VISHAY GT100NA120UX

GT100NA120UX
Vishay Semiconductors
"High Side Chopper" IGBT SOT-227
(Trench IGBT), 100 A
FEATURES
• Trench IGBT technology
• Very low VCE(on)
• Square RBSOA
• HEXFRED® clamping diode
• 10 μs short circuit capability
• Fully isolated package
SOT-227
• Speed 4 kHz to 30 kHz
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
• Compliant to RoHS directive 2002/95/EC
PRODUCT SUMMARY
BENEFITS
VCES
1200 V
IC DC
100 A at 71 °C
VCE(on) typical at 100 A, 25 °C
2.36 V
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
• Easy to assemble and parallel
• Direct mounting on heatsink
• Plug-in compatible with other SOT-227 packages
• Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter voltage
VCES
Continuous collector current
IC
TEST CONDITIONS
MAX.
UNITS
1200
V
TC = 25 °C
134
TC = 80 °C
92
Pulsed collector current
ICM
270
Clamped inductive load current
ILM
270
Diode continuous forward current
Gate to emitter voltage
Power dissipation, IGBT
Power dissipation, diode
RMS isolation voltage
Document Number: 93100
Revision: 22-Jul-10
IF
A
TC = 25 °C
87
TC = 80 °C
59
± 20
VGE
PD
PD
VISOL
TC = 25 °C
463
TC = 80 °C
260
TC = 25 °C
338
TC = 80 °C
190
Any terminal to case, t = 1 min
2500
V
W
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GT100NA120UX
Vishay Semiconductors "High Side Chopper" IGBT SOT-227
(Trench IGBT), 100 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Collector to emitter breakdown
voltage
VBR(CES)
Collector to emitter voltage
VCE(on)
Gate threshold voltage
VGE(th)
Temperature coefficient of
threshold voltage
VGE(th)/TJ
Collector to emitter leakage current
ICES
Diode reverse breakdown voltage
VBR
TEST CONDITIONS
MIN.
TYP.
MAX.
VGE = 0 V, IC = 1 mA
1200
-
-
VGE = 15 V, IC = 50 A
-
1.79
2.33
VGE = 15 V, IC = 100 A
-
2.36
2.85
VGE = 15 V, IC = 50 A, TJ = 125 °C
-
2.05
2.62
VFM
Diode reverse leakage current
IRM
Gate to emitter leakage current
IGES
V
VGE = 15 V, IC = 100 A, TJ = 125 °C
-
2.8
3.42
VCE = VGE, IC = 500 μA
5
5.8
7
VCE = VGE, IC = 1 mA (25 °C to 125 °C)
-
- 15.6
-
VGE = 0 V, VCE = 1200 V
-
0.5
100
μA
VGE = 0 V, VCE = 1200 V, TJ = 125 °C
-
0.052
2
mA
V
IR = 1 mA
IC = 50 A, VGE = 0 V
Diode forward voltage drop
UNITS
1200
-
-
-
2.53
3.55
IC = 100 A, VGE = 0 V
-
3.32
4.35
IC = 50 A, VGE = 0 V, TJ = 125 °C
-
2.66
3.70
mV/°C
V
IC = 100 A, VGE = 0 V, TJ = 125 °C
-
3.7
4.50
VR = VR rated
-
4
50
μA
TJ = 125 °C, VR = VR rated
-
0.6
3
mA
VGE = ± 20 V
-
-
± 200
nA
MIN.
TYP.
MAX.
UNITS
-
400
-
-
120
-
-
170
-
-
21.9
-
-
5.48
-
-
27.38
-
-
23.6
-
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Total gate charge (turn-on)
Qg
Gate to emitter charge (turn-on)
Qge
Gate to collector charge (turn-on)
Qgc
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Energy losses
include tail and
diode recovery
(see fig. 18)
7.65
-
31.25
-
-
195
-
-
259
-
td(off)
-
188
-
tf
-
212
-
Etot
Turn-on delay time
td(on)
tr
Fall time
IC = 100 A, VCC = 600 V,
VGE = 15 V, Rg = 5 
L = 500 μH
-
Eoff
Total switching loss
Turn-off delay time
IC = 100 A, VCC = 600 V, VGE = 15 V
-
Turn-off switching loss
Rise time
TEST CONDITIONS
IC = 100 A, VCC = 600 V,
VGE = 15 V, Rg = 5 
L = 500 μH, TJ = 125 °C
Reverse bias safe operating area
RBSOA
TJ = 150 °C, IC = 270 A, Rg = 22 
VGE = 15 V to 0 V, VCC = 900 V,
VP = 1200 V
Short circuit safe operating area
SCSOA
TJ = 150 °C, Rg = 22 
VGE = 15 V to 0 V, VCC = 900 V,
VP = 1200 V
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
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IF = 50 A, dIF/dt = 200 A/μs, VR = 200 V
IF = 50 A, dIF/dt = 200 A/μs,
VR = 200 V, TJ = 125 °C
nC
mJ
ns
Fullsquare
10
μs
-
129
161
-
11
14
A
-
700
1046
nC
-
208
257
ns
-
17
21
A
-
1768
2698
nC
For technical questions within your region, please contact one of the following:
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ns
Document Number: 93100
Revision: 22-Jul-10
GT100NA120UX
"High Side Chopper" IGBT SOT-227 Vishay Semiconductors
(Trench IGBT), 100 A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNITS
TJ, TStg
- 40
-
150
°C
Maximum junction and storage temperature
range
-
-
0.27
-
-
0.37
-
0.05
-
Mounting torque, 6-32 or M3 screw
-
-
1.3
Nm
Weight
-
30
-
g
IGBT
Thermal resistance, junction to case
RthJC
Diode
RthCS
300
160
140
250
TJ = 25 °C
120
200
100
IC (A)
Allowable Case Temperature (°C)
Thermal resistance, case to sink per module
°C/W
80
60
TJ = 125 °C
150
100
40
50
20
0
0
0
20
40
60
80
100
120
140
0
160
1
2
3
4
5
6
IC - Continuous Collector Current (A)
VCE (V)
Fig. 1 - Maximum DC IGBT Collector Current vs.
Case Temperature
Fig. 3 - Typical IGBT Collector Current Characteristics
0.1
1000
TJ = 125 °C
100
ICES (mA)
0.01
IC (A)
10
1
0.001
TJ = 25 °C
0.1
0.01
1
10
100
1000
VCE (V)
Fig. 2 - IGBT Reverse Bias SOA
TJ = 150 °C, VGE = 15 V
Document Number: 93100
Revision: 22-Jul-10
10 000
0.0001
100
300
500
700
900
1100
VCES (V)
Fig. 4 - Typical IGBT Zero Gate Voltage Collector Current
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GT100NA120UX
Vishay Semiconductors "High Side Chopper" IGBT SOT-227
(Trench IGBT), 100 A
6.5
300
TJ = 25 °C
6.0
250
IF (A)
Vgeth (V)
TJ = 25 °C
200
5.5
5.0
4.5
150
TJ = 125 °C
100
TJ = 125 °C
50
4.0
0
3.5
0.0002
0.0004
0.0006
0.0008
0.001
0
1
2
3
4
5
6
7
IC (mA)
VFM (V)
Fig. 5 - Typical IGBT Threshold Voltage
Fig. 8 - Typical Diode Forward Characteristics
3.0
25
100 A
20
Energy (mJ)
VCE (V)
2.5
50 A
2.0
1.5
27 A
Eon
10
Eoff
5
1.0
0
10
30
50
70
90
110
130
150
10
20
30
40
50
60
70
80
90
100
TJ (°C)
IC (A)
Fig. 6 - Typical IGBT Collector to Emitter Voltage vs.
Junction Temperature, VGE = 15 V
Fig. 9 - Typical IGBT Energy Loss vs. IC
TJ = 125 °C, L = 500 μH, VCC = 600 V,
Rg = 5 , VGE = 15 V
1000
160
140
tf
Switching Time (ns)
Allowable Case Temperature (°C)
15
120
100
80
60
40
td(off)
td(on)
100
tr
20
0
10
0
20
40
60
80
100
IF - Continuous Forward Current (A)
Fig. 7 - Maximum DC Forward Current vs.
Case Temperature
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0
20
40
60
80
100
120
IC (A)
Fig. 10 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, L = 500 μH, VCC = 600 V,
Rg = 5 , VGE = 15 V
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 93100
Revision: 22-Jul-10
GT100NA120UX
"High Side Chopper" IGBT SOT-227 Vishay Semiconductors
(Trench IGBT), 100 A
40
250
230
35
Eon
190
25
trr (ns)
Energy (mJ)
TJ = 125 °C
210
30
20
170
150
TJ = 25 °C
130
15
110
Eoff
10
90
0
0
10
20
30
40
70
100
50
Rg (Ω)
1000
dIF/dt (A/µs)
Fig. 13 - Typical trr Diode vs. dIF/dt
VR = 200 V, IF = 50 A
Fig. 11 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, IC = 100 A, L = 500 μH,
VCC = 600 V, VGE = 15 V
1000
40
td(on)
35
Switching Time (ns)
td(off)
30
TJ = 125 °C
25
Irr (A)
tf
20
15
tr
TJ = 25 °C
10
5
100
0
10
20
30
40
0
100
50
Rg (Ω)
1000
dIF/dt (A/µs)
Fig. 14 - Typical Irr Diode vs. dIF/dt
VR = 200 V, IF = 50 A
Fig. 12 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, L = 500 μH, VCC = 600 V,
IC = 100 A, VGE = 15 V
2650
2400
2150
TJ = 125 °C
Qrr (nC)
1900
1650
1400
1150
900
TJ = 25 °C
650
400
100
1000
dIF/dt (A/µs)
Fig. 15 - Typical Qrr Diode vs. dIF/dt
VR = 200 V, IF = 50 A
Document Number: 93100
Revision: 22-Jul-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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GT100NA120UX
Vishay Semiconductors "High Side Chopper" IGBT SOT-227
(Trench IGBT), 100 A
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.01
DC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 16 - Maximum Thermal Impedance ZthJC Characteristics (IGBT)
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.01
DC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 17 - Maximum Thermal Impedance ZthJC Characteristics (Diode)
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 93100
Revision: 22-Jul-10
GT100NA120UX
"High Side Chopper" IGBT SOT-227 Vishay Semiconductors
(Trench IGBT), 100 A
R=
L
D.U.T.
VCC
ICM
VC *
50 V
1000 V
D.U.T.
1
2
+
-V
CC
Rg
* Driver same type as D.U.T.; VC = 80 % of Vce(max)
* Note: Due to the 50 V power supply, pulse width and inductor
will increase to obtain Id
Fig. 18a - Clamped Inductive Load Test Circuit
Fig. 18b - Pulsed Collector Current Test Circuit
Diode clamp/
D.U.T.
L
- +
-5V
+
VCC
D.U.T./
driver
Rg
Fig. 19a - Switching Loss Test Circuit
1
2
90 %
10 %
3
VC
90 %
td(off)
10 %
IC
5%
tf
tr
td(on)
t = 5 µs
Eoff
Eon
Ets = (Eon + Eoff)
Fig. 19b - Switching Loss Waveforms Test Circuit
Document Number: 93100
Revision: 22-Jul-10
For technical questions within your region, please contact one of the following:
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GT100NA120UX
Vishay Semiconductors "High Side Chopper" IGBT SOT-227
(Trench IGBT), 100 A
ORDERING INFORMATION TABLE
Device code
G
T
100
N
A
120
U
X
1
2
3
4
5
6
7
8
1
-
Insulated Gate Bipolar Transistor (IGBT)
2
-
T = Trench IGBT
3
-
Current rating (100 = 100 A)
4
-
Circuit configuration (N = High side chopper)
5
-
Package indicator (A = SOT-227)
6
-
Voltage rating (120 = 1200 V)
7
-
Speed/type (U = Ultrafast IGBT)
8
-
Diode (X = HEXFRED®)
CIRCUIT CONFIGURATION
3
2
1
4
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95036
Packaging information
www.vishay.com/doc?95037
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For technical questions within your region, please contact one of the following:
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Document Number: 93100
Revision: 22-Jul-10
Outline Dimensions
Vishay Semiconductors
SOT-227
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
Chamfer
2.00 (0.079) x 45°
4 x M4 nuts
Ø 4.40 (0.173)
Ø 4.20 (0.165)
-A3
4
6.25 (0.246)
12.50 (0.492)
25.70 (1.012)
25.20 (0.992)
-B-
1
2
R full
7.50 (0.295)
15.00 (0.590)
30.20 (1.189)
29.80 (1.173)
8.10 (0.319)
4x
7.70 (0.303)
2.10 (0.082)
1.90 (0.075)
0.25 (0.010) M C A M B M
2.10 (0.082)
1.90 (0.075)
-C-
12.30 (0.484)
11.80 (0.464)
0.12 (0.005)
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036
Revision: 28-Aug-07
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Disclaimer
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
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including but not limited to the warranty expressed therein.
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Document Number: 91000
Revision: 11-Mar-11
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