FDG6342L tm Integrated Load Switch Features General Description Max rDS(on) = 150mΩ at VGS = 4.5V, ID = –1.5A This device is particularly suited for compact power management in portable electronic equipment where 1.5V to 8V input and 1.5A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) that drives a large P-Channel power MOSFET (Q2) in one tiny SC70-6 package. Max rDS(on) = 195mΩ at VGS = 2.5V, ID = –1.3A Max rDS(on) = 280mΩ at VGS = 1.8V, ID = –1.1A Max rDS(on) = 480mΩ at VGS = 1.5V, ID = –0.9A Control MOSFET (Q1) includes Zener protection for ESD ruggedness ( >4KV Human body model) Applications High performance trench technology for extremely low rDS(on) Power management Compact industry standard SC70-6 surface mount package Load switch RoHS Compliant Q2 Vin,R1 3 4 Equivalent Circuit Vout,C1 IN ON/OFF 5 R1,C1 6 Q1 2 Vout,C1 1 R2 VDROP OUT ON/OFF Pin 1 SC70-6 See Application Circuit MOSFET Maximum Ratings TA = 25°C unless otherwise noted Symbol Parameter VIN Gate to Source Voltage (Q2) VON/OFF Gate to Source Voltage (Q1) ILoad Load Current TJ, TSTG Units V –0.5 to 8 V -Continuous (Note 2) –1.5 -Pulsed (Note 2) –6 (Note 1a) 0.36 (Note 1b) 0.3 Power Dissipation for Single Operation PD Ratings ±8 Operating and Storage Junction Temperature Range –55 to +150 A W °C Thermal Characteristics RθJA Thermal Resistance, Junction to Ambient Single operation (Note 1a) 350 RθJA Thermal Resistance, Junction to Ambient Single operation (Note 1b) 415 °C/W Package Marking and Ordering Information Device Marking .42 Device FDG6342L ©2007 Fairchild Semiconductor Corporation FDG6342L Rev.B1 Package SC70-6 1 Reel Size 7’’ Tape Width 8mm Quantity 3000units www.fairchildsemi.com FDG6342L Integrated Load Switch September 2007 Symbol Parameter Test Conditions Min Typ Max Units –1 µA Off Characteristics BVIN VIN Breakdown Voltage ID = -250µA, VON/OFF = 0V ILoad Zero Gate Voltage Drain Current VIN = -6.4V, VON/OFF = 0V 8 V IFL Leakage Current, Forward VIN = 8V, VON/OFF = 0V 10 µA IRL Leakage Current, Reverse VIN = -8V, VON/OFF = 0V –10 µA V On Characteristics (note 2) VON/OFF(th) rDS(on) Gate Threshold Voltage VIN = VON/OFF, ID = -250µA Static Drain to Source On Resistance (Q2) Static Drain to Source On Resistance (Q1) 0.8 1.5 VIN = 4.5V, ID = –1.5A 0.65 125 150 VIN = 2.5V, ID = –1.3A 150 195 VIN = 1.8V, ID = –1.1A 200 280 VIN = 1.5V, ID = –0.9A 250 480 VIN = 4.5V, ID = 0.4A 2.6 4.0 VIN = 2.7V, ID = 0.2A 3.3 5.0 mΩ Ω Drain-Source Diode Characteristics IS Maximum Continuous Drain to Source Diode Forward Current VSD Source to Drain Diode Forward Voltage VON/OFF = 0V, IS = –0.25A (Note 2) –0.6 –0.25 V –1.2 V NOTES: 1. RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθJA is determined by the user's board design. a. 350°C/W when mounted on a 1 in2 pad of 2 oz copper . b. 415°C/W when mounted on a minimum pad of 2 oz copper. 2. Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%. FDG6342LLoad Switch Application circuit Q2 IN OUT C1 R1 Q1 LOAD ON/OFF R2 External Component Recommendation: For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030 ©2007 Fairchild Semiconductor Corporation FDG6342L Rev.B1 2 www.fairchildsemi.com FDG6342L Integrated Load Switch Electrical Characteristics TJ = 25°C unless otherwise noted 0.5 0.5 VIN = -1.5V VON/OFF = 1.5-8V PW = 300µs, D < 2% 0.4 TJ = 125oC -VDROP, (V) -VDROP, (V) 0.4 VIN = -1.8V VON/OFF = 1.5-8V PW = 300µs, D < 2% 0.3 TJ = 25oC 0.2 0.1 TJ = 125oC 0.3 TJ = 25oC 0.2 0.1 0.0 0.0 0.4 0.8 1.2 1.6 0.0 0.0 2.0 0.5 1.0 -IL, (A) Figure 1. Conduction Voltage Drop Variation with Load Current. 2.5 3.0 0.5 VIN = -2.5V VON/OFF = 1.5-8V PW = 300µs, D < 2% TJ VIN = -4.5V VON/OFF = 1.5-8V PW = 300µs, D < 2% 0.4 = 125oC -VDROP, (V) 0.4 -VDROP, (V) 2.0 Figure 2. Conduction Voltage Drop Variation with Load Current. 0.5 0.3 TJ = 25oC 0.2 0.1 TJ = 125oC 0.3 TJ = 25oC 0.2 0.1 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.0 3.5 0.5 1.0 1.5 -IL, (A) 2.0 2.5 3.0 3.5 4.0 4.5 -IL, (A) Figure 3. Conduction Voltage Drop Variation with Load Current. Figure 4. Conduction Voltage Drop Variation with Load Current. 0.6 0.6 IL = -1.3A VON/OFF = 1.5-8V PW = 300µs, D < 2% 0.5 rDS(on), ON-RESISTANGE (Ω) rDS(on), ON-RESISTANGE (Ω) 1.5 -IL, (A) 0.4 0.3 TJ = 125oC 0.2 TJ = 0.1 0.0 1.0 1.5 25oC 2.0 2.5 3.0 3.5 4.0 0.4 TJ = 125oC 0.3 0.2 0.1 TJ = 25oC 0.0 1.0 4.5 -VIN, INPUT VOLTAGE (V) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 -VIN, INPUT VOLTAGE (V) Figure 5. On-Resistance Variation With Input Voltage ©2007 Fairchild Semiconductor Corporation FDG6342L Rev.B1 IL = -1.5A VON/OFF = 1.5-8V PW = 300µs, D < 2% 0.5 Figure 6. On-Resistance Variation With Input Voltage 3 www.fairchildsemi.com FDG6342L Integrated Load Switch Typical Characteristics TJ = 25°C unless otherwise noted The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® Power247® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 Green FPS™ Green FPS™ e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FPS™ FRFET® Global Power ResourceSM ® PDP-SPM™ Power220® SuperSOT™-8 SyncFET™ The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® UniFET™ VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition tm Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I31 ©2007 Fairchild Semiconductor Corporation FDG6342L Rev.B1 www.fairchildsemi.com FDG6342L Integrated Load Switch TRADEMARKS