MN101C73 Series Type Internal ROM type MN101C73A MN101CF73A Mask ROM FLASH 32K ROM (byte) 1.5K RAM (byte) Package (Lead-free) Minimum Instruction Execution Time 2K LQFP064-P-1414, TQFP064-P-1010C 0.1 µs (at 3.0 V to 3.6 V, 10 MHz) 0.235 µs (at 1.8 V to 3.6 V, 4.25 MHz)* 62.5 µs (at 1.8 V to 3.6 V, 32 kHz)* *: The lower limit for operation guarantee for flash memory built-in type is 2.2 V. Interrupts RESET. Watchdog. External 0 to 5. External 6 (key interrupt dedicated). Timer 0 to 3. Timer 6. Timer 7 (2 systems). Timer 8 (2 systems). Time base. Serial 0 (2 systems). Serial 1 (2 systems). Serial 3. A/D conversion finish Timer Counter 8-bit timer × 5 Timer 0 ..................Square-wave/8-bit PWM output. Event count. Remote control carrier output. Simple pulse width measurement. Added pulse (2-bit) type PWM output. Square-wave/PWM output to large current terminal P50 possible Timer 1 ..................Square-wave output. Event count. Synchronous output event Timer 2 ..................Square-wave output. Added pulse (2-bit) type PWM output. PWM output. Serial transfer clock output. Event count. Synchronous output event. Simple pulse width measurement. Square-wave/PWM output to large current terminal P51 possible Timer 3 ..................Square-wave output. Event count. Serial transfer clock output Timer 6 ..................8-bit freerun timer Timer 0, 1 can be cascade-connected Timer 2, 3 can be cascade-connected 16-bit timer × 2 Timer 7 ..................Square-wave output. 16-bit PWM output (cycle/duty continuous variable). Event count. Synchronous output event. Pulse width measurement. Input capture. Real time output control. High performance IGBT output. Squarewave/PWM output to large current terminal P52 possible Timer 8 ..................Square-wave/16-bit PWM output (duty continuous variable). Event count. Pulse width measurement. Input capture. Square-wave/PWM output to large current terminal P53 possible Timer 7, 8 can be cascade-connected: Square-wave output, PWM is possible as a 32-bit timer Time base timer: One-minute count setting Watchdog timer × 1 Serial interface Synchronous type/UART (full-duplex) × 2: Serial 0, 1 Synchronous type/Single-master I2C × 1: Serial 3 I/O Pins I/O 55 : Common use. Specified pull-up resistor available. Input/output selectable (bit unit) A/D converter 10-bit × 12 channels (with S/H) Display control function LCD: 32 segments × 4 commons (Static, 1/2, 1/3, or 1/4 duty) Usable if VLCD ≤ VDD LCD power shunt resistance contained Special Ports Buzzer output. Inverted buzzer output. Remote control carrier output. High-current drive port ROM Correction Correcting address designation: Up to 3 addresses possible MAD00047GEM MN101C73A, MN101CF73A Electrical Charactreistics (Supply current) Parameter Operating supply current Supply current at HALT Supply current at STOP Symbol Condition min Limit typ 1 max 1.8 mA IDD1 fosc = 4 MHz. VDD = 3 V IDD2 fx = 32 kHz. VDD = 3 V 4 15 µA IDD3 fx = 32 kHz. VDD = 3 V. Ta = 25 °C 2 5 µA IDD4 fx = 32 kHz. VDD = 3 V. Ta = -40 °C to +85 °C 10 µA IDD5 VDD = 3 V. Ta = 25 °C 2 µA IDD6 VDD = 3 V. Ta = -40 °C to +85 °C 8 µA Pin Assignment 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 P34, VLC3 P35, VLC2 P36, VLC1 VDD VDD (Flash, VPP) OSC2 OSC1 MMOD XO XI NRST, P27 VSS AN11, RMOUT, TM0O, LED0, P50 AN10, TM2O, LED1, P51 AN9, BUZZERB, TM7O, LED2, P52 AN8, TM8O, LED3, P53 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 SEG3, P64 SEG2, P65 SEG1, P66 SEG0, P67 COM0, P30 COM1, P31 COM2, P32 COM3, P33 SEG24, P8O, SDO0, TM7IOB SEG25, P81, SDO1, TM8IOB SEG26, P82, SDO2, TM0IOB SEG27, P83, SDO3, TM1IOB SEG28, P84, SDO4, TM2IOB SEG29, P85, SDO5, TM3IOB SEG30, P86, SDO6 SEG31, P87, SDO7 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 SEG4, P77, KEY7B SEG5, P76, KEY6B SEG6, P75, KEY5B SEG7, P74, KEY4B SEG8, P73, KEY3B SEG9, P72, KEY2B SEG10, P71, KEY1B SEG11, P70, KEY0B SEG12, P63 SEG13, P62, SBT0B SEG14, P61, SBI0B, RXD0B SEG15, P60, SBO0B, TXD0B SEG16, P07, SBT1B SEG17, P06, SBI1B, RXD1B SEG18, P05, SBO1B, TXD1B SEG19, P04, SBT3 TQFP064-P-1010C, LQFP064-P-1414 MAD00047GEM Unit 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 SEG20, SBO3, P03 SEG21, SBI3, IRQ5, P02 SEG22, NBUZZER, IRQ4, P01 SEG23, BUZZERA, IRQ3, P00 IRQ2, SBT1A, P23 IRQ1, SBI1A, RXD1A, P22 IRQ0, SBO1A, TXD1A, P21 VREF+, P20 AN0, KEY7A, TM3IOA, P17 , AN1, KEY6A, TM2IOA, P16 AN2, KEY5A, TM1IOA, P15 AN3, KEY4A, SBT0A, TM0IOA, P14 AN4, KEY3A, SBI0A, RXD0A, P13 AN5, KEY2A, SBO0A, TXD0A, P12 AN6, KEY1A, TM8IOA, P11 AN7, KEY0A, TM7IOA, P10 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805