 9 of 12 | www.onsemi.com
CM1453-08CP
Performance Information (cont’d)
Figure 9. Typical Diode Capacitance vs. Input Voltage
(normalized to 2.5V d.c)
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices. See http://www.wlcspforum.org/documents/pdf/ap-217.pdf for
download.
Rev. 2 | Page 10 of 12 | www.onsemi.com
CM1453-08CP
Mechanical Specifications
CM1453 devices are packaged in custom Chip Scale Packages (CSP). See Application Note AP-217 for more
information at: http://www.wlcspforum.org/documents/pdf/ap-217.pdf.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
20
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
3.229 3.274 3.319 0.1271 0.1289 0.1307
A2
1.099 1.144 1.189 0.0433 0.0450 0.0468
B1
0.395 0.400 0.405 0.0156 0.0157 0.0159
B2
0.195 0.200 0.205 0.0077 0.0079 0.0081
B3
0.342 0.347 0.352 0.0135 0.0137 0.0139
B4
0.342 0.347 0.352 0.0135 0.0137 0.0139
C1
0.187 0.237 0.287 0.0074 0.0093 0.0113
C2
0.175 0.225 0.275 0.0069 0.0089 0.0108
D1
0.545 0.615 0.685 0.0215 0.0242 0.0270
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1453-08CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 11 of 12 | www.onsemi.com
CM1453-08CP
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1453-08CP
3.27 X 1.14X 0.615
3.40 X 1.27 X 0.73
12mm
330mm (13")
3500
4mm
4mm
+
+
+
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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