VISHAY TN2460T

TN2460L/TN2460T
Vishay Siliconix
N-Channel 240-V (D-S) MOSFET
PRODUCT SUMMARY
Part Number
V(BR)DSS Min (V)
TN2460L
240
TN2460T
rDS(on) Max (W)
VGS(th) (V)
ID Min (mA)
60 @ VGS = 10 V
0.5 to 1.8
75
60 @ VGS = 10 V
0.5 to 1.8
51
FEATURES
BENEFITS
APPLICATIONS
D
D
D
D
D
D
D
D
D
D
D High-Voltage Drivers: Relays, Solenoids,
Lamps, Hammers, Displays,
Transistors, etc.
D Telephone Mute Switches, Ringer Circuits
D Power Supply, Converters
D Motor Control
Low On-Resistance: 40 W
Secondary Breakdown Free: 260 V
Low Power/Voltage Driven
Low Input and Output Leakage
Excellent Thermal Stability
Low Offset Voltage
Full-Voltage Operation
Easily Driven Without Buffer
Low Error Voltage
No High-Temperature
“Run-Away”
TO-226AA
(TO-92)
S
1
G
2
D
TO-236
(SOT-23)
Device Marking
Front View
G
“S” TN
2406L
xxyy
3
“S” = Siliconix Logo
xxyy = Date Code
3
Marking Code: T2wll
1
S
D
2
T2 = Part Number Code for TN2460T
w = Week Code
ll = Lot Traceability
Top View
Top View
TN2460L
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
TN2460L
TN2460T
Drain-Source Voltage
VDS
240
240
Gate-Source Voltage
VGS
"20
"20
75
51
Continuous Drain Current (TJ = 150_C)
_
TA= 25_C
TA= 100_C
Pulsed Drain Currenta
Power Dissipation
Thermal Resistance, Junction-to-Ambient
Operating Junction and Storage Temperature Range
ID
IDM
TA= 25_C
TA= 100_C
PD
RthJA
TJ, Tstg
48
32
800
400
0.8
0.36
0.32
0.14
156
350
–55 to 150
Unit
V
mA
W
_C/W
_C
Notes
a. Pulse width limited by maximum junction temperature.
Document Number: 70205
S-04279—Rev. D , 16-Jul-01
www.vishay.com
11-1
TN2460L/TN2460T
Vishay Siliconix
SPECIFICATIONS (TA = 25_C UNLESS OTHERWISE NOTED)
Limits
Parameter
Symbol
Test Conditions
Min
Typa
V(BR)DSS
VGS = 0 V, ID = 10 mA
240
260
VGS(th)
VDS = VGS, ID = 250 mA
0.5
1.65
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
VDS = 0 V, VGS = "20 V
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
nA
"5
TJ = 125_C
0.1
5
TJ = 125_C
VDS = 10 V, VGS =10 V
75
140
VDS = 10 V, VGS = 4.5 V
20
130
VGS = 10 V, ID = 0.05 A
38
60
VGS = 4.5 V, ID = 0.02 A
40
60
75
120
gfs
VDS = 10 V, ID = 0.05 A
30
m
mA
mA
rDS(on)
TJ = 125_C
Forward Transconductanceb
V
"10
VDS = 120 V, VGS = 0 V
Drain-Source On-Resistanceb
1.8
70
W
mS
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS = 25 V, VGS = 0 V, f = 1 MHz
14
30
4
15
1
10
8
20
20
35
pF
Switchingc
Turn-On Time
tON
Turn-Off Time
tOFF
VDD = 25 V, RL = 500 W
ID ^ 0.05 A, VGEN = 10 V, RG = 25 W
Notes
a. For DESIGN AID ONLY, not subject to production testing.
b. Pulse test: PW v80 ms duty cycle v1%.
c. Switching time is essentially independent of operating temperature.
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11-2
ns
VNDN24
Document Number: 70205
S-04279—Rev. D , 16-Jul-01
TN2460L/TN2460T
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS OTHERWISE NOTED)
Output Characteristics
Transfer Characteristics
100
200
VGS = 10 V
160
80
4V
ID – Drain Current (mA)
ID – Drain Current (mA)
25_C
TJ = –55_C
120
80
3V
125_C
60
40
20
40
VDS = 15 V
2V
0
0
0
4
8
12
16
0
20
1
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
3
4
5
On-Resistance vs. Drain Current
125
100
VGS = 10 V
rDS(on) – On-Resistance ( Ω )
90
rDS(on) – On-Resistance ( Ω )
2
VGS – Gate-Source Voltage (V)
80
70
ID = 100 mA
60
50
100
75
50
25
50 mA
40
10 mA
0
30
0
4
8
12
16
20
0
50
100
VGS – Gate-Source Voltage (V)
Normalized On-Resistance
vs. Junction Temperature
200
250
Threshold Region
10
2.25
VDS = 5 V
VGS = 4.5 V
ID = 50 mA
2.00
TJ = 150_C
1.75
ID – Drain Current (mA)
rDS(on) – Drain-Source On-Resistance ( Ω )
(Normalized)
150
ID – Drain Current (A)
1.50
1.25
1.00
75_C
1
25__C
0.1
–55_C
0.75
0.50
–50
–10
30
70
110
TJ – Junction Temperature (_C)
Document Number: 70205
S-04279—Rev. D , 16-Jul-01
150
0.01
0.75
1
1.25
1.5
1.75
2
2.25
2.5
VGS – Gate-Source Voltage (V)
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11-3
TN2460L/TN2460T
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS OTHERWISE NOTED)
Capacitance
Gate Charge
20
15.0
VGS = 0 V
f = 1 MHz
ID = 30 mA
VGS – Gate-to-Source Voltage (V)
C – Capacitance (pF)
16
Ciss
12
Coss
8
4
12.5
10.0
7.5
VDS = 100 V
5.0
192 V
2.5
Crss
0
0
0
10
20
30
40
50
0
VDS – Drain-to-Source Voltage (V)
100
150
200
250
300
Qg – Total Gate Charge (pC)
Drive Resistance Effects on Switching
Load Condition Effects on Switching
100
50
VDD = 25 V
RL = 500 W
VGS = 0 to 10 V
ID = 50 mA
t – Switching Time (ns)
VDD = 25 V
RG = 25 W
VGS = 0 to 10 V
50
t – Switching Time (ns)
50
20
tf
td(off)
10
5
tr
tf
10
td(off)
tr
td(on)
2
td(on)
2
1
1
20
10
50
10
100
20
50
RG – Gate Resistor (W)
ID – Drain Current (A)
Normalized Effective Transient Thermal Impedance, Junction-to-Ambient (TO-226AA)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
Notes:
0.05
PDM
0.02
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 156_C/W
0.01
3. TJM – TA = PDMZthJA(t)
Single Pulse
0.01
0.1
1
10
100
1K
10 K
t1 – Square Wave Pulse Duration (sec)
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11-4
Document Number: 70205
S-04279—Rev. D , 16-Jul-01