DIODES DMP57D5UV-7

DMP57D5UV
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET
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NEW PRODUCT
Features
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Mechanical Data
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Low On-Resistance
ESD Protected Gate to 1kV
Low Input Capacitance
Fast Switching Speed
Lead Free By Design/RoHS Compliant (Note 2)
“Green” Device (Note 3)
Qualified to AEC-Q 101 Standards for High Reliability
Case: SOT-563
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish ⎯ Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
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SOT-563
ESD protected to 1kV
Maximum Ratings
D2
G1
S1
S2
G2
D1
TOP VIEW
Internal Schematic
TOP VIEW
@TA = 25°C unless otherwise specified
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Drain Current (Note 2)
Thermal Characteristics
Symbol
VDSS
VGSS
ID
Continuous
Continuous
Value
-50
±8
-160
Units
V
V
mA
Value
400
313
-55 to +150
Units
mW
°C/W
°C
@TA = 25°C unless otherwise specified
Characteristic
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
Electrical Characteristics
Symbol
PD
RθJA
TJ, TSTG
@TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-50
⎯
⎯
⎯
⎯
⎯
⎯
-10
±500
V
μA
nA
VGS = 0V, ID = -250μA
VDS = -50V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(th)
RDS (ON)
⎯
4.6
6.0
-1.0
6
8
V
Static Drain-Source On-Resistance
⏐Yfs⏐
VSD
-0.7
⎯
⎯
100
⎯
⎯
⎯
⎯
-1.2
mS
V
VDS = VGS, ID = -250μA
VGS = -4V, ID = -100mA
VGS = -2.5V, ID = -80mA
VDS = -5V, ID = -100mA
VGS = 0V, IS = -100mA
Ciss
Coss
Crss
⎯
⎯
⎯
29
7.3
2.5
⎯
⎯
⎯
pF
pF
pF
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Notes:
Ω
Test Condition
VDS = -25V, VGS = 0V, f = 1.0MHz
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
DMP57D5UV
Document number: DS31540 Rev. 3 - 2
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April 2009
© Diodes Incorporated
DMP57D5UV
0.8
0.4
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
0.6
VGS = -10V
0.5
VGS = -4.5V
0.4
0.3
VGS = -2.5V
0.2
0.1
VGS = -1.5V
0
0.5
1
1.5 2 2.5 3 3.5 4 4.5
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
VDS = -5V
0.2
TA = 25°C
TA = 150°C
TA = -55°C
TA = 85°C
0.1
0
0.5
5
1
1.5
2
2.5
-VGS, GATE SOURCE VOLTAGE (V)
3
Fig. 2 Typical Transfer Characteristics
100
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
10
9
8
7
6
VGS = -2.5V
5
4
VGS = -4.5V
VGS = -10V
3
2
1
0
0.001
0.01
0.1
-ID, DRAIN CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
T A = 125°C
10
TA = 25°C
TA = -55°C
1
2.0
35
1.8
30
1.6
25
VGS = -4V
ID = -100mA
1.4
VGS = -2.5V
ID = -100mA
1.2
1.0
T A = 150°C
TA = 85°C
0
1
C, CAPACITANCE (pF)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.3
VGS = -1.8V
0
RDS(ON), DRAIN-TO-SOURCE
RESISTANCE (NORMALIZED)
NEW PRODUCT
0.7
0.1
0.2
0.3
0.4
0.5
-ID, DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
Ciss
20
f = 1MHz
VGS = 0V
15
10
0.8
5
0.6
-50
0
Coss
C rss
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
DMP57D5UV
Document number: DS31540 Rev. 3 - 2
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0
5
10
15
20
25
30
35
-VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 6 Typical Capacitance
40
April 2009
© Diodes Incorporated
DMP57D5UV
0.5
0.9
ID = -250µA
-IS, SOURCE CURRENT (A)
-VGS(TH), GATE THRESHOLD VOLTAGE (V)
0.8
0.7
0.6
0.4
0.3
0.2
T A = 150°C
T A = 125°C
0.1
T A = 85°C
T A = 25°C
0.5
-50
TA = -55°C
0
0.3
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
0.4
0.5
0.6
0.7
0.8
0.9
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
1
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.9
D = 0.1
D = 0.05
D = 0.02
RθJA(t) = r(t) * RθJA
RθJA = 294°C/W
D = 0.01
D = 0.005
0.01
P(pk)
D = Single Pulse
t1
t2
T J - T A = P * RθJA(t)
Duty Cycle, D = t1/t2
0.001
0.00001
0.0001
0.001
0.01
0.1
t1, PULSE DURATION TIME (s)
1
10
100
Fig. 9 Transient Thermal Response
Ordering Information
(Note 5)
Part Number
DMP57D5UV -7
Notes:
Case
SOT-563
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
(Note 6)
KDP = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
KDP YM
Notes:
Packaging
3000/Tape & Reel
6. Package is non-polarized. Parts may be on reel in orientation illustrated, 180° rotated, or mixed (both ways).
Date Code Key
Year
Code
Month
Code
2008
V
Jan
1
DMP57D5UV
Document number: DS31540 Rev. 3 - 2
2009
W
Feb
2
Mar
3
2010
X
Apr
4
2011
Y
May
5
Jun
6
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2012
Z
Jul
7
2013
A
Aug
8
Sep
9
2014
B
Oct
O
2015
C
Nov
N
Dec
D
April 2009
© Diodes Incorporated
DMP57D5UV
Package Outline Dimensions
A
NEW PRODUCT
B
C
D
G
M
K
SOT-563
Dim Min
Max
Typ
A
0.15 0.30 0.20
B
1.10 1.25 1.20
C
1.55 1.70 1.60
D
0.50
G
0.90 1.10 1.00
H
1.50 1.70 1.60
K
0.55 0.60 0.60
L
0.10 0.30 0.20
M
0.10 0.18 0.11
All Dimensions in mm
H
L
Suggested Pad Layout
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
2.2
G
1.2
X
0.375
Y
0.5
C
1.7
E
0.5
X
DMP57D5UV
Document number: DS31540 Rev. 3 - 2
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April 2009
© Diodes Incorporated
DMP57D5UV
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
DMP57D5UV
Document number: DS31540 Rev. 3 - 2
5 of 5
www.diodes.com
April 2009
© Diodes Incorporated